DATASHEET

ESIGNS
NEW D
R
O
F
D
DE
T PART
OMMEN REPLACEMEN
C
E
R
T
D
NO
ME N D E
B
R E C OM
ISL9211
DATASHEET
Charging System Safety Circuit
ISL9211A
Features
The ISL9211A is an integrated circuit (IC) optimized to provide a
redundant safety protection to a Li-ion battery charging system.
The IC monitors the input voltage, the battery voltage, and the
charge current. When any of the three parameters exceeds its
limit, the IC turns off an internal N-channel MOSFET to remove
the power from the charging system to the battery. In addition to
the above protected parameters, the IC also monitors its own
internal temperature and turns off the N-channel MOSFET when
the temperature exceeds +150°C. Together with the battery
charger IC and the protection module in a battery pack, the
charging system using the ISL9211A has triple-level protection
and is two-fault tolerant.
• 24V Max Input Voltage
The IC is designed to turn on the internal NFET slowly to avoid
inrush current at power up but will turn off the NFET quickly when
the input is overvoltage in order to remove the power before any
damage occurs. The ISL9211A has a logic flag output to indicate
a fault condition. The enable input allows the system to cut off
the input power if needed.
• Pb-Free (RoHS Compliant)
• Supports Up To 2.0A Input Current
• Fully Integrated Protection Circuit for Three Protected Variables
• High Accuracy Protection Thresholds
• User Programmable Overcurrent Protection Threshold
• Responds To Input Overvoltage in Less Than 1µs
• High Immunity of False Triggering Under Transients
• Fault Indication for Various Fault Occurrence
• Easy to Use
Applications
• Cell Phones
• Digital Still Cameras
• PDAs and Smart Phones
Related Literature
• Portable Instruments
• Desktop Chargers
• Technical Brief TB363 “Guidelines for Handling and Processing
Moisture Sensitive Surface Mount Devices (SMDs)”
• Technical Brief TB379 “Thermal Characterization of Packaged
Semiconductor Devices”
• Technical Brief TB389 “PCB Land Pattern Design and Surface
Mount Guidelines for QFN Packages”
INPUT
VIN
OUT
C1
C2
ISL9211A
ILIM
RVB
VB
EN
RILIM
ISL6292
BATTERY
CHARGER
DISA
ENA
GND
FAULT
BATT
PACK
FIGURE 1. TYPICAL APPLICATION CIRCUIT
November 5, 2014
FN6702.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2009, 2010, 2013, 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL9211A
Block Diagram
IN P U T
OUT
V IN
IS L 6 2 9 2
BATTERY
CHARGER
Q1
Q2
POR
P R E -R E G
REF
R1
FET
D R IV E R
CP1
R2
Q3
R IL IM
CP2
Submit Document Feedback
2
VB
CP3
R VB
R3
Q4
FAULT
EA
0 .8 V
L O G IC
1 .2 V
IL IM
R4
GND
EN
FN6702.3
November 5, 2014
ISL9211A
Pin Configuration
ISL9211A
(8 LD µTDFN)
TOP VIEW
VIN 1
8 OUT
GND 2
NC 3
7
PAD
FAULT 4
ILIM
6 VB
5 EN
Pin Descriptions
SYMBOL
PIN NUMBER
DESCRIPTION
VIN
1
The input power source. The VIN can withstand 24V input.
GND
2
System ground reference.
NC
3
No connection and must be left floating.
FAULT
4
FAULT is an open-drain logic output that turns LOW when any protection event occurs.
EN
5
IC enable pin. Pull this pin to LO to enable the device and pull it to HI to disable.
VB
6
Battery voltage monitoring input. This pin is connected to the battery pack positive terminal via an isolation resistor.
ILIM
7
Overcurrent protection threshold setting pin. Connect a resistor between this pin and GND to set the OCP threshold.
OUT
8
Output pin.
