sla6870mz ds en

SLA6868MZ and SLA6870MZ
High Voltage 3-Phase Motor Drivers
Features and Benefits
▪
▪
▪
▪
▪
▪
▪
▪
▪
▪
Description
Built-in pre-drive IC
MOSFET power element
Alleviate noise generation by adjusting an internal resistor
CMOS compatible input (5 V)
High-side gate driver using bootstrap circuit or floating
power supply
Built-in protection circuit for controlling power supply
voltage drop (UVLO on VCC)
Overcurrent protection (OCP), overcurrent limiting (OCL),
and thermal shutdown (TSD)
Output of fault signal during operation of protection circuit
Output current 1.5, 2.5, or 3 A
Small SIP (SLA 24-pin)
Packages: Power SIP
The SLA power package includes an IC with all of the necessary
power elements (six MOSFETs), pre-driver ICs (two), and
bootstrap diodes (three), needed to configure the main circuit
of an inverter. This enables the main circuit of the inverter to
be configured with fewer external components than traditional
designs.
Applications include residential white goods (home
applications) and commercial appliance motor control:
• Air conditioner fan
• Small ventilation fan
• Dishwasher pump
Not to scale
Leadform
2171
The SLA6868MZ and SLA6870MZ inverter power module
(IPM) ICs provide a robust, highly-integrated solution for
optimally controlling 3-phase motor power inverter systems
and variable speed control systems used in energy-conserving
designs to drive motors of residential and commercial
appliances. These ICs take 230 VAC input voltage, and up to
3 A (continuous) output current. They can withstand voltages
of up to 500 V (MOSFET breakdown voltage).
Leadform 2175
Functional Block Diagram
VB1
VB2
VB3
UVLO
UVLO
UVLO
VCC1
UVLO
HIN1
HIN2
HIN3
Input
Logic
VBB
High-Side
Level Shift Driver
COM1
W1
W2
V
U
SD1
VCC 2
UVLO
LIN1
LIN2
LIN3
COM2
SD2
Input Logic
(OCP Reset )
Thermal
Shutdown
Low-Side
Driver
OCP
LS 2
OCP and OCL
LS1
OCL
RC
Figure 1. Driver block diagram.
28610.09, Rev. 6
¯¯D̄¯2̄¯ terminals are used for both input and output.
A. S̄¯¯D̄¯1̄¯ , S̄
¯¯D̄¯2̄¯ , and Ō
¯¯C̄¯L̄¯ terminals are open-collector output. RC terminal is open-drain input.
B. S̄¯¯D̄¯1̄¯ , S̄
C. Blanking Time (tblank) is used in Overcurrent Limiting (OCL) and Overcurrent Protection (OCP).
If the time exceeds the limit, the signal will be output (open-collector output turns on), and protection
operation will start up.
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Selection Guide
Output Current
Part Number
MOSFET Breakdown
Voltage, VDSS(min)
(V)
Continuous, IO(max)
(A)
Pulsed, IOP (max)
(A)
SLA6868MZ
500
2.5
3.75
SLA6870MZ
500
3
4.5
Absolute Maximum Ratings, valid at TA = 25°C
Rating
Unit
MOSFET Breakdown Voltage
Characteristic
Symbol
VDSS
VCC = 15 V, ID = 100 μA, VIN = 0 V
500
V
Logic Supply Voltage
VCC
Between VCC and COM
20
V
Bootstrap Voltage
VBS
Between VB and HS (U,V, and W phases)
20
V
Output Current, Continuous
IO
Output Current, Pulsed
IOP
Input Voltage
VIN
Pull-up Voltage for Shutdown Pins
VSDX
Pull-up Voltage for Overcurrent Limiting Pin
VOCL
Allowable Power Dissipation
PD
Remarks
SLA6868MZ
2.5
A
SLA6870MZ
3
A
SLA6868MZ
SLA6870MZ
PW ≤ 100 μs, duty cycle = 1%
HINx and LINx pins
3.75
A
4.5
A
–0.5 to 7
V
S̄¯¯D̄¯x̄¯ pins
7
V
7
V
TC = 25°C
32.9
W
Thermal Resistance (Junction to Case)
RθJC
3.8
°C/W
Case Operating Temperature
TCOP
All elements operating
–20 to 100
°C
Junction Temperature (MOSFET)
TJ
150
°C
Storage Temperature
Tstg
–40 to 150
°C
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
2
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Recommended Operating Conditions
Characteristic
Main Supply Voltage
Symbol
VBB
Remarks
Between VBB and LS
Min.
