5962F7802302V

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
K
Add device type 02 and add vendor CAGE 27014. Change to one part-one
part number format. Technical changes to 1.3, 1.4, table I, and table II.
Change figure 2 to figure 3. Add figure 2. - mlp
91-04-19
M. A. Frye
L
Changes in accordance with N.O.R. 5962-R062-92. - jt
91-11-22
M. Poelking
M
Changes in accordance with N.O.R. 5962-R168-98. - drw
98-09-01
R. Monnin
N
Add radiation hardened information. Editorial changes throughout. - drw
99-05-12
R. Monnin
P
Make change to 3.2.5. Delete the radiation hardened circuit as specified in
figure 4. - ro
00-10-26
R. Monnin
R
Add case outline Z. - ro
01-05-02
R. Monnin
T
Redraw. Update drawing to current requirements. - drw
12-01-26
Charles F. Saffle
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
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SHEET
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REV STATUS
REV
T
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PMIC N/A
PREPARED BY
Joan M. Fisher
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
C. R. Jackson
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
N. A. Hauck
DRAWING APPROVAL DATE
79-02-02
REVISION LEVEL
T
MICROCIRCUIT, LINEAR, QUAD HIGH SPEED
DIFFERENTIAL LINE DRIVER, MONOLITHIC
SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
78023
1 OF 16
5962-E115-12
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
78023
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
E
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
02
Circuit function
26LS31
26F31
Quad, high speed, differential line driver
Quad, high speed, differential line driver
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
Outline letter
E
F
Z
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
GDFP1-G16
CQCC1-N20
Terminals
16
16
16
20
Package style
Dual-in-line
Flat pack
Flat pack with gullwing leads
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
2
1.3 Absolute maximum ratings. 1/
Power supply and input voltage ................................................................
Output voltage...........................................................................................
Storage temperature range .......................................................................
Lead temperature (soldering, 10 seconds) ...............................................
Maximum power dissipation (PD) ..............................................................
7.0 V dc
5.5 V dc
-65°C to +150°C
+300°C
450 mW 2/
Junction temperature (TJ) ......................................................................... +150°C
Thermal resistance, junction-to-case (θJC):
Device 01:
Case E ..............................................................................................
Case F ..............................................................................................
Case 2 ...............................................................................................
Device 02:
Case E ..............................................................................................
Cases F and Z ...................................................................................
Case 2 ...............................................................................................
Thermal resistance, junction-to-ambient (θJA):
Device 01:
Case E ..............................................................................................
Case F ..............................................................................................
Case 2 ...............................................................................................
Device 02:
Case E ..............................................................................................
Cases F and Z ...................................................................................
Case 2 ...............................................................................................
16°C/W
14°C/W
19°C/W
14°C/W
13°C/W
15°C/W
94°C/W derate above +25°C at 10.6 mW/°C
163°C/W derate above +25°C at 6.1 mW/°C
83°C/W derate above +25°C at 12 mW/°C
88°C/W derate above +25°C at 11.4 mW/°C
151°C/W derate above +25°C at 6.6 mW/°C
81°C/W derate above +25°C at 12.3 mW/°C
1.4 Recommended operating conditions.
Supply voltage range (VCC) ...................................................................... 4.5 V dc to 5.5 V dc
Minimum high-level input voltage (VIH) ..................................................... 2.0 V dc
Maximum low-level input voltage (VIL) ...................................................... 0.8 V dc
Ambient operating temperature range (TA) ............................................... -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 to 300 rads (Si)/s) ................ 300 Krads(Si) 3/
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Must withstand the added PD due to short circuit test: e.g., IOS.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2.
3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3.
3.2.5 Radiation test circuit. The radiation test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
4
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 53 (see MIL-PRF-38535, appendix A).
