DATASHEET

1.8V to 3.3V, Micro-Power, ±15kV ESD, +125°C, Slew
Rate Limited, RS-485/RS-422 Transceivers
ISL32600E, ISL32601E, ISL32602E, ISL32603E
The Intersil ISL32600E, ISL32601E, ISL32602E and
Features
ISL32603E are ±15kV IEC61000 ESD protected, micro power,
wide supply range transceivers for differential communication.
The ISL32600E and ISL32601E operate with VCC ≥ 2.7V and
have maximum supply currents as low as 100µA with both the
transmitter (Tx) and receiver (Rx) enabled. The ISL32602E and
ISL32603E operate with supply voltages as low as 1.8V. These
transceivers have very low bus currents, so they present less
than a “1/8 unit load” to the bus. This allows more than 256
transmitters on the network, without violating the RS-485
specification’s 32 unit load maximum.
• Single 1.8V, 3V, or 3.3V Supply
Rx inputs feature symmetrical switching thresholds, and up to
65mV of hysteresis, to improve noise immunity and to reduce
duty cycle distortion in the presence of slow moving input
signals (see Figure 9). The Rx input common mode range is the
full -7V to +12V RS-485 range for supply voltages ≥ 3V.
• Up to 65mV Hysteresis for Improved Noise Immunity
Hot Plug circuitry ensures that the Tx and Rx outputs remain in
a high impedance state while the power supply stabilizes.
• -7V to +12V Common Mode Input/Output Voltage Range
(VCC ≥ 3V)
This transceiver family utilizes slew rate limited drivers, which
reduce EMI, and minimize reflections from improperly terminated
transmission lines, or unterminated stubs in multidrop and
multipoint applications.
• Half and Full Duplex Pinouts; Three State Rx and Tx Outputs
The ISL32600E and ISL32602E are configured for full duplex
(separate Rx input and Tx output pins) applications. The half
duplex versions multiplex the Rx inputs and Tx outputs to allow
transceivers with output disable functions in 8 Ld packages.
See Table 1 for a summary of each device’s features.
Applications
• Low Supply Currents . . . . . . . ISL32601E, 100µA (Max) @ 3V
. . . . . . ISL32603E, 150µA (Max) @ 1.8V
- Ultra Low Shutdown Supply Current . . . . . . . . . . . . . . 10nA
• IEC61000 ESD Protection on RS-485 I/O Pins . . . . . . ±15kV
- Class 3 ESD Levels on all Other Pins . . . . . . . . . >8kV HBM
• Symmetrical Switching Thresholds for Less Duty Cycle
Distortion (See Figure 9)
• Data Rates from 128kbps to 460kbps
• Specified for +125°C Operation
• 1/8 Unit Load Allows up to 256 Devices on the Bus
• 5V Tolerant Logic Inputs
• Tiny MSOP Packages Consume 50% Less Board Space
• Differential Sensor Interfaces
• Process Control Networks
• Security Camera Networks
• Building Environmental Control/Lighting Systems
10m
ISL3172E DYNAMIC (9.6kbps)
25°C, RD = ∞, CD = 50pF
ISL3260XE DYNAMIC (9.6kbps)
100µ
ICC (A)
ISL3172E STATIC
ICC (A)
DYNAMIC (256kbps)
DE = VCC, RE = GND
1m
DYNAMIC (128kbps)
1m
ISL3260XE STATIC
STATIC
DE = VCC, RE = GND
10µ
2.7
2.8
2.9
3
25°C, RD = ∞, CD = 50pF
3.1
3.2
3.3
3.4
3.5
3.6
SUPPLY VOLTAGE (V)
1
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
SUPPLY VOLTAGE (V)
FIGURE 1. ISL32600E AND ISL32601E HAVE A 9.6kbps
OPERATING ICC LOWER THAN THE STATIC ICC OF
MANY EXISTING 3V TRANSCEIVERS
June 22, 2012
FN7967.0
100µ
1.8
FIGURE 2. ISL32602E AND ISL32603E WITH VCC = 1.8V REDUCE
OPERATING ICC BY A FACTOR OF 25 TO 40,
COMPARED WITH ICC AT VCC = 3.3V
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL32600E, ISL32601E, ISL32602E, ISL32603E
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
SUPPLY
RANGE (V)
HALF/FULL
DUPLEX
DATA RATE
(kbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
# DEVICES
ON BUS
RX/TX
ENABLE?
QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL32600E
2.7 to 3.6
FULL
128 - 256
YES
YES
256
YES
60 @ 3V
YES
10, 14
ISL32601E
2.7 to 3.6
HALF
128 - 256
YES
YES
256
YES
60 @ 3V
YES
8
ISL32602E
1.8 to 3.6
FULL
256 - 460
YES
YES
256
YES
105 @ 1.8V
YES
10, 14
ISL32603E
1.8 to 3.6
HALF
256 - 460
YES
YES
256
YES
105 @ 1.8V
YES
8
Pin Configurations
ISL32600E, ISL32602E
(10 LD MSOP)
TOP VIEW
ISL32601E, ISL32603E
(8 LD MSOP, SOIC)
TOP VIEW
RO 1
R
8
VCC
RO 1
RE 2
7
B/Z
RE 2
DE 3
6
A/Y
DE 3
5
GND
DI 4
DI 4
D
R
10 VCC
9 A
8 B
D
GND 5
7 Z
6 Y
ISL32600E, ISL32602E
(14 LD SOIC)
TOP VIEW
14 VCC
NC 1
RO 2
RE 3
13 NC
R
11 B
DE 4
DI 5
12 A
D
10 Z
GND 6
9 Y
GND 7
8 NC
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL32600EFBZ
32600EFBZ
-40 to +125
14 Ld SOIC
M14.15
ISL32600EFUZ
32600
-40 to +125
10 Ld MSOP
M10.118
ISL32601EFBZ
32601 EFBZ
-40 to +125
8 Ld SOIC
M8.15
ISL32601EFUZ
32601
-40 to +125
8 Ld MSOP
M8.118
ISL32602EFBZ
32602EFBZ
-40 to +125
14 Ld SOIC
M14.15
ISL32602EFUZ
32602
-40 to +125
10 Ld MSOP
M10.118
ISL32603EFBZ
32603 EFBZ
-40 to +125
8 Ld SOIC
M8.15
ISL32603EFUZ
32603
-40 to +125
8 Ld MSOP
M8.118
NOTES:
1. Add “-T” (full reel) or -T7A (250 piece reel) suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32600E, ISL32601E, ISL32602E, ISL32603E. For more information
on MSL please see tech brief TB363.
