ESD8V0R1B-02LS Data Sheet (609 KB, EN)

ESD8V0R1B...
Bi-directional Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): ±18 kV (air) ±15 kV (contact)
IEC61000-4-4 (EFT): 40 A (5 / 50 ns)
• Extremely small form factor down to
0.62 x 0.32 x 0.31 mm³ (0201)
• Max. working voltage: −8 / +14 V
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.2 nH typ.
• Low capacitance of 4 pF typ.
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0R1B-02LS
ESD8V0R1B-02LRH
1
2
Type
ESD8V0R1B-02LRH
ESD8V0R1B-02LS
Package
TSLP-2-17
TSSLP-2-1
Configuration
1 line, bi-directional
1 line, bi-directional
1
Marking
E
E
2009-12-18
ESD8V0R1B...
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
ESD discharge1)
VESD
Value
Unit
kV
air
18
contact
15
Peak pulse current (tp = 8 / 20 µs)2)
I pp
1
A
Operating temperature range
T op
-55...150
°C
Storage temperature
T stg
-65...150
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
-8
-
14
I(BR) = 1 mA, from pin 2 to 1
14.5
17
20
I(BR) = 1 mA, from pin 1 to 2
8.5
11
14
-
<1
50
Characteristics
Reverse working voltage, from pin 2 to 1
VRWM
Breakdown voltage
V(BR)
Reverse current
IR
V
nA
VR = 3.3 V
Clamping voltage
V
VCL
IPP = 1 A, tP = 8/20 µs, from pin 2 to 1 2)
-
23
28
IPP = 1 A, tP = 8/20 µs, from pin1 to 2 2)
-
17
22
-
4
7
Line capacitance
CT
pF
VR = 0 V, f = 1 MHz
Series inductance
LS
nH
ESD8V0R1B-02LS
-
0.2
-
ESD8V0R1B-02LRH
-
0.4
-
1V
ESD according to IEC61000-4-2
2I
pp according to IEC61000-4-5
2
2009-12-18
ESD8V0R1B...
Power derating curve Ppk = ƒ (TA)
Non-repetitive peak pulse power
Ppk = ƒ (tp)
10 3
110
%
W
P pk or I pp
P pk
90
D= 0
D= .005
D= .01
D= .02
D= .05
D= .1
D= .2
D= .5
10 2
10 1
80
70
60
50
40
30
20
10
10 0 -8
-7
-6
-5
-4
-3
-2
10
10
10
10
10
10
10
s
10
0
0
0
25
50
75
100
°C
tp
150
TA
Reverse current IR = ƒ(VR)
Diode capacitance CT = ƒ (VR)
f = 1MHz
TA = Parameter
10 1
7
pF
nA
TA = 85°C
5
IR
CT
10 0
4
TA = 25°C
3
10 -1
2
1
10 -2
0
2
4
6
8
10
V
0
0
14
VR
2
4
6
8
10
12
V
15
VR
3
2009-12-18
ESD8V0R1B...
Connector
Application example ESD8V0R1B...
1 line, bi-directional
Protected data line with signal levels
-8V up to +14V (bi-directional)
I/O
ESD
sensitive
device
2
1
The protection diode should be placed
very close to the location where the ESD
or other transients can occur to keep
loops and inductances as small as
possible.
Pin 1 should be connected directly to a
ground plane on the board .
4
2009-12-18
TSLP-2-17 (mm)
ESD8V0R1B...
Package Outline
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1
1
0.25 ±0.035 1)
2
1±0.05
0.65 ±0.05
2
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.35
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Stencil apertures
Marking Layout (Example)
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
Cathode
marking
8
1.16
4
0.76
5
2009-12-18
TSSLP-2-1 (mm)
6
ESD8V0R1B...
2009-12-18
ESD8V0R1B...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office ( <www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
7
2009-12-18
Similar pages