Data Sheet

BB182LX
VHF variable capacitance diode
Rev. 01 — 29 January 2009
Product data sheet
1. Product profile
1.1 General description
The BB182LX is a planar technology variable capacitance diode in a SOD882T ultra small
leadless plastic SMD package. The excellent matching performance is achieved by gliding
matching and a Direct Matching Assembly (DMA) procedure.
1.2 Features
n
n
n
n
n
High linearity
Excellent matching to 2 % DMA
Ultra small leadless SMD package
Cd(28V) :2.7 pF; Cd(1V) to Cd(28V) ratio: 22
Low series resistance
1.3 Applications
n Voltage Controlled Oscillators (VCO)
n Electronic tuning in VHF television tuners, Band A up to 160 MHz
2. Pinning information
Table 1.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
Transparent
top view
[1]
sym008
The marking bar indicates the cathode.
3. Ordering information
Table 2.
Ordering information
Type number
BB182LX
Package
Name
Description
Version
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.4 mm
SOD882T
BB182LX
NXP Semiconductors
VHF variable capacitance diode
4. Marking
Table 3.
Marking codes
Type number
Marking code
BB182LX
L7
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VR
reverse voltage
Conditions
-
32
V
IF
forward current
-
20
mA
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−55
+125
°C
6. Characteristics
Table 5.
Characteristics
Symbol
Parameter
Conditions
IR
reverse current
see Figure 3
Min
Typ
Max
Unit
VR = 30 V
-
-
10
nA
VR = 30 V; Tj = 85 °C
-
-
200
nA
rs
diode series resistance
f = 100 MHz at Cd = 30 pF;
see Figure 2
-
1.0
-
Ω
Cd
diode capacitance
f = 1 MHz; see Figure 1 and
Figure 4
VR = 1 V
52
-
62
pF
VR = 28 V
2.48
2.7
2.89
pF
Cd(1V)/Cd(2V)
diode capacitance ratio (1 V to 2 V)
f = 1 MHz
-
1.31
-
Cd(1V)/Cd(28V)
diode capacitance ratio (1 V to 28 V)
f = 1 MHz
20.6
22
-
Cd(25V)/Cd(28V) diode capacitance ratio (25 V to 28 V)
f = 1 MHz
-
1.05
-
∆Cd/Cd
VR = 1 V to 28 V; in sequence of
5 diodes (gliding)
-
-
2
diode capacitance matching
BB182LX_1
Product data sheet
%
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 29 January 2009
2 of 7
BB182LX
NXP Semiconductors
VHF variable capacitance diode
001aaj475
80
Cd
(pF)
001aaj476
1.2
rs
(Ω)
60
0.8
40
0.4
20
0
10−1
1
0
10−1
102
10
1
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig 1.
102
10
VR (V)
f = 100 MHz; Tj = 25 °C.
Diode capacitance as a function of reverse
voltage; typical values
001aaj477
103
IR
(nA)
Fig 2.
Diode serial resistance as a function of
reverse voltage; typical values
001aaj478
10−2
TCCd
(K−1)
102
10−3
10
10−4
1
0
20
40
60
80
100
10−5
10−1
1
Tj (°C)
102
10
VR (V)
Tj = 0 °C to 85 °C.
Fig 3.
Reverse current as a function of junction
temperature; maximum values
Fig 4.
Temperature coefficient of diode capacitance
as a function of reverse voltage; typical values
BB182LX_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 29 January 2009
3 of 7
BB182LX
NXP Semiconductors
VHF variable capacitance diode
7. Package outline
Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm
SOD882T
(2×)
L1 (2×)
w
1
2
M
A
b (2×)
(2×)
w
M
B
e1
A
A1
y
A
E
D
(1)
B
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
b
D
E
e1
L1
w
y
mm
0.40
0.36
0.04
0.55
0.45
0.65
0.55
1.05
0.95
0.65
0.30
0.22
0.1
0.03
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
04-12-14
06-04-12
SOD882T
Fig 5.
EUROPEAN
PROJECTION
Package outline SOD882T
BB182LX_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 29 January 2009
4 of 7
BB182LX
NXP Semiconductors
VHF variable capacitance diode
8. Abbreviations
Table 6.
Abbreviations
Acronym
Description
SMD
Surface Mounted Device
VHF
Very High Frequency
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BB182LX_1
20090129
Product data sheet
-
-
BB182LX_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 29 January 2009
5 of 7
BB182LX
NXP Semiconductors
VHF variable capacitance diode
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BB182LX_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 29 January 2009
6 of 7
BB182LX
NXP Semiconductors
VHF variable capacitance diode
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
1
2
2
2
4
5
5
6
6
6
6
6
6
7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 January 2009
Document identifier: BB182LX_1
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