an1513

Application Note 1513
EBL4600CI-EVALZ: QLx4600-S30 Evaluation Board User
Guide
Introduction
Key Features
The QLx4600-S30 lane extender evaluation board is a versatile
stand-alone card developed to evaluate the performance of
Intersil QLx4600-S30 series quad equalizer.
• QLx4600-S30 series IC
Items provided along with the board:
• This application note
• Single 5V external power supply
• On-board regulators provide all voltages required for MCU and
IC operation
• Power cable
• On-board DC/DC converter that provides the 1.2V supply to the
IC
References
• Optional on-board boost selection for each channel via two
sets of headers
• Adjustable detection threshold for quiescent modes
• QLx4600-S30 Datasheet
• 8 sets of SMA connectors for high speed signals input and
output
Ordering Information
PART NUMBER
EBL4600CI-EVALZ
DESCRIPTION
QLx4600-S30 evaluation board with
power supply cable
FIGURE 1. TOP OF BOARD
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FIGURE 2. BOTTOM OF BOARD
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2010, 2016. All Rights Reserved
Intersil (and design) and Q:ACTIVE are trademarks owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
Application Note 1513
Operation of Evaluation Board
After a brief description of the board design and layout, the
different features and options to operate the board are
highlighted.
• Providing power to the board through an external supply
• The eight high speed differential I/O
PROVIDING POWER FROM EXTERNAL 5V POWER
SUPPLY
The evaluation board can also be powered by an independent
external 5.0V power supply via header P1 as highlighted on
Figure 4. The maximum current consumption for the board
including the voltage regulators, microcontroller circuits and the
IC together is approximately 245mA with all channels active.
• The impedance select function
• The variable detection threshold
• Controlling the equalizer boost via control pins
QLx4600-S30 Evaluation Board
The QLx4600-S30 evaluation board is a 4-layer,
4”(w)x5.6”(h)x0.059”(t) in dimension, and fabricated with
(Allied-Signal) FR-408 dielectric material. 100Ω differential
signal traces are laid out with 0.0062” width and 0.0058”
spacing. 50Ω single-ended traces are 0.009” wide. Figure 3
shows the top view of the board.
FIGURE 4. QLX4600-S30 EVALUATION BOARD EXTERNAL POWER
SUPPLY POWER CONNECTOR
Table 1 provides description of the connector P1. A power cable
is provided with the evaluation board.
TABLE 1. P1 CONNECTOR DESCRIPTION
8 – NC
7 – NC
6 – 5.0V
5 – 5.0V
4 – NC
3 – NC
2 – GND
1 – GND
High Speed Data_I/O Interface Connectors
There are sixteen SMA connectors on the board, eight for the CML
differential inputs and eight for the CML differential outputs. All the
connections from the SMA connectors to the QLx4600-S30 series
chip are AC-coupled with a 220nF broadband capacitor. Figure 5 on
page 3 shows each channel by their name, direction and their
polarities.
Detection Threshold (DT)
The DT is another very important feature of the QLx4600-S30
series IC. On the evaluation board, the DT can be changed by
adjusting the potentiometer VR1 (Figure 6 on page 3).
In normal operation, the potentiometer should be set so that the
voltage across the adjacent 10k resistor is 0V.
For applications that need to adjust this level, it can be simply
done by changing the potentiometer and reading the voltage
across the 10k resistor in order to infer the current coming from
the DT pin.
FIGURE 3. QLX4600-S30 EVALUATION BOARD PCB OUTLINE
Power Supply
For example, measuring a voltage of -200mV across the 10k
resistor indicates a 20µA current from the DT pin.
Power can be supplied to the board by using an external power
supply. On-board voltage regulators supply the appropriate 1.2V
to the QLx4600-S30 IC.
