Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D102
BAP51-04W
General purpose PIN diode
Preliminary specification
2002 Feb 19
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
FEATURES
PINNING
• Two elements in series configuration in a small SMD
plastic package
PIN
• Low diode capacitance
• Low diode forward resistance.
DESCRIPTION
1
anode
2
cathode
3
common connection
APPLICATIONS
handbook, halfpage
3
3
• General RF applications.
1
2
DESCRIPTION
1
Two planar PIN diodes in series configuration in a SOT323
small SMD plastic package.
2
Top view
MAM391
Marking code: W6-
Fig.1 Simplified outline (SOT323) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per diode
VR
continuous reverse voltage
−
50
V
IF
continuous forward current
−
50
mA
Ptot
total power dissipation
−
240
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−65
+150
°C
2002 Feb 19
Ts = 90 °C
2
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Per diode
−
VF
forward voltage
VR
reverse voltage
IR = 10 µA
50
−
−
V
IR
reverse current
VR = 50 V
−
−
100
nA
Cd
diode capacitance
VR = 0; f = 1 MHz
−
0.4
−
pF
VR = 1 V; f = 1 MHz
−
0.3
0.55
pF
rD
diode forward resistance
IF = 50 mA
0.95
1.1
V
VR = 5 V; f = 1 MHz
−
0.2
0.35
pF
IF = 0.5 mA; f = 100 MHz; note 1
−
5.5
9
Ω
IF = 1 mA; f = 100 MHz; note 1
−
3.6
6.5
Ω
IF = 10 mA; f = 100 MHz; note 1
−
1.5
2.5
Ω
τL
charge carrier life time
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω;
measured at IR = 3 mA
−
550
−
ns
LS
series inductance
IF = 10 mA; f = 100 MHz
−
1.6
−
nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
2002 Feb 19
PARAMETER
thermal resistance from junction to soldering point
3
VALUE
UNIT
250
K/W
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
GRAPHICAL DATA
MLD507
102
handbook, halfpage
MLD508
500
Cd
handbook, halfpage
rD
(Ω)
(fF)
400
10
300
200
1
100
10−1
10−1
10
1
IF (mA)
0
102
4
0
12
16
20
VR (V)
f = 100 MHz; T j = 25 °C.
f = 100 MHz; T j = 25 °C.
Fig.2
Fig.3
Forward resistance as a function of forward
current; typical values.
MGS659
Diode capacitance as a function of reverse
voltage; typical values.
MLD509
0
0
handbook, halfpage
s 2
handbook, halfpage
|S | 2
21
(dB)
−10
21
(dB)
−0.5
(1)
(2)
(3)
−1
−20
−1.5
−30
−2
−40
−2.5
0.5
8
1
1.5
2
−50
0.5
3
2.5
f (GHz)
1
1.5
2
2.5
f (GHz)
3
(1) I F = 10 mA.
(2) I F = 1 mA
(3) I F = 0.5 mA
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Diode inserted in series with a 50 Ω stripline circuit and biased via the
analyzer Tee network. T amb = 25 °C.
Fig.4
T amb = 25 °C.
Insertion loss (|s21|2) of the diode as a
function of frequency; typical values.
2002 Feb 19
Fig.5
4
Isolation (|s21|2) of the diode as a function of
frequency; typical values.
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT323
D
E
B
A
X
HE
y
v M A
3
Q
A
A1
c
1
2
e1
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
SOT323
2002 Feb 19
REFERENCES
IEC
JEDEC
EIAJ
SC-70
5
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury.
Philips Semiconductors customers using or selling these
products for use in such applications do so at their own
risk and agree to fully indemnify Philips Semiconductors
for any damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in
the Characteristics sections of the specification is not
implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or
title under any patent, copyright, or mask work right to
these products, and makes no representations or
warranties that these products are free from patent,
copyright, or mask work right infringement, unless
otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will
be suitable for the specified use without further testing or
modification.
2002 Feb 19
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613512/01/pp7
Date of release: 2002
Feb 19
Document order number:
9397 750 09456
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