str5a450 ds en

For Non-Isolated
Off-Line PWM Controllers with Integrated Power MOSFET
STR5A450 Series
Data Sheet
Description
Package
The STR5A450 Series is power ICs for switching
power supplies, incorporating a MOSFET and a current
mode PWM controller IC for non-isolated Buck
converter and Inverting converter topologies.
The operation mode is automatically changed, in
response to load, to the fixed switching frequency, to the
switching frequency control, and to the burst oscillation
mode. Thus the power efficiency is improved.
The product achieves high cost-performance power
supply systems with few external components.
DIP8
S/OCP
1
8
D/ST
FB
2
7
D/ST
GND
3
6
D/ST
VCC
4
5
D/ST
Not to scale
Features
●
●
●
●
●
●
●
●
●
●
Buck converter
Inverting converter
Current mode type PWM control
Automatically changed operation mode in response to
load conditions
Fixed switching frequency mode, 60 kHz (typ.)
Green mode, 23 kHz (typ.) to 60 kHz (typ.)
Burst oscillation mode
Built-in Startup Function
reducing power consumption, and shortening the
startup time
Built-in Error Amplifier
Random Switching Function
Leading Edge Blanking Function
Soft Start Function
Protections
Overcurrent Protection (OCP): adjustabe by an
external current detection resistor, including OCP
input compensation function
Overload Protection (OLP): Auto-restart
Overvoltage Protection (OVP): Auto-restart
Thermal Shutdown with hysteresis (TSD): Auto-restart
Typical Application (Buck Convertor, DIP8)
STR5A450D
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
3
6
7
8
D1
4
C4
R1
C2
C3
R2
D2
L1
ROCP
VOUT
(+)
U1
VAC
C1
D3
● Electrical Characteristics
fOSC(AVG) = 60 kHz (typ.)
VD/ST = 650V (max.)
Products
RDS(ON)
(max.)
STR5A451D
4.0 Ω
IOUT(MAX)*
(Universal, open
frame, VOUT = 24 V)
0.7 A
STR5A453D
1.9 Ω
0.9 A
* The output power is actual continues current that is
measured at 50 °C ambient. The peak output current
can be 120 to 140 % of the value stated here. Thermal
design affects the output current. It may be less than
the value stated here.
Recommended Operating Condition
Buck
Inverting
Converter
Converter
AC 85 V to AC 265 V
Input Voltage
D/ST Input
≥ 40 V
Voltage
Output Voltage
> 11 V
> – 27.5 V
Range*
< 27.5 V
< – 11 V
*Add a zener diode or a regulator to VCC pin when
target output voltage is high.
R3
2
1
STR5A450 Series
C5
R4
(-)
TC_STR5A450_1_R1
Applications
● White goods
● Auxiliary power supply (lighting equipment with
microcomputer, etc.)
● Power supply for motor control (actuator, etc.)
● Telecommunication equipment (convertible from
48VDC to 15VDC)
● Other Switchung mode power supply, SMPS
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
1
STR5A450 Series
CONTENTS
Description ------------------------------------------------------------------------------------------------------ 1
1. Absolute Maximum Ratings ----------------------------------------------------------------------------- 3
2. Electrical Characteristics -------------------------------------------------------------------------------- 3
3. Performance Curves -------------------------------------------------------------------------------------- 5
3.1 Derating Curves ------------------------------------------------------------------------------------- 5
3.2 MOSFET Safe Operating Area Curves --------------------------------------------------------- 5
3.3 Ambient Temperature versus Power Dissipation Curves ----------------------------------- 6
3.4 Transient Thermal Resistance Curves ---------------------------------------------------------- 6
4. Block Diagram --------------------------------------------------------------------------------------------- 7
5. Pin Configuration Definitions --------------------------------------------------------------------------- 7
6. Typical Application --------------------------------------------------------------------------------------- 8
7. External Dimensions and Marking Diagram -------------------------------------------------------- 9
8. Operational Description ------------------------------------------------------------------------------- 10
8.1 Startup Operation of IC ------------------------------------------------------------------------- 10
8.2 Undervoltage Lockout (UVLO) ---------------------------------------------------------------- 10
8.3 Power Supply Startup and Soft Start Function --------------------------------------------- 10
8.4 Constant Voltage (CV) Control----------------------------------------------------------------- 11
8.4.1
Buck Converter Operation ---------------------------------------------------------------- 12
8.4.2
Inverting Converter Operation ----------------------------------------------------------- 12
8.5 Leading Edge Blanking Function -------------------------------------------------------------- 13
8.6 Random Switching Function -------------------------------------------------------------------- 13
8.7 Operation Mode ----------------------------------------------------------------------------------- 13
8.8 Overcurrent Protection (OCP) ----------------------------------------------------------------- 14
8.8.1
OCP Operation ------------------------------------------------------------------------------ 14
8.8.2
OCP Input Compensation Function ----------------------------------------------------- 14
8.9 Overload Protection (OLP) ---------------------------------------------------------------------- 14
8.10 Overvoltage Protection (OVP) ------------------------------------------------------------------ 15
8.11 Thermal Shutdown (TSD) ----------------------------------------------------------------------- 15
9. Design Notes ---------------------------------------------------------------------------------------------- 15
9.1 External Components ---------------------------------------------------------------------------- 15
9.1.1
Input and Output Electrolytic Capacitor ----------------------------------------------- 16
9.1.2
Inductor --------------------------------------------------------------------------------------- 16
9.1.3
VCC Pin Peripheral Circuit --------------------------------------------------------------- 16
9.1.4
FB Pin Peripheral Circuit ----------------------------------------------------------------- 16
9.1.5
Freewheeling diode -------------------------------------------------------------------------- 16
9.1.6
Bleeder resistance --------------------------------------------------------------------------- 16
9.2 D/ST Pin --------------------------------------------------------------------------------------------- 16
9.3 Inductance Calculation --------------------------------------------------------------------------- 17
9.3.1
Parameter Definition ----------------------------------------------------------------------- 17
9.3.2
Buck Convertor ------------------------------------------------------------------------------ 18
9.3.3
Inverting Convertor ------------------------------------------------------------------------ 23
9.4 PCB Trace Layout -------------------------------------------------------------------------------- 28
10. Reference Design of Power Supply ------------------------------------------------------------------ 30
10.1 Buck Converter ------------------------------------------------------------------------------------ 30
10.2 Inverting Converter ------------------------------------------------------------------------------- 31
IMPORTANT NOTES ------------------------------------------------------------------------------------- 32
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
2
STR5A450 Series
1.