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Application Note 1513
FIGURE 5. QLX4600-S30 EVALUATION BOARD RF-I/O INTERFACE
DT POTENTIOMETER
10k RESISTOR
FIGURE 6. QLX4600-S30 EVALUATION BOARD DT POTENTIOMETER
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Application Note 1513
IS1
IS2
IS4
IS3
FIGURE 7. QLX4600-S30 EVALUATION BOARD IMPEDANCE SELECT
Impedance Select
Two 3x2 headers, JP4 and JP5, provide interfaces to the
“impedance select” pins of the QLx4600-S30 series ICs. With this
function, the user can put any equalizer channel into a standby or
reset state by placing a jumper across the header for the
selected channel. When in the reset state, the single-ended input
impedance of the equalizer channel goes in excess of 200kΩ
(from its nominal value of 50Ω) to indicate to a transmitter that
the receiver channel is down and not passing data. Additionally,
power consumption for a channel is reduced when in the standby
state.
TABLE 2. DESCRIBES JP4 AND JP5 CONNECTIVITY
JP4
JP5
2 - IS1
4 - IS2
6 - GND
2 - Mode
4 - IS4
6 - IS3
1 - GND
3 - GND
5 - GND
1 - GND
3 - GND
5 - GND
Boost Setting Control Pins
In order to enable boost setting control via the control pins,
JP5-Pin 2 must be jumpered to ground.
The boost setting configuration (compensation setting) for each
individual equalizer channel is done through a 3x3 header. There
are four sets of headers, one for each equalizer channel. Figure 8
illustrates the location of the headers.
FIGURE 8. EQUALIZER BOOST CONTROL HEADERS
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Application Note 1513
The notation CP[1-4]_[A – C] refers to the QLx4600-S30 quad
equalizer CPs. They are associated with the 4 channels 3-digit
number where ‘A’ is the MSB and ‘C’ is the LSB. Table 3 describes
the relationship between the CPs and the equalizer boost setting.
Bit A can only take one of two values, either Low (L) or High (H),
while bit B and C can take one of three values, Low (L), Middle
(M) and High (H). Hence, eighteen of the thirty-two different boost
levels are accessible through the CPs for each equalizer channel.
For Channels 3 and 4, we use headers JP1-3 in a similar fashion
except High is achieved using the bottom two pins and middle is
achieved by using the top two pins. Figure 10 illustrates how one
could set the CPs for a boost value of 18 (H, L, M) on Channel 3
and a value of 14 (L, H, M) on Channel 4.
On Figure 10 please also note how pin 2 on JP5 is jumpered to
ground in order to enable the CP control feature.
TABLE 3. CP AND EQUALIZER BOOST SETTING RELATIONSHIP
CP[1-4]_A
CP[1-4]_B
CP[1-4]_C
BOOST
L
L
L
0
L
L
M
2
L
L
H
4
L
M
L
6
L
M
M
8
L
M
H
10
L
H
L
12
L
H
M
14
L
H
H
15
H
L
L
16
H
L
M
17
H
L
H
19
H
M
L
21
H
M
M
23
H
M
H
24
H
H
L
26
H
H
M
28
H
H
H
31
FIGURE 10. ILLUSTRATION OF SETTINGS FOR CP3 = (H, L, M) AND
CP4 = (L, H, M)
For Channels 1 and 2, the headers JP6-8 are used to set the CPs.
High state is achieved by placing a jumper between the top two
pins of the header and the middle state is achieved by placing a
jumper between the bottom two pins. Low state is simply
achieved by using no jumper at all. Figure 9 illustrates how one
could set the CPs for a QLx4600-S30 Series IC boost value of 21
(H, M, L) on Channel 1 and a boost of 16 (H, L, L) on Channel 2.