-
PAD
Exposed pad. Connect to system ground
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP RANGE
(°C)
PACKAGE
Tape and Reel
(Pb-free)
PKG.
DWG. #
ISL9211AIRU48XZ-T
4XE
-40 to +85
8 Ld µTDFN
L8.2x2B
ISL9211AIRU58XZ-T
5XX
-40 to +85
8 Ld µTDFN
L8.2x2B
ISL9211AIRU68XZ-T
6XX
-40 to +85
8 Ld µTDFN
L8.2x2B
ISL9211AIRU48EVZ
Evaluation Board
ISL9211AIRU58EVZ
Evaluation Board
ISL9211AIRU68EVZ
Evaluation Board
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu-Ag plate
- e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL9211A. For more information on MSL please see techbrief TB363.
Submit Document Feedback
3
FN6702.3
November 5, 2014
ISL9211A
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 26V
Output and VB Pin (OUT, VB) (Note 4) . . . . . . . . . . . . . . . . . . . . . -0.3V to 8V
Other Pins (ILIM, FAULT, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
ESD Rating
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 3kV
Machine Model (Tested per JESD22-A115-A) . . . . . . . . . . . . . . . . . 200V
Latch Up (Tested per JESD78B; Class II, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
8 Ld 2x2 µTDFN (Notes 5, 6). . . . . . . . . . . . .
98
37
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . .+150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3V to 24V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. The maximum voltage rating for the VB pin under continuous operating conditions is 5.5V. All other pins are allowed to operate continuously at the
absolute maximum ratings.
5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
MIN
(Note 8)
TYP
MAX
(Note 8)
UNITS
Rising
-
-
2.47
V
Falling
2.20
-
-
V
RILIM = 24.9k, EN = L
-
-
1000
µA
EN = H
-
80
-
µA
ISL9211ARU48
4.6
4.8
5.0
V
ISL9211ARU58
5.6
5.8
6.0
V
ISL9211ARU68
6.6
6.8
7.0
V
-
100
-
mV
ISL9211ARU48
4.55
-
-
V
ISL9211ARU58
5.55
-
-
V
ISL9211ARU68
6.55
-
-
V
-
-
1
µs
0.93
1.0
1.07
A
-
2.0
-
A
SYMBOL
TEST CONDITIONS
POWER-ON RESET
VIN Threshold
VPOR
VIN Bias Current
IVIN
PROTECTIONS
Input Overvoltage Protection
VOVP
Input OVP Hysteresis
Input OVP Falling Threshold
Input OVP Response Time (Note 7)
Overcurrent Protection
IOCP
VVB = 3V, RILIM = 24.9k
Maximum Output Current
IMAX
RILIM = 9.53k
Overcurrent Protection Blanking Time
BTOCP
-
180
-
µs
Battery Overvoltage Protection Threshold
VBOVP
4.25
4.34
4.40
V
-
30
-
mV
-
180
-
µs
-
-
20
nA
Battery OVP Threshold Hysteresis
Battery OVP Blanking Time
BTBOVP
VVB = 4.34V
VB Pin Leakage Current
Submit Document Feedback
4
FN6702.3
November 5, 2014
ISL9211A
Electrical Specifications
(Continued)
MIN
(Note 8)
TYP
MAX
(Note 8)
UNITS
Over-Temperature Protection Rising Threshold
-
150
-
°C
Over-Temperature Protection Falling Threshold
-
110
-
°C
EN Input Logic HIGH
1.5
-
-
V
EN Input Logic LOW
-
-
0.4
V
EN Internal Pull-down Resistor
-
200
-
k
PARAMETER
SYMBOL
TEST CONDITIONS
LOGIC
FAULT Output Logic Low
Sink 5mA current
-
0.4
0.8
V
FAULT Output Logic High Leakage Current
Pin Voltage = 4.2V
-
-
1.5
µA
Measured at 200mA
-
170
280
m
POWER MOSFET
On-Resistance (Note 7)
rDS(ON)
NOTES:
