SANKEN ELECTRIC CO., LTD.
SI-6635M
Scope
The present specifications shall apply to a 3 phase brushless motor driver IC, SI-6635M.
The present specifications shall apply to SI-6635M which is performed RoHS instructions.
The present specifications, which shows in Japanese and English, shall be prior to Japanese.
Outline
Type
Monolithic integrated circuit
Structure
Plastic molded (transfer mold)
3 phase brushless motor driver
Applications
(Sinusoidal Current Control)
Absolute maximum ratings
Items
Symbol
Power supply voltage
※1
Output voltage
Output current※2
Condition
Limit
Unit
VBB
-0.3～38
V
VOUT
-0.5～VBB
±2
V
A
IOUT(Ave)
IOUT(Peak)
tw<500msec/Duty<10%
±4
A
IOD
FG/FLAG
10
mA
-0.3~5.5
V
-0.3~5.5
V
VIN(Analog)
-0.3~6
V
Sense voltage
VSENSE
±0.5
V
Package power dissipation
Maximum junction
temperature
Storage temperature
PD
4.1
W
TJ
150
°C
Tstg
-40~150
°C
Ambient temperature
TA
-20~85
°C
Open drain output
sink current
Logic input voltage
VIN(Logic)
Logic output voltage
VOUT(Logic)
Analog input voltage
FG/FLAG
SK evaluation board
Output current rating may be limited by duty cycle, ambient temperature, and heat sinking.
Under any set of conditions, do not exceed the specified junction temperature (Tj).
※1 Output voltage can not be over 38V.
※2 Peak current is guaranteed by design.
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SI-6635M
Electrical characteristics
Recommended Operating Range
VBB
VIN(Logic)
VIN(Analog)
FCLK
VSEN
TC
Limit
Min
10
0
0
9.5
-0.5
-20
Max
30
5.25
5.25
20
0.5
105
TA
-20
85
Items
Symbol
Power supply voltage
Logic input voltage
Analog input voltage
CLK input range
Sense voltage
Package temperature
Ambient
temperature
Unit
Remark
V
V
V
MHz
V
°C
In normal operation
°C
Note) Especially, care should be taken with output current on condition over recommended range and below
absolute max rating. In this case, enough evaluation is needed with thermal design data below and application note
to avoid the device being over absolute max rating for other item.
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SI-6635M
Electrical Characteristic (Ta=25°C,VBB=24V，Unless Otherwise Noted.)
Item
Output Drivers
VBB voltage range
Symbol
VBB
MIN
Limit
TYP
MAX
10
5
-
VBBOV
25
V
mA
3
-
25
mA
Unit
Condition
In normal operation
Opration state
Non-operation state
with charge pomp OFF, output OFF
Main power supply current
IBB
Output ON resistance
Ron
0.1
0.2
0.3
Ω
Iout=2A
MOSFET diode forward volatge
VF
0.3
1.15
2.0
V
Iout=2A
Control Logic
VDD voltage range
Logic input voltage
Logic input current
Internal PWM
Sen pin input current
Sense voltage
Current sensing filter time
VDD
3.0
3.3
3.5
V In operation
VIN(0)
- VDD×0.3 V
VIN(1) VDD×0.7 V
IIN(0)
-10
0
10
μ A VIN(0) , VIN=0V
-10
0
10
μ A VIN(1) , VIN=5.5V, SDA/SCL
IIN(1)
45
145
μ A VIN(1) , VIN=5.5V, ADRS1/ADRS2/BRKn
ISen
VSen
tLPFSen
-10
0.21
0.5
0
0.25
2
10
0.29
4
μ A VSen=0～0.5V
V With VREF=0.25V
μ s Guaranteed by design
Typ data is for reference only.
Negative current is defined as coming out of the specified pin.
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SI-6635M
Electrical Characteristic(continued) (Ta=25°C,VBB =24V，Unless Otherwise Noted.)
