REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 99-11-15 R. Monnin 00-07-17 R. Monnin 00-10-03 R. Monnin 00-12-22 R. Monnin 02-05-10 R. Monnin 02-08-01 R. Monnin 02-09-05 R. Monnin 06-07-18 R. Monnin 08-09-25 Robert M. Heber 11-11-14 Charles F. Saffle 12-06-27 Charles F. Saffle 15-03-12 Charles F. Saffle Add device types 03 and 04. – rrp Changes made to VRLOAD, IADJ(line), VRLINE, VOUT, and VIN/VOUT tests in table I. – rrp Add case outline Z. Make change to 1.2.4, 1.3, and figure 2. - ro Add footnote to 1.5. Change made to 3.2.3. Remove radiation test circuits. -rrp Drawing updated to reflect current requirements. – gt Make change to the radiation hardened VOUT test maximum limits for device types 03 and 04 as specified under table I. - ro Make change to VOUT (Recovery) test as specified in table I for device types 03 and 04. - ro Add device type 05 tested at Low Dose Rate. Make changes to 1.2.2, 1.3, 1.4, 1.5, table I, figure 2, table IIB, and 4.4.4.1. Drawing updated to reflect current requirements. -rrp Add appendix A, die requirements. Change 1.3, ELDRS dose rate from 12 mrad(Si)/s to 10 mrad(Si)/s. - drw Add device types 06 and 07. - drw B C D E F G H J K L Add device type 08. - ro Make correction to the Output voltage recovery after output short circuit current test by adding the post irradiation limit for device type 08 as specified under Table I. Delete references to device class M requirements. - ro M REV SHEET REV M M M M M M M M M M SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rajesh Pithadia STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY Rajesh Pithadia APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Raymond Monnin DRAWING APPROVAL DATE 99-05-13 REVISION LEVEL M MICROCIRCUIT, LINEAR, RADIATION HARDENED, ADJUSTABLE, VOLTAGE REGULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-99517 1 OF 24 5962-E230-15 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 P 99517 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q X A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 Generic number Circuit function LM137H, WG LM137K LM117H, WG LM117K LM117H, WG LM117GW LM117GW LM137H 1/ 1/ 1/ 1/ Adjustable, negative, voltage regulator Adjustable, negative, voltage regulator Adjustable, positive, voltage regulator Adjustable, positive, voltage regulator Adjustable, positive, voltage regulator Adjustable, positive, voltage regulator Adjustable, positive, voltage regulator Adjustable, negative, voltage regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z 1/ Descriptive designator See figure 1 MBFM1-P2 GDFP1-G16 Terminals 3 2 16 Package style TO-39 can Flange mount Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. _____ 1/ For case outline Z, package material for device types 03 and 05 are aluminum nitride and package material for device types 06 and 07 are aluminum oxide. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 2 1.3 Absolute maximum ratings. 2/ Minimum input voltage (VIN): Device types 01, 02, and 08 ..................................................................... Maximum input voltage (VIN): Device types 03, 04, 05, 06 and 07 ........................................................... Input-output voltage differential ................................................................... Power dissipation: ....................................................................................... Maximum power dissipation at TA = 25C: Device types 01 and 08 ........................................................................... Device type 02 ......................................................................................... Device types 03, 05, 06 and 07 ................................................................ Device type 04 ......................................................................................... Storage temperature range ......................................................................... Lead temperature (soldering, 10 seconds) .................................................. Maximum junction temperature (TJ) ............................................................ Operating junction temperature ................................................................... Thermal resistance, junction-to-case (JC): Case X at 1.0 W (device types 01 and 08) ................................................ Case Y (device type 02) ........................................................................... Case X (device types 03 and 05) ............................................................. Case Y (device type 04) ........................................................................... Case Z (device type 01) ........................................................................... Case Z (device types 03 and 05) ............................................................. Case Z (device types 06 and 07) ............................................................. Thermal resistance, junction-to-ambient (JA): Case X (device types 01 and 08) ............................................................. Case Y (device type 02) ........................................................................... Case X (device types 03 and 05) ............................................................. Case Y (device type 04) ........................................................................... Case Z (device type 01) ........................................................................... Case Z (device types 03 and 05) ............................................................. Case Z (device types 06 and 07) ............................................................. -41.25 V 41.25 V 40 V Internally limited 3/ 2.5 W 28 W 2W 20 W -65C to +150C 300C 150C 3/ -55C to +150C 15C/W 4C/W 21C/W 1.9C/W 2.7C/W 3.4C/W 1/ 7C/W 1/ 140C/W still air at 0.5 W 64C/W 500 LFPM air flow at 0.5 W 40C/W still air 14C/W 500 LFPM air flow 186C/W still air 64C/W 500 LFPM air flow 39C/W still air 14C/W 500 LFPM air flow 108C/W still air at 0.5 W 65C/W 500 LFPM air flow at 0.5 W 115C/W still air at 0.5 W 1/ 66C/W 500 LFPM air flow at 0.5 W 1/ 130C/W still air 1/ 80C/W 500 LFPM air flow 1/ 1.4 Recommended operating conditions. Input voltage range: Device types 01 02, and 08 ...................................................................... -4.25 V to -41.25 V Device types 03, 04, 05, 06 and 07 .......................................................... 4.25 V to 41.25 V Ambient operating temperature range (TA) ................................................. -55C to +125C ______ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ, JA, and TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX – TA)/JA or the number given in the absolute maximum ratings, whichever is lower. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 3 1.5 Radiation features. Maximum total dose available (dose rate = 50 – 300 rads(Si)/s ): Device classes Q and V (device types 01, 02, and 08) ............................ 30 krads(Si) 4/ Device classes Q and V (device types 03, 04 and 06) ............................. 100 krads(Si) 4/ Maximum total dose available (dose rate = 10 mrads(Si)/s): Device classes Q and V (device types 05 and 07) ................................... 