Data Sheet

BAP51-06W
General purpose PIN diode
Rev. 01 — 26 May 2008
Product data sheet
1. Product profile
1.1 General description
Two planar PIN diodes in common anode configuration in a SOT323 small SMD plastic
package.
1.2 Features
n Two elements in common anode configuration in a small SMD plastic package
n Low diode capacitance
n Low diode forward resistance
1.3 Applications
n general RF application
2. Pinning information
Table 1.
Discrete pinning
Pin
Description
Simplified outline
1
cathode 1
2
cathode 2
3
common connection
Graphic symbol
3
3
2
1
mgu320
1
2
3. Ordering information
Table 2.
Ordering information
Type number Package
BAP51-06W
Name
Description
Version
-
plastic surface-mounted package; 3 leads
SOT323
BAP51-06W
NXP Semiconductors
General purpose PIN diode
4. Marking
Table 3.
Marking
Type number
Marking
Description
BAP51-06W
W7*
* = p: made in Hong Kong
* = t : made in Malaysia
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
-
50
V
Per diode
VR
reverse voltage
IF
forward current
Ptot
total power dissipation
Tstg
Tj
-
50
mA
-
240
mW
storage temperature
−65
+150
°C
junction temperature
−65
+150
°C
Tsp = 90 °C
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction
to solder point
Conditions
Typ
Unit
250
K/W
7. Characteristics
Table 6.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 50 mA
-
0.95
1.1
V
IR
reverse current
VR = 50 V
-
-
100
nA
Cd
diode capacitance
see Figure 1; f = 1 MHz
rD
diode forward resistance
VR = 0 V
-
0.4
-
pF
VR = 1 V
-
0.3
0.55
pF
VR = 5 V
-
0.2
0.35
pF
see Figure 2; f = 100 MHz
IF = 0.5 mA
[1]
-
5.3
9
Ω
IF = 1 mA
[1]
-
3.5
6.5
Ω
IF = 10 mA
[1]
-
1.5
2.5
Ω
BAP51-06W_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
2 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
Table 6.
Characteristics …continued
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
ISL
isolation
VR = 0 V
insertion loss
Lins
Min
Typ
Max
Unit
f = 900 MHz
-
17
-
dB
f = 1800 MHz
-
13
-
dB
f = 2450 MHz
-
12
-
dB
f = 900 MHz
-
0.44
-
dB
f = 1800 MHz
-
0.50
-
dB
f = 2450 MHz
-
0.54
-
dB
f = 900 MHz
-
0.33
-
dB
f = 1800 MHz
-
0.39
-
dB
f = 2450 MHz
-
0.43
-
dB
f = 900 MHz
-
0.19
-
dB
f = 1800 MHz
-
0.24
-
dB
f = 2450 MHz
-
0.28
-
dB
IF = 0.5 mA
IF = 1 mA
IF = 10 mA
τL
charge carrier life time
when switched from IF = 10 mA to IR = 6 mA;
RL = 100 Ω; measured at IR = 3 mA
-
0.55
-
µs
LS
series inductance
IF = 100 mA; f = 100 MHz
-
1.6
-
nH
[1]
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
mld508
500
Cd
(fF)
mld507
102
rD
(Ω)
400
10
300
200
1
100
0
0
4
8
12
20
16
10−1
10−1
1
VR (V)
f = 100 MHz; Tj = 25 °C.
Fig 1.
IF (mA)
102
f = 100 MHz; Tj = 25 °C.
Diode capacitance as a function of reverse
voltage; typical values
Fig 2.
Diode forward resistance as a function of
forward current; typical values
BAP51-06W_1
Product data sheet
10
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
3 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
001aai135
0
001aai136
0
Lins
(dB)
ISL
(dB)
−0.5
−10
(1) (2) (3)
−1
−20
−1.5
−30
−2
−40
−2.5
0.5
1
1.5
2
2.5
3
f (GHz)
−50
0.5
1
1.5
2
2.5
3
f (GHz)
Diode zero biased and inserted in series with a 50 Ω
stripline circuit; Tamb = 25 °C.
(1) IF = 10 mA
(2) IF = 1 mA
(3) IF = 0.5 mA
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer Tee network.
Fig 3.
Insertion loss of the diode as a function of
frequency; typical values
Fig 4.
Isolation of the diode as a function of
frequency; typical values
BAP51-06W_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
4 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
8. Package outline
Plastic surface-mounted package; 3 leads
SOT323
D
E
B
A
X
HE
y
v M A
3
Q
A
A1
c
1
2
e1
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
REFERENCES
IEC
SOT323
Fig 5.
JEDEC
JEITA
SC-70
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
Package outline SOT323
BAP51-06W_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
5 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
9. Abbreviations
Table 7.
Abbreviations
Acronym
Description
AQL
Acceptable Quality Level
PIN
P-type, Intrinsic, N-type
SMD
Surface Mounted Device
RF
Radio Frequency
S4
Special inspection level 4
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAP51-06W_1
20080526
Product data sheet
-
-
BAP51-06W_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
6 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAP51-06W_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 26 May 2008
7 of 8
BAP51-06W
NXP Semiconductors
General purpose PIN diode
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
1
2
2
2
2
5
6
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 May 2008
Document identifier: BAP51-06W_1
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