DATASHEET

EL6208
®
Data Sheet
August 10, 2007
Dual Push-Pull Laser Driver Oscillator
Features
The EL6208 is a dual push-pull
oscillator used to reduce laser noise in
twin laser diodes. It uses the standard
interface to existing ROM controllers. The frequency and
amplitude are both set with a separate resistor connected to
ground. The tiny package and harmonic reduction allow the
part to be placed close to a laser with low RF emissions. An
auto turn-off feature allows activates the oscillator only when
the APC current is applied.
• Low power dissipation
If the APC current is reduced such that the average laser
voltage drops to less than 1.1V, the output and oscillator are
disabled, reducing power consumption to a minimum.
The current drawn by the oscillator consists of a small utility
current, plus the peak output amplitude in the positive cycle.
In the negative cycle the oscillator subtracts peak output
amplitude from the laser APC current. The waveform is
filtered to reduce EMI emissions.
The EL6208 operates from a signal +5V supply. Power
consumption is very low. The EL6208 part is available in the
space-saving 6 Ld SOT-23 package and is specified for
operation from 0°C to +70°C.
Ordering Information
PART
NUMBER
PART
MARKING
• User-selectable frequency from 60MHz to 600MHz
controlled with a single resistor
• User-specified amplitude from 10mAP-P to
100mAP-P controlled with a single resistor
• Auto turn-off threshold
• Soft edges for reduced EMI
• Small 6 Ld SOT-23 package
• Pb-free available (RoHS compliant)
Applications
• CD-DVD ROM drives
Pinout
EL6208
(6 LD SOT-23)
TOP VIEW
VDD 1
RFREQ 2
RAMP 3
PACKAGE
FN7374.1
6 IOUT2
5 GND
4 IOUT1
PKG.
DWG. #
EL6208CW
7
6 Ld SOT-23 MDP0038
EL6208CW-T7*
7
6 Ld SOT-23 MDP0038
EL6208CW-T7A*
7
6 Ld SOT-23 MDP0038
EL6208CWZ
BPAA
6 Ld SOT-23 MDP0038
(Pb-free)
EL6208CWZ-T7*
BPAA
6 Ld SOT-23 MDP0038
(Pb-free)
EL6208CWZ-T7A* BPAA
6 Ld SOT-23 MDP0038
(Pb-free)
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach
materials and 100% matte tin plate PLUS ANNEAL - e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003, 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL6208
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Voltages Applied to:
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
RFREQ, RAMP . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
Operating Ambient Temperature Range . . . . . . . . . . . 0°C to +70°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mAP-P
Power Dissipation (max) . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
VOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2V to 3V
RFREQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3KΩ (min)
RAMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25kΩ (min)
fOSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60MHz to 600MHz
IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10mAP-P to 100mAP-P
CAUTION:Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Supply and Reference Voltage Characteristics VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 5210Ω (fOSC = 360MHz),
RAMP = 2540Ω (IOUT = 50mAP-P measured at 60MHz), VOUT = 2.2V
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 1)
TYP
4.5
MAX
(Note 1)
UNIT
5.5
V
PSOR
Power Supply Operating Range
ISO
Supply Current Disabled
VOUT < VCUTOFF
280
440
µA
ISTYP
Supply Current Typical Conditions
RFREQ = 5.21kΩ, RAMP = 2.54kΩ
20
23
mA
ISLO
Supply Current Low Conditions
RFREQ = 18.2kΩ, RAMP = 12.7kΩ