7. Limits should be considered typical and are not production tested.
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
Typical Application
INPUT
VIN
OUT
C1
C2
ISL9211A
ILIM
RVB
VB
DISA
EN
RILIM
ISL6292
BATTERY
CHARGER
ENA
GND
FAULT
BATT
PACK
TABLE 1. TYPICAL COMPONENT VALUES
PART
RILIM
RVB
C1,C2
Submit Document Feedback
5
DESCRIPTION
24.9k
200k to 1M
1µF/25V X5R ceramic capacitor
FN6702.3
November 5, 2014
ISL9211A
Typical Operating Performance The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 24.9k, RVB = 200k, Unless Otherwise Noted.
VIN(2V/div)
VIN (2V/DIV)
V
VIN(2V/div)
IN (2V/DIV)
OUT
(2V/DIV)
OUT(2V/div)
OUT
(2V/DIV)
OUT(2V/div)
LOAD
(200mA/DIV)
LoadCURRENT
Current(200mA/div)
FAULT (5V/DIV)
Fault(5V/div)
TIME - 4ms/DIV
FIGURE 2. CAPTURED WAVEFORMS FOR POWER-UP. THE OUTPUT
IS LOADED WITH A 10 RESISTOR
TIME - 20µs/DIV
FIGURE 3. CAPTURED WAVEFORMS WHEN THE INPUT VOLTAGE
STEPS FROM 5.5V TO 9.5V
V
VIN(2V/div)
IN (2V/DIV)
VIN
(2V/DIV)
VIN(2V/div)
OUT
(2V/DIV)
OUT(2V/div)
OUT
(2V/DIV)
OUT(2V/div)
FAULT (5V/DIV)
Fault(5V/div)
TIME - 2s/DIV
FIGURE 4. CAPTURED WAVEFORMS WHEN THE INPUT GRADUALLY
RISES TO THE INPUT OVERVOLTAGE THRESHOLD
VVIN(5V/div)
IN (5V/DIV)
FAULT (5V/DIV)
Fault(5V/div)
TIME - 4ms/DIV
FIGURE 5. TRANSIENT WHEN THE INPUT VOLTAGE STEPS FROM
6.5V TO 5.5V
VVIN(1V/div)
IN (1V/DIV)
VB
(1V/DIV)
VB(1V/div)
OUT
(2V/DIV)
OUT(2V/div)
FAULT
(2V/DIV)
Fault(2V/div)
TIME - 40µs/DIV
FIGURE 6. TRANSIENT WAVEFORMS WHEN INPUT STEPS FROM 0V
TO 9V
Submit Document Feedback
6
OUT
(1V/DIV)
OUT(1V/div)
FAULT
(2V/DIV)
Fault(2V/div)
TIME - 20s/DIV
FIGURE 7. BATTERY OVERVOLTAGE PROTECTION. THE IC IS
LATCHED OFF AFTER 16 COUNTS OF PROTECTION. VB
VOLTAGE VARIES BETWEEN 4.3V TO 4.5V
FN6702.3
November 5, 2014
ISL9211A
Typical Operating Performance The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 24.9k, RVB = 200k, Unless Otherwise Noted. (Continued)
VIN
(5V/DIV)
VIN(5V/div)
VVIN(5V/div)
IN (5V/DIV)
LOAD
CURRENT
Load
current
(2A/div) (2A/DIV)
LOAD CURRENT (2A/DIV)
Load current (2A/div)
FAULT
(2V/DIV)
Fault(2V/div)
FAULT
(2V/DIV)
Fault(2V/div
TIME - 1ms/DIV
TIME - 40µs/DIV
FIGURE 9. ZOOMED-IN VIEW OF FIGURE 8
FIGURE 8. POWER-UP WAVEFORMS WHEN OUTPUT IS SHORTCIRCUITED
5.85
2.52
2.48
5.80
RISING THRESHOLD
2.40
2.36
FALLING THRESHOLD
2.32
RISING THRESHOLD
5.75
VOVP (V)
VPOR (V)
2.44
5.70
2.28
FALLING THRESHOLD
5.65
2.24
2.20
-50
-30
-10
10
30
50
70
5.60
-50
90
-30
-10
FIGURE 10. VPOR vs TEMPERATURE
1.03
1.01
1.00
0.99
0.98
3.0V
90
0.984
0.982
0.980
0.978
0.976
0.974
0.96
10
30
50
70
90 110 130
TEMPERATURE (°C)
FIGURE 12. OVERCURRENT PROTECTION vs TEMPERATURE AT
VARIOUS INPUT VOLTAGES
Submit Document Feedback
70
0.986
4.3V
1.02
0.95
-50 -30 -10
50
0.988
5.0V
0.97
30
FIGURE 11. INPUT OVERVOLTAGE PROTECTION vs TEMPERATURE
ILIM PIN VOLTAGE (V)
OVERCURRENT PROTECTION (A)
