FMN-1206S ds en

Fast Recovery Diode
FMN-1206S
Mar/21/2011
Features
Package
The FMN-1206S is a fast recovery diode which realize
a peak reverse voltage of 600V and a typical forward
voltage drop of 1.1V optimizing a tradeoff between VF
and trr. It has the characteristics suit for PFC circuit of
both DCM and CRM.
The high current full-mold package achieves high
performance in terms of heat release and isolation.
·
·
·
·
VRM----------------------------------------------------- 600V
VF ------------------------------------- 1.3V max (IF=20A)
IF(AV) ------------------------------------------------------ 20A
trr------------- 100ns (IF=0.5A, IRP=1.0A, 75% of R.P.)
TO-220F-2L
(1) (2)
Equivalent circuit
Applications
· PFC Circuit (DCM, CRM)
· High Current Secondary Side Rectifier
· High Frequency Rectifier Circuit, etc.
Absolute maximum ratings Valid at Ta = 25°C, unless otherwise specified
Characteristic
Symbol
Rating
Unit
Transient Peak Reverse Voltage
VRSM
600
V
Peak Reverse Voltage
VRM
600
V
Average Forward Current
IF(AV)
20
A
Peak Surge Forward Current
IFSM
150
A
I2t Limiting Value
I2 t
112.5
A2s
Junction Temperature
Tj
-40∼+150
°C
Storage Temperature
Tstg
-40∼+150
°C
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
http://www.sanken-ele.co.jp
Notes
10msec.
Half sinewave, one shot
1msec≦t≦10msec
1
Fast Recovery Diode
FMN-1206S
Mar/21/2011
Electrical characteristics Valid at Ta = 25°C, unless otherwise specified
Characteristic
Symbol
Limits
Test Conditions
MIN.
Unit
TYP.
MAX.
―
1.3
V
Forward Voltage Drop
VF
IF=20A
Reverse Leakage Current
IR
VR=VRM
―
―
200
µA
VR=VRM, Tj=150°C
―
―
20
mA
―
―
150
ns
―
―
100
ns
―
―
4.0
°C /W
Reverse Leakage Current Under High
Temperature
H・IR
IF= IRP=500mA,
Tj=25℃, 90% Recovery
point
IF=500mA,IRP=1A,
Tj=25°C, 75% Recovery
point
Between junction and case
trr1
Reverse Recovery Time
trr2
Thermal Resistance
Rth(j-l)
Performance Curves
VF-IF
VR-IR
Ta=RT、60℃、100℃、150℃
Ta=RT、60℃、100℃、150℃
100
100
10
10
150℃
1
100℃
IF (A)
IR (mA)
1
0.1
60℃
0.1
0.01
R.T.
150℃
0.01
100℃
0.001
60℃
R.T.
0.0001
0.001
0
0.5
1
1.5
2
2.5
0
100
200
VF (V)
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
300
400
500
600
VR (V)
2
Fast Recovery Diode
FMN-1206S
Mar/21/2011
Characteristics
Average Forward Current ― Forward Power Dissipation
IF(AV) − PF
40
Forward Power Dissipation PF (W)
Tj=150℃
t/T=1/6
t
T
30
t/T=1/3,sinewave
20
t/T=1/2
10
DC
0
0
2
4
6
8
10
12
14
16
18
20
Average Forward Current IF(AV) (A)
Reverse Voltage ― Reverse Power Dissipation
VR − PR
10
Reverse Power Dissipation PR (W)
Tj=150℃
8
t
T
1-t/T=5/6
6
1-t/T=2/3
4
1-t/T=1/2
2
sinewave
0
0
100
200
300
400
500
600
Reverse Voltage VR (V)
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
3
Fast Recovery Diode
FMN-1206S
Mar/21/2011
Derating
Case Temperature ― Average Forward Current
Tc − IF(AV)
VR=0(V)
20
Average Forward Current IF (AV)
DC
t/T=1/6
t/T=1/3,Sinewave
10
t/T=1/2
Tj=150℃
t
T
0
0
50
100
150
Case Temperature Tc (°C)
Case Temperature ― Average Forward Current
Tc − IF(AV)
VR=600(V)
20
Average Forward Current IF(AV)
DC
t/T=1/6
10
t/T=1/3
Tj=150℃
sinewave
t/T=1/2
t
T
0
0
50
100
150
Case Temperature Tc (°C)
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
4
Fast Recovery Diode
FMN-1206S
Mar/21/2011
Package Outline
TO-220F-2L
NOTES:
1) All liner dimensions are in millimeters
2) Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
N1206
S
YMDD
Part Number
Lot Number
Y = Last digit of year(0­9)
M = Month (1­9,O,N or D)
DD = Day (01­31)
1
Rev.0.1
2
SANKEN ELECTRIC CO.,LTD.
5
Fast Recovery Diode
FMN-1206S
Mar/21/2011
OPERATING PRECAUTIONS
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the
following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
 When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
 Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone
greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product
life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
 When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should be 0.05mm or less.
 Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the
products and may cause failures.
 Recommended screw torque
Package
Recommended Screw Torque
TO-220 , TO-220F
0.490 to 0.686 N・m (5 to 7 kgf・cm)
TO-3P , TO-3PF
0.686 to 0.882 N・m (7 to 9 kgf・cm)
SLA
0.588 to 0.784 N・m (6 to 8 kgf・cm)
 For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress
fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening
with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and
the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with
the specified torque. When using a power driver, torque control is mandatory.
 Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less than 4
mm, it may cause the resin crack at tightening.
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
260 ± 5 °C 10 ± 1 s (Flow, 2 times)
380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
 Soldering should be at a distance of at least 1.5 mm from the body of the products.
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
6
Fast Recovery Diode
FMN-1206S
Mar/21/2011
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice.
Make sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for
the use of the products herein and Sanken can assume no responsibility for any infringement of industrial
property rights, intellectual property rights or any other rights of Sanken or any third party which may result
from its use. Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether
express or implied, as to the products, including product merchantability, and fitness for a particular purpose
and special environment, and the information, including its accuracy, usefulness, and reliability, included in this
document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take,
at their own risk, preventative measures including safety design of the equipment or systems against any
possible injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment,
measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required
(transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm
systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose
electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to
the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 In the case that you use Sanken products or design your products by using Sanken products, the reliability
largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case
that an operation range is set by derating the load from each rated value or surge voltage or noise is considered
for derating in order to assure or improve the reliability. In general, derating factors include electric stresses
such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature,
humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating
value, the degree of derating of junction temperature affects the reliability significantly.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks
that may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out
of Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
Rev.0.1
SANKEN ELECTRIC CO.,LTD.
7