2
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Truth Tables
Truth Tables (continued)
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode (See Note 11).
OUTPUT
RE
DE
Half Duplex
DE
Full Duplex
A-B
RO
0
0
X
≥ 0.2V
1
0
0
X
≤ -0.2V
0
0
0
X
Inputs Open
1
1
0
0
X
High-Z *
1
1
1
X
High-Z
NOTE: *Shutdown Mode (See Note 11).
Pin Descriptions
PIN
8 LD
10 LD
14 LD
PACKAGE PACKAGE PACKAGE
FUNCTION
RO
1
1
2
Receiver output: If A-B ≥ 200mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected
(floating).
RE
2
2
3
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable
function isn’t required, connect RE directly to GND.
DE
3
3
4
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance
when DE is low. If the Tx enable function isn’t required, connect DE to VCC.
DI
4
4
5
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high
and output Z low.
GND
5
5
6, 7
A/Y
6
-
-
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver
output. Pin is an input if DE = 0; pin is an output if DE = 1.
B/Z
7
-
-
±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is
an input if DE = 0; pin is an output if DE = 1.
A
-
9
12
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input.
B
-
8
11
±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input.
Y
-
6
9
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output.
Z
-
7
10
±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output.
VCC
8
10
14
System power supply input (2.7V to 3.6V for ISL32600E and ISL32601E; 1.8V to 3.6V for ISL32602E and
ISL32603E).
NC
-
-
1, 8, 13
3
Ground connection.
No Internal Connection.
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Typical Operating Circuits
HALF DUPLEX NETWORK USING ISL32603E
+1.8V
+1.8V
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
DI 4
2 RE
B/Z
7
7
B/Z
DE 3
3 DE
A/Y
6
6
A/Y
RE 2
4 DI
GND
GND
5
5
NOTE 14
RO 1
R
D
}
FULL DUPLEX NETWORK USING ISL32600E
(PIN NUMBERS FOR SOIC)
+3.3V
+
14
VCC
2 RO
R
A 12
0.1µF
+3.3V
0.1µF
RT
+
14
VCC
9 Y
B 11
D
10 Z
3 RE
DE 4
RE 3
4 DE
5 DI
DI 5
Z 10
Y 9
D
GND
6, 7
4
RT
11 B
R
12 A
}
NOTE 14
RO 2
GND
6, 7
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
A/Y, B/Z, Y, Z (VCC = 0V or ≥ 3V) . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
A/Y, B/Z, Y, Z (1.8V ≤ VCC < 3V) . . . . . . . . . . . . . . . . . . . . . . . -8V to +11V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indeterminate
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . . +125°C
Thermal Resistance (Typical, Notes 4, 5)
θJA (°C/W) θJC (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . .
105
47
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . .
140
40
10 Ld MSOP Package . . . . . . . . . . . . . . . . . .
160
59
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . .
128
39
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Recommended Operating Conditions (continued)
Supply Voltage Range
ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 3.3V
ISL32602E, ISL32603E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V
Differential Load Resistance
ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Ω or 120Ω
ISL32602E, ISL32603E . . . . . . . . . . . . . . . ≥10kΩ @ 1.8V; 120Ω @ 3.3V
Common Mode Range
ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V
ISL32602E, ISL32603E
VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to +2V
VCC = 3.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C;
Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6)
PARAMETER
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
UNITS
RL = 100Ω (RS-422) (Figure 3A, VCC ≥ 3.15V)
Full
1.95
2.1
-
V
RL = 54Ω (RS-485)
(Figure 3A)
VCC = 2.7V
Full
1.2
1.5
VCC
V
VCC ≥ 3V
SYMBOL
TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential VOUT
VOD
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Full
1.4
1.7
VCC
V
No Load
Full
-
-
VCC
V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B,
VCC ≥ 3V)
Full
1.3
-
-
V
ΔVOD
RL = 54Ω or 100Ω (Figure 3A)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
RL = 54Ω or 100Ω (Figure 3A)
Full
-
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 54Ω or 100Ω (Figure 3A)
Full
-
0.01
0.2
V
Output Leakage Current (Y, Z) (Full
Duplex Versions Only)
IOZD
DE = 0V, VCC = 0V
(-7V ≤ VIN ≤ 12V) or
2.7V ≤ VCC ≤ 3.6V
VIN = 12V (VCC ≥ 3V)
Full
-
3
60
µA
VIN = 10V (VCC = 2.7V)
Full
-
3
60
µA
VIN = -7V
Full
-30
-10
-
µA
Driver Short-Circuit Current,
VO = High or Low
IOSD
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 8)
Full
-
-
±250
mA
Logic Input High Voltage
VIH
DI, DE, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DI, DE, RE
Full
-
-
0.7
V
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC (Note 14)
Full
-1
-
1
µA
5
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C;
Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued)
PARAMETER
SYMBOL
Input Current (A, B, A/Y, B/Z)
IIN2
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
UNITS
VIN = 12V (VCC ≥ 2.7V
for A, B)
Full
-
80
125
µA
VIN = 12V (VCC ≥ 3V for
A/Y, B/Z)
Full
-
80
125
µA
VIN = 10V (VCC = 2.7V
for A/Y, B/Z)
Full