5.4
mA
ISHI
Supply Current High Conditions
RFREQ = 3.3kΩ, RAMP = 1.27kΩ
36.8
mA
VFREQ
Voltage at RFREQ Pin
1.27
V
VRAMP
Voltage on RAMP Pin
1.27
V
VCUTOFF
Monitoring Voltage of IOUT Pin
1.1
1.4
V
Oscillator Characteristics VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 5210Ω (FOSC = 360MHz), RAMP = 2540Ω (IOUT = 50mAP-P
measured at 60MHz), VOUT = 2.2V
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 1)
TYP
MAX
(Note 1)
UNIT
310
358
400
MHz
fOSC
Frequency Tolerance
Unit-unit frequency variation
fHIGH
Frequency Range High
RFREQ = 3.3kΩ
566
MHz
fLOW
Frequency Range Low
RFREQ = 18.2kΩ
100
MHz
TCOSC
Frequency Temperature Sensitivity
0°C to +70°C ambient
50
ppm/°C
PSRROSC
Frequency Change ΔF/F
VDD from 4.5V to 5.5V
1
%
Driver Characteristics
PARAMETER
VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 30.5kW (fOSC = 60MHz), RAMP = 2540Ω (IOUT = 50mAP-P
measured at 60MHz), VOUT = 2.2V
DESCRIPTION
CONDITIONS
MIN
(Note 1)
TYP
MAX
(Note 1)
UNIT
AMPHIGH
Amplitude Range High
RAMP = 1.27kΩ
100
mAP-P
AMPLOW
Amplitude Range Low
RAMP = 12.7kΩ
10
mAP-P
IOSNOM
Offset Current @ 2.2V
RFREQ = 5210Ω, VOUT = 2.2V
-4
mA
IOSHIGH
Offset Current @ 2.8V
RFREQ = 5210Ω, VOUT = 2.8V
-4.8
mA
2
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August 10, 2007
EL6208
Driver Characteristics
PARAMETER
VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 30.5kW (fOSC = 60MHz), RAMP = 2540Ω (IOUT = 50mAP-P
measured at 60MHz), VOUT = 2.2V (Continued)
DESCRIPTION
CONDITIONS
IOSLOW
Offset Current @ 1.8V
RFREQ = 5210Ω, VOUT = 1.8V
IOUTP-P
Output Current Tolerance
Duty Cycle
MIN
(Note 1)
TYP
MAX
(Note 1)
UNIT
-3.5
mA
Defined as one standard deviation
2
%
Output Push Time/Cycle Time
RFREQ = 5210Ω
43
%
PSRRAMP
Amplitude Change of Output ΔI/I
VDD from 4.5V to 5.5V
-54
dB
tON
Auto Turn-on Time
Output voltage step from 0V to 2.2V
15
µs
tOFF
Auto Turn-off Time
Output voltage step from 2.2V to 0V
0.5
µs
IOUTN
Output Current Noise Density
RFREQ = 5210Ω, measured @ 10MHz
2.5
nA/√Hz
NOTES:
1. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
Pin Descriptions
PIN NAME
PIN TYPE
PIN DESCRIPTION
1
VDD
2
RFREQ
3
RAMP
Set pin for output current amplitude
4
IOUT1
Current output to laser diode
5
GND1
Chip ground pin (0V for output)
6
IOUT2
Current output to laser diode
Positive power for laser driver (4.5V to 5.5V)
Set pin for oscillator frequency
IOUT Control
VOUT
IOUT
Less than VCUTOFF
OFF
More than VCUTOFF
Normal Operation
3
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August 10, 2007
EL6208
Typical Performance Curves VDD = 5V, TA = +25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified.
400
8
TYPICAL
PRODUCTION
DISTORTION
7
NUMBER OF PARTS
NUMBER OF PARTS
500
300
200
100
MEASURED FROM
-40°C TO +85°C
6
5
4
3
2
FREQUENCY (MHz)
90
78
66
54
FIGURE 2. FREQUENCY DRIFT with TEMPERATURE
700
700
FREQ = 1824*1kΩ / RFREQ (MHz)
FREQ = 1824*1kΩ / RFREQ (MHz)
600
FREQUENCY (MHz)
600
500
400
300
200
500
400
300
200
100
100
0
0
0
5
10
15
20
25
30
0
35
0.05
0.10
0.15
0.20
0.25
0.30
0.35
1kΩ / RFREQ
RFREQ (kΩ)
FIGURE 4. FREQUENCY vs 1/RFREQ
FIGURE 3. FREQUENCY vs RFREQ
180
180
IOUT PK-PK MEASURED
@60/350/600MHz
(OVER-SHOOT INCLUDED)
140
120
AMPLITUDE P-P = 127 * 1kΩ /
RAMP (mA) MEASURED
@60MHz (OVER-SHOOT NOT
INCLUDED)
100
80
60
40
140
120
100
80
60
20
0
0
2
4
6
8
10
12
RAMP (kΩ)
FIGURE 5. OUTPUT CURRENT vs RAMP
4
14
IOUT P-P
MEASURED
@60/350/600MHz
40
20
0
AMPLITUDE P-P = 127 *
1kΩ / RAMP (mA)
MEASURED
@60MHz (OVER-SHOOT
NOT INCLUDED)