Typ.
Max.
Units
–
–
400
V
VBB Snubber Capacitor
CSB
0.01
–
0.1
μF
Logic Supply Voltage
VCC
Between VCC and COM
13.5
15
16.5
V
Zener Voltage for VCCx Pins
VZ
Between VCC and COM
18
–
20
V
VSDx, VOCL
4.5
5
5.5
V
Pull-up Resistor S̄¯¯D̄¯x̄¯ Pins
RUP2
3.3
–
10
kΩ
Pull-up Resistor OCL Pin
RUP1
1
–
10
kΩ
Pull-up Resistor RC Pin
RR
33
–
390
kΩ
CSDX
1
–
10
nF
CC
1
–
4.7
nF
Pull-up Voltage
Capacitor S̄¯¯D̄¯x̄¯ Pins
Capacitor RC Pin
Dead Time
Minimum Input Pulse Width
Switching Frequency
28610.09, Rev. 6
tdead
TJ = –20°C to 150°C
1.5
–
–
μs
IINMIN(on)
TJ = –20°C to 150°C
0.5
–
–
μs
IINMIN(off)
TJ = –20°C to 150°C
0.5
–
–
μs
–
–
20
kHz
fPWM
SANKEN ELECTRIC CO., LTD.
3
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Typical Application Diagram
Shows configuration for implementing current
¯¯D̄¯1̄¯ pins tied together
¯¯C̄¯L̄¯ and S̄
limiter function: Ō
1
2
3
SLA6868MZ
SLA6870MZ
10
VB1 VB2 VB3
4
5V
RUP1
HO 1
VCC1
HS1
DZ1
CSD1
HVIC
5
9
8
7
6
SD1
24
HO 2
HS2
12
HIN 3
HO 3
COM1
HS3
11
13
23
M
HIN 1
HIN 2
CSB
VCC 2
DZ2
LO 1
17
MC U
20
19
18
OCL
LVIC
LIN1
LIN2
LIN3
RR
RS
16
LO 3
5V
15
5V
CC
LO 2
RUP2
22
CSD2
21
RC
14
SD2
COM 2
15 V
NOTE:
▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from
external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise
susceptibility is necessary.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
4
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Typical Application Diagram
Shows configuration without current limiter
function: S̄¯¯D̄¯1̄¯ and S̄¯¯D̄¯2̄¯ pins tied together
1
3
2
SLA6868MZ
SLA6870MZ
10
VB1
4
VB2 VB3
HO1
VCC1
HS1
ZD
24
5V
HO2
Rup
Rup1
5
9
8
7
6
SD1
HS2
12
M
HIN1
HIN2
HIN3
COM1
HO3
HVIC
HS3
11
13
CSD
23
VCC2
ZD
LO1
17
20
19
18
OCL
LIN1
LIN2
LIN3
RR
VRC
LO2
RS
16
LO3
15
14
RC
CC
22
21
SD2
COM2
LVIC
15V
NOTE:
The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions
from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further
reduction of noise susceptibility is necessary.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
5
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
SLA6868MZ
Logic Supply Current
ICC
Bootstrap Supply Current
IBX
VBX = 15 V, VHIN = 5 V
VIH
VIL
VIhys
Input Voltage
Input Voltage Hysteresis
Input Current
IIN
VUVHL
VUVHH
Undervoltage Lock Out
VUVHhys
VUVLL
VUVLH
SDx and OCL Output Voltage
Overtemperature Detection Threshold
Temperature (Activation and
Deactivation)
SLA6870MZ
VCC = 15 V, TC = –20°C to 125°C
Min
Typ
Max
Units
–
4.2
7
mA
–
2.7
5.0
mA
–
135
380
μA
VCC = 15 V
–
2.9
3.4
V
VCC = 15 V
1.6
2.1
–
V
VCC = 15 V
–
0.8
–
V
VIN = 5 V
–
230
500
μA
9.0
10.0
11.0
V
9.5
10.5
11.5
V
–
0.5
–
V
10.0
11.0
12.0
V
10.5
11.5
12.5
V
High side, between VBx and U, V, or W
High side, hysteresis
Low side, between VCC2 and COM2
VUVLhys
Low side, hysteresis
–
0.5
–
V
VSDX(on),
VOCL
VSDX = VOCL = 5 V, RUPX = 3.3 kΩ
–
–
0.6
V
120
135
150
°C
100
115
130
°C
–
20
–
°C
V
TDH
TDL
VCC = 15 V, high-side and low side