-
80
125
µA
VIN = -7V
Full
-100
-50
-
µA
TEST CONDITIONS
DE = 0V, VCC = 0V
(-7V ≤ VIN ≤ 12V) or
2.7V ≤ VCC ≤ 3.6V
Receiver Differential Threshold
Voltage
V TH
-7V ≤ VCM ≤ 12V
Full
-200
0
200
mV
Receiver Input Hysteresis
ΔV TH
-7V ≤ VCM ≤ 12V
Full
-
40
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
VCC - 0.5
-
-
V
Receiver Output Low Voltage
VOL
IO = 4mA, VID = -200mV
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0V ≤ VO ≤ VCC, RE = VCC
Full
-1
-
1
µA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
-
30
±60
mA
VCC = 3V
Full
-
60
100
µA
VCC = 3.6V
Full
-
70
120
µA
DI = 0V or VCC, Rx Only VCC = 3V
(DE = 0V, RE = 0V)
VCC = 3.6V
Full
-
42
65
µA
Full
-
46
80
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.01
1
µA
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model, From Bus Pins to GND
25
-
±15
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±8
-
kV
Machine Model
25
-
400
-
V
VCC = 2.7V
Full
128
-
-
kbps
VCC ≥ 3V
Full
256
-
-
kbps
SUPPLY CURRENT
No-Load Supply Current (Note 7)
ICC
Shutdown Supply Current
ISHDN
DI = 0V or VCC,
DE = VCC, RE = 0V or
VCC
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z)
All Pins
SWITCHING CHARACTERISTICS
Maximum Data Rate
fMAX
RDIFF = 54Ω,
(Figures 6, 7)
Driver Differential Output Delay
tDD
RDIFF = 54Ω, CD = 50pF (Figure 4)
Full
-
340
600
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CD = 50pF (Figure 4)
Full
-
1
30
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CD = 50pF (Figure 4)
Full
200
400
1000
ns
Driver Enable to Output High
tZH
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5),
(Note 9)
Full
-
-
1000
ns
Driver Enable to Output Low
tZL
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5),
(Note 9)
Full
-
-
1000
ns
Driver Disable from Output High
tHZ
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5)
Full
-
-
150
ns
Driver Disable from Output Low
tLZ
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5)
Full
-
-
150
ns
Driver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5),
(Notes 11, 12)
Full
-
-
10
µs
6
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C;
Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued)
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
UNITS
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5),
(Notes 11, 12)
Full
-
-
10
µs
tSHDN
(Note 11)
Full
50
-
600
ns
Receiver Input to Output Delay
tPLH, tPHL
(Figure 7)
Full
-
750
1300
ns
Receiver Skew | tPLH - tPHL |
tSKD
(Figure 7)
Full
-
115
300
ns
PARAMETER
SYMBOL
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
Time to Shutdown
TEST CONDITIONS
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8),
(Note 10)
Full
-
-
50
ns
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8),
(Note 10)
Full
-
-
50
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8)
Full
-
12
50
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8)
Full
-
13
50
ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8),
(Notes 11, 13)
Full
-
-
12
µs
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8),
(Notes 11, 13)
Full
-
-
12
µs
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” starting on page 14 for more information.
9. When testing this parameter, keep RE = 0 to prevent the device from entering SHDN.
10. When testing this parameter, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
11. Devices are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter
shutdown. If the inputs are in this state for at least 600ns (1200ns if VCC=1.8V), the parts are guaranteed to have entered shutdown. See “Low Power
Shutdown Mode” on page 13.
12. Keep RE = VCC, and set the DE signal low time >600ns (1200ns if VCC=1.8V) to ensure that the device enters SHDN.
13. Set the RE signal high time >600ns (1200ns if VCC=1.8V) to ensure that the device enters SHDN.
14. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 3).
15. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design.
Electrical Specifications ISL32602E, ISL32603E:
Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V,
TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 15)
TYP
MAX
(Note 15) UNITS
DC CHARACTERISTICS
Driver Differential VOUT
VOD
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
7
RL = 100Ω (RS-422)
(Figure 3A)
VCC = 1.8V
Full
0.8
0.9
VCC ≥ 3.15V
-
V
V
Full
1.95
2.25
-
No Load, VCC = 1.8V
Full
1.1
1.4
VCC
RL = 54Ω (RS-485) (Figure 3A, VCC ≥ 3V)
Full
1.5
1.95
-
V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B,
VCC ≥ 3V)
Full
1.3
-
-
V
ΔVOD
RL = 100Ω (Figure 3A)
Full
-
0.01
0.2
V
VOC
RL = 100Ω (Figure 3A)
Full
-
-
3
V
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Electrical Specifications ISL32602E, ISL32603E:
Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V,
TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 100Ω (Figure 3A)
Output Leakage Current (Y, Z)
(Full Duplex Versions Only)
IOZD
DE = 0V, VCC = 0V
(-7V ≤ VIN ≤ 12V) or
1.8V or
3V ≤ VCC ≤ 3.6V
TEMP
MIN
(°C) (Note 15)
TYP
MAX
(Note 15) UNITS
Full
-
0.01
0.2
V
VOUT = 12V (VCC ≥ 3V)
Full
-
1
60
µA
VOUT = 10V (VCC = 1.8V)