160
OUTPUT CURRENT (mA)
160
OUTPUT CURRENT (mA)
42
FREQUENCY TC (ppm/°C)
FIGURE 1. FREQUENCY DISTRIBUTION
FREQUENCY (MHz)
30
18
6
0
400
392
384
376
368
360
352
344
336
328
320
1
0
(OVER-SHOOT INCLUDED)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1kΩ / RAMP
FIGURE 6. OUTPUT CURRENT vs 1/RAMP
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August 10, 2007
EL6208
Typical Performance Curves VDD = 5V, TA = +25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified. (Continued)
50
45
RFREQ = 2.9kΩ
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
40
RAMP = 1kΩ
40
30
RAMP = 2.54kΩ
20
RAMP = 10kΩ
RAMP = 5kΩ
10
35
RFREQ = 5.21kΩ
30
25
RFREQ = 10kΩ
20
15
10
0
0
5
10
15
20
25
30
0
5
10
RFREQ (kΩ)
355
95
IOUT P-P (mA)
100
350
25
30
90
85
345
4.6
4.8
5.0
5.2
5.4
80
4.4
5.6
4.6
4.8
5.0
5.2
5.4
5.6
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 9. FREQUENCY vs SUPPLY VOLTAGE
FIGURE 10. PEAK-TO-PEAK OUTPUT CURRENT vs SUPPLY
VOLTAGE
400
FREQUENCY (MHz)
21
20
19
18
17
4.4
20
FIGURE 8. SUPPLY CURRENT vs RAMP
360
340
4.4
15
RAMP (kΩ)
FIGURE 7. SUPPLY CURRENT vs RFREQ
FREQUENCY (MHz)
RFREQ = 30kΩ
5
RAMP = 20kΩ
0
SUPPLY CURRENT (mA)
RFREQ = 20kΩ
380
360
340
320
4.6
4.8
5.0
5.2
5.4
5.6
SUPPLY VOLTAGE (V)
FIGURE 11. SUPPLY CURRENT vs SUPPLY VOLTAGE
5
300
-50
0
50
100
150
AMBIENT TEMPERATURE (°C)
FIGURE 12. FREQUENCY vs TEMPERATURE
7374.1
August 10, 2007
EL6208
Typical Performance Curves VDD = 5V, TA = +25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified. (Continued)
95
30
SUPPLY CURRENT (mA)
IOUT P-P (mA)
90
85
80
75
70
65
60
-50
0
50
100
25
20
15
10
-50
150
0
AMBIENT TEMPERATURE (°C)
100
150
AMBIENT TEMPERATURE (°C)
FIGURE 13. PEAK-TO-PEAK OUTPUT CURRENT vs
TEMPERATURE
40mA
50
FIGURE 14. SUPPLY CURRENT vs TEMPERATURE
40mA
5ns
1ns
RFREQ = 5.21kΩ
RAMP = 2.54kΩ
RFREQ = 30.3kΩ
RAMP = 2.54kΩ
FIGURE 15. OUTPUT CURRENT @ 60MHz
FIGURE 16. OUTPUT CURRENT @ 350MHz
10
0.5ns
RELATIVE AMPLITUDE (dB)
40mA
RFREQ=3.03kΩ
RAMP=2.54kΩ
-10
-30
-50
-70
-90
340
344
348
352
356
360
FREQUENCY (MHz)
FIGURE 17. OUTPUT CURRENT @ 600MHz
6
FIGURE 18. OUTPUT SPECTRUM - WIDEBAND
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August 10, 2007
EL6208
Block Diagram
VDD 1
OSCILLATOR
DRIVER
6 IOUT1
RFREQ 2
AUTO SHUTOFF
RAMP 3
5 GND
4 IOUT1
DRIVER
Typical Application Diagram
TWIN
ROM LASER
DRIVER
EMI
REDUCTION
FILTERS
IAPC2
GAIN
SETTING
RESISTORS
FREQUENCY
SETTING
RESISTOR
BEAD
PNP
BEAD
LASER DIODE
+5V
1 VDD
IOUT2 6
RFREQ
2 RFREQ
4.7µF
LASER
POWER
CONTROL
0.1µF
0.1µF
GND 5
RAMP
LASER DIODE
3 RAMP
IOUT1 4
AMPLITUDE
SETTING
RESISTOR
GND
MAIN BOARD
BEAD
PNP
0.1µF
PHOTO DIODE
FLEX
ON PICKUP
Typical Waveforms
~10mW
LASER
OUTPUT
POWER
THRESHOLD
CURRENT
LASER
OUTPUT
POWER
IAPC
0mW
0mA
~60mA
LASER CURRENT
OSCILLATOR
CURRENT
7
7374.1
August 10, 2007
EL6208
Applications Information
Product Description
The EL6208 is a solid state, low-power, high-speed laser
modulation oscillator with external resistor-adjustable
operating frequency and output amplitude. It is designed to
interface easily to laser diodes to break up optical feedback
resonant modes and thereby reduce laser noise. The output
of the EL6208 is composed of a push-pull current source,
switched alternately at the oscillator frequency. The output
and oscillator are automatically disabled for power saving
when the average laser voltage drops to less than 1.1V. The
EL6208 has the operating frequency from 60MHz to
600MHz and the output current from 10mAP-P to 100mAP-P.