100 krads(Si) 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 4/ For device types 01, 02, 03, 04, 06, and 08, these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 5/ For device types 05 and 07, these parts have been tested lot acceptance testing at low dose rate (10 mrads(Si)/s) and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, test method 1019, condition D. Lot acceptance testing at low dose rate will continue to be performed on each wafer or wafer lot until characterization testing has been performed in accordance with Method 1019 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 4 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 5 TABLE I. Electrical performance characteristics. Test Output voltage Symbol VOUT Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type 1 01, 02, 08 VIN = -4.25 V, IL = 5 mA 2, 3 -1.3 -1.2 -1.225 -1.3 -1.2 02 -1.275 -1.225 -1.3 -1.2 1 01, 02, -1.275 -1.225 2, 3 08 -1.3 -1.2 1 2, 3 VIN = -41.25 V, IL = 5 mA M, D, P VIN = -41.25 V, IL = 50 mA 1 08 -1.30 -1.225 1 01, 08 -1.275 -1.225 -1.3 -1.2 1 08 -1.30 -1.225 1 02 -1.275 -1.225 -1.3 -1.2 -9 9 -23 23 2, 3 M, D, P VIN = -41.25 V, 2, 3 IL = 200 mA Line regulation VRLINE 1 VIN = -41.25 V to -4.25 V, 2, 3 IL = 5 mA M, D, P Load regulation VRLOAD VIN = -6.25 V, IL = 5 mA to 500 mA VIN = -41.25 V, IL = 5 mA to 50 mA VIN = -6.25 V, IL = 5 mA to 200 mA IL = 5 mA to 1.5 A M, D, P VIN = -41.25 V, IL = 5 mA to 200 mA Thermal regulation Vrth 01, 02, 08 1 08 -9.0 +50 1 01, 08 -12 12 2, 3 -24 24 1 -6 6 2, 3 -12 12 1 -6 6 2, 3 -12 12 -6 6 2, 3 -12 12 1 VIN = -6.25 V, Max -1.225 -1.275 2, 3 VIN = -4.25 V, IL = 1.5 A Min -1.275 Unit 01, 08 1 VIN = -4.25 V, IL = 500 mA Limits 02 1 -7.5 7.5 1 -6 6 2, 3 -12 12 VIN = -14.6 V, IL = 500 mA 1 01, 08 -5 5 VIN = -14.6 V, IL = 1.5 A 1 02 -5 5 V mV mV mV See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Adjust pin current Iadj Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max 1, 2, 3 01, 02, 25 100 08 25 100 1 08 25 140 1, 2, 3 01, 02, 08 -5 +5 1 01 -20 +20 1, 2, 3 08 01, 08 -70 -5 +20 5 02 -5 5 01, 08 0.5 1.8 A 0.05 0.5 1.5 3.5 0.2 1 VIN = -4.25 V, IL = 5 mA VIN = -41.25 V, IL = 5 mA M, D, P Adjust pin current change vs. line voltage Iadj (line) VIN = -41.25 V to –4.25 V, IL = 5 mA M, D, P M, D, P Adjust pin current change vs. load current Iadj (load) VIN = -6.25 V, Limits Unit A A A IL = 5 mA to 500 mA VIN = -6.25 V, IL = 5 mA to 1.5 A Output short circuit current IOS 1, 2, 3 VIN = -4.25 V VIN = -40 V 02 VIN = -4.25 V VIN = -40 V Output voltage recovery after output short circuit current VOUT VIN = -4.25 V (Recovery) VIN = -40 V M, D, P Minimum load current Iq VIN = -4.25 V 1 01, 02, -1.275 -1.225 V 2, 3 08 -1.3 -1.2 1 01, 02, -1.275 -1.225 2, 3 08 -1.3 -1.2 1 08 -1.30 -1.225 1, 2, 3 01, 02, 0.2 3 mA 08 0.2 3 1 5 -1.275 -1.225 V -1.3 -1.2 -1.275 -1.225 -1.3 -1.2 -1.3 -1.2 V VIN = -14.25 V VIN = -41.25 V Voltage start-up Vstart 1 VIN = -4.25 V, IL = 500 mA 01, 08 2, 3 1 VIN = -4.25 V, IL = 1.5 A 02 2, 3 Output voltage Ripple rejection 3/ VOUT VIN = -6.25 V, IL = 5 mA 2 01, 02, 08 VIN / VIN = -6.25 V, IL = 125 mA, 4 01, 08 48 dB VOUT ei = 1 Vrms at 2400 Hz 02 50 VIN = -6.25 V, IL = 500 mA, ei = 1 Vrms at 2400 Hz See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type 7 01, 08 Max 120 Vrms 02 120 01, 08 80 mV/V 02 80 01, 08 60 4/ mV 02 60 5/ Limits Min Output noise voltage Vno VIN = -6.25 V, IL = 50 mA VIN = -6.25 V, IL = 100 mA Line transient response VOUT/VIN 7 VIN = -6.25 V, Unit VPULSE = -1 V, IL = 50 mA VIN = -6.25 V, VPULSE = -1 V, IL = 100 mA Load transient response VOUT/IL 7 VIN = -6.25 V, IL = 50 mA, IL = 200 mA VIN = -6.25 V, IL = 100 mA, IL = 400 mA Output voltage VOUT 1,2,3 VIN = 4.25 V, IL = -5 mA M,D,P,L,R VIN = 4.25 V, IL = -500 mA M,D,P,L,R VIN = 4.25 V, IL = -1.5 A M,D,P,L,R M,D,P,L,R VIN = 41.25 V, IL = -50 mA M,D,P,L,R VIN = 41.25 V, IL = -200 mA M,D,P,L,R VRLINE 1.2 1.3 1 07 1.2 1.350 1,2,3 03, 05, 1.2 1.3 1 06, 07 1.2 1.350 1,2,3 04 1.2 1.3 1 VIN = 41.25 V, IL = -5 mA Line regulation 03, 04, 05, 06, 1.2 1.350 1,2,3 03, 04, 1.2 1.3 1 05, 06, 07 1.2 1.350 1,2,3 03, 05, 1.2 1.3 1 06, 07 1.2 1.350 1,2,3 04 1.2 1.3 1.2 1.350 1 1 VIN = 4.25 V to 41.25 V IL = -5 mA M,D,P,L,R -9 9 2, 3 03, 04, 05, 06, -23 23 1 07 -25 25 V mV See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 8 TABLE I. Electrical performance characteristics – Continued. Test Load regulation Symbol VRLOAD Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type 