FIGURE 9. ILLUSTRATION OF SETTINGS FOR CP1 = (H, M, L) AND
CP2 = (H, L, L)
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Evaluation Board Schematic
6
Application Note 1513
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FIGURE 11. SCHEMATIC OF THE QLX4600-S30 EVALUATION BOARD
Application Note 1513
QLx4600-S30 Bill of Materials
MANUFACTURER
PART
REFERENCE
DESIGNATOR
QTY UNITS
DESCRIPTION
MANUFACTURER
EBL4XXXEVALZREVAPCB
1
ea
SEE LABEL-RENAME BOARD
PWB-PCB, EBL4XXXEVALZ, REVA, ROHS
IMAGINEERING INC
MBB0502Y224MGP5N8
- (GLOBAL PN)
16
ea
C5-C20
CAP-BURIED, SMD, 0502, 220nF/82pF, 16V,
+22-82%, Y5V, ROHS
PRESIDO
COMPONENTS
GRM1555C1H101JZ01D
6
ea
C22, C23, C24, C25, C26, C27
CAP, SMD, 0402, 100pF, 50V, 5%, C0G, ROHS
MURATA
18
ea
C1, C38, C1A-C16A
CAP, SMD, 0402, 0.01µF, 16V, 10%, X7R, ROHS TDK
ECJ-0EF0J105Z
2
ea
C36, C37
CAP, SMD, 0402, 1µF, 6.3V, +80-20%, Y5V,
ROHS
PANASONIC
LMK105F224ZV-F
6
ea
C40, C41, C42, C43, C44, C45
CAP, SMD, 0402, 0.22µF, 10V, +80-20%, Y5V,
ROHS
TAIYO YUDEN
TA016TCR106KBR
6
ea
C3, C4, C33, C34, C34A, C39
CAP, TANT, SMD, B, 10µF, 16V, 10%, ROHS
VENKEL
LQH31CN2R2M03L
4
ea
L1, L2, L3, L4
COIL-INDUCTOR, CHOKE, SMD, 1206, 2.2µH,
20%, 430mA, ROHS
MURATA
10-89-7062
6
ea
JP1, JP2, JP4, JP5, JP6, JP7 -SEE CONN-HEADER, 2x3, BRKAWY, 2.54mm,
LABEL-GENERIC.
0.330x.107, ROHS
MOLEX
10-89-7082
2
ea
JP10, P1 NOTE: Cut keying pin on CONN-HEADER, 2x4, BRKAWY, 2.54mm,
P1 per DWG.#1.
0.330x.107, ROHS
MOLEX
22-28-4063
3
ea
JP3, JP8, P9 NOTE: Cut keying pin CONN-HEADER, 1x6, BRKAWY, 2.54mm,
on P9 per DWG.#1.
0.240x.125, ROHS
MOLEX
221789-1
16
ea
J1-J16 *(SEE ASSEMBLY-NOTE)
CONN-RF, SMA JACK, PCB MNT, 50Ω, GOLD,
ROHS
AMP/TYCO
SPC02SYAN
12
ea
BAG and SHIP W/BOARD
CONN-JUMPER, SHORTING, 2PIN, BLACK,
GOLD, ROHS
SULLINS
UX60-MB-5ST
1
ea
P8
CONN-RECEPTACLE, SMD, MINI USB 2.0, 5POS, HIROSE ELECTRIC
ROHS
597-3311-407F
1
ea
LED1
LED, SMD, 1206, GREEN, 75mW, 3mcd,
PbFREE
DIALIGHT
CY8C24894-24LFXI
1
ea
U4
IC-PSoC MICROCONTROLLER, 8-BIT, 24MHz,
56P, QFN, ROHS
CYPRESS
SEMICONDUCTOR
LM1117MP-ADJ/NOPB
2
ea
U2, U3
IC- ADJ. LDO REGULATOR, 3P, SOT-223, 800mA, NATIONAL
ROHS
SEMICONDUCTOR
QLX4600SIQSR
1
ea
U1
IC-QLX4600-SI30, QUAD LANE EXTENDER, 46P, INTERSIL
QFN, ROHS
SN65220DBVR
1
ea
U5
IC-SINGLE USB PORT TVS, SMD, 6P, SOT-23-6,
ROHS
TEXAS
INSTRUMENTS
2SC248000L
1
ea
Q1
TRANSISTOR, NPN, SMD, SC-59, 3P, 30V,
50mA, 150mW, ROHS
PANASONIC
CT94EW102
1
ea
VR1
POT-TRIM, TH, 3P, 1k, 1/2W, 10%, 18TURN,
TOP ADJ., ROHS
COPAL ELECTRONICS
CR0402-16W-1001FT
6
ea
R7, R8, R9, R26, R27, R28
RES, SMD, 0402, 1k, 1/16W, 1%, TF, ROHS
VENKEL
ERJ-2RKF1002X
6
ea
R11, R12, R13, R14, R15, R42
RES, SMD, 0402, 10k, 1/16W, 1%, TF, ROHS
PANASONIC
ERJ-2RKF1100X
1
ea
R18
RES, SMD, 0402, 110Ω, 1/16W, 1%, TF, ROHS PANASONIC
CR0402-16W-1501FT
3
ea
R3, R4, R5
RES, SMD, 0402, 1.5k, 1/16W, 1%, TF, ROHS
CR0402-16W-1800FT
1
ea
R19