1.04
10
TEMPERATURE (°C)
TEMPERATURE (°C)
7
0.972
-50 -30 -10
10
30
50
70
90 110 130
TEMPERATURE (°C)
FIGURE 13. ILIM PIN VOLTAGE vs TEMPERATURE
FN6702.3
November 5, 2014
ISL9211A
Typical Operating Performance The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 24.9k, RVB = 200k, Unless Otherwise Noted. (Continued)
350
3.0V
300
4.3V
rDS(ON) (mΩ)
250
200
150
5.0V
100
50
0
-50 -30 -10
10
30
50
70
90
110 130
TEMPERATURE (°C)
FIGURE 14. ON-RESISTANCE vs TEMPERATURE AT DIFFERENT INPUT VOLTAGES
Theory of Operation
The ISL9211A is an integrated circuit (IC) optimized to provide a
redundant safety protection to a Li-ion battery from charging
system failures. The IC monitors the input voltage, the battery
voltage, and the charge current. When any of the above three
parameters exceeds its limit, the IC turns off an internal
N-channel MOSFET to remove the power from the charging
system. In addition to the above protected parameters, the IC
also monitors its own internal temperature and turns off the
N-channel MOSFET when the temperature exceeds +150°C.
Together with the battery charger IC and the protection module in
a battery pack, the charging system has triple-level protection
from overcharging the Li-ion battery and is two-fault tolerant. The
ISL9211A protects up to 26V input voltage.
Power-Up
The ISL9211A has a power-on reset (POR) threshold of 2.47V
(max). Before the input voltage reaches the POR threshold, the
internal power NFET is off. Approximately 10ms after the input
voltage exceeds the POR threshold, the IC resets itself and
begins the soft-start. The 10ms delay allows any transients at the
input during a hot insertion of the power supply to settle down
before the IC starts to operate. The soft-start slowly turns on the
power NFET to reduce the inrush current as well as the input
voltage drop during the transition. The power-up sequence is
illustrated in Figure 2.
Input Overvoltage Protection (OVP)
The input voltage is monitored by the comparator CP1 in the
“Block Diagram” on page 2. CP1 has an accurate reference of
1.2V from the bandgap reference. The OVP threshold is set by the
resistive divider consisting of R1 and R2. When the input voltage
exceeds the threshold, the CP1 outputs a logic signal to turn off
the power NFET within 1µs (see Figure 3) to prevent the high
input voltage from damaging the electronics in the handheld
system. The hysteresis for the input OVP threshold is given in the
“Electrical Specifications” table on page 4. When the input
overvoltage condition is removed, the ISL9211A re-enables the
output by running through the soft-start, as shown in Figure 5.
Submit Document Feedback
8
Because of the 10ms second delay before the soft-start, the
output is never enabled if the input rises above the OVP threshold
quickly, as shown in Figure 6.