Item
Protection
Flag output saturation voltage
Flag output pin ON current
Flag output leak current
OCP sensing volatge
VBB overvoltage protection
threshold voltage
VBB overvoltageprotection
hysteresis
Thermal protection
operating temperature
Thermal protection hysteresis
VDD UVLO releasing voltage
VDD UVLO hysteresis
VBB UVLO releasing voltage
VBB UVLO hysteresis
FG
FG output saturation voltage
FG output pin ON current
FG output leak current
Hall Logic
Hall input current
Common mode input voltage
AC inputrange
voltage range
Hysteresis
Pulse removal filter
Hall input thresh voltage
Hall input hysteresis
FG amplifier
FG input bias current
FG input offset voltage
FGO output leak current
FGO output L voltage
FG amplifier bias voltage
FG comparator hysteresis
Limit
TYP MAX
Unit
Condition
0.45
7.5
0
1.2
0.8
0.7
25
50
2
1.8
V
mA
μ A
V
V
IFG=2mA
VFI=2V
VFG=5.5V
LowSideMOSFET sensing (OUT-GND)
HighSideMOSFETsensing (VBB-GND)
32
35
38
V
VBBOVhys 1.4
2
5.1
V
165
-
℃
TJTSDhys VDDUV 2.55
VDDUVhys 0.15
VBBUV 6.5
VBBUVhys 0.15
50
3.0
0.25
9
0.3
3.3
0.35
9.75
0.45
℃
V
V
V
V
VFG(sat)
IFI(ON)
IFGlkg
0.08
5
-1
0.45
7.5
0
0.7
25
50
IHALL
VCMR
VHALL
VHYS
tpulse
VHIC(1)
VHIC(1)HYS
-2
0.2
60
20
0.9
2.3
20
-0.1
2
μ A VIN=0.2～3.5V
4
V
mV
p-p
40 VHALL mV
2
4
μ s
2.5
2.8
V In applied voltage rising/ Hall IC input
40
60
mV
Hall IC input
IBFG
VOSFG
IOH
VOL
VBFG
VFGhys
-1
-60
-110
0.05
2.2
20
Symbol
MIN
VFI(ON) 0.08
IFI(ON)
5
IFI(OFF)
-1
VOCPLS 0.7
VOCPHS 0.3
VBBOV
TJTSD
-
0
2.5
70
1
60
10
0.6
2.8
150
In VBB voltage rising
In temperature rising
Guaranteed by design
In VDD voltage rising
In VBB voltage rising
V IFG=2mA
V VFI=2V
μ A VFG=5.5V
μ A
mV
μ A
V
I=10uA
V
mV
Typ data is for reference only.
Negative current is defined as coming out of the specified pin.
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SI-6635M
Serial Interface
Electrical Characteristic(continued) (Ta=25°C,VBB =24V，Unless Otherwise Noted.)
Parameter
項目
Symbol
記号
Conditions
条件
Ratings
規格値
Min.
Typ.
Max.
Unit
単位
400
kHz
SCLClock
クロック周波数
SCL
Frequency
fＳＣＬ
Start
Condition
Hold Time
START
条件でのホールド時間
tＨＤ;ＳＴＡ
0.6
μ s
Start
Condition
Set Up Time
START
条件でのセットアップ時間
tＳＵ;ＳＴＡ
0.6
μ s
SCL
Time
SCLLow
Low
時間
tＬＯＷ
1.3
μ s
SCL
Time
SCLHigh
High
時間
tＨＩＧＨ
0.6
μ s
SDA
Time
SDAHold
ホールド時間
tＨＤ;ＤＡＴ
0
SDA
Up Time
SDASet
セットアップ時間
tＳＵ;ＤＡＴ
100
Rising
Time立上り時間
of SCL and SDA
SCL、SDA
tｒ
300
ns
Falling
Time立下り時間
of SCL and SDA
SCL、SDA
tｆ
300
ns
Stop
Condition
Set Up Time
STOP
条件でのセットアップ時間
tＳＵ;ＳＴＯ
Bus
Free条件、START
Time between 条件の間のバスフ
Stop and Start
STOP
tＢＵＦ
Condition
リー時間
900
ns
ns
0.6
μ s
1.3
μ s
※All threshold voltage referred to VIH(Min.) and VIL(Max.) level.
※There are design guarantee values.
Serial Timing
tSU;STA tHD;STA
tSU;DAT
tHD;DAT
tSU;STO
tBUF
SDA
tr
SCL
tｆ
START
START条件
condition
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tLOW
STOP
STOP条件
condition
tHIGH
SSJ-
STOP
START条件
condition
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SI-6635M
Block diagram (Connection diagram)
CPL
CPH
Internal functional block diagram
VDD
VDD
HUP
Reg
Logic
Reg
Charge
Pump
CP
Reg
HUM
HVP
HVM
Commutation
Logic
VBB
VDD
VDD
HWP
HWM
Sinusoidal
Wave
Control
SDA
SCL
Serial
Interface
VDD
Highside
Gate
Driver
VDD Reg
OutU
OutV
OutW
Lowside
Gate
Driver
Control
Logic
S
Brake
250 mV(Default)
SEN
OSC1
Oscillator
OSC2
FG
FGO
FLAG
ADRS1
UVLO
TSD
OCP
OVP
LOCK
FG-
FG+
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NC
NC
NC
GND
GND
PGND
TEST
ADRS2
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SI-6635M
Pin Assignment (Terminal Functions)
1 HWM
Hall input W2 HWP
Hall input W+
3 HVM
Hall input V4 HVP
Hall input V+
5 HUM
Hall input U6 HUP
Hall input U+
7 FGM
Pattern FG input (-)/ Encoder input
8 FGP
Pattern FG input (+)/ Encoder input
9 FGO
Pattern FG feedback
10 FLAG
Output for protection detected
11 FG
FG signal output/ Error output for designated speed
12 GND
Ground
13 VBB
Motor power supply
14 VBB
Motor power supply
15 CP
Reservoir pin for charge pump
16 CPH
Reservoir pin for charge pump (High)
17 CPL
Reservoir pin for charge pump (Low)
18 GND
Ground
19 SDA
Serial interface (data)
20 SCL
Serial interface (clock)
21 ADRS1
Device address setting（most significant bit)
22 ADRS2
Device address setting (least significant bit)
