Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
BAP1321-03
Silicon PIN diode
Product specification
Supersedes data of 2001 May 11
2004 Feb 17
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
FEATURES
PINNING
 High voltage, current controlled
PIN
DESCRIPTION
 RF resistor for RF attenuators and switches
1
cathode
 Low diode capacitance
2
anode
 Low diode forward resistance
 Very low series inductance
 For applications up to 3 GHz.
1
2
APPLICATIONS
sym006
 RF attenuators and switches.
Marking code: V8.
The marking bar indicates the cathode.
DESCRIPTION
Fig.1
Planar PIN diode in a SOD323 (SC-76) ultra small SMD
plastic package.
Simplified outline (SOD323; SC-76) and
symbol.
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
BAP1321-03

DESCRIPTION
VERSION
plastic surface mounted package; 2 leads
SOD323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
continuous reverse voltage

60
V
IF
continuous forward current

100
mA
Ptot
total power dissipation

500
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature
65
+150
C
2004 Feb 17
Ts  90 C
2
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
VF
forward voltage
IF = 50 mA
0.95
1.1
V
IR
reverse leakage current
VR = 60 V

100
nA
Cd
diode capacitance
VR = 0; f = 1 MHz
0.4

pF
rD
diode forward resistance
VR = 1 V; f = 1 MHz
0.35
0.45
pF
VR = 20 V; f = 1 MHz
0.25
0.32
pF
f = 100 MHz; note 1
IF = 0.5 mA
3.4
5.0

IF = 1 mA
2.4
3.6

IF = 10 mA
1.2
1.8

0.85
1.3

VR = 0; f = 900 MHz
16.6

dB
VR = 0; f = 1800 MHz
11.6

dB
VR = 0; f = 2450 MHz
9.2

dB
IF = 0.5 mA; f = 900 MHz
0.26

dB
IF = 0.5 mA; f = 1800 MHz
0.35

dB
IF = 0.5 mA; f = 2450 MHz
0.44

dB
IF = 1 mA; f = 900 MHz
0.20

dB
IF = 1 mA; f = 1800 MHz
0.29

dB
IF = 1 mA; f = 2450 MHz
0.38

dB
IF = 10 mA; f = 900 MHz
0.13

dB
IF = 10 mA; f = 1800 MHz
0.22

dB
IF = 10 mA; f = 2450 MHz
0.32

dB
IF = 100 mA; f = 900 MHz
0.10

dB
IF = 100 mA; f = 1800 MHz
0.20

dB
IF = 100 mA; f = 2450 MHz
0.29

dB
IF = 100 mA
s212
s212
s212
s212
s212
isolation
insertion loss
insertion loss
insertion loss
insertion loss
L
charge carrier life time
when switched from IF = 10 mA to IR = 6 mA;
RL = 100 ; measured at IR = 3 mA
0.5

s
LS
series inductance
IF = 100 mA; f = 100 MHz
1.5

nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-s)
2004 Feb 17
PARAMETER
thermal resistance from junction to soldering point
3
VALUE
UNIT
120
K/W
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
GRAPHICAL DATA
MLD591
10
MLD592
500
Cd
handbook, halfpage
handbook, halfpage
rD
(Ω)
(fF)
400
300
1
200
100
10−1
10−1
1
10
IF (mA)
0
102
Fig.3
MLD593
0
21
(dB)
(1)
(2)
(dB)
−10
−20
−0.6
−30
1
2
(1) IF = 100 mA.
(3) IF = 1 mA.
(2) IF = 10 mA.
(4) IF = 0.5 mA.
f (GHz)
−40
3
Diode inserted in series with a 50  stripline circuit
and biased via the analyzer Tee network.
Tamb = 25 C.
Fig.4
0
1
2
f (GHz)
3
Diode zero biased and inserted in series with a 50  stripline circuit.
Tamb = 25 C.
Insertion loss (s212) of the diode as a
function of frequency; typical values.
2004 Feb 17
MLD594
s21 2
(4)
0
20
Diode capacitance as a function of reverse
voltage; typical values.
0
−0.4
−0.8
16
handbook, halfpage
(3)
−0.2
12
Tj = 25 C; = 1 MHz.
Forward resistance as a function of
forward current; typical values.
handbook, halfpage
s 2
8
VR (V)
Tj = 25 C; f = 100 MHz.
Fig.2
4
0
Fig.5
4
Isolation (s212) of the diode as a function
of frequency; typical values.
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
PACKAGE OUTLINE
Plastic surface-mounted package; 2 leads
SOD323
A
D
E
X
v
HD
M
A
Q
1
2
bp
A
A1
(1)
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
HD
Lp
Q
v
mm
1.1
0.8
0.05
0.40
0.25
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45
0.15
0.25
0.15
0.2
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
SOD323
2004 Feb 17
REFERENCES
IEC
JEDEC
JEITA
SC-76
5
EUROPEAN
PROJECTION
ISSUE DATE
03-12-17
06-03-16
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification  The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use  NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
2004 Feb 17
6
NXP Semiconductors
Product specification
Silicon PIN diode
BAP1321-03
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Terms and conditions of commercial sale  NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
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conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
2004 Feb 17
7
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
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© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/03/pp8
Date of release: 2004 Feb 17
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