Absolute Maximum Ratings
● The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
● Unless otherwise specified, TA = 25 °C, all D/ST pins (5 pin to 8pin) are shorted.
Parameter
Symbol
Drain Peak Current
IDPEAK
Avalanche Energy(1)
EAS
Test Conditions
Pins
Rating
3.6
8–1
Single pulse
ILPEAK = 2.13 A
5A451D
5A453D
53
5A451D
mJ
72
5A453D
VS/OCP
1–3
− 2 to 5
A
FB Pin Voltage
VFB
2–3
− 0.3 to 7
V
VCC Pin Voltage
VCC
4–3
− 0.3 to 32
V
D/ST Pin Voltage
VD/ST
4–5
− 0.3 to VDSS
V
S/OCP Pin Voltage
MOSFET Power Dissipation
PD1
(2)
1.68
8–1
5A451D
W
1.76
5A453D
Control Part Power Dissipation
PD2
4–3
1.3
W
Operating Ambient Temperature
TOP
–
− 40 to 125
°C
Storage Temperature
Tstg
–
− 40 to 125
°C
Junction Temperature
Tj
–
150
°C
(1)
(2)
2.
Notes
A
5.2
8–1
ILPEAK = 2.46 A
Units
Single pulse, VDD = 99 V, L = 20 mH
When embedding this hybrid IC onto the printed circuit board (cupper area in a 15mm×15mm)
Electrical Characteristics
● The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
● Unless otherwise specified, TA = 25 °C, all D/ST pins (5 pin to 8pin) are shorted.
Parameter
Symbol
Test
Conditions
Pins
Min.
Typ.
Max.
Units
Notes
Power Supply Startup Operation
Operation Start Voltage
VCC(ON)
4–3
13.6
15.0
16.6
V
Operation Stop Voltage
VCC(OFF)
4–3
7.3
8.0
8.7
V
Circuit Current in Operation
Startup Circuit Operation
Voltage
Startup Current
PWM Operation
Average PWM Switching
Frequency
Switching Frequency Modulation
Deviation
Feedback Reference Voltage
ICC(ON)
VCC = 12 V
4–3
–
–
3.0
mA
VST(ON)
VCC = 13.5 V
8–3
21
29
37
V
ICC(ST)
VCC = 13.5 V
4–3
– 3.0
− 1.7
– 0.9
mA
VFB
= VFB(REF)–20mV
8–3
53
60
67
kHz
Δf
8–3
–
7.1
–
kHz
VFB(REF)
2–3
2.44
2.50
2.56
V
fOSC(AVG)
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
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© SANKEN ELECTRIC CO.,LTD. 2015
3
STR5A450 Series
Parameter
Symbol
Feedback Current(1)
S/OCP Pin Standby Threshold
voltage
Maximum ON Duty
Test
Conditions
Pins
Min.
Typ.
Max.
Units
2–3
− 2.4
− 0.8
−
μA
VOCP(STB)
1–3
–
0.11
–
V
DMAX
8–3
56
62
69
%
IFB(OP)
VFB = 2.3 V
Notes
Protection
Leading Edge Blanking Time(1)
tBW
–
–
280
–
ns
(1)
DPC
–
–
15.8
–
mV/µs
(1)
DDPC
−
−
36
−
%
VOCP(L)
1−3
0.640
0.735
0.830
V
VOCP(H)
1−3
0.74
0.83
0.92
V
VOCP(LEB)
1−3
−
1.61
−
V
VCC(OVP)
4–3
27.5
29.3
31.3
V
ms
OCP Compensation Coefficient
OCP Compensation Limit Duty
OCP Threshold Voltage at Zero
ON-Duty
OCP Threshold Voltage
OCP Threshold Voltage During
LEB (tBW)
OVP Threshold Voltage
OLP Delay Time at Startup
Circuit Current in Overload
Protection
Delay Time of FB Pin Short
Protection at Startup
Standby Blanking Time at
Startup
Thermal Shutdown Operating
Temperature(1)
Thermal Shutdown Hysteresis(1)
Power MOSFET
Drain-to-Source Breakdown
Voltage
Drain Leakage Current
On Resistance
Switching Time
Thermal Characteristics
Thermal Resistance Junction to
Case (2)
(1)
(2)
tOLP
VFB = 0.41 V
8–3
53
70
88
IOLP
VCC = 9 V
4–3
–
300
–
tFBSH
VFB = 0.2 V
8–3
13.0
17.5
22.0
tSTB(INH)
VFB = 2.6 V
8–3
2.0
3.0
4.0
ms
Tj(TSD)
–
135
–
–
°C
Tj(TSDHYS)
–
–
80
–
°C
VDSS
IDS = 50 µA
8–1
650
−
−
V
IDSS
VDS = VDSS
8–1
−
−
50
μA
RDS(ON)
8–1
−
−
4.0
IDS = 0.4 A
−
−
1.9
–
–
250
–
–
18
tf
8–1
θj-C
Ω
5A451D
5A453D
ns
5A451D
°C/W 5A453D
Design assurance
Case temperature (TC) measured at the center of the case top surface
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
4
STR5A450 Series
3.
Performance Curves
3.1
Derating Curves
100
EAS Temperature Derating Coefficient (%)
Safe Operating Area
Temperature Derating Coefficient (%)
100
80
60
40
20
0
0
25
50
75
100
125
80
60
40
20
0
25
150
Ambient Temperature, TA (°C)
75
100
125
150
Junction Temperature, Tj (°C)
Figure 3-1 SOA Temperature Derating Coefficient Curve
3.2
50
Figure 3-2 Avalanche Energy Derating Coefficient Curve
MOSFET Safe Operating Area Curves
When the IC is used, the safe operating area curve should be multiplied by the temperature derating coefficient
derived from Figure 3-1. The broken line in the safe operating area curve is the drain current curve limited by
on-resistance.