Full
-
1
60
µA
VOUT = -7V
Full
-30
-10
-
µA
Driver Short-Circuit Current,
VO = High or Low
IOSD
DE = VCC, -7V ≤ VY or VZ ≤ 12V (3.0V ≤ VCC ≤ 3.6V) or
-7V ≤ VY or VZ ≤ 10V (VCC = 1.8V) (Note 8)
Full
-
-
±250
mA
Logic Input High Voltage
VIH
DI, DE, RE
VCC ≥ 1.8V
Full
1.26
-
-
V
VCC ≥ 3V
Full
2
-
-
V
VCC ≥ 1.8V
Full
-
-
0.4
V
VCC ≥ 3V
Full
-
-
0.8
V
-1
-
1
µA
Logic Input Low Voltage
VIL
DI, DE, RE
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC (Note 14)
Full
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V
(-7V ≤ VIN ≤ 12V) or
1.8V or
3V ≤ VCC ≤ 3.6V
VIN = 12V (A, B Only)
Full
-
80
125
µA
VIN = 12V (VCC ≥ 3V for A/Y,
B/Z)
Full
-
80
125
µA
VIN = 10V (VCC = 1.8V for
A/Y, B/Z)
Full
-
80
125
µA
VIN = -7V
Full
-100
-50
-
µA
Receiver Differential Threshold
Voltage
V TH
-7V ≤ VY or VZ ≤ 2V at VCC = 1.8V or -7V ≤ VY or
VZ ≤ 12V at VCC ≥ 3V
Full
-200
0
200
mV
Receiver Input Hysteresis
ΔV TH
-7V ≤ VY or VZ ≤ 2V at VCC = 1.8V or -7V ≤ VY or
VZ ≤ 12V at VCC ≥ 3V
Full
-
65
-
mV
Receiver Output High Voltage
VOH
IO = -1mA, VID = 200mV
Full
VCC - 0.4
-
-
V
Receiver Output Low Voltage
VOL
IO = 2.2mA, VID = -200mV
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0V ≤ VO ≤ VCC, RE = VCC
Full
-1
-
1
µA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
-
-
±60
mA
VCC = 1.8V
Full
-
105
150
µA
VCC = 3.6V
Full
-
150
350
µA
DI = 0V or VCC, Rx Only VCC = 1.8V
(DE = 0V,
VCC = 3.6V
RE = 0V)
Full
-
90
115
µA
Full
-
125
260
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
-
1
µA
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model, From Bus Pins to GND
25
-
±15
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±8
-
kV
Machine Model
25
-
400
-
V
SUPPLY CURRENT
No-Load Supply Current (Note 7)
ICC
Shutdown Supply Current
ISHDN
DI = 0V or VCC,
DE = VCC, RE = 0V or
VCC
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z)
All Pins
8
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Electrical Specifications ISL32602E, ISL32603E:
Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V,
TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 15)
TYP
MAX
(Note 15) UNITS
SWITCHING CHARACTERISTICS
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
Driver Differential Output Skew
tSKEW
Driver Differential Rise or Fall Time
tR, tF
(Figures 6, 7)
CD = 50pF (Figure 4)
CD = 50pF (Figure 4)
CD = 50pF (Figure 4)
VCC = 1.8V, RDIFF = ∞
Full
256
-
-
kbps
VCC ≥ 3V, RDIFF = 54Ω
Full
460
-
-
kbps
VCC = 1.8V, RDIFF = ∞
Full
-
750
2600
ns
VCC ≥ 3V, RDIFF = 54Ω
Full
-
350
1500
ns
VCC = 1.8V, RDIFF = ∞
Full
-
120
220
ns
VCC ≥ 3V, RDIFF = 54Ω
Full
-
2
100
ns
VCC = 1.8V, RDIFF = ∞
Full
150
1700
4500
ns
VCC ≥ 3V, RDIFF = 54Ω
Full
200
400
900
ns
Driver Enable to Output High
tZH
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5),
(Note 9)
Full
-
-
3000
ns
Driver Enable to Output Low
tZL
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5),
(Note 9)
Full
-
-
3000
ns
Driver Disable from Output High
tHZ
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5)
Full
-
-
250
ns
Driver Disable from Output Low
tLZ
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5)
Full
-
-
250
ns
Driver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 50pF, SW = GND (Figure 5),
(Notes 11, 12)
Full
-
-
3000
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5),
(Notes 11, 12)
Full
-
-
3000
ns
tSHDN
(Note 11)
Full
50
500
1200
ns
Receiver Input to Output Delay
tPLH, tPHL
(Figure 7)
Full
-
180
1000
ns
Receiver Skew | tPLH - tPHL |
tSKD
(Figure 7)
Full
-
35
250
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10)
Full
-
-
100
ns
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10)
Full
-
-
100
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8)
Full
-
-
75
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8)
Full
-
-
75
ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8),
(Notes 11, 13)
Full
-
-
5500
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8),
(Notes 11, 13)
Full
-
-
5500
ns
Time to Shutdown
9
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Test Circuits and Waveforms
VCC
RL/2
DE
VCC
Z
DI
Z
DI
VOD
D
375Ω
DE
VOD
D
Y
VCM
RL = 60Ω
-7V to +12V
Y
RL/2
VOC
375Ω
FIGURE 3B. VOD WITH COMMON MODE LOAD
FIGURE 3A. VOD AND VOC
FIGURE 3. DC DRIVER TEST CIRCUITS
VCC
DI
50%
50%
tDDLH
tDDHL
0V
DE
VCC
Z
DI
RDIFF
D
OUT (Z)
VOH
OUT (Y)
VOL
CD
Y
SIGNAL
GENERATOR
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
tSKEW = |tDDLH - tDDHL|
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
1kΩ
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
50pF
VCC
DE
NOTE 11
50%
0V
tZH, tZH(SHDN)
NOTE 11
PARAMETER
OUTPUT
RE
DI
SW
tHZ
Y/Z
X
1/0
GND
OUTPUT HIGH
tHZ
VOH - 0.25V
50%
OUT (Y, Z)
VOH
0V
tLZ
Y/Z
X
0/1
VCC
tZH
Y/Z
0 (Note 9)
1/0
GND
tZL, tZL(SHDN)
NOTE 11
tZL
Y/Z
0 (Note 9)
0/1
VCC
OUT (Y, Z)
tZH(SHDN)
Y/Z
1 (Note 12)
1/0
GND
tZL(SHDN)
Y/Z
1 (Note 12)
0/1
VCC
FIGURE 5A. TEST CIRCUIT
50%
tLZ
VCC
50%
OUTPUT LOW
VOL + 0.25V V
OL
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER ENABLE AND DISABLE TIMES
10