TDhys
Overcurrent Protection Trip Voltage
VTRIP
VCC = 15 V
0.9
1.0
1.1
Overcurrent Limit Reference Voltage
VLIM
VCC = 15 V
0.5035
0.53
0.5565
V
–
2.0
–
ms
Overcurrent Protection Hold Time
tp
VRC = 5 V, RR = 360 kΩ, CC = 0.0047 μF
Blanking Time
tblank
VCC = 15 V
1.4
2.0
2.6
μs
Bootstrap Diode Leakage Current
ILBD
VR = 250 V
–
–
10
μA
Bootstrap Diode Forward Voltage
VFBD
–
1.1
1.3
V
–
0.8
1.3
V
Bootstrap Diode Recovery Time
trrb
Bootstrap Diode Series Resistor
RBD
MOSFET Breakdown Voltage
VDSS
MOSFET Leakage Current
IDSS
MOSFET On State Resistance
MOSFET Diode Forward Voltage
28610.09, Rev. 6
RDS(on)
VSDF
SLA6868MZ
SLA6870MZ
IF = 0.05 A
IF / IRP = 100 mA / 100 mA
–
70
–
ns
168
210
252
Ω
VCC = 15 V, ID = 100 μA, VIN = 0 V
500
–
–
V
VCC = 15 V, VDS = 500 V, VIN = 0 V
–
–
100
μA
SLA6868MZ
VCC = 15 V, ID = 1.5 A, VIN = 5 V
–
2.0
2.4
Ω
SLA6870MZ
VCC = 15 V, ID = 1.25 A, VIN = 5 V
–
1.4
1.7
Ω
SLA6868MZ
VCC = 15 V, ISD = 1.5 A, VIN = 0 V
–
1.1
1.5
V
SLA6870MZ
VCC = 15 V, ISD = 1.25 A, VIN = 0 V
–
1.0
1.5
V
SANKEN ELECTRIC CO., LTD.
6
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
SLA6868MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
tdH(on)
trH
Switching Time, High Side
Typ
Max
Units
–
790
–
ns
–
60
–
ns
–
115
–
ns
tdH(off)
–
725
–
ns
tfH
–
20
–
ns
tdL(on)
–
680
–
ns
trrH
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V
trL
Switching Time, Low Side
Min
–
70
–
ns
–
120
–
ns
tdL(off)
–
605
–
ns
tfL
–
20
–
ns
Min
Typ
Max
Units
tdH(on)
–
755
–
ns
trH
–
65
–
ns
–
100
–
ns
–
680
–
ns
trrL
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V
SLA6870MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Switching Time, High Side
Symbol
trrH
Conditions
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V,
inductive load
tdH(off)
tfH
–
15
–
ns
tdL(on)
–
645
–
ns
trL
Switching Time, Low Side
28610.09, Rev. 6
–
70
–
ns
–
105
–
ns
tdL(off)
–
560
–
ns
tfL
–
20
–
ns
trrL
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V,
inductive load
SANKEN ELECTRIC CO., LTD.
7
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
IN
trr
ton
VDS
td(on)
tr
90%
ID
toff
td(off) tf
90%
10%
10%
Switching Characteristics Definitions
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
8
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Truth Table
Mode
Normal
TSD
OCP
¯¯C̄¯L̄¯ ( = L )1
Ō
UVLO ( VCC )2
UVLO ( VB )3
S̄¯¯D̄¯2̄¯ ( = L )
Hin
Lin
H-side MOSFET
L-side MOSFET
L
L
Off
Off
H
L
On
Off
L
H
Off
On
H
H
On
On
L
L
Off
Off
H
L
On
Off
L
H
Off
Off
H
H
On
Off
L
L
Off
Off
H
L
On
Off
L
H
Off
Off
H
H
On
Off
Off
L
L
Off
H
L
Off
Off
L
H
Off
On
H
H
Off
On
L
L
Off
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
On
H
H
Off
On
L
L
Off
Off
H
L
On
Off
L
H
Off
Off
H
H
On
Off
1The OCL feature is enabled when the Ō
¯¯C̄¯L̄¯ and S̄¯¯D̄¯1̄¯ pins are tied together externally. If these pins are not tied when an
OCL condition occurs, device operation continues in Normal mode.