RES, SMD, 0402, 180Ω, 1/16W, 1%, TF, ROHS VENKEL
CR0402-16W-2552FT
12
ea
R30-R41
RES, SMD, 0402, 25.5k, 1/16W, 1%, TF, ROHS VENKEL
CR0402-16W-3901FT
2
ea
R1, R6
RES, SMD, 0402, 3.9k, 1/16W, 1%, TF, ROHS
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VENKEL
VENKEL
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Application Note 1513
QLx4600-S30 Bill of Materials (Continued)
MANUFACTURER
PART
REFERENCE
DESIGNATOR
QTY UNITS
DESCRIPTION
MANUFACTURER
CR0402-16W-6041FT
1
ea
R10
RES, SMD, 0402, 6.04k, 1/16W, 1%, TF, ROHS VENKEL
CR0402-16W-6800FT
1
ea
R29
RES, SMD, 0402, 680Ω, 1/16W, 1%, TF, ROHS VENKEL
CR0603-10W-000T
1
ea
D1
RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS
2841/1-100-BLK (TEFLON)
0.25
in
VR2 - Wire jumper from pin 2 to
pin 3.
WIRE, 30AWG, SOLID T.C., INSULATED, BLACK, ALPHA WIRE
ROHS
WIREDPOWERCABLE1ZFG
1
ea
BAG and SHIP W/BOARD
CABLE-FG, WIREDPOWERCABLE1Z, ROHS
INTERSIL
SJ-5003SPBL
4
ea
Bottom four corners.
BUMPONS, 0.44inW x 0.20inH, DOMETOP,
BLACK
3M
212403-013
1
ea
Place assy in bag.
BAG, STATIC, 5x8, ZIPLOC, ROHS
INTERSIL
1
ea
ASSEMBLY NOTE
J1-J16 - Ignore silkscreen on
component side of PCB. Mount
SMA's on solder side (bottom) of
PCB. Cut SMA post ends flush
with the PCB.
0
ea
C35
DO NOT POPULATE OR PURCHASE
0
ea
JP11
DO NOT POPULATE OR PURCHASE
0
ea
JP9
DO NOT POPULATE OR PURCHASE
0
ea
R20, R23, R24, R25
DO NOT POPULATE OR PURCHASE
1
ea
P1, P9
See attached drawing for visual and/or manual INTERSIL
instruction.
1
ea
Place a LABEL marked H_M, in a LABEL, GENERIC
vertical position between JP2
and JP5 so the “H” is located at
the bottom and the “M” is at the
top when looking at the label
after installation.
LABEL-RENAME BOARD
1
ea
RENAME PCB TO: EBL4600CIEVALZ.
LABEL-SERIAL NUMBER
1
ea
DWG#1_EBL4XXX_KEYPIN_CUT
About Q:ACTIVE™
Intersil has long realized that to enable the complex server
clusters of next generation datacenters, it is critical to manage
the signal integrity issues of electrical interconnects. To address
this, Intersil has developed its groundbreaking Q:ACTIVE™
product line. By integrating its analog ICs inside cabling
interconnects, Intersil is able to achieve unsurpassed
improvements in reach, power consumption, latency and cable
gauge size as well as increased airflow in tomorrow’s
datacenters. This technology transforms passive cabling into
intelligent “roadways” that yield lower operating expenses and
capital expenditures for the expanding data center.
VENKEL
LABEL, TO RENAME BOARD
INTERSIL
LABEL-SERIAL #, LINE 1 = YRWK/REV#/SN;
LINE 2 = BOM NAME
INTERSIL
Intersil lane extenders allow greater reach over existing cabling
while reducing the need for thicker cables. This significantly
reduces cable weight and clutter, increases airflow and improves
power consumption.
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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