23 VDD
Ceramic capacitor connection for internal regulator
24 TEST
for test
25 OSC1
for ceramic oscillator connection/External clock input
26 OSC２
for ceramic oscillator connection
27 BRKｎ
Brake input
28 OUTW
Output for W phase
29 N.C.
No connection
30 PGND
Power ground
31 SEN
Current sensing input
32 S
Source pin
33 N.C.
No connection
34 OUTV
Output for V phase
35 N.C.
No connection
36 OUTU
Output for U phase
※ Both VBB pins should be connected to VBB line on PCB.
※ GND pins and PGND pin should be connected to GND line on PCB.
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SI-6635M
OutW
NC
PGND
SEN
S
NC
HWM
BRKn
HWP
OSC2
HVM
OSC1
HVP
TEST
SI-6635M
HUM
VDD
SSJ-
GND
SDA
CPL
FGO
CPH
SCL
CP
FGP
VBB
ADRS1
VBB
FGM
GND
ADRS2
FG
HUP
FLAG
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OutV
NC
OutU
Pin assignment diagram
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SI-6635M
Example application circuit(Evaluation Board Circuit)
Ceramic resonator module, Hall element and Print coil FG (set by I2C)
CPL
0.1uF
Hall Bias
VDD
VDD
HUP
HALL
CPH
0.1uF
Reg
Logic
Reg
Charge
Pump
CP
Reg
0.1uF
HUM
HVP
HALL
HVM
Commutation
Logic
VDD
HWP
HALL
HWM
Sinusoidal
Wave
Control
SDA
SCL
0.1uF
VBB
VDD
Serial
Interface
VDD
VBB
100uF
Highside
Gate
Driver
VDD Reg
OUTU
OUTV
OUTW
Lowside
Gate
Driver
BLDC
Control
Logic
S
BRKn
250 mV(Default)
SEN
CERAMIC
RESONATOR
MODULE
OSC1
Controller
Oscillator
OSC2
FG
FGO
FLAG
ADRS1
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39k
FGP
PRINT COIL FG
0.1uF
NC
NC
NC
GND
GND
PGND
120pF
3.9k 0.1uF
FGM
ADRS2
TEST
Device
デバイス
address
アドレス
設定端子
setting
pin
UVLO
TSD
OCP
OVP
LOCK
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SI-6635M
External clock, Hall IC and Encoder (set by I2C)
5V
CPL
3.3
0.1uF
VDD
VDD
HALL
IC
CPH
0.1uF
HUP
Reg
Logic
Reg
Charge
Pump
CP
Reg
0.1uF
HUM
HALL
IC
HVP
HVM
HALL
IC
Commutation
Logic
VDD
HWP
HWM
Sinusoidal
Wave
Control
SDA
SCL
0.1uF
VBB
VDD
Serial
Interface
VDD
VBB
100uF
Highside
Gate
Driver
VDD Reg
OUTU
OUTV
OUTW
Lowside
Gate
Driver
BLDC
Control
Logic
S
BRKn
250 mV(Default)
SEN
OSC1
Controller
Oscillator
External Clock
OSC2
FG
FGO
FLAG
ADRS1
FGM
Encoder
エンコー
ダ入力
input
FGP
NC
NC
NC
GND
GND
PGND
ADRS2
TEST
デバイス
Device
アドレス
address
設定端子
setting pin
UVLO
TSD
OCP
OVP
LOCK
※1：The capacitance on VBB or VDD is used as close to the device as possible.
※2：Care should be taken for power dissipation for SEN/S resistance.
☆ Precaution to avoid the noise on VDD line.
Switching noise from PCB traces, where high current flows, to the VDD line should be minimized
because the noise level more than 0.3Von the VDD line may cause malfunctioning operation.
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SI-6635M
7 Package information
7-1 Package type, physical dimensions and recommendation foot print
Recommendation foot print (red line)
Dimensions in millimeters
Material of terminal: Cu
Treatment of terminal : Ni + Pd +Au (Pb Free)
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SI-6635M
7-2 Appearance
The body shall be clean and shall not bear any stain, rust or flaw.