Battery Overvoltage Protection
The battery voltage OVP is realized with the VB pin. The
comparator CP3, as shown in the “Block Diagram” on page 2,
monitors the VB pin and issues an overvoltage signal when the
battery voltage exceeds the 4.34V battery OVP threshold. The
threshold has 30mV built-in hysteresis. The comparator CP3 has
a built-in 180µs blanking time to prevent any transient voltage
from triggering the OVP. If the OVP situation still exists after the
blanking time, the power NFET is turned off. The control logic
contains a 4-bit binary counter that if the battery overvoltage
event occurs 16 times, the power NFET is turned off permanently,
as shown in Figure 7. Recycling the input power will reset the
counter and restart the ISL9211A.
The resistor between the VB pin and the battery, RVB, as shown in
the “TYPICAL APPLICATION CIRCUIT” on page 1, is an important
component. This resistor provides a current limit in case the VB
pin is shorted to the input voltage under a failure mode. The VB
pin leakage current under normal operation is negligible to allow
a resistance of 200k to 1M be used.
Overcurrent Protection (OCP)
The current in the power NFET is limited to prevent charging the
battery with an excessive current. The current is sensed using the
voltage drop across the power FET after it is turned on. The
reference of the OCP is generated using a sensing FET Q2 (Mirror
to Q1), as shown in the “Block Diagram” on page 2. The current in
the sensing FET is forced to match the value programmed by ILIM
pin. The OCP threshold can be set with the resistor RLIM, as
shown in Table 2.
FN6702.3
November 5, 2014
ISL9211A
RLIM
(k)
OCP
(mA)
RLIM
(k)
OCP
(mA)
82.5
300
21
1200
61.9
400
19.1
1300
49.9
500
16.5
1400
41.2
600
15.4
1500
35.7
700
14
1600
31.6
800
12.4
1700
28
900
11.3
1800
24.9
1000
10.5
1900
22.6
1100
9.53
2000
The size of the power FET Q1 is 31,250 times the size of the
sensing FET. Therefore, when the current in the power FET is
31,250 times the current in the sensing FET, the drain voltage of
the power FET falls below that of the sensing FET. The
comparator CP2 then outputs a signal to turn off the power FET,
where the 0.8V is the regulated reference voltage at the ILIM pin.
The OCP comparator CP2 has a built-in 180µs delay to prevent
false triggering by transient signals. The OCP function also has a
4-bit binary counter that accumulates during an OCP event.
When the total count reaches 16, the power NFET is turned off
permanently until the input power is recycled or the enable pin is
toggled. Figures 8 and 9 illustrate the waveforms during the
power-up when the output is shorted to ground.
Internal Over-Temperature Protection
The ISL9211A monitors its own internal temperature to prevent
thermal failures. When the internal temperature reaches
+150°C, the IC turns off the N-channel power MOSFET. The IC
does not resume operation until the internal temperature drops
below +110°C.
Fault Indication Output
The FAULT pin is an open-drain output that indicates a LOW
signal when any of the three fault events happens. This provides
a signal to the microprocessor to take further action to enhance
the safety of the charging system.
Applications Information
The ISL9211A is designed to meet the “Lithium-Safe” criteria
when operating together with a qualified Li-ion battery charger.
The “Lithium-Safe” criteria requires the charger output to fall
within the green region shown in Figure 15 under normal
operating conditions and NOT to fall in the red region when there
is a single fault in the charging system. Taking into account the
safety circuit in a Li-ion battery pack, the charging system is
allowed to have two faults without creating hazardous conditions
for the battery cell. The output of the Li-ion charger, such as the
ISL6292C, has a typical I-V curve shown with the blue lines under
normal operation, which is within the green region. The function
of the ISL9211A is to add a redundant protection layer such that,
under any single fault condition, the charging system output does
not exceed the I-V limits shown with the red lines. As a result, the
Submit Document Feedback
9
charging system adopting the ISL9211A and the ISL6292C chip
set can easily pass the “Lithium-Safe” criteria test procedures.
