PANASONIC FC551601

This product complies with the RoHS Directive (EU 2002/95/EC).
FC551601
Silicon N-channel MOS FET
For switching circuits
 Overview
 Package
FC551601 is N-channel dual type small signal MOS FET employed small size
surface mounting package.

Code
SMini5-F3-B

Pin Name
1: Gate (FET1)
2: Source (FET1/2)
3: Gate (FET2)
 Features
 Low drain-source ON resistance: RDS(on) typ. = 6 W (VGS = 4.0 V)
 High-speed switching
 Small size surface mounting package: SMini5-F3-B
 Contributes to miniaturization of sets, reduction of component count.
 Eco-friendly Halogen-free package
 Marking Symbol: V5
 Internal Connection
 Packaging
(D1)
5
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
 Absolute Maximum Ratings Ta = 25°C
Parameter
FET1
FET2
Overall
4: Drain (FET2)
5: Drain (FET1)
Symbol
Rating
Unit
Drain-source surrender voltage
VDSS
60
V
Gate-source surrender voltage
VGSS
±12
V
Drain current
ID
100
mA
Peak drain current
IDP
200
mA
Total power dissipation
PT
150
mW
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Publication date: January 2011
Ver. AED
(D2)
4
FET2
FET1
1
(G1)
2
(S)
3
(G2)
1
This product complies with the RoHS Directive (EU 2002/95/EC).
FC551601
 Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Drain-source surrender voltage
VDSS
ID = 1 mA, VGS = 0
Drain-source cutoff current
IDSS
VDS = 60 V, VGS = 0
1.0
mA
Gate-source cutoff current
IGSS
VGS = ±10 V, VDS = 0
±10
mA
Gate threshold voltage
VTH
ID = 1.0 mA, VDS = 3.0 V
1.2
1.5
V
ID = 10 mA, VGS = 2.5 V
8
15
ID = 10 mA, VGS = 4.0 V
6
12
Drain-source ON resistance
RDS(on)
Forward transfer admittance
Yfs
60
Unit
V
0.9
ID = 10 mA, VDS = 3.0 V
20
W
60
mS
12
pF
7
pF
3
pF
Short-circuit input capacitance (Common source)
Ciss
Short-circuit output capacitance (Common source)
Coss
Reverse transfer capacitance (Common source)
Crss
Turn-on time *
ton
VDD = 3 V, VGS = 0 V to 3 V,
ID = 10 mA
100
ns
Turn-off time *
toff
VDD = 3 V, VGS = 3 V to 0 V,
ID = 10 mA
100
ns
VDS = 3 V, VGS = 0, f = 1 MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Test circuit
VDD = 3 V
ID = 10 mA
RL = 300 Ω
VGS = 0 V to 3 V
VIN
G
D
VOUT
90%
10%
VOUT
50 Ω
S
2
VIN
ton
Ver. AED
10%
90%
toff
This product complies with the RoHS Directive (EU 2002/95/EC).
FC551601
FC551601_ ID-VGS
ID  VDS
ID  VGS
102
Ta = 25°C
Drain current ID (mA)
Drain current ID (mA)
VGS = 4.0 V
60
VDS = 3 V
2.5 V
40
20
1.8 V
0.1
0.2
0.3
0.4
Ta = 85°C
25°C
10−1
−30°C
10−2
2.1 V
0
1
10−3
0.5
0
Drain-source voltage VDS (V)
2.5
1
10−1
0
2
4
6
8
10
Gate-source voltage VGS (V)
PT  Ta
Ta = 25°C
Total power dissipation PT (mW)
Drain-source ON resistance RDS(on) (Ω)
2.0
10
200
VGS = 2.5 V
10
4.0 V
1
1
10
150
100
50
0
102
0
40
80
120
Drain current ID (mA)
Ambient temperature Ta (°C)
FC551601_Ciss , Crss , Coss -VDS
FC551601_|Yfs|-ID
Ciss , Crss , Coss  VDS
25
160
Yfs  ID
1
Ta = 25°C
Ta = 25°C
VDS = 3 V
Forward transfer admittance |Yfs | (S)
Short-circuit input capacitance (Common source) Ciss ,
Reverse transfer capacitance (Common source) Crss ,
Short-circuit output capacitance (Common source) Coss (pF)
1.5
Ta = 25°C
ID = 0.01 A
FC654601_ PT-Ta
RDS(on)  ID
10−1
10−1
1.0
Gate-source voltage VGS (V)
FC551601_ RDS(on)-ID
102
0.5
RDS(on)  VGS
102
10
80
0
FC551601_ RDS(on)-VGS
Drain-source ON resistance RDS(on) (Ω)
100
FC551601_ ID-VDS
20
10−1
15
Ciss
10
10−2
Coss
5
0
Crss
0
5
10
15
Drain-source voltage VDS (V)
20
10−3
1
10
102
103
Drain current ID (mA)
Ver. AED
3
This product complies with the RoHS Directive (EU 2002/95/EC).
FC551601
SMini5-F3-B
Unit: mm
2.0 ±0.1
1.3 ±0.1
(0.65)
4
2.1 ±0.1
1.25 ±0.10
5
7°
(0.425)
(0.65)
1
2
3
+0.05
0.20 ±0.05
0.13 −0.02
0 to 0.10
0.7 ±0.1
(0.15)
7°
4
Ver. AED
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202