REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline 2. Changes in accordance with N.O.R. 5962-R055-92. 91-12-04 M. A. FRYE B Make change to shutdown threshold test under the Shutdown section as specified in table I. Redrawn. - ro 00-09-13 R. MONNIN C Drawing updated to reflect current requirements. - ro 03-06-17 R. MONNIN D Add case outline S. Make changes to 1.2.2, 1.3, and figure 1. Add device class V paragraphs and Table IIB. Under Table IIA, add subgroup 4 to Interim electrical parameters and add subgroups 4,5,6 to Group C end point electrical parameters. - ro 10-05-27 C. SAFFLE E Update drawing to current MIL-PRF-38535 requirements. –rrp 16-05-10 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY JOSEPH A. KERBY STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY CHARLES E. BESORE APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 90-08-08 REVISION LEVEL E MICROCIRCUIT, LINEAR, SWITCHED MODE CONTROLLER FOR DC MOTOR DRIVE, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-89957 1 OF 15 5962-E349-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device class M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 89957 01 V A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 89957 01 V S A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 UC1637 Circuit function Switched mode controller for DC motor drive 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter S V 2 Descriptive designator GDFP2-F20 GDIP1-T18 or CDIP2-T18 CQCC1-N20 Terminals Package style 20 18 20 Flat pack Dual-in-line Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage (VS) ..................................................................................... ±20 V dc Output current, source/sink (AOUT, BOUT pins ) ......................................... Analog inputs: (all pins, except AOUT, -VS, +VS, BOUT ) ................................................ Error amplifier output current (E/A OUTPUT pin) ........................................ Oscillator charging current (ISET pin) .......................................................... 500 mA VS ±20 mA -2.0 mA Power dissipation at TA = 25°C ................................................................... 1000 mW 3/ Power dissipation at TC = 25°C .................................................................. Storage temperature range ......................................................................... Lead temperature (soldering, 10 seconds) .................................................. Thermal resistance, junction-to-case (θJC) ................................................. 2000 mW 4/ -65°C to +150°C +300°C See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case S ..................................................................................................... 77°C/W Case V ..................................................................................................... 75°C/W Case 2 ..................................................................................................... 70°C/W 1.4 Recommended operating conditions. Supply voltage range (VS) ........................................................................... ±2.5 V to ±19 V Oscillator +VTH, -VTH input range ............................................................... -VS + 2 V to +VS – 2 V PWM comparator common mode range ..................................................... -VS + 1 V to +VS – 2 V Current limit common mode range .............................................................. -VS to +VS – 3 V Ambient operating temperature range (TA) ................................................. -55°C to +125°C _____ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Currents are positive into, negative out of the specified terminal. All currents should be treated as absolute values. 3/ Derate at 10 mW/°C for TA above 50°C. 4/ Derate at 16 mW/°C for TC above 25°C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein . 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 9.4 10.6 9.2 10.8 Oscillator section Initial accuracy IA 4 RT = 16.7 kΩ from ISET to 5,6 0 V, CT = 1500 pF Voltage stability VST 01 VS = ±5.0 V to ±20 V, kHz 4,5,6 01 7.0 % +VTH pin = 3.0 V, -VTH pin = -3.0 V +VTH input bias current IIB CT pin = 6.0 V 1,2,3 01 ±10 µA -VTH input bias current IIB CT pin = 0 V 1,2,3 01 -10 µA Input offset voltage VIO VCM = 0 V 1,2,3 01 ±5.0 mV Input bias current IIB VCM = 0 V 1,2,3 01 5.0 µA Input offset current IIO VCM = 0 V 1,2,3 01 ±1.0 µA Open loop voltage gain AVS RL = 10 kΩ 4,5,6 01 75 dB Common mode rejection ratio CMRR VCM = -VS + 2 V to +VS 4,5,6 01 75 dB Power supply rejection ratio PSRR VS = ±5.0 V to ±20 V 4,5,6 01 75 dB Output sink current ISINK E/A OUTPUT pin = 0 V 1,2,3 01 20 mA Output source current ISOURCE E/A OUTPUT pin = 0 V 1,2,3 01 High level output voltage VOH 1,2,3 01 Low level output voltage VOL 1,2,3 01 Error amplifier section -5.0 13 mA V -13 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max -10 50 mV PWM comparators section Input offset voltage VIO VCM = 0 V 1,2,3 01 Input bias current IIB VCM = 0 V 1,2,3 01 -10 µA Input hysteresis HYSIN VCM = 0 V 1,2,3 01 30 mV VIO VCM = 0 V 1 01 190 210 mV 160 370 Current limit section Input offset voltage 2,3 Input bias current IIB -10 µA -2.7 V 01 -10 µA 1,2,3 01 5.0 V 500 mV 15 mA 1,2,3 01 1,2,3 01 1,2,3 Shutdown section Shutdown threshold VSDT Input bias current IIB 2/ SHUTDOWN pin = +VS to -2.3 -VS Undervoltage lockout section 3/ Start threshold VST Hysteresis HYS 1,2,3 01 IS 1,2,3 01 75 Total standby current section Supply current See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Output section Output low level voltage VOL 1,2,3 ISINK = 20 mA 01 -13 -13 ISINK = 100 mA Output high level voltage VOH V 1,2,3 ISOURCE = -20 mA 01 13 V 12 ISOURCE = -100 mA Rise time tr CL = 1 nF, TJ = 25°C 4/ 9 01 600 ns Fall time tf CL = 1 nF, TJ = 25°C 4/ 9 01 300 ns 1/ Unless otherwise specified; +VS = +15 V, -VS = -15 V, +VTH = 5.0 V, -VTH = -5.0 V, RT = 16.7 kΩ, CT = 1500 pF. 2/ Parameter measured, voltage rising (becoming less negative), with respect to +VS pin. 3/ Parameter measured at +VS pin with respect to –VS pin. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 55 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 7 Device type 01 Case outlines S Terminal number V 2 Terminal symbol 1 +VTH +VTH +VTH 2 CT CT CT 3 -VTH -VTH -VTH 4 AOUT AOUT AOUT 5 -VS -VS -VS 6 +VS +VS NC 7 BOUT BOUT +VS 8 +BIN +BIN BOUT 9 -BIN -BIN +BIN 10 NC -AIN -BIN 11 NC +AIN -AIN 12 -AIN +C/L +AIN 13 +AIN -C/L +C/L 14 +C/L SHUTDOWN -C/L 15 -C/L +E/A SHUTDOWN 16 SHUTDOWN -E/A NC 17 +E/A E/A OUTPUT +E/A 18 -E/A ISET -E/A 19 E/A OUTPUT --- E/A OUTPUT 20 ISET --- ISET NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 8 FIGURE 2. Logic diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 9 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 10 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1,4 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3, 1/ 2/ 4,5,6 1,2,3,4,5,6,9 1,2,3 1,2,3 1,2,3 1,2,3 --- Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Device class V 1,2,3, 2/ 4,5,6 1,2,3 --- --- 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and delta limits shall be computed with reference to the previous endpoint electrical parameters. TABLE IIB. Burn-in and operating life test delta parameters. TA = +25°C. 1/ Parameters Symbol Delta limits Oscillator initial accuracy IA ±0.2 kHz Error amplifier input offset voltage VIO ±0.5 mV Error amplifier input bias current IIB ±0.25 µA 1/ Deltas are performed at room temperature. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 11 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89957 A REVISION LEVEL E SHEET 12 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 16-05-10 Approved sources of supply for SMD 5962-89957 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8995701VA 01295 UC1637J/883 5962-89957012A 01295 UC1637L/883 5962-8995701VSA 01295 UC1637W-SP 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments, Inc. Semiconductor Group 8505 Forest Ln. PO Box 660199 Dallas, TX 75243 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.