The supply current is only 18.5mA for the output current of
50mAP-P at the operating frequency of 350MHz.
Theory of Operation
A typical semiconductor laser will emit a small amount of
incoherent light at low values of forward laser current. But
after the threshold current is reached, the laser will emit
coherent light. Further increases in the forward current will
cause rapid increases in laser output power. A typical
threshold current is 35mA and a typical slope efficiency is
0.7mW/mA.
When the laser is lasing, it will often change its mode of
operation slightly, due to changes in current, temperature, or
optical feedback into the laser. In a DVD-ROM, the optical
feedback from the moving disk forms a significant noise
factor due to feedback-induced mode hopping. In addition to
the mode hopping noise, a diode laser will roughly have a
constant noise level regardless of the power level when a
threshold current is exceeded.
The oscillator is designed to produce a low noise oscillating
current that is added to the external DC current. The
effective AC current is to cause the laser power to change at
the oscillator frequency. This change causes the laser to go
through rapid mode hopping. The low frequency component
of laser power noise due to mode hopping is translated up to
sidebands around the oscillator frequency by this action.
Since the oscillator frequency can be filtered out of the low
frequency read and serve channels, the net result is that the
laser noise seems to be reduced. The second source of
laser noise reduction is caused by the increase in the laser
power above the average laser power during the pushingcurrent time. The signal-to-noise ratio (SNR) of the output
power is better at higher laser powers because of the almost
constant noise power when a threshold current is exceeded.
In addition, when the laser is off during the pulling-current
time, the noise is also very low.
RAMP and RFREQ Value Setting
The laser should always have a forward current during
operation. This will prevent the laser voltage from collapsing,
8
and ensure that the high frequency components reach the
junction without having to charge the junction capacitance.
Generally it is desirable to make the oscillator currents as
large as possible to obtain the greatest reduction in laser
noise. But it is not a trivial matter to determine this critical
value. The amplitude depends on the wave shape of the
oscillator current reaching the laser junction.
If the output current is sinusoidal, and the components in the
output circuit are fixed and linear, then the shape of the
current will be sinusoidal. But the amount of current reaching
the laser junction is a function of the circuit parasitics. These
parasitics can result in a resonant increase in output
depending on the frequency due to the junction capacitance
and layout. Also, the amount of junction current causing
laser emission is variable with frequency due to the junction
capacitance. In conclusion, the sizes of the RAMP and
RFREQ resistors must be determined experimentally. A good
starting point is to take a value of RAMP for a peak-to-peak
current amplitude less than the minimum laser threshold
current and a value of RFREQ for an output current close to a
sinusoidal wave form (refer to the “Typical Performance
Curves” on page 4).
RAMP and RFREQ Pin Interfacing
Figure 19 shows an equivalent circuit of pins associated with
the RAMP and RFREQ resistors. VREF is roughly 1.27V for
both RAMP and RFREQ. The RAMP and RFREQ resistors
should be connected to the non-load side of the power
ground to avoid noise pick-up. These resistors should also
return to the EL6208's ground very directly to prevent noise
pickup. They also should have minimal capacitance to
ground. Trimmer resistors can be used to adjust initial
operating points.
+
VREF
PIN
FIGURE 19. RAMP AND RFREQ PIN INTERFACE
External voltage sources can be coupled to the RAMP and
RFREQ pins to effect frequency or amplitude modulation or
adjustment. It is recommended that a coupling resistor of 1k
be installed in series with the control voltage and mounted
directly next to the pin. This will keep the inevitable highfrequency noise of the EL6208's local environment from
propagating to the modulation source, and it will keep
parasitic capacitance at the pin minimized.
Supply Bypassing and Grounding
The resistance of bypass-capacitors and the inductance of
bonding wires prevent perfect bypass action, and 150mVP-P
7374.1
August 10, 2007
EL6208
noise on the power lines is common. There needs to be a
lossy bead inductance and secondary bypass on the supply
side to control signals from propagating down the wires.
Figure 20 shows the typical connection.