7-3 Marking
The type number and lot number shall be clearly marked by laser so that cannot be erased easily.
7-4 Blanding
SI-6635M Marking Specification
Discrimination
Mark No
Year
①
Month
②
Week
③
Contents
The last digit of year
Month by number or alphabet when assembly is
started
[1-9] in case from January to September
[O] in case October
[N] in case November
[D] in case December
[1] in case from first to tenth
[2] in case from eleven to twentieth
[3] in case from twenty to first to thrty first
Casting order
④、⑤
Assembly entry order
1 to 9 to be used.”11” ~ “99” ("0" is excluded)
*Unit of assembly entry order is per MIC lot
Registration code
⑥～⑨
The last three digit of MIC’s lot number + "T" mark
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SI-6635M
8 Packing specifications
8-1. Container/Material/The number of parts per reel
Container is taping. the number of parts is 2500pcs per reel.
Remainder is packed with combination with next lot.
8-2. The material of taping
Material
Emboss tape
Reel
laminate bag
Inner packing figure
Outer packing figure
The width of tape : 16mm
φ330 [mm]
Size : 0.075×380× 450 [mm]
Size : 340×360× 55 [mm]
Size : 350×370×230 [mm]
4 reels(max) per 1 outer box
8-3. Emboss tape diagram
L winding
IC mounted
Trailer
Over 50pcs of vacant pocket
Reader
Over 50pcs of vacant pocket
※ It is heat-sealed with cover tape in reader and trailer.
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SI-6635M
8-4．Dimension, material and diagram
8-4-1．Emboss tape
Ao＝6.30
Bo＝6.30
Ko＝1.10
（単位
ｍｍ）
8-4-2．Reel
Tape width: 16.0mmm
W1 ：17.5±1.0 mm
W2 ；21.5±1. 0mm
Detail drawing of shaft hole
Dimension in millimeter
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SI-6635M
・8-5-1
Srage environment is below.
Temperature: 5 degrees-30 degrees
Humidity: 90% or below
Storage limitation is within 12month from packing date
8-5-2
If the above storage condition (8-5.1) is expired, the device is needed to have baking with 125 dgerees for 20
hours. Also, Tape and reel are not guaranteed with the temperature and time condition.
If the device should be baked, it is needed to use container with “heatproof” or temperture to cover baking
condition. And the container is needed to have static electricity control.
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SI-6635M
9 Cautions and warnings
Input/output (SDA, SCL, FG, FLAG, Brake, ADRS1, ADRS2, TEST)
・Be sure to prevent the logic inout (SDA, SCL, for 2-wire serial) from being "OPEN".
※In case some of the logic inputs stay "OPEN", a malfunction may occur due to external noises.
・Logic input (Brake, ADRS1, ADRS2) has internal 78k ohm (typ) pull-down resistor.
Please take care that current source/sink capacity of external microcontroller if use.
・TEST terminal should be used as open or connected to GND.
・When the open-drain output (FG, FLAG) is not used, be sure to keep it "OPEN" or GND.
※In case it is connected to VDD, it may cause the device's deterioration or/and breakdown.
Schottky should be needed between each OUT pin and GND(Please see 6. Example application circuit).
About the protection circuit operation
This product has protection circuits (motor coil short-circuit and overheating).
These protection circuits work with detecting the thing that excessive energy joins the driver.
Therefore, it is not possible to protect it when the energy caused by the motor coil short-circuit is outside the
tolerance of the driver.
Notice
This driver has MOS inputs. Please notice as following contents.
・When static electricity is a problem, care should be taken to properly control
the room humidity. This is particularly true in the winter when static
electricity is most troublesome.
・Care should be taken with device leads and with assembly sequencing to avoid
applying static charges to IC leads. PC board pins should be shorted together
to keep them at the same potential to avoid this kind of trouble.
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SI-6635M
10. other
Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the
products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intell ectual property
rights or any other rights of Sanken or any third party which may result from its use.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of
semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk,
preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to
the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic
equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Please
return to us this document with your signature(s) or seal(s) prior to the use of the products herein.
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipmen t
and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please
contact your nearest Sanken sales representative to discuss, and then return to us this document with your signature(s) or seal(s)
prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliabilit y
largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or
improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power
etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of
semiconductor devices. For these stresses, instantaneous values, maximum values and minimu m values must be taken into
consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree
of derating of junction temperature (Tj) affects the reliability significantly.
When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such
uses in advance and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
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Sanken assumes no responsibility for any troubles, such as dropping products caused during
transportation out of Sanken’s distribution network.
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