Unless otherwise specified, TA = 25 °C, Single pulse.
Drain Current, ID (A)
0.1ms
1
1ms
0.1
10
0.1ms
Drain Current, ID (A)
10
1
S_STR5A453D_R1
● STR5A453D
S_STR5A451D_R1
● STR5A451D
1ms
0.1
0.01
0.01
1
10
100
Drain-to-Source Voltage (V)
1000
1
10
100
1000
Drain-to-Source Voltage (V)
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
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© SANKEN ELECTRIC CO.,LTD. 2015
5
STR5A450 Series
Ambient Temperature versus Power Dissipation Curves
PD1 = 1.68 W
0
25
50
75
100
125
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
PD1 = 1.76 W
0
150
25
50
75
100
125
150
Ambient Temperature, TA (°C )
Ambient Temperature, TA (°C )
3.4
PD1_STR5A453D_R1
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
● STR5A453D
PD1_STR5A45D_R1
Power Dissipation, PD1 (W)
● STR5A451D
Power Dissipation, PD1 (W)
3.3
Transient Thermal Resistance Curves
● STR5A451D
TR_STR5A451D_R1
Transient Thermal Resistance
θch-c (°C/W)
10
1
0.1
0.01
1µ
10µ
100µ
1m
10m
100m
1m
10m
100m
Time (s)
● STR5A453D
TR_STR5A453D_R1
Transient Thermal Resistance
θch-c (°C/W)
10
1
0.1
0.01
1µ
10µ
100µ
Time (s)
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
6
STR5A450 Series
4.
Block Diagram
VCC
4
STARTUP
D/ST
5, 6, 7, 8
UVLO
OVP
REG
PROTECTION
TSD
DRV
PWM
OSC
S Q
R
OCP
Drain Peak Current
Compensation
2
FB
E/A
Feedback
Control
VFB(REF)
LEB
S/OCP
GND
1
3
BD_STR5A450_R1
5.
Pin Configuration Definitions
Pin
Name
S/OCP
1
8
D/ST
1
S/OCP
FB
2
7
D/ST
2
FB
3
GND
GND
3
6
D/ST
4
VCC
VCC
4
5
D/ST
Descriptions
Power MOSFET source and Overcurrent
Protection (OCP) signal input
Constant voltage control signal input and
overload protection signal input
Ground
Power supply voltage input for control part
and Overvoltage Protection (OVP) signal
input
5
6
7
D/ST
MOSFET drain and startup current input
8
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
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© SANKEN ELECTRIC CO.,LTD. 2015
7
STR5A450 Series
6.
Typical Application
Figure 6-1 and Figure 6-2 are the example circuits.
To enhance the heat dissipation, the wide pattern layout of the D/ST pin (5 through 8 pin) is recommended.
When the absolute value of the output voltage | VOUT | is 27.5 V or higher, add a zener diode DZ1 connected to D1 in
serial as shown in Figure 6-3. Using the maximum on-duty of 50 % in the steady state operation, the condition of |VOUT|
is shown below:
| VOUT | :
| VOUT | in response to the input voltage :
STR5A450D
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
8
C4
3
6
7
D1
4
C3
R1
C2
R3
R2
2
D2
1
VOUT
(+)
L1
ROCP
U1
VAC
C1
D3
C5
R4
(-)
TC_STR5A450_2_R1
Figure 6-1
Buck converter
STR5A450D
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
3
6
7
8
D1
4
C4
C3
R1
C2
R2
1
VOUT
(-)
ROCP
D3
U1
VAC
R3
2
C1
L1
C5
D2
R4
(+)
TC_STR5A450_3_R1
Figure 6-2
Inverting converter
STR5A450D
D1
DZ1
D2
(+)
VCC
4
C4
C3
GND
3
U1
Figure 6-3
TC_STR5A450_4_R1
Increasing the absolute value of |VOUT|
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
8
STR5A450 Series
7.
External Dimensions
● DIP8
NOTES:
1) Units: mm
2) Pb-free. Device composition compliant with the RoHS directive
8.
Marking Diagram
DIP8
8
5A45×D
Part Number
SKYMD
1
Lot Number
Y = Last Digit of Year (0-9)
M = Month (1-9,O,N or D)
D = Period of days (1 to 3)
1 : 1st to 10th
2 : 11th to 20th
3 : 21st to 31st
Sanken Control Number
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
9
STR5A450 Series
9.
Operational Description
All of the parameter values used in these descriptions
are typical values, unless they are specified as minimum
or maximum. With regard to current direction, "+"
indicates sink current (toward the IC) and "–" indicates
source current (from the IC).
The common items of Buck converter and Inverting
are desribed by using Buck conveter.
The voltage between VCC pin and GND pin in the
steady state operation is calculated as follows, where
VFD1, VFD2 and VFD3 are the forward voltage of D1, D2
and D3 respectively:
(2)
9.2
9.1
Startup Operation of IC
Figure 9-1 shows the circuit around VCC pin.
U1
ISTRTUP
STARTUP
Normal operation
4
VCC
Contro1
Startup operation
D2
D1
C4
GND
C3
Undervoltage Lockout (UVLO)
Figure 9-2 shows the relationship of VCC pin voltage
and the circuit current, ICC. When VCC pin voltage
increases to VCC(ON) = 15.0 V, the control circuit starts
switching operation and the circuit current, ICC, increases.
When VCC pin voltage decreases to VCC(OFF) = 8.0 V,
the control circuit stops its operation by the
Undervoltage Lockout (UVLO) circuit, and reverts to
the state before startup.
3
C1
VOUT
(+)
ROCP
S/OCP
D/ST
L1
1
D3
R4
Stop
C5
Circuit current, ICC
Start
5~8
(-)
Figure 9-1 VCC pin peripheral circuit in Buck converter
The IC incorporates the startup circuit. The circuit is
connected to D/ST pin. When D/ST pin voltage reaches
the Startup Circuit Operation Voltage VST(ON) = 29 V,
the startup circuit starts operation.