1,2,3 03, 05, VIN = 6.25 V, Limits Unit Min -12 Max 12 -12 12 -3.5 3.5 2, 3 -12 12 1 -7.0 7.0 1 -3.5 3.5 2, 3 -12 12 mV 06, 07 IL = -500 mA to -5 mA 1,2,3 VIN = 41.25 V, IL = -50 mA to -5 mA 1 VIN = 6.25 V, IL = -1.5 A to -5 mA M,D,P,L,R VIN = 41.25 V, IL = -200 mA to -5 mA M,D,P,L,R Thermal regulation Adjust pin current Adjust pin current change vs. line voltage 04 -7.0 7.0 VIN = 14.6 V, IL = -500 mA 1 03, 05, 06, 07 -12 12 VIN = 14.6 V, IL = -1.5 A 1 04 -12 12 Iadj VIN = 4.25 V, IL = -5 mA 1, 2, 3 -100 -15 VIN = 41.25 V, IL = -5 mA 03, 04, 05, 06, 07 -100 -15 Iadj (line) VIN = 4.25 V to 41.25 V, 1, 2, 3 03, 04, 05, 06, 07 -5 5 A 1, 2, 3 03, 05, 06, 07 -5 5 A 04 -5 5 03, 05, 06, 07 -1.8 -0.5 -0.5 -0.05 -3.5 -1.5 -1 -0.18 Vrth 1 IL = -5 mA Adjust pin current change vs. load current Iadj (load) VIN = 6.25 V, mV A IL = -500 mA to -5 mA VIN = 6.25 V, IL = -1.5 A to --5 mA Output short circuit current IOS 1, 2, 3 VIN = 4.25 V VIN = 40 V 04 VIN = 4.25 V VIN = 40 V A See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 9 TABLE I. Electrical performance characteristics - Continued. Test Symbol Output voltage recovery after output short circuit current Conditions 1/ 2/ -55C TA +125C unless otherwise specified VOUT VIN = 4.25 V, RL = 2.5 , (Recovery) CL = 20 F Group A subgroups Device type 1, 2, 3 03, 05, 06, 07 M,D,P,L,R 1 1, 2, 3 VIN = 4.25 V, RL = 0.833, 04 Limits Unit Min 1.2 Max 1.3 V 1.2 1.350 1.2 1.3 1.2 1.350 CL = 20 F M,D,P,L,R 1 VIN = 40 V, RL = 250 M,D,P,L,R Minimum load current Iq VIN = 4.25 V, 1, 2, 3 03, 04, 1.2 1.3 1 05, 06, 07 1.2 1.350 1, 2, 3 03, 05, 06, 07 -3 -0.5 mA -3 -0.5 -5 -1 -3 -0.2 -3 -0.2 -5 -0.2 forced VOUT = 1.4 V VIN = 14.25 V, forced VOUT = 1.4 V VIN = 41.25 V, forced VOUT = 1.4 V 04 VIN = 4.25 V, mA forced VOUT = 1.4 V VIN = 14.25 V, forced VOUT = 1.4 V VIN = 41.25 V, forced VOUT = 1.4 V Voltage start-up Vstart VIN = 4.25 V, IL = -500 mA, 1, 2, 3 03, 05, 06, 07 1.2 1.3 V 1, 2, 3 04 1.2 1.3 1.3 V RL = 2.5 , CL = 20 F VIN = 4.25 V, IL = -1.5 A, RL = 0.833 , CL = 20 F Output voltage Ripple rejection 3/ VOUT VIN = 6.25 V, IL = -5 mA 2 03, 04, 05, 06, 07 1.2 VIN / VIN = 6.25 V, IL = -125 mA, ei = 1 Vrms at 2400 Hz 4 03, 05, 06, 07 65 dB 60 65 60 VOUT M,D,P,L,R 04 VIN = 6.25 V, IL = -500 mA, ei = 1 Vrms at 2400 Hz M,D,P,L,R See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 10 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type 7 03, 05, 06, 07 Limits Min Output noise voltage Vno VIN = 6.25 V, IL = -50 mA VIN = 6.25 V, IL = -100 mA Line transient response Load transient response VOUT / VIN = 6.25 V, VIN = 3 V, VIN IL = -10 mA 7 7 VOUT / VIN = 6.25 V, IL IL = -200 mA, IL = -50 mA VIN = 6.25 V, Unit Max 120 Vrms 04 120 03, 05, 06, 07 6 04 18 6/ 03, 05, 06, 07 0.6 mV/mA 04 120 7/ mV IL = -400 mA, mV/V mV IL = -100 mA 1/ Device types 01, 02, and 08 have been characterized through all levels M, D, P of irradiation. However, these devices are only tested at the “P” level. Device types 03, 04, 05, 06 and 07 have been characterized through all levels M, D, P, L, R of irradiation. However, these devices are only tested at the “R” level. Pre and Post irradiation values are identical unless otherwise specified in table I. 2/ For device types 01, 02, 03, 04, 06, and 08, these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. For device types 05 and 07, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, test method 1019, condition D. 3/ Tested at TA = +125C, correlated to TA = +150C. 4/ Limit is equivalent to a limit of 0.3 mV/mA. 5/ Limit is equivalent to a limit of 0.15 mV/mA. 6/ Limit of 6 mV/V is equivalent to 18 mV. 7/ Limit of 0.3 mV/V is equivalent to 120 mV. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 11 Case X FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 12 Case X Symbol Inches Millimeters Notes Min Max Min Max A .165 .195 4.19 4.95 A1 .100 --- 2.54 --- 7 b .016 .019 0.41 0.48 3 b1 .016 .021 0.41 0.53 3 D .335 .370 8.51 9.40 D1 .305 .335 7.75 8.51 e .200 BSC 5.08 BSC 5 e1 .100 BSC 2.54 BSC 5 F --- .050 --- 1.27 k .028 .034 0.71 0.86 k1 .029 .045 0.74 1.14 k2 .009 .041 0.23 1.04 L .500 ---- 12.70 ---- L1 --- .050 --- 1.27 L2 .250 --- 6.35 --- 45 T.P. 4 5 45 T.P. NOTES: 1. The US government preferred system of measurement is the metric SI system. However, this item was originally designed using inch-pound units of measurement. In the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. b applies between L1 and beyond .500 inch (12.70 mm) from the seating plane (two leads). Diameter is uncontrolled in L1 and beyond .500 inch (12.70 mm) from the seating plane. Two leads. Two holes. Two holes located at true position within diameter .010 inch (0.25 mm). Leads having a maximum diameter of .043 inch (1.09 mm) measured in gauging plane .054 inch (1.37 mm) .001 inch (0.03 mm) .000 inch (0.00 mm) below the seating plane shall be located at true position within diameter .014 inch (0.36 mm). 7. The mounting surface of the header shall be flat to convex within .003 inch (0.08 mm) inside a .930 inch (23.62 mm) diameter circle on the center of the header and flat to convex within .006 inch (0.15 mm) overall. 3. 4. 5. 6. FIGURE 1. Case outline – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 13 Device types 01, 08 02 03 and 05 04 Case outlines X Y 1/ X Y 2/ Terminal number 1 ADJUSTMENT ADJUSTMENT INPUT ADJUSTMENT 2 OUTPUT OUTPUT ADJUSTMENT INPUT 3 INPUT --- OUTPUT --- Terminal symbol Device types 01 03, 05, 06 and 07 Case outline Z 3/ Terminal number 1 NC NC 2 NC NC 3 ADJUSTMENT ADJUSTMENT 4 INPUT NC 5 NC INPUT 6 NC NC 7 NC NC 8 NC NC 9 NC NC 10 NC NC 11 OUTPUT SENSE NC 12 OUTPUT OUTPUT 13 NC OUTPUT SENSE 14 NC NC 15 NC NC 16 NC NC Terminal symbol 4/ 1/ For case outline Y, case is input. 2/ For case outline Y, case is output. 3/ For case Z to function properly, the “OUTPUT” and “OUTPUT SENSE” pins must be connected on the users printed circuit board. 4/ NC = No connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 14 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. . 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5, 6, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 15 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Device class V Interim electrical Parameters (see 4.2) 1 1 Final electrical Parameters (see 4.2) 1, 2, 3, 4 1/ 1, 2, 3, 4 1/ Group A test Requirements (see 4.4) 1, 2, 3, 4, 7 1, 2, 3, 4, 7 Group C end-point electrical parameters (see 4.4) 1, 2,3 1, 2, 3 2/ Group D end-point electrical parameters (see 4.4) 1, 2, 3 1, 2, 3 Group E end-point electrical parameters (see 4.4) 1 1 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous endpoint electrical parameters. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019 condition A for device types 01, 02, 03, 04, 06 and 08; condition D for device type 05 and 07 and as specified herein. 4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level greater than 5 krads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25C ±5C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 16 Table IIB. Group C end-point electrical parameters. TA = 25C Parameter VOUT Device type Max VIN = -4.25 V, IL = 5 mA -0.01 V 0.01 V VIN = -4.25 V, IL = 500 mA -0.01 V 0.01 V 02 VIN = -4.25 V, IL = 1.5 A -0.01 V 0.01 V 01,02, 08 VIN = -41.25 V, IL = 5 mA -0.01 V 0.01 V 01, 08 VIN = -41.25 V, IL = 50 mA -0.01 V 0.01 V 02 VIN = -41.25 V, IL = 200 mA -0.01 V 0.01 V VIN = 4.25 V, IL = -5 mA -0.01 V 0.01 V VIN = 4.25 V, IL = -500 mA -0.01 V 0.01 V 04 VIN = 4.25 V, IL = -1.5 A -0.01 V 0.01 V 03,04,05,06,07 VIN = 41.25 V, IL = -5 mA -0.01 V 0.01 V 03,05,06,07 VIN = 41.25 V, IL = -50 mA -0.01 V 0.01 V 04 VIN = 41.25 V, IL = -200 mA -0.01 V 0.01 V -4 mV 4 mV -4 mV 4 mV 01, 02, 08 03,04,05,06,07 03,05,06,07 Iadj VOUT (Recovery) 01,02, 08 VIN = -41.25 V to -4.25 V, IL = 5 mA 03,04, 05,06,07 VIN = 4.25 V to 41.25 V, 01, 02, 08 VIN = -4.25 V, IL = 5 mA -10 A 10 A VIN = -41.25 V, IL = 5 mA -10 A 10 A 03,04, VIN = 4.25 V, IL = -5 mA -10 A 10 A 05,06,07 VIN = 41.25 V, IL = -5 mA -10 A 10 A -0.01 V 0.01 V -0.01 V 0.01 V 03,05,06,07 IL = -5 mA VIN = 4.25 V, RL = 2.5, CL = 20 F VIN = 40 V, RL = 250 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Delta limit Min 01, 08 Vrline Conditions SIZE 5962-99517 A REVISION LEVEL M SHEET 17 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 18 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 R Federal stock class designator \ RHA designator (see A.1.2.1) 03 V 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) 99517 / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 03 05 Generic number Circuit function LM117H LM117H Adjustable, positive, voltage regulator Adjustable, positive, voltage regulator A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-99517 A REVISION LEVEL M SHEET 19 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 03, 05 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 03, 05 A-1 A.1.2.4.3 Interface materials. Die type Figure number 03, 05 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 03, 05 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 20 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein. A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 21 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4, 4.4.4.1, and 4.4.4.1.1 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 432183990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 22 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 Die bonding pad locations and electrical functions Die physical dimensions. Die size: 2184.40 µm x 2362.20 µm 86.0 mils x 93.0 mils Die thickness: 254 µm Minimum pitch: 1827.53 µm Interface materials. Top metallization: AL 0.5% CU Backside metallization: Gold Glassivation. Type: Vapox over metal only (VOM only) Thickness: 8 kÅ to 12 kÅ Substrate: Silicon Assembly related information. Substrate potential: Output Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 23 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-99517 Die Bond Pad Coordinate Locations (C-Step) (Referenced to die center, coordinates in µm) NC = No connection Signal Name Pad Number Input Output NC NC Output Adj NC Input Output 1 2 3 4 5 6 7 8 9 X/Y Coordinates X 10 -655 -680 -826 -914 913 800 254 603 Y 986 515 -673 -689 -1000 -996 -391 -91 514 Pad Size X 213 228 91 88 193 195 208 193 226 Y 210 187 91 170 198 205 208 233 185 X X X X X X X X X FIGURE A-1. Die bonding pad locations and electrical functions - continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-99517 A REVISION LEVEL M SHEET 24 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-03-12 Approved sources of supply for SMD 5962-99517 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9951701VZA 3/ LM137WG-QMLV 5962P9951701QXA 3/ LM137HPQML 5962P9951701QZA 3/ LM137WGPQML 5962P9951701VXA 3/ LM137HPQMLV 5962P9951701VZA 3/ LM137WGPQMLV 5962P9951702QYA 3/ LM137KPQML 5962P9951702VYA 3/ LM137KPQMLV 5962-9951703VZA 3/ LM117WG-QMLV 5962R9951703QXA 3/ LM117HRQML 5962R9951703QZA 3/ LM117WGRQML 5962R9951703V9A 3/ LM117H MDR 5962R9951703VXA 3/ LM117HRQMLV 5962R9951703VZA 3/ LM117WGRQMLV 5962R9951704QYA 3/ LM117KRQML 5962R9951704VYA 3/ LM117KRQMLV 5962R9951705V9A 3/ LM117H MDE 5962R9951705VXA 3/ LM117HRLQMLV 5962R9951705VZA 3/ LM117WGRLQMLV See footnotes at end of table. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN – CONTINUED. DATE: 15-03-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9951706QZA 3/ LM117GW-QML 5962R9951706VZA 3/ LM117GWRQMLV 5962R9951707VZA 3/ LM117GWRLQMLV 5962P9951708VXA 27014 LM137H1PQMLV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 27014 National Semiconductor 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2