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Test Circuits and Waveforms (Continued)
VCC
DE
DI
VCC
-
Z
0V
VOD
50pF
RDIFF
D
DI
Y
+
SIGNAL
GENERATOR
+VOD
DIFF OUT (Y - Z)
-VOD
0V
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6A. TEST CIRCUIT
FIGURE 6. DRIVER DATA RATE
+1V
RE
GND
15pF
B
R
A
A
0V
0V
RO
-1V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7A. TEST CIRCUIT
FIGURE 7. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
GND
B
A
R
NOTE 11
1kΩ
RO
VCC
SW
SIGNAL
GENERATOR
GND
VCC
RE
50%
50%
0V
15pF
tZH, tZH(SHDN)
NOTE 11
PARAMETER
DE
A
SW
tHZ
X
+1.5V
GND
tLZ
X
-1.5V
VCC
tZH (Note 10)
0
+1.5V
GND
tZL (Note 10)
0
-1.5V
VCC
tZH(SHDN) (Note 13)
0
+1.5V
GND
tZL(SHDN) (Note 11)
0
-1.5V
OUTPUT HIGH
tHZ
V
VOH - 0.25V OH
1.5V
RO
0V
tZL, tZL(SHDN)
NOTE 11
RO
tLZ
VCC
1.5V
OUTPUT LOW
VCC
VOL + 0.25V V
OL
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8A. TEST CIRCUIT
FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices) receivers
on each bus. RS-485 is a true multipoint standard, which
allows up to 32 one-unit load devices (any combination of
drivers and receivers) on each bus. To allow for multipoint
operation, the RS-485 spec requires that drivers must handle
bus contention without sustaining any damage.
11
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
-7V to +12V. RS-422 and RS-485 are intended for runs as long
as 4000’, so the wide CMR is necessary to handle ground
potential differences, as well as voltages induced in the cable
by external fields.
Receiver Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity is
better than ±200mV, as required by the RS-422 and RS-485
specifications. The symmetrical ±200mV switching thresholds
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
RECEIVER OUTPUT (V)
RECEIVER INPUT (V)
eliminate the duty cycle distortion that occurs on receivers with
full fail safe (FFS) functionality and with slowly transitioning
input signals (see Figure 9). FFS receiver switching points have a
1
A-B
0
-1
4
ISL3260XE
0
Driver Features
These drivers are differential output devices that deliver at
least 1.4V with VCC ≥ 3V across a 54Ω load (RS-485) and at
least 1.95V with VCC ≥ 3.15V across a 100Ω load (RS-422).
The 1.8V transmitters deliver a 1.1V unloaded, differential
level. Drivers operate at data rates from 128kbps to 460kbps depending on the supply voltage - and they feature low
propagation delay skews to maximize bit width. Driver outputs
are slew rate limited to minimize EMI and to reduce reflections
in unterminated or improperly terminated networks.
All drivers are tri-statable via the active high DE input. There
are no parasitic nor ESD diodes to VCC on the DI and DE inputs,
so these inputs are tolerant of input voltages up to 5.5V, even
with the ISL3260XE powered down (i.e., VCC = 0V).
4
ISL3172E
1.8V Operation
0
VCC = 3.3V, DATA RATE = 125kbps
TIME (4µs/DIV)
FIGURE 9. COMPARED WITH A FULL-FAILSAFE ISL3172E
RECEIVER, THE SYMMETRICAL RX THRESHOLDS OF
THE ISL3260XE DELIVER LESS OUTPUT DUTY CYCLE
DISTORTION WHEN DRIVEN WITH SLOW INPUT
SIGNALS
negative offset, so the RO high time is naturally longer than the
low time. The ISL3260XE’s larger receiver input sensitivity range
enables an increase of the receiver input hysteresis. The 40mV
to 65mV receiver hysteresis increases the noise immunity,
which is a big advantage for noisy networks, or networks with
slow bus transitions.
Receiver input resistance of 96kΩ surpasses the RS-422 spec
of 4kΩ and is eight times the RS-485 “Unit Load (UL)”
requirement of 12kΩ minimum. Thus, these products are
known as “one-eighth UL” transceivers and there can be up to
256 of these devices on a network while still complying with
the RS-485 loading specification.
Receiver inputs function with common mode voltages as great
as +9V/-7V outside the power supplies (i.e., +12V and -7V) at
VCC = 3V, making them ideal for long networks where induced
voltages and ground potential differences are realistic concerns.
The positive CMR is limited to +2V when the ISL32602E or
ISL32603E is operated with VCC = 1.8V.
All the receivers include a “Fail-Safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating). Because the Rx is not full failsafe,
terminated networks may require bus biasing resistors (pull-up
on noninverting input, pull-down on inverting input) to preserve
the bus idle state when the bus is not actively driven.
Receivers operate at data rates from 128kbps to 460kbps depending on the supply voltage - and all receiver outputs are
tri-statable via the active low RE input. There are no parasitic
nor ESD diodes to VCC on the RE input, so it is tolerant of input
voltages up to 5.5V, even with the ISL3260XE powered down
(i.e., VCC = 0V).
12
The ISL32602E and ISL32603E are specifically designed to
operate with supply voltages as low as 1.8V. Termination
resistors should be avoided at this operating condition, and the
unterminated driver is guaranteed to deliver a healthy 1.1V
differential output voltage. This low supply voltage limits the
+CMR to +2V, but the CMR increases as VCC increases.