2Returning to the Normal mode of operation from a V
CC UVLO condition, a high-side MOSFET resumes switching
on the rising edge of an HINx input. On the other hand, a low-side MOSFET resumes switching on the first logic high
of a LINx input after release of the UVLO condition.
3Returning to the Normal mode of operation from a V UVLO condition, a high-side MOSFET resumes switching on the rising
B
edge of an HINx input.
Note: To prevent a shoot-through condition, the external microcontroller should not drive HINx = LINx = H at the same time.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
9
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
OCP Timing Diagram
LIN
LO
VTRIP
LS1
tblank
OC P
Release
S D2
tp
RC
3.5 V
Slope defined by RC, CC
Low-Side TSD Timing Diagram
Open-collector output transistor
turned on in low state
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
10
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
High-Side UVLO Timing Diagram
Low-Side UVLO Timing Diagram
LIN
VCC2
UVLH
UVLL
UVLH
LO
SD2
28610.09, Rev. 6
Open-collector output transistor
turned on in low state
SANKEN ELECTRIC CO., LTD.
11
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
OCL Timing Diagram
¯¯C̄¯L̄¯ and S̄
¯¯D̄¯1̄¯ pins connected externally
Ō
Enable resumption of high-side
operation at next HIN rising edge
HIN
Enable resumption of low-side
operation at next LIN rising edge
LIN
High-side
shutdown
High-side
shutdown
HO
3.3 μs
3.3 μs
Low-side shutdown
LO
VTRIP (1 V)
LS1
2 μs
2 μs
VOCL (0.5 V)
2 μs
OCL,
SD1
VTH (2.1 V)
T= 50 Cf
VTH (2.9 V)
VTH (2.1 V)
VTH (2.9 V)
T= RL×Cf
T= RL×Cf
VTH (2.9 V)
SD2
T= 50 C2
T= R2×C2
3.5 V
RC
T= 50 CC
5 μs
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
T= RR×CC
12
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Shut Down Timing Diagram
S̄¯¯D̄¯1̄¯ and S̄¯¯D̄¯2̄¯ pins connected externally; current-limiter function not in use
HIN(a)
LIN(a)
Slope defined by RC, CC
(a) Each HINx or LINx pin drives a independent side of a phase, that is, the high-side and the
low-side swtiching devices of a U, V, or W motor coil phase are each driven separately, by the
corresponding dedicated HINx or LINx input
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
13
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Pin-out Diagram
Leadform 2175
Leadform 2171
1
3
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
23
22
24
Pad Side
1
3
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
23
22
24
Pad Side
Terminal List Table
28610.09, Rev. 6
Number
1
Name
VB1
High side bootstrap terminal (U phase)
2
VB2
High side bootstrap terminal (V phase)
3
VB3
4
VCC1
Function
High side bootstrap terminal (W phase)
High side logic supply voltage
5
S̄¯¯D̄¯1̄¯
6
COM1
7
HIN3
High side input terminal (W phase)
8
HIN2
High side input terminal (V phase)
High side shutdown input and UVLO fault signal output
High side logic GND terminal
9
HIN1
High side input terminal (U phase)
10
VBB
Main supply voltage
11
W1
Output of W phase (connect to W2 externally)
12
V
Output of V phase
13
W2
Output of W phase (connect to W1 externally)
14
LS2
Low side source terminal (connect to LS1 externally)
15
RC
Overcurrent protection hold time adjustment input terminal
16
LS1
Low side source terminal (connect to LS2 externally)
17
¯¯C̄¯L̄¯
Ō
Output for overcurrent limiting
18
LIN3
Low side input terminal (W phase)
19
LIN2
Low side input terminal (V phase)
20
LIN1
Low side input terminal (U phase)
21
COM2
22
S̄¯¯D̄¯2̄¯
23
VCC2
24
U
Low side GND terminal
Low side shutdown input and overtemperature, overcurrent, and UVLO fault signals output
Low side logic supply voltage
Output of U phase
SANKEN ELECTRIC CO., LTD.
14
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Package Outline Drawing
Leadform 2171
Dual rows, 24 alternating pins; vertical case mounting; pin #1 on pad side
Exposed
heatsink pad
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2
4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15
Ø3.2 ±0.15
2X Gate protrusion
2.45 ±0.2
BSC
16 ±0.2 B
12.9 ±0.2
9.9 ±0.2
Branding Area
5 ±0.5
9.5 +0.7
– 0.5
View A
2
1
4
3
6
5
8
7
10
9
12
11
14
13
16
15
18
17
20
19
22
21
4.5
REF
Measured at pin tips
B
To case top
4.5 ±0.7
24
23
0.7 MAX
A
R1
REF
+0.15
0.5 – 0.05
1.27 ±0.7 A
0.6 +0.15
– 0.05
Heatsink
exposed
this side
2X Exposed
tie bar
0.7 MAX
Deflection at pin bend
View A
Leadform: 2171
Terminal core material: Cu
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6868MZ or SLA6870MZ
2nd line, lot:
YMDD#
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
# is the tracking letter
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
15
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Package Outline Drawing
Leadform 2175
Dual rows, 24 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row
Exposed
heatsink pad
31.3 ±0.1
31 ±0.2
24.4 ±0.2
16.4 ±0.2
Gate protrusion
4.8 ±0.2
0.6
1.7 ±0.1
Ø3.2 ±0.15
Ø3.2 ±0.15
2X Gate protrusion
2.45 ±0.1
BSC
16 ±0.2 B
12.9 ±0.2
9.9 ±0.1
Branding Area
3 ±0.3
BSC
2X Exposed
tie bar
2.2 ±0.6
BSC
4.4
REF
0.6 +0.2
– 0.1
View A
1.27 ±0.2 A
2.2 ±0.6
BSC
R1
REF
0.5 ±0.1
1 2 3
5
7
9
11
13
15
17
19
21
23
16
4
6
18
8
12
14
20
10
22
24
0.7 MAX
A
Measured at pin exit from case
B
To case top
0.7 MAX
Deflection at pin bend
View A
Leadform: 2175
Terminal core material: Cu
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6868MZ or SLA6870MZ
2nd line, lot:
YMDD#
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
# is the tracking letter
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
16
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
Because reliability can be affected adversely by improper
storage environments and handling methods, please observe
the following cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative
humidity (around 40% to 75%); avoid storage locations
that experience extreme changes in temperature or
humidity.
• Avoid locations where dust or harmful gases are present
and avoid direct sunlight.
• Reinspect for rust on leads and solderability of the
products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and
other standard test periods, protect the products from
power surges from the testing device, shorts between
the product pins, and wrong connections. Ensure all test
parameters are within the ratings specified by Sanken for
the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on
a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce
excess stress.
• Volatile-type silicone greases may crack after long periods
of time, resulting in reduced heat radiation effect. Silicone
greases with low consistency (hard grease) may cause
cracks in the mold resin when screwing the products to a
heatsink.
Our recommended silicone greases for heat radiation
purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
• When the flatness around the screw hole is insufficient, such
as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged,
even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should
be 0.05 mm or less.
28610.09, Rev. 6
•
Please select suitable screws for the product shape. Do not
use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When
using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole
before threading or the work situation. That may stress the
products and may cause failures.
• Recommended screw torque: 0.588 to 0.785 N●m (6 to 8
kgf●cm).
• For tightening screws, if a tightening tool (such as a driver)
hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of
the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact.
In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an
electric driver is recommended.
When the package is tightened at two or more places, first
pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque
control is mandatory.
Soldering
• When soldering the products, please be sure to minimize
the working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 1.5 mm from
the body of the products.
Electrostatic Discharge
• When handling the products, the operator must be
grounded. Grounded wrist straps worn should have at
least 1 MΩ of resistance from the operator to ground to
prevent shock hazard, and it should be placed near the
operator.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor
mats.
• When using measuring equipment such as a curve tracer,
the equipment should be grounded.
• When soldering the products, the head of soldering irons
or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the
products.
• The products should always be stored and transported in
Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
SANKEN ELECTRIC CO., LTD.
17
SLA6868MZ and
SLA6870MZ
High Voltage 3-Phase Motor Drivers
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
28610.09, Rev. 6
SANKEN ELECTRIC CO., LTD.
18