0.1µF
CHIP
The supply current of the EL6208 depends on the peak-topeak output current and the operating frequency which are
determined by resistors RAMP and RFREQ. The supply
current can be predicted approximately by Equation 2:
GND
EL6208
FIGURE 20. RECOMMENDED SUPPLY BYPASSING
Also important is circuit-board layout. At the EL6208's
operating frequencies, even the ground plane is not
low-impedance. High frequency current will create voltage
drops in the ground plane. Figure 21 shows the output
current loops.
RFREQ
RAMP
SUPPLY
BYPASS
GND
SOURCING CURRENT LOOP
SINKING CURRENT LOOP
TJMAX = Maximum junction temperature
θJA = Thermal resistance of the package
+5V
0.1µF
CHIP
PDMAX = Maximum power dissipation in the package
TAMAX = Maximum ambient temperature
L SERIES: 70Ω REACTANCE AT 300MHz
VS
where:
LASER
DIODE
31.25mA × 1kΩ 30mA × 1kΩ
I SUP = ------------------------------------------- + ---------------------------------- + 0.6mA
R FREQ
R AMP
(EQ. 2)
The power dissipation can be calculated from Equation 3:
P D = V SUP × I SUP
(EQ. 3)
Here, VSUP is the supply voltage. Figures 22 and provide a
convenient way to see if the device will overheat. The
maximum safe power dissipation can be found graphically,
based on the package type and the ambient temperature. By
using the previous equation, it is a simple matter to see if PD
exceeds the device's power derating curve. To ensure
proper operation, it is important to observe the
recommended derating curve shown in Figures 22 and . A
flex circuit may have a higher θJA, and lower power
dissipation would then be required.
FIGURE 21. OUTPUT CURRENT LOOPS
For the pulling current loop, the current flows into the IOUT
pin, out of the ground pin, to the laser cathode, and from the
laser diode back to the IOUT pin. This loop should also be
small.
Power Dissipation
With the high output drive capability, the EL6208 is possible
to exceed the +125°C “absolute-maximum junction
temperature” under certain conditions. Therefore, it is
important to calculate the maximum junction temperature for
the application to determine if the conditions need to be
modified for the oscillator to remain in the safe operating
area.
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.6
POWER DISSIPATION (W)
For the pushing current loop, the current flows through the
bypass capacitor, into the EL6208 supply pin, out the IOUT
pin to the laser, and from the laser back to the decoupling
capacitor. This loop should be small.
488mW
0.5
6
0.4
θ
JA
Ld
=
0.3
+2
SO
56
T23
C/
W
0.2
0.1
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
The maximum power dissipation allowed in a package is
determined according to Equation 1:
T JMAX - T AMAX
P DMAX = --------------------------------------------Θ JA
(EQ. 1)
9
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August 10, 2007
EL6208
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
POWER DISSIPATION (W)
0.6
0.5 543mW
6
θ
JA
=
0.4
0.3
Ld
SO
+2
3
0
T2
C/
3
W
0.2
0.1
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
10
7374.1
August 10, 2007
EL6208
SOT-23 Package Family
MDP0038
e1
D
SOT-23 PACKAGE FAMILY
A
MILLIMETERS
6
N
SYMBOL
4
E1
2
E
3
0.15 C D
1
2X
2
3
0.20 C
5
2X
e
0.20 M C A-B D
B
b
NX
0.15 C A-B
1
3
SOT23-5
SOT23-6
TOLERANCE
A
1.45
1.45
MAX
A1
0.10
0.10
±0.05
A2
1.14
1.14
±0.15
b
0.40
0.40
±0.05
c
0.14
0.14
±0.06
D
2.90
2.90
Basic
E
2.80
2.80
Basic
E1
1.60
1.60
Basic
e
0.95
0.95
Basic
e1
1.90
1.90
Basic
L
0.45
0.45
±0.10
L1
0.60
0.60
Reference
N
5
6
Reference
D
2X
Rev. F 2/07
NOTES:
C
A2
2. Plastic interlead protrusions of 0.25mm maximum per side are not
included.
SEATING
PLANE
A1
0.10 C
1. Plastic or metal protrusions of 0.25mm maximum per side are not
included.
3. This dimension is measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
NX
5. Index area - Pin #1 I.D. will be located within the indicated zone
(SOT23-6 only).
(L1)
6. SOT23-5 version has no center lead (shown as a dashed line).
H
A
GAUGE
PLANE
c
L
0.25
0° +3°
-0°
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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11
7374.1
August 10, 2007
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