To get good 1.8V operation, the ISL32602E and ISL32603E
have to run at a higher operating current. Thus, their ICC with
VCC = 3.3V is considerably higher than the ICC of the
ISL32600E and ISL32601E, which are optimized for low ICC at
3.3V (see Figures 1 and 2).
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx
outputs are kept disabled. If the equipment is connected to the
bus, a driver activating prematurely during power up may
crash the bus. To avoid this scenario, the ISL3260XE devices
incorporate a “Hot Plug” function. During power up, circuitry
monitoring VCC ensures that the Tx and Rx outputs remain
disabled for a period of time, regardless of the state of DE and RE.
This gives the processor/ASIC a chance to stabilize and drive the
RS-485 control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (>8kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs and receiver inputs) incorporate advanced
structures allowing them to survive ESD events in excess of
±15kV HBM and ±15kV IEC61000. The RS-485 pins are
particularly vulnerable to ESD damage because they typically
connect to an exposed port on the exterior of the finished
product. Simply touching the port pins, or connecting a cable,
can cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not it
is powered up, and without degrading the transceiver’s
common mode range. This built-in ESD protection eliminates
the need for board level protection structures (e.g., transient
suppression diodes), and the associated, undesirable
capacitive load they present.
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge storage
capacitor yields a test that is much more severe than the HBM
test. The extra ESD protection built into this device’s RS-485
pins allows the design of equipment meeting level 4 criteria
without the need for additional board level protection on the
RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the IC
pin until the voltage arcs to it. The current waveform delivered
to the IC pin depends on approach speed, humidity,
temperature, etc. so it is difficult to obtain repeatable results.
The ISL3260XE RS-485 pins withstand ±15kV air-gap
discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. The ISL3260XE survive ±8kV contact
discharges on the RS-485 pins.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000’
(1220m), but the maximum system data rate decreases as the
transmission length increases. The ISL32600E and ISL32601E
operate at data rates up to 128kbps at the maximum (4000’)
distance, or at data rates of 256kbps for cable lengths less
than 3000’ (915m). The ISL32602E and ISL32603E, with
VCC = 1.8V, are limited to 1000’ (305m) at 256kbps, or 2000’
(610m) at 128kbps. With VCC = 3.3V, the ISL32602E and
ISL32603E deliver 460kbps over 2000’, 256kbps over 3000’,
or 128kbps over 4000’ cables.
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Short networks using these transceivers need not be
terminated, but terminations are recommended for 2.7V to
3.6V powered networks unless power dissipation is an
overriding concern. Terminations are not recommended for
1.8V applications, due to the low drive available from those
transmitters.
main cable be terminated in its characteristic impedance at
both ends. Stubs connecting a transceiver to the main cable
should be kept as short as possible.
Terminated networks using the ISL3260XE may require bus
biasing resistors (pull-up on noninverting input, pull-down on
inverting input) to preserve the bus idle state when the bus is
not actively driven. Without bus biasing, the termination
resistor collapses the undriven, differential bus voltage to 0V,
which is an undefined level to the ISL3260XE Rx. Bus biasing
forces a few hundred milli-volt positive differential voltage on
the undriven bus, which all RS-485/422 Rx interpret as a valid
logic high.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These devices
meet this requirement via driver output short circuit current
limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry that ensures that the output current never
exceeds the RS-485 spec, even at the common mode voltage
range extremes. Additionally, these devices utilize a foldback
circuit which reduces the short circuit current, and thus the
power dissipation, whenever the contending voltage exceeds
either supply.
In the event of a major short circuit condition, these ICs also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops by about 20°C. If the condition persists, the thermal
shutdown / re-enable cycle repeats until the fault is cleared.
Receivers remain operational during thermal shutdown.
Low Power Shutdown Mode
These micro-power transceivers all use a fraction of the power
required by their counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC to
a 10nA trickle. These devices enter shutdown whenever the
receiver and driver are simultaneously disabled (RE = VCC and
DE = GND) for a period of at least 600ns (1200ns at
VCC = 1.8V). Disabling both the driver and the receiver for less
than 50ns guarantees that the transceiver will not enter
shutdown.