3.11 PIN supersession information. The PIN supersession information shall be as specified in the appendix.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Condition 1/, 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
(MIL-STD-883 test method)
Output high voltage
(3006)
VOH
VCC = 4.5 V, IOH = -20 mA
Group A
subgroups
Device
type
1, 2, 3
All
M,D,P,L,R,F
Output low voltage
(3007)
VOL
All
VIH
VCC = 4.5 V 3/
1, 2, 3
All
Input low voltage
VIL
VCC = 5.5 V 3/
1, 2, 3
All
Input low current
(3009)
IIL
VCC = 5.5 V, 4/
1, 2, 3
01
VIN = 0.4 V
1
1, 2, 3
VCC = 5.5 V, 4/
V
V
0.5
Input high voltage
IIH
Max
0.5
1
M,D,P,L,R,F
Unit
2.5
1, 2, 3
M,D,P,L,R,F
Input high current
(3010)
Min
2.5
1
VCC = 4.5 V, IOH = 20 mA
Limits
2.0
V
0.8
V
0.10
-0.36
mA
02
0.10
-0.20
01
0.10
-0.36
02
0.10
-0.20
All
-2.0
20
-2.0
20
-0.01
0.1
-0.01
0.1
µA
VIN = 2.7 V
M,D,P,L,R,F
Input reverse current
II
1
1, 2, 3
VCC = 5.5 V, 4/
All
mA
VIN = 7.0 V
M,D,P,L,R,F
Off-state (high impedance)
output current
(3020, 3021)
IO
1
1, 2, 3
VCC = 5.5 V, VO = 2.5 V
M,D,P,L,R,F
VCC = 5.5 V, VO = O.5 V
M,D,P,L,R,F
Input clamp voltage
(3022)
VI
M,D,P,L,R,F
Output short circuit current
(3011)
IOS
20
1,2,3
-20
1
-20
All
-1.5
1
M,D,P,L,R,F
V
-1.5
1, 2, 3
VCC = 5.5 V 5/
µA
20
1
1, 2, 3
VCC = 4.5 V, IIN = -18 mA
All
All
1
-30
-150
-30
-150
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
6
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
(MIL-STD-883 test method)
Power supply current
(3005)
ICC
Conditions 1/, 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
1, 2, 3
01
Max
80
02
50
01
80
02
50
1,2,3
02
40
1
02
40
9
01
6.0
Min
VCC = 5.5 V,
all outputs disabled
M,D,P,L,R,F
1
VCC = 5.5 V, all outputs
enabled
M,D,P,L,R,F
Propagation delay,
output to output
tSKEW
VCC = 5.0 V, 6/
10, 11
CL = 30 pF
9
02 7/
9
VCC = 5.0 V, 6/
tPLH
02
9
VCC = 5.0 V, 6/
20
02 7/
9
tPHL
02
9
VCC = 5.0 V 6/
16
24
01
20
10, 11
CL = 30 pF, see figure 3
9
30
02 7/
10, 11
9
VCC = 5.0 V 6/
15
23
02
17
10, 11
CL = 50 pF, see figure 3
15
23
10, 11
CL = 50 pF, see figure 3
ns
30
10, 11
VCC = 5.0 V, 6/
4.5
9.0
01
9
ns
6.0
10, 11
CL = 30 pF, see figure 3
mA
7.0
10, 11
CL = 50 pF
Unit
9.0
10, 11
Propagation delay,
input to output
(3003)
Limits
25
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
7
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
(MIL-STD-883 test method)
Output disable time,
ENABLE to output
(3003)
tPLZ
Conditions 1/, 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
9
01
Min
VCC = 5.0 V 6/
10, 11
CL = 10 pF, see figure 3
9
02 7/
9
VCC = 5.0 V, 6/
tPHZ
02
9
VCC = 5.0 V 6/
CL = 10 pF, see figure 3
30
45
02 7/
10, 11
9
tPZL
02
9
VCC = 5.0 V 6/
23
30
01
45
10, 11
CL = 30 pF, see figure 3
9
02 7/
9
tPZH
02
9
VCC = 5.0 V 6/
28
40
01
40
10, 11
CL = 30 pF, see figure 3
9
60
02 7/
10, 11
9
VCC = 5.0 V 6/
30
50
02
32
10, 11
CL = 50 pF, see figure 3
25
37
10, 11
CL = 50 pF, see figure 3
ns
68
10, 11
VCC = 5.0 V 6/
20
27
10, 11
CL = 50 pF, see figure 3
35
56
10, 11
VCC = 5.0 V, 6/
ns
38
01
9
Max
35
53
10, 11
CL = 50 pF, see figure 3
Unit
53
10, 11
Output enable time,
ENABLE to output
Limits
52
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
8
TABLE I. Electrical performance characteristics – continued.
1/
Devices supplied to this drawing will meet all levels M, D, P, L, R, F of irradiation. However, this device is only tested at the
“F” level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post
irradiation electrical measurements for any RHA level, TA = +25°C.
2/
These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
3/
VIH and VIL tests are not required and shall be applied as forcing functions for the VOH and VOL tests.
4/
The minimum limits apply to the device classes Q and V. For device class M, these limits are not tested. The limits
specified for the input low current represents the numerical range in which this parameter will pass:
device type 01: -0.36 to +0.10 and device type 02: -0.20 to +0.10.
5/
Not more than one output should be shorted at one time, and the duration of the short circuit condition should not exceed 1
second.
6/
VIN = 1.3 V to VO = 1.3 V, VPULSE = 0 V to +3.0 V.
7/
This parameter is guaranteed by correlation to the testing at CL = 50 pF.
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
9
Case outlines
E, F, and Z
2
Device types
01 and 02
Terminal
number
Terminal symbol
1
INPUT A
NC
2
OUTPUT A+
INPUT A
3
OUTPUT A-
OUTPUT A+
4
ENABLE
OUTPUT A-
5
OUTPUT B-
ENABLE
6
OUTPUT B+
NC
7
INPUT B
OUTPUT B-
8
GND
OUTPUT B+
9
INPUT C
INPUT B
10
OUTPUT C+
GND
11
OUTPUT C-
NC
12
ENABLE
INPUT C
13
OUTPUT D-
OUTPUT C+
14
OUTPUT D+
OUTPUT C-
15
INPUT D
ENABLE
16
VCC
NC
17
---
OUTPUT D-
18
---
OUTPUT D+
19
---
INPUT D
20
---
VCC
NC = no connection.
