485AW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN16, 2.5x3.5, 0.5P
CASE 485AW−01
ISSUE O
1
SCALE 2:1
D
PIN ONE
REFERENCE
A
B
ÏÏÏ
ÏÏÏ
ÏÏÏ
2X
L1
DETAIL A
E
TOP VIEW
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
(A3)
0.10 C
GENERIC MARKING
DIAGRAM*
A1
0.08 C
NOTE 4
C
SIDE VIEW
XXXX
ALYWG
G
SEATING
PLANE
0.15 C A B
XXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
D2
16X
L
K
8
10
DETAIL A
0.15 C A B
E2
16X
2
15
e
1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.50 BSC
0.85
1.15
3.50 BSC
1.85
2.15
0.50 BSC
0.20
--0.35
0.45
--0.15
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÎÎÎ
ÎÎÎ
ÏÏÏ
DETAIL B
16X
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
0.15 C
2X
DATE 11 DEC 2008
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
b
0.10 C A B
0.05 C
NOTE 3
SOLDERING FOOTPRINT*
e/2
3.80
2.10
BOTTOM VIEW
0.50
PITCH
2.80 1.10
1
16X
0.60
16X
0.30
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON36347E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN16, 2.5X3.5
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON36347E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. LEPKOWSKI.
DATE
11 DEC 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 01O
Case Outline Number:
485AW
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