The ISL9211A is a simple device that requires only three external
components, in addition to the ISL6292 charger circuit, to meet
the “Lithium-Safe” criteria, as shown in the “TYPICAL
APPLICATION CIRCUIT” on page 1. The selection of the current
limit resistor RILIM is given in “Overcurrent Protection (OCP)” on
page 8.
RVB Selection
The RVB prevents a large current from the VB pin to the battery
terminal, in case the ISL9211A fails. The recommended value
should be between 200k to 1M. With 200k resistance, the
worst case current flowing from the VB pin to the charger output
is shown in Equation 1, assuming the VB pin voltage is 24V under
a failure mode and the battery voltage is 4.2V.
 24V – 4.2V    200k  = 99A
(EQ. 1)
Such a small current can be easily absorbed by the bias current
of other components in the handheld system. Increasing the RVB
value reduces the worst case current, but at the same time
increases the error for the 4.34V battery OVP threshold.
The error of the battery OVP threshold is the original accuracy at
the VB pin given in the “Electrical Specifications” table on page 4
plus the voltage built across the RVB by the VB pin leakage
current. The VB pin leakage current is less than 20nA, as given in
the “Electrical Specifications” table on page 4. With the 200k
resistor, the worst-case additional error is 4mV and with a 1M
resistor, the worst-case additional error is 20mV.
1000
ISL9211A
LIMITS
CHARGE CURRENT (mA)
TABLE 2. RLIM VALUE vs OCP THRESHOLD
ISL6292C
LIMITS
0
1
3
2
4
5
6
BATTERY VOLTAGE (V)
FIGURE 15. LITHIUM-SAFE OPERATING REGIONS
Capacitor Selection
The input capacitor (C1 in the “TYPICAL APPLICATION CIRCUIT”
on page 1) is for decoupling. Higher value reduces the voltage
drop or the over-shoot during transients.
Two scenarios can cause the input voltage over-shoot. The first
one is when the AC adapter is inserted live (hot insertion) and the
second one is when the current in the power NFET of the
ISL9211A has a step-down change. Figure 16 shows an
equivalent circuit for the ISL9211A input. The cable between the
AC/DC converter output and the handheld system input has a
parasitic inductor. The parasitic resistor is the lumped sum of
FN6702.3
November 5, 2014
ISL9211A
various components, such as the cable, the adapter output
capacitor ESR, the connector contact resistance, and so on.
C1
L
R
AC/DC
ADAPTER
C2
ISL9211A
CABLE
HANDHELD SYSTEM
FIGURE 16. EQUIVALENT CIRCUIT FOR THE ISL9211A INPUT
During the load current step-down transient, the energy stored in
the parasitic inductor is used to charge the input decoupling
capacitor C2. The ISL9211A is designed to turn off the power
NFET slowly during the OCP and the battery OVP event. Because
of such design, the input over-shoot during those events is not
significant. During an input OVP, however, the NFET is turned in
less than 1µs and can lead to significant over-shoot. Higher
capacitance reduces the over-shoot.
The over-shoot caused by a hot insertion is not very dependent on
the decoupling capacitance value. Especially when ceramic type
capacitors are used for decoupling. In theory, the over-shoot can
rise up to twice of the DC output voltage of the AC adapter. The
actual peak voltage is dependent on the damping factor that is
mainly determined by the parasitic resistance (R in Figure 16).
In practice, the input decoupling capacitor is recommended to
use a 25V, X5R dielectric ceramic capacitor with a value between
0.1µF to 1µF.
The output of the ISL9211A and the input of the charging circuit
typically share one decoupling capacitor. The selection of that
capacitor is mainly determined by the requirement of the
charging circuit. When using the ISL6292 family chargers, a 1µF,
6.3V, X5R capacitor is recommended.
Layout Recommendation
The ISL9211A uses a thermal-enhanced TDFN package with an
exposed thermal pad at the bottom of the package. The layout
should include as much copper as possible beneath the exposed
pad on the component layer to improve thermal performance.
The exposed pad under the package should be connected to the
ground plane electrically as well as thermally. The vias should be
about 0.3mm to 0.33mm in diameter, use as many vias as
possible to fit in the exposed pad area.
Submit Document Feedback
10
FN6702.3
November 5, 2014
ISL9211A
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
January 29, 2014
FN6702.3
Page 3, updated note 2 for the ordering information to reflect the correct finish used.
November 22, 2013
FN6702.2
Page 3, added evaluation boards to “Ordering Information”.
Page 3, pinout and pin descriptions, changed ILIM to ILIM
Page 4, “Absolute Maximum Ratings” table, changed ILIM to ILIM
Page 9, paragraph after Table 2, changed ILIM to ILIM
May 5, 2010
FN6702.1
In Table 2 on page 9, changed layout from: 2 columns to 4 columns.
In “Electrical Specifications” table on page 4, changed the test conditions for “Maximum Output Current” from
“Rlim = 12.4k” to “Rlim = 9.53k”.
March 30, 2010
CHANGE
Converted to new Intersil template. Edits include:
Moved “Block Diagram” to page 2, “Pin Configuration” to page 3, “Ordering Information” to page 3 and
“TYPICAL APPLICATION CIRCUIT” on page 1.
Added MSL Note 3 and TB347 Note 1 to “Ordering Information” on page 3.
Converted “Pin Descriptions” to tabular format and moved after “Pin Configuration” on page 3.
Added Exposed Pad to “Pin Descriptions” on page 3.
Added PAD label to “Pin Configuration” on page 3.
Added “ESD Rating” on page 4. Added “Latch up” to page 4.
Moved “Parameters with MIN and Max..” in common conditions of “Electrical Specifications” table to Note 8 in
MIN MAX columns.
Removed the following from “Overcurrent Protection (OCP)” on page 9:
“The OCP threshold can be calculated using Equation 1:
ILIM = 0.8V/RILIM x 31250 - 25000/RILIM (EQ. 1)”
Added Table 2 to page 9 and following sentence to“Overcurrent Protection (OCP)” on page 9:
“The OCP threshold can be set with the resistor RLIM as shown in Table 2."
Added “Revision History” on page 11 .
April 2, 2009
FN6702.0
Initial Release
About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management
semiconductors. The company's products address some of the largest markets within the industrial and infrastructure, personal
computing and high-end consumer markets. For more information about Intersil, visit our website at www.intersil.com.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting
www.intersil.com/en/support/ask-an-expert.html. Reliability reports are also available from our website at
http://www.intersil.com/en/support/qualandreliability.html#reliability
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Submit Document Feedback
11
FN6702.3
November 5, 2014
ISL9211A
Package Outline Drawing
L8.2x2B
8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (µTDFN) WITH E-PAD
Rev 0, 04/08
2.00
A
6
PIN #1
INDEX AREA
B
6
PIN 1
INDEX AREA
8
1
0.50
2.00
1.60±0.050
EXP. DAP
(4X)
0.15
0.10 M C A B 0.25±0.050
( 8x0.30 )
0.90±0.050
EXP. DAP
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
( 8x0.20 )
PACKAGE
OUTLINE
0.10
C
0 . 55 MAX
( 8x0.30 )
C
BASE PLANE
SEATING PLANE
SIDE VIEW
( 6x0.50 )
1.60
C
2.00
C
( 8x0.25 )
0.08
0 . 2 REF
0.90
0 . 00 MIN.
2.00
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
Submit Document Feedback
12
FN6702.3
November 5, 2014
Similar pages