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
10
Case outlines E, F, and Z.
FIGURE 2. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
11
NOTE:
Pulse generator characteristics:
ZO = 50 Ω
PRR ≤ 1.0 MHz
tr, tf ≤ 6 ns
CL includes probe and jig capacitance.
FIGURE 3. Test circuit and switching waveforms.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
12
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
13
TABLE IIA. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
Device
class V
1
1
1
1, 2, 3, 9 1/
1, 2, 3, 9 1/
1, 2, 3, 9 2/
1, 2, 3, 9, 10, 11 3/
1, 2, 3, 9, 10,
11
1, 2, 3, 9, 10,
11
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
1
1
1/ PDA applies to subgroup 1.
2/ PDA applies to subgroups 1 and delta limits. Delta limits shall be in accordance with
table IIB and shall be computed with reference to the previous interim electrical parameters.
3/ Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I.
TABLE IIB. Delta limits at +25°C.
Parameter 4/
Device type
Limit
VOH
All
≤ 250 mV
VOL
All
≤ 50 mV
ICC
All
≤ 8 mA
4/ These parameters shall be read and recorded at TA = +25°C before and after each burn-in and shall not
change by more than the limits indicated. The delta rejects shall be included in the PDA calculation.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
14
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A and as specified herein.
4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level
greater than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be
the pre-irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after
any design or process changes which may affect the RHA response of the device.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
15
APPENDIX
A.1. SCOPE
A.1.1 Scope. This appendix contains the PIN supersession information to support the one part-one part number system. For
new system designs, after the date of April 19, 1991 the new PIN shall be used in lieu of the old PIN. For existing system
designs prior to the date of April 19, 1991 the new PIN can be used in lieu of the old PIN. This is a mandatory part of the
document. The information contained herein is intended for compliance. The PIN supersession data shall be as in 30.
A.2. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
A.3. SUPERSESSION DATA
New PIN
Old PIN
5962-7802301MEA
5962-7802301MFA
5962-7802301M2A
7802301EA
7802301FA
78023012A
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78023
A
REVISION LEVEL
T
SHEET
16
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 12-01-26
Approved sources of supply for SMD 78023 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is
superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an
online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-7802301M2A
01295
AM26LS31MFKB
5962-7802301M2A
3V146
26LS31/B2A
5962-7802301M2A
0C7V7
QP26LS31/B2A
5962-7802301MEA
01295
AM26LS31MJB
5962-7802301MEA
3V146
26LS31/BEA
5962-7802301MEA
0C7V7
QP26LS31/BEA
5962-7802301MEA
27014
DS26LS31MJ-SMD
5962-7802301MFA
01295
AM26LS31MWB
5962-7802301MFA
3V146
26LS31/BFA
5962-7802301MFA
0C7V7
QP26LS31/BFA
5962-7802301MFA
3/
DS26LS31MW-SMD
5962-7802301Q2A
0C7V7
QP26LS31/B2A
5962-7802301Q2A
01295
AM26LS31M
5962-7802301Q2A
27014
DS26LS31ME-SMD
5962-7802301VEA
27014
DS26LS31MJ-QMLV
5962-7802301VFA
3/
DS26LS31MW-QMLV
5962-7802302M2A
27014
DS26F31ME/883
5962-7802302MEA
3/
DS26F31MJ/883
5962-7802302MFA
27014
DS26F31MW/883
5962-7802302MZA
3/
DS26F31MWG/883
5962-7802302VEA
3/
DS26F31MJ-QMLV
5962-7802302VFA
3/
DS26F31MW-QMLV
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962F7802301MEA
3/
DS26LS31MJFQML
5962F7802301MFA
3/
DS26LS31MWFQML
5962F7802301Q2A
3/
DS26LS31MEFQML
5962F7802301VEA
3/
DS26LS31MJFQMLV
5962F7802301VFA
3/
DS26LS31MWFQMLV
5962F7802302VEA
3/
DS26F31MJFQMLV
5962F7802302VFA
27014
DS26F31MWFQMLV
5962F7802302VZA
3/
DS26F31MWGFQMLV
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
27014
National Semiconductor
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Point of contact: 333 Western Avenue
South Portland, ME 04106
01295
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
PO Box 660199
Dallas, TX 75243
Point of contact:
U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
0C7V7
E2V Aerospace and Defense, Inc.
dba QP Semiconductor, Inc.
2945 Oakmead Village Court
Santa Clara, CA 95051
3V146
Rochester Electronics Inc.
16 Malcolm Hoyt Drive
Newburyport, MA 01950
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2