During the startup process, the constant current,
ICC(ST) = − 1.7 mA, charges C4 at VCC pin. When VCC
pin voltage increases to VCC(ON) = 15.0 V, the control
circuit starts switching operation.
After switching operation begins, the startup circuit
turns off automatically so that its current consumption
becomes zero.
The approximate startup time tSTART is calculated as
follows:
(1)
where,
tSTART is the startup time of IC (s),
VCC(INT) is the initial voltage on VCC pin (V).
When the internal power MOSFET turns off, the
output voltage, VOUT, charges C4 through D1 and D2
(Refer to Figure 9-1).
VCC(OFF)
VCC pin
VCC(ON) voltage
Figure 9-2 Relationship between
VCC pin voltage and ICC
9.3
Power Supply Startup and Soft Start
Function
The Soft Start Function reduces the voltage and the
current stress of the internal power MOSFET and the
freewheeling diode, D3.
Figure 9-3 shows the startup waveforms. After the IC
starts, during the Standby Blanking Time at Startup,
tSTB(INH), the burst oscillation mode is disabled to operate
the soft start.
The IC activates the soft start circuitry during the
startup period. The soft start time is fixed to about 10.2
ms. During the soft start period, the overcurrent
threshold is increased step-wisely (7 steps). The IC
operates switching operation by the frequency
responding to FB pin voltage until the output reaches the
setting voltage.
Here, the tLIM is defined as the period until FB pin
voltage reaches 1.6 V after the IC starts. When the tLIM
reaches the OLP Delay Time at Startup, tOLP, of 70 ms
STR5A450-DSE Rev.1.0s
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10
STR5A450 Series
and more, the IC stops switching operation. Thus, it is
necessary to adjust the value of output electrolytic
capacitor, C5 so that the tLIM is less than tOLP.
If VCC pin voltage reaches VCC(OFF) and a startup
failure occurs as shown in Figure 9-4, increase C4 value
or decrease C5 value. Since the larger capacitance
causes the longer startup time of IC, it is necessary to
check and adjust the startup process based on actual
operation in the application.
Since the Leading Edge Blanking Function (Refer to
Section 9.5) is disabled during the soft start period, the
on-time may be less than the Leading Edge Blanking
Time (tBW = 280 ns).
operation.
The IC controls the peak value of the voltage of a
current detection resistor (VROCP) to be close to target
voltage (VSC), comparing VROCP with VSC by internal FB
comparator. Feedback Control circuit receives the target
voltage, VSC, reversed FB pin voltage by an error
amplifier (Refer to Figure 9-5 and Figure 9-6).
U1
Feedback
Control
FB comp
+
VSC
E/A
FB
+
-
R2 R3
2
R1
GND 3
PWM
Control
VCC pin
voltage
Startup of IC
C3
L1
5~8 D/ST
Normal opertion
Startup of SMPS
VOUT
(+)
ROCP
S/OCP 1
VROCP
tSTART
ILON
D3
C1
VCC(ON)
R4
C5
(-)
VCC(OFF)
tSTB(INH)
Time
D/ST pin
current, ID
Time
FB pin voltage
VFB(REF)
Figure 9-5 FB pin peripheral circuit in Buck converter
Soft start period,
fixed to approximately 10.2 ms
tLIM < tOLP
-
VSC
+
VROCP
FB comparator Voltage on both side of ROCP
1.6V
Drain current,
ION
Time
Figure 9-3 Startup waveforms
Figure 9-6 Drain current ID and FB comparator
in steady state operation
VCC pin
voltage
Startup success
IC starts operation
Target operating
voltage
VCC(ON)
Increase with rising of
output voltage
VCC(OFF)
Startup failure
Time
Startup time of IC, tSTART
Figure 9-4 VCC pin voltage during startup period
9.4
Constant Voltage (CV) Control
● Decreasing load
When the output load decreases, the FB pin voltage
increases in response to the increase of the output
voltage. Since VSC which is the output voltage of
internal error amplifier becomes low, the peak value
of VROCP is controlled to become low, and the peak of
the drain current decreases. This control prevents the
output voltage from increasing.
● Increasing load
When the output load increases, the control circuit
operates the reverse of the former operations. Since
VSC becomes high, the peak drain current increases.
This control prevents the output voltage from
decreasing.
The constant voltage (CV) control for power supply
output adopts the peak-current-mode control method
which enhances the response speed and the stable
STR5A450-DSE Rev.1.0s
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11
STR5A450 Series
9.4.1
Buck Converter Operation
Figure 9-7 shows the output current path in the Buck
converter. Figure 9-8 shows the operational waveforms.
D1
VCC 4
Contro1
U1
D2
C4
FB 2
C3
GND 3
5~8
1
IL
ROCP
L1
2) PWM Off-Time Period
When the internal power MOSFET turns off, the
back electromotive force occurs in the inductor, L1,
the freewheeling diode, D3, is forward biased and
turns on. Thus, the ILOFF current flows as shown in
Figure 9-7.
As shown in Figure 9-8, after the average switching
period,
C AVG ), the power MOSFET turns on
again, and the event moves to the previous 1).
VOUT
(+)
The output current is equal to the average inductor
current of L1.
R4
9.4.2
VL
C1
VIN
ILON
(MOSFET ON)
D3
ILOFF
(MOSFET OFF)
C5
(-)
Inverting Converter Operation
Figure 9-9 shows the output current path in the
Inverting converter. Figure 9-10 shows the operational
waveforms.
Figure 9-7 Output current path in Buck converter
VL
MOSFET
ON
OFF
ON
D1
VCC 4
Contro1
U1
C4
FB 2
C3
GND 3
VIN-VRON-VOUT
5~8
0
1
D2
D3
ROCP
VOUT
(-)
t
-(VOUT+VFD3)
C1
VIN
IL
ILON
(MOSFET ON)
VL
C5
IL ILOFF
(MOSFET OFF)
R4
L1
t
(+)
t
Figure 9-9 Output current path in Inverting converter
ILON
ILOFF
t
VL
1/fOSC(AVG)
Figure 9-8 Operational waveforms in Buck converter
MOSFET
ON
OFF
VIN-VRON
t
0
-(VOUT+VFD3)
In the Buck converter, the PWM control is described
in the following.