Note that most receiver and driver enable times increase when
the transceiver enables from shutdown. Refer to Notes 9 through
13, at the end of the “Electrical Specification table” on page 7, for
more information.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as short
as possible. Multipoint (multi-driver) systems require that the
13
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Typical Performance Curves
Specified
VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise
30
RECEIVER OUTPUT CURRENT (mA)
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.9
2.7
RDIFF = 10kΩ
2.5
2.3
2.1
RDIFF = 100Ω
1.9
1.7
RDIFF = 54Ω
1.5
-40
-25
-10
5
20
35
50
65
80
95
20
VOL, +125°C
15
VOL, +85°C
10
5
0
-5
VOH, +85°C
-10
VOH, +125°C
-15
-20
110 125
VOL, +25°C
25
VOH, +25°C
0
0.5
TEMPERATURE (°C)
FIGURE 10. ISL32600E, ISL32601E DRIVER DIFFERENTIAL
OUTPUT VOLTAGE vs TEMPERATURE
10m
65
1.5
2.0
2.5
3.0
FIGURE 11. ISL32600E, ISL32601E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
70
RE = 0V
1.0
RECEIVER OUTPUT VOLTAGE (V)
RD = ∞, CD = 50pF
DE = VCC, RE = 0V
VCC = 3.3V
256kbps
60
VCC = 3.0V
50
45
128kbps
DE = VCC
VCC = 2.7V
ICC (A)
ICC (µA)
55
VCC = 3.3V
40
Tx AND Rx BOTH
SWITCHING
DE = 0V
VCC = 3.0V
35
1m
9.6kbps
VCC = 2.7V
30
-25
-10
5
20
35
50
65
80
95
100µ
2.7
110 125
2.8
TEMPERATURE (°C)
DI
3
2
1
0
A-B
-1
-2
RD = ∞
3
2
1
0
TIME (10µs/DIV)
FIGURE 14. ISL32600E, ISL32601E PERFORMANCE WITH
VCC = 3V, 256kbps, 3000’ (915m) CAT 5 CABLE
14
3.1
3.2
3.3
3.4
3.5
3.6
FIGURE 13. ISL32600E, ISL32601E DYNAMIC SUPPLY CURRENT
vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES
3
RECEIVER OUTPUT (V) RECEIVER INPUTS (V)
DRIVER INPUT (V)
RECEIVER OUTPUT (V) RECEIVER INPUTS (V)
0
3.0
VCC (V)
FIGURE 12. ISL32600E, ISL32601E STATIC SUPPLY CURRENT vs
TEMPERATURE
3
2.9
DRIVER INPUT (V)
25
-40
0
DI
3
2
1
0
A-B
-1
-2
RD = ∞
3
2
1
0
TIME (20µs/DIV)
FIGURE 15. ISL32600E, ISL32601E PERFORMANCE WITH
VCC = 2.7V, 128kbps, 4000’ (1220m) CAT 5 CABLE
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Typical Performance Curves
Specified (Continued)
VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise
3.0
400
RD = 54Ω, CD = 50pF
RD = 54Ω, CD = 50pF
PROPAGATION DELAY (ns)
390
2.5
380
2.0
SKEW (ns)
370
360
1.5
1.0
350
tDDLH
0.5
340
tDDHL
330
-40
-25
-10
5
tSKEW = |tDDLH - tDDHL|
20
35
50
65
80
95
0
-40
110 125
-25 -10
5
TEMPERATURE (°C)
20
35
50
65
80
95
110 125
TEMPERATURE (°C)
FIGURE 16. ISL32600E, ISL32601E DRIVER DIFFERENTIAL
PROPAGATION DELAY vs TEMPERATURE
FIGURE 17. ISL32600E, ISL32601E DRIVER DIFFERENTIAL SKEW
vs TEMPERATURE
130
1000
128
950
126
124
850
SKEW (ns)
800
122
tPLH
750
120
118
116
700
tPHL
114
650
112
600
-40
-25
-10
5
20
35
50
65
80
95
110
tSKEW = |tPLH - tPHL|
110
-40
125
-25 -10
DRIVER OUTPUT (V)
2
1
0
RECEIVER OUTPUT (V)
0
RO
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
DRIVER OUTPUT (V)
3
0
3
A/Y - B/Z
-1
-2
TIME (200ns/DIV)
FIGURE 20. ISL32600E, ISL32601E DRIVER AND RECEIVER
WAVEFORMS, LOW TO HIGH
15
35
50
65
80
95
110 125
FIGURE 19. ISL32600E, ISL32601E RECEIVER SKEW vs
TEMPERATURE
FIGURE 18. ISL32600E, ISL32601E RECEIVER PROPAGATION
DELAY vs TEMPERATURE
DI
20
TEMPERATURE (°C)
TEMPERATURE (°C)
RDIFF = 54Ω, CD = 50pF
5
RDIFF = 54Ω, CD = 50pF
DI
3
0
3
0
RO
DRIVER INPUT (V)
PROPAGATION DELAY (ns)
900
2
1
0
A/Y - B/Z
-1
-2
TIME (200ns/DIV)
FIGURE 21. ISL32600E, ISL32601E DRIVER AND RECEIVER
WAVEFORMS, HIGH TO LOW
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Typical Performance Curves
Specified (Continued)
VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise
140
200
120
-40°C
150
+125°C
Y OR Z = LOW
50
0
Y OR Z = HIGH
-50
+125°C
-100
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
+25°C
100
100
-40°C
80
+25°C
60
Y OR Z = LOW
+25°C
20
-40°C
0
+125°C
-20
+25°C
-40°C
-150
-7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12
-40
Y OR Z = HIGH
-40°C
-7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7
FIGURE 22. ISL32600E, ISL32601E DRIVER OUTPUT CURRENT
vs SHORT CIRCUIT VOLTAGE
FIGURE 23. ISL32602E, ISL32603E DRIVER OUTPUT CURRENT
vs SHORT CIRCUIT VOLTAGE
VCC = 3.3V, RDIFF = 100Ω
2.1
VCC = 3.3V, RDIFF = 54Ω
1.7
1.5
VCC = 1.8V, RDIFF = 10kΩ
1.3
1.1
0.9
VCC = 1.8V, RDIFF = 100Ω
0.7
-40
-25
-10
5
20
35
50
65
80
95
30
RECEIVER OUTPUT CURRENT (mA)
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.5
1.9
VOL, +25°C
20
VCC = 1.8V
0
VOL, +85°C
VOL, +25°C
VOL, +85°C
VOL, +125°C
10
VOH, +25°C, +85°C, +125°C
VOH, +85°C
VOH, +125°C
-10
VCC = 3.3V
-20
VOH, +25°C
-30
110 125
VOL, +125°C
VCC = 3.3V
0
0.5
1.0
1.5
2.0
2.5
FIGURE 24. ISL32602E, ISL32603E DRIVER DIFFERENTIAL
OUTPUT VOLTAGE vs TEMPERATURE
RE = 0V
Tx AND Rx BOTH
SWITCHING
RD = ∞, CD = 50pF
DE = VCC, RE = 0V
160
460kbps
10m
256kbps
VCC = 3.3V, DE = VCC
ICC (A)
ICC (µA)
3.3
FIGURE 25. ISL32602E, ISL32603E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
100m
180
120
3.0
RECEIVER OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
140
8 9 10 11 12
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.3
+125°C
40
VCC = 3.3V, DE = 0V
VCC = 1.8V, DE = VCC
128kbps
1m
9.6kbps
100
100µ
80
60
-40
STATIC
VCC = 1.8V, DE = 0V
-25
-10
5
20
35
50
65
80
95
110 125
TEMPERATURE (°C)
FIGURE 26. ISL32602E, ISL32603E STATIC SUPPLY CURRENT vs
TEMPERATURE
16
10µ
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
VCC (V)
FIGURE 27. ISL32602E, ISL32603E DYNAMIC SUPPLY CURRENT
vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
DI
A-B
RD = ∞
2.0
1.5
1.0
0.5
0
TIME (10µs/DIV)
FIGURE 28. ISL32602E, ISL32603E PERFORMANCE WITH
VCC = 1.8V, 256kbps, 1000’ (305m) CAT 5 CABLE
1200
DI
0
4
3
2
1
0
-1
-2
-3
A-B
RD = ∞
4
3
2
1
0
TIME (10µs/DIV)
FIGURE 29. ISL32602E, ISL32603E PERFORMANCE WITH
VCC = 3.3V, 460kbps, 2000’ (610m) CAT 5 CABLE
CD = 50pF
1100
CD = 50pF
120
tSKEW = |tDDLH - tDDHL|
VCC = 1.8V, RD = ∞
1000
100
900
800
SKEW (ns)
PROPAGATION DELAY (ns)
3
DRIVER INPUT (V)
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
DRIVER INPUT (V)
RECEIVER OUTPUT (V) RECEIVER INPUTS (V)
2
0
VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise
RECEIVER OUTPUT (V) RECEIVER INPUTS (V)
Typical Performance Curves
Specified (Continued)
tDDHL
700
tDDLH
600
VCC = 1.8V, RD = ∞
80
60
40
500
400
300
-40
-25
-10
5
20
tDDHL
VCC = 3.3V, RD = 54Ω
VCC = 3.3V, RD = 54Ω
tDDLH
20
35
50
65
TEMPERATURE (°C)
80
95
0
110 125
FIGURE 30. ISL32602E, ISL32603E DRIVER DIFFERENTIAL
PROPAGATION DELAY vs TEMPERATURE
-40
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110 125
FIGURE 31. ISL32602E, ISL32603E DRIVER DIFFERENTIAL SKEW
vs TEMPERATURE
300
140
tSKEW = |tPLH - tPHL|
280
120
100
240
220
SKEW (ns)
PROPAGATION DELAY (ns)
260
VCC = 1.8V, tPLH
200
180
160
80
60
VCC = 1.8V, tPHL
40
VCC = 3.3V, tPHL
140 VCC = 3.3V, tPLH
20
120
100
-40
VCC = 1.8V
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110 125
FIGURE 32. ISL32602E, ISL32603E RECEIVER PROPAGATION
DELAY vs TEMPERATURE
17
0
-40
VCC = 3.3V
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110 125
FIGURE 33. ISL32602E, ISL32603E RECEIVER SKEW vs
TEMPERATURE
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
2
RO
0
1.5
1.0
0.5
0
A/Y - B/Z
-0.5
-1.0
-1.5
DI
2
RO
0
1.5
1.0
0.5
0
A/Y - B/Z
-0.5
-1.0
-1.5
TIME (1µs/DIV)
0
3
RO
0
3
2
1
0
-1
RECEIVER OUTPUT (V)
3
DRIVER INPUT (V)
DI
FIGURE 35. ISL32602E, ISL32603E DRIVER AND RECEIVER
WAVEFORMS, HIGH TO LOW
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 34. ISL32602E, ISL32603E DRIVER AND RECEIVER
WAVEFORMS, LOW TO HIGH
RDIFF = 54Ω, CD = 50pF
A/Y - B/Z
-2
-3
TIME (200ns/DIV)
FIGURE 36. ISL32602E, ISL32603E DRIVER AND RECEIVER
WAVEFORMS, LOW TO HIGH
2
0
TIME (1µs/DIV)
VCC = 3.3V
RDIFF = 10kΩ, CD = 50pF
DRIVER INPUT (V)
0
VCC = 1.8V
VCC = 3.3V
RDIFF = 54Ω, CD = 50pF
DI
3
0
3
0
RO
DRIVER INPUT (V)
DI
2
RECEIVER OUTPUT (V)
RDIFF = 10kΩ, CD = 50pF
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
DRIVER OUTPUT (V)
VCC = 1.8V
VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise
DRIVER INPUT (V)
Typical Performance Curves
Specified (Continued)
3
2
1
0
-1
A/Y - B/Z
-2
-3
TIME (200ns/DIV)
FIGURE 37. ISL32602E, ISL32603E DRIVER AND RECEIVER
WAVEFORMS, HIGH TO LOW
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Si Gate BiCMOS
18
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
DATE
REVISION
June 22, 2012
FN7967.0
CHANGE
Initial Release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL32600E, ISL32601E, ISL32602E, ISL32603E
To report errors or suggestions for this data sheet, please go to: www.intersil.com/askourstaff
FITs are available from our website at: http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
19
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
20
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
21
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Package Outline Drawing
M10.118
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
5
3.0±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.18 - 0.27
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.50)
(0.29)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
22
FN7967.0
June 22, 2012
ISL32600E, ISL32601E, ISL32602E, ISL32603E
Package Outline Drawing
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
8.65
A 3
4
0.10 C A-B 2X
6
14
DETAIL"A"
8
0.22±0.03
D
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
5
0.31-0.51
B 3
(0.35) x 45°
4° ± 4°
6
0.25 M C A-B D
TOP VIEW
0.10 C
1.75 MAX
H
1.25 MIN
0.25
GAUGE PLANE C
SEATING PLANE
0.10 C
0.10-0.25
1.27
SIDE VIEW
(1.27)
DETAIL "A"
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 identifier may be either a mold or mark feature.
(1.50)
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
23
FN7967.0
June 22, 2012
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