1) PWM On-Time Period
When the internal power MOSFET turns on, the ILON
current flows as shown in Figure 9-7, and the
inductor, L1, stores some energy.
Since the ILON flows through the current detection
resistor, ROCP, the voltage of ROCP is detected as the
current detection voltage, VROCP.
FB pin voltage is the voltage divided C3 voltage by
voltage dividing resistors, and the target voltage, V SC,
is given by FB pin voltage.
When VROCP reaches VSC, the power MOSFET turns
off.
ON
IL
t
ILON
t
ILOFF
t
1/fOSC(AVG)
Figure 9-10 Operational waveforms in Inverting
converter
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In the Inverting converter, the PWM control is
described in the following.
1) PWM On-Time Period
When the internal power MOSFET turns on, the ILON
current flows as shown in Figure 9-9, and the
inductor, L1, stores some energy.
Since the ILON flows through the current detection
resistor, ROCP, the voltage of ROCP is detected as the
current detection voltage, VROCP.
FB pin voltage is the voltage divided C3 voltage by
voltage dividing resistors, and the target voltage, V SC,
is given by FB pin voltage.
When VROCP reaches VSC, the power MOSFET turns
off.
2) PWM Off-Time Period
When the internal power MOSFET turns off, the
back electromotive force occurs in the inductor, L1,
the freewheeling diode, D3, is forward biased and
turns on. Thus, the ILOFF current flows as shown in
Figure 9-9
As shown in Figure 9-10, after the average
switching period,
C AVG , the power MOSFET
turns on again, and the event moves to the previous
1).
The output current is equal to the average current of
ILOFF of L1.
9.5
Leading Edge Blanking Function
The constant voltage control for power supply output
adopts the peak-current-mode control method. The peak
drain current is detected by the current detection resistor,
ROCP. Just in turning on the internal power MOSFET,
the steep surge current would occur.
If the Overcurrent Protection (OCP) responds to the
voltage caused by that surge current, the power
MOSFET may be turned off.
To prevent that response, the OCP threshold voltage
increases during Leading Edge Blanking (tBW = 280 ns)
just after the power MOSFET turns on, and this prevents
the OCP detection from responding to the surge voltage
in turning-on (Refer to Section 9.8.1).
9.6
Random Switching Function
The switching frequency is randomly modulated by
superposing the modulating frequency on fOSC(AVG). This
function reduces the conduction noise compared with
other products without this function, and simplifies noise
filtering of the input lines of power supply.
9.7
Operation Mode
As shown in Figure 9-12, when the output power is
decreasing, together with the decrease of the drain
current ID of the internal power MOSFET, the operation
mode is automatically changed to the fixed switching
frequency mode (60 kHz), to the Green mode controlled
the switching frequency (23 kHz to 60 kHz), and to the
burst oscillation mode controlled by an internal
oscillator. In the Green mode, the number of switching
is reduced. In the burst oscillation mode, the switching
operation is stopped during a constant period. Thus, the
switching loss is reduced, and the power efficiency is
improved (Refer to Figure 9-13).
When the output load becomes lower, FB pin voltage
increases and S/OCP pin voltage decreases. The S/OCP
pin voltage reaches to the S/OCP pin standby threshold
voltage, VOCP(STB) = 0.11 V, the burst oscillation mode is
activated.
As shown in Figure 9-13, the burst oscillation mode
consists of the switching period and the non-switching
period. The oscillation frequency during the switching
period is the Minimum Frequency of about 23 kHz.
Switching
frequency
fOSC
60 kHz
Normal
operation
About 23 kHz
Burst oscillation
Green mode
Output power, PO
Figure 9-12 Switching frequency in response to PO
tBW
ROCP voltage
Surge pulse voltage width at turning on
Figure 9-11 Leading Edge Blanking
ID
Switching period
Non-switching period
Switching operation of about 23 kHz
Time
Figure 9-13 Switching waveform
at burst oscillation mode
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9.8.1
Overcurrent Protection (OCP)
1.0
OCP Operation
Overcurrent Protection (OCP) detects each drain peak
current level of a power MOSFET on pulse-by-pulse
basis, and limits the output power when the voltage on
the current detection resistor, ROCP, reaches to OCP
threshold voltage.
During Leading Edge Blanking Time shown in Figure
9-11, the OCP
threshold voltage becomes
VOCP(LEB) = 1.61 V which is higher than the normal OCP
threshold voltage. Changing to this threshold voltage
prevents the OCP detection from responding to the surge
voltage in turning-on the power MOSFET. This function
operates as protection at the condition including output
shorted.
When the power MOSFET turns on, the surge voltage
width of the S/OCP pin should be less than t BW. To
prevent surge voltage, pay extra attention to ROCP trace
layout (Refer to Section 10.4).
9.8.2
OCP threshold voltage after
compensating, VOCP
9.8
OCP Input Compensation Function
ICs with PWM control usually have some propagation
delay time. The steeper the slope of the actual drain
current at a high AC input voltage is, the larger the
detection voltage of actual drain peak current is,
compared to VOCP. Thus, the peak current has some
variation depending on AC input voltage in OCP state.
To reduce the variation of peak current in OCP state, the
Input Compensation Function is built-in.
This function compensates the OCP threshold voltage
so that it depends on AC input voltage, as shown in
Figure 9-14.
When AC input voltage is low, the OCP threshold
voltage is controlled to become high. Thus this control
reduces the difference of peak drain current between at
low AC input voltage and at high.
When the on-time is 6 µs or more, the OCP threshold
voltage is VOCP(H) of 0.83 V. When the on-time is less
than 6 µs, that is VOCP shown in Equation (3).
VOCP(H)
VOCP(L)
0.5
0
6
ONTime (µs)
Figure 9-14 Relationship between ONTime and OCP
threshold voltage after compensating
9.9
Overload Protection (OLP)
When the voltage on the current detection resistor,
ROCP, reaches the OCP threshold voltage, the internal
power MOSFET turns off. Figure 9-15 shows the
characteristic of output voltage and current.
The output voltage decreases in the overload state,
and FB pin voltage also decreases. When the period
keeping FB pin voltage less than 1.6 V continues for
OLP Delay Time at Startup, tOLP = 70 ms, the Overload
Protection (OLP) is activated, and the IC stops switching
operation. Thus, VCC pin voltage decreases to VCC(OFF),
and the control circuit stops operation. After that, the
startup circuit is activated, VCC pin voltage increases to
VCC(ON) by the startup current, and the control circuit
operates again. Thus, the intermittent operation by
UVLO is repeated in the OLP state (Refer to Figure
9-16).
This intermittent operation reduces the stress of parts
including the power MOSFET and the freewheeling
diode. In addition, this operation reduces power
consumption because the switching period in this
intermittent operation is much shorter than the
oscillation stop period.
When the abnormal condition is removed, the IC
returns to normal operation automatically.
(3)
Where,
VOCP(L): OCP Threshold Voltage at Zero ON Duty (V)
DPC: CP Compensation Coefficient mV/μs
ONTime: On-time of power M FET μs
Output voltage,
VOUT
CV mode
Output current, IOUT
Figure 9-15 Overload characteristics
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STR5A450 Series
startup current, and the control circuit operates again.
The intermittent operation by TSD and UVLO is
repeated in the TSD state.
After the fault condition is removed, the IC returns to
normal operation automatically.
Non-switching interval
VCC pin voltage
VCC(ON)
VCC(OFF)
Junction temperature,
Tj
Drain current,
ID
tOLP
TSD is active
Return
to normal operation
Tj(TSD)
tOLP
Tj(TSD)−Tj(TSD)HYS
ON
Bias Assist Function
Figure 9-16 OLP operational waveform
OFF
OFF
VCC pin voltage
VCC(ON)
VCC(BIAS)
VCC(OFF)
9.10 Overvoltage Protection (OVP)
When the voltage between VCC pin and GND pin
increases to VCC(OVP) = 29.3 V or more, the Overvoltage
Protection (OVP) is activated and the IC stops switching
operation. The intermittent operation by UVLO is
repeated in the OVP state. Refer to Section 9.9 about the
intermittent operation by UVLO.
When the abnormal condition is removed, the IC
returns to normal operation automatically.
The approximate value of output voltage VOUT(OVP) in
the OVP condition is calculated by using Equation (4).
Drain current,
ID
Figure 9-17 TSD operational waveforms
10. Design Notes
(4)
where,
VOUT(OVP) is voltage of between VOUT(+) and VOUT − ,
VFD1 is the forward voltage of D1 in Figure 9-1,
VFD2 is the forward voltage of D2, and
VFD3 is the forward voltage of D3.
10.1 External Components
Take care to use properly rated, including derating as
necessary, and proper type of components.
Figure 10-1 shows the peripheral circuit of IC in Buck
converter.
9.11 Thermal Shutdown (TSD)
Figure 9-17 shows the Thermal Shutdown (TSD)
operational waveforms.
When the junction temperature of the IC control
circuit increases to Tj(TSD) = 135 °C (min.) or more, the
TSD is activated, and the IC stops switching operation.
The TSD has a temperature hysteresis. While the
junction temperature of the control circuit is more than
Tj(TSD)−Tj(TSD)HYS, the Bias Assist Function is enabled
when VCC pin voltage decreases to about 9.4 V. While
this function is activated, the startup current is supplied
to VCC pin in order to keep VCC(OFF) or more, and the IC
holds stopping.
While the junction temperature is Tj(TSD)−Tj(TSD)HYS or
less, the Bias Assist Function is disabled, and VCC pin
voltage decreases to VCC(OFF) or less. Thus, the control
circuit stops operation. After that, the startup circuit is
activated, VCC pin voltage increases to VCC(ON) by the
D1
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
3
6
7
8
4
C4
R1
C2
C3
R2
R3
2
1
D2
L1
ROCP
VOUT
(+)
U1
VAC
C1
D3
C5
R4
(-)
Figure 10-1 Peripheral circuit of IC in Buck converter
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10.1.1 Input and Output Electrolytic
Capacitor
Apply proper derating to ripple current, voltage, and
temperature rise.
The value of output electrolytic capacitor, C5, should
be fulfilled the following conditions:
- The specification of output ripple
- Enough shorter output voltage rising time in startup
than the OLP Delay Time at Startup, tOLP = 70 ms.
- Low impedance types, designed for switch mode
power supplies, is recommended.
depends on the value of output electrical capacitor, C5.
Usually the value of C3 is 0.022 μF to 0.22 μF. When
C3 value is set larger, the line regulation becomes better,
however, the dynamic response of the output voltage
becomes worse. Be careful of that value.
The voltage dividing resistor of R1, R2 and R3 is
determined by the reference voltage, VFB(REF) = 2.50 V,
the output voltage, VOUT, and so on. The following
Equation (6) shows the relationship of them.
The target value of R1 is about 10 kΩ to 22 kΩ. R2
and R3 should be adjusted in actual operation condition.
The VF of D2 and D3 affects the output voltage. Thus,
the diodes of low VF should be selected.
The ESR of C5 should be set in the range of
Equation (5).
(5)
where,
ZCO is the ESR of electrolytic capacitor at the
operation frequency (Since the ESR in general
catalogs is mostly measured at 100 kHz, check the
frequency characteristic.),
ΔVOR is the output ripple voltage specification, and
ILRP is the ripple current of inductor (Refer to Section
10.3).
10.1.2 Inductor
Apply proper design margin to core temperature rise
by core loss and copper loss.
The inductor should be designed so that the inductor
current does not saturate. Refer to Section 10.3 about the
inductance. The value should be the minimum
considered a negative tolerance of inductance and a
decline of DC superposition characteristics.
The on-time must be longer than the Leading Edge
Blanking Time to control the output voltage constantly.
In the universal input voltage design, the on-time is
easy to become short in the condition of maximum AC
input voltage and light load. Be careful not to choose too
small value for the inductance (The recommended value
is 100 μH or more).
(6)
where,
VFD2 is the forward voltage of D2, and
VFD3 is the forward voltage of D3.
10.1.5 Freewheeling diode
D3 in Figure 10-1 is the freewheeling diode.
When the internal power MOSFET turns on, the
recovery current flows through D3. The current affects
power loss and noise much. The VF affects the output
voltage. Thus, the diode of fast recovery and low VF
should be selected.
10.1.6 Bleeder resistance
For light load application, the bleeder resistor, R4, in
Figure 10-1 should be connected to both ends of
output capacitor, C5, to prevent the increase of output
voltage.
The value of R4 should be satisfied with Equation (7),
and should be adjusted in actual operation condition.
(7)
10.1.3 VCC Pin Peripheral Circuit
The reference value of C4 in Figure 10-1 is generally
10 to 47 μF. Refer to Section 9.1 about the startup time.
10.2 D/ST Pin
10.1.4 FB Pin Peripheral Circuit
As shown in Figure 10-1, FB pin is input the voltage
divided the voltage between VOUT(+) and GND pin by
resistors.
C3 is the smoothing capacitor. The value of C3
When the voltage or the current of the D/ST pins
shown in
Figure 10-1 exceeds the Absolute Maximum Ratings,
the internal power MOSFET connected to the D/ST pin
would be permanently damaged.
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10.3 Inductance Calculation
10.3.1 Parameter Definition
Since this calculation is just on paper, it is necessary
to take account of margins and to check operations on
actual operation in the application.
The following parameters refer to the circuit of Figure
6-1 and Figure 6-2.
VDCIN_MIN : Min. DC input voltage at C1
VDCIN_MAX : Max. DC input voltage at C1
VOUT : Output voltage
IOUT : Output current
VRON : On voltage of internal power MOSFET
Drain current × RDS(ON)
VFD1 : D1 forward voltage
VFD2 : D2 forward voltage
VFD3 : D3 forward voltage
VDZ1 : DZ1 zener voltage
When | VOUT | is 27.5 V or more, add a zener diode or
a regulator. Take care of that power loss.
ROCP : Current detection resistor between S/OCP pin
and GND pin
The PWM control has the three operation modes
shown below. Since each operation mode has that
characteristic, it is necessary to take account of choosing
the operation mode.
The table on the right shows the comparison of three
operation modes in the same input and output condition.
Table 10-1 Operation mode comparison
POW
L
ILR
PRD(ON)
PSW
CCM
Large
Large
Small
Small
Large
CRM
Middle Middle Middle Middle Small
When the following have no values, refer to the
values of Section 2. Electrical Characteristics.
DON_MAX : Max. on-duty in steady operation, 0.5
KRP_MIN : 0.4
VST_MAX : Max. value of VST(ON)
VDC(MAX) : Minimum DC input voltage, recommended
400 V
VCC_MIN : Min. value of VCC Voltage, 10 V
VCC(OVP)_MIN : Min. value of VCC(OVP)
IDLIM : less than the value of IDPEAK × the derating
supposed as 90 %
fTYP : Typ. value of fOSC(AVG)
fMIN : Minimum switching frequency, 23 kHz
VOCP(L)_MIN :Min. value of VOCP(L)
VOCP(L)_TYP :Typ. value of VOCP(L)
VOCP(H)_MIN :Min. value of VOCP(H)
VOCP(H)_TYP :Typ. value of VOCP(H)
VOCP(H)_MAX :Max. value of VOCP(H)
VOCP(STB):Typ. value of VOCP(STB)
DPC:Typ. value of DPC
DCM
Small
Small Large Large Small
where,
CCM : Continuous current mode,
CRM : Critical current mode,
DCM : Discontinuous current mode
POW : Capable output power,
L : Inductance value of L1,
ILR : Ripple inductor current,
PRDS(ON) : Conduction loss on the power MOSFET,
PSW : Switching loss
CCM
CRM
DCM
ILU
ILU
ILU
ILR
ILR
ILR
ILL
0A
tON
tOFF
1/fSW
I
KRP = LR
ILU
tON
tOFF
1/fSW
tON tOFF tD
1/fSW
Figure 10-2 Operation mode of PWM control
where,
fSW : Switching frequency, tON: On-time, tOFF: Off-time, tD: Discontinuous current time,
ILU : Upper inductor current, ILL: Lower inductor current, ILR: Ripple inductor current,
KRP : Ripple inductor current ratio,
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10.3.2 Buck Convertor
(B-1) Input and Output Condition
The definition refers to Section 10.3.1.
Lower value is a higher value or more of either VST_MAX or
VDCIN_MIN
Upper value is VDC(MAX) or less.
VDCIN_MAX
.
VOUT
IOUT
. In addition,IOUT also depends on the OCP setting.
VDZ1
Lower value is a higher value or more of either 0 or
Upper value is
ROCP
Lower value is ROCP(L) =
.
, or more.
(B-2) Calculation
● Choosing DCM
The on-duty for DCM, DCCM1, is set in the range of
There are two calculation ways: LCALC Calculation,
and Parameter Calculation assigned LUSER.
(B-2-1) LCALC Calculation
The inductance, LCALC, is given by choosing the
operation mode at VDCIN_MIN. The parameters of both
VDCIN_MIN and VDCIN_MAX are given by LCALC.
The condition of IOUT :
(B-2-1-1-3) Inductor current
(B-2-1-1) Parameters for VDCIN_MIN
DON1 is denoted the on-duty. LLH1, ILL1, and ILR1 are
the upper inductor current, the lower inductor current,
and the ripple inductor current, respectively.
(B-2-1-1-1) On-duty in continuous operation, DCCM1
● Choosing CCM
The condition of DCCM1 : < 0.5
(B-2-1-1-2) Choosing the operation mode, and KRP1
or DDCM1
● Choosing CCM
KRP1 is set in the following range.
● Choosing CRM
The condition of IOUT :
● Choosing CRM
The condition of IOUT :
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● Choosing DCM
(B-2-1-1-6) On-time, tON1
By DON1 and fSW1 of the choosing operation mode,
If tON1 is less than 500 ns, try the procedure 1 in
Section (B-2-1-1-4) to increase it.
(B-2-1-1-4) Upper
ROCP(H)_TMP1
temporary
value
of
ROCP,
(B-2-1-1-7) OCP threshold voltage, VOCP1
VOCP1 is given below by tON1.
● For
, VOCP1 = VOCP(H)_MIN
● For
,
The temporary range of the current detection resistor,
ROCP, is given below.
where, DPC (mV/µs)、tON1 (µs)
If ROCP setting has no range, try the following
procedure 1.
● Procedure 1 :
For CCM, reduce KRP1 or IOUT.
For CRM, change to CCM.
For DCM, increase DDCM1, or change to CRM or CCM.
After these changes, try to calculate again from
Section (B-1) Input and Output Condition.
ROCP setting is set in the previous range.
The switching frequency, fSW1, and the peak inductor
current at OCP depend on ROCP. When ROCP is set low,
fSW1 becomes low, and the peak current becomes large.
(B-2-1-1-5) Switching frequency, fSW1
The fSW1 is given by the following with the ILH1 of the
choosing operation mode and ROCP.
The following K is a coefficient.
(B-2-1-1-8) Current detection resistor, ROCP
Upper value at VDCIN_MIN of the ROCP range is given
below.
The range of ROCP is given below.
If ROCP setting has no range, try the procedure 1 in
Section (B-2-1-1-4).
If ROCP setting is out of the previous range, try to set it
again, and then try to calculate again from Section
(B-2-1-1-5).
(B-2-1-1-9) Inductance, LCALC
By ILH1, ILL1, and fSW1 of the choosing operation
mode,
fSW1 is given below by using K.
where,
For
For
, set to fMIN.
, set to fTYP.
The value should be the minimum considered a
negative tolerance of inductance and a decline of DC
superposition characteristics.
If LCACL is less than 100 µH, try the procedure 1 of
Section (B-2-1-1-4) to increase it.
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STR5A450 Series
(B-2-1-1-10) Drain RMS current and Inductor RMS
current : IDRMS1, ILRMS1
The conduction loss of RDS(ON) of power MOSFET is
estimated to be
.
3) Calculate Switching frequency, fSW2
where,
For fSW2 < fMIN, set to fMIN.
For fTYP < fSW2, set to fTYP.
When fSW2 is fMIN or fTYP, calculate ILH2 again by the
following.
This value is equivalent to the rating for inductor.
(B-2-1-2) Parameters for VDCIN_MAX
(B-2-1-2-1) On-duty in continuous operation, DCCM2
For fMIN ≤ fSW2 ≤ fTYP, ILH2 is the value of the previous
2).
If ILH2 is IDLIM or more, try the procedure 1 in Section
(B-2-1-1-4) to decrease it.
4) Calculate Lower inductor current, ILL2
The condition of DCCM2 : < 0.5
(B-2-1-2-2) Operation mode check
1) At first, calculate the following coefficients
ROCP setting in Section (B-2-1-1-8) and LCALC
calculated in Section (B-2-1-1-9) are used.
5) The operation mode is given by the following.
● For ILL2 > 0, CCM
● For ILL2 = 0, CRM
● For ILL2 < 0, DCM
(B-2-1-2-3) DON2, fSW2, ILH2, ILL2 of the operation
mode result
These parameters are different in the operation mode
results of Section (B-2-1-2-2)-5).
● Resulting in CCM
fSW2 is the value of Section (B-2-1-2-2) - 3).
ILH2 is the value of Section (B-2-1-2-2) - 3).
ILL2 is the value of Section (B-2-1-2-2) - 4).
2) Calculate Upper inductor current, ILH2
● Resulting in CRM
fSW2 is the value of Section (B-2-1-2-2) - 3).
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● Resulting in DCM
1) Draw the graph of the following equations.
By using this, find the values of fSW2 and ILH2 of
DCM.
2) Set Switching frequency, fSW2
When fSW at the intersection of ILH2_f and ILH2_DCM is
in the range of fMIN to fTYP as shown in Figure 10-3,
fSW2 is set to that value. When fSW is out of the range
as shown in Figure 10-4, fSW2 is set to the limited
value which is fMIN or fTYP of the over range side.
3) Calculate On-duty, DON2
The condition of DDCM2 : < DCCM2
I LH (A)
5
I LH2_f
ILH_f
4
I LH2_DCM
ILH_dcm
3
4) Calculate ILH2, ILL2, and ILR2
ILH2 is the value at the intersection of fSW2 which is
given in the previous 2) and ILH2_DCM. Otherwise, ILH2
is given below.
I LH2_CRM
ILH_crm
2
f MIN
fmin
1
f TYP
fmax
0
20 25 30 35 40 45 50 55 60 65 70 f SW (kHz)
Figure 10-3 ILH2 and fSW2 of DCM Graph in which the
intersection of ILH_f and ILH_DCM is in the range of fMIN to
fTYP.
(B-2-1-2-4) ILH2
If ILH2 is IDLIM or more, try the procedure 1 in Section
(B-2-1-1-4) to decrease it.
(B-2-1-2-5) On-time, tON2
I LH (A)
5
4
3
2
1
I LH2_f
ILH_f
I LH2_DCM
ILH_dcm
I LH2_CRM
ILH_crm
f MIN
fmin
f TYP
fmax
0
20 25 30 35 40 45 50 55 60 65 70 f SW (kHz)
Figure 10-4 ILH2 and fSW2 of DCM Graph in which the
intersection of ILH_f and ILH_DCM is out of the range of
fMIN to fTYP.
If tON2 is less than 500 ns, try the procedure 1 in
Section (B-2-1-1-4) to increase it.
(B-2-1-2-6) OCP threshold voltage, VOCP2
VOCP2 is given below by tON2.
● For
, VOCP2 = VOCP(H)_MIN
● For
,
where, DPC (mV/µs)、tON1 (µs)
In DCM, ILH value at the intersection of ILH2_f and
ILH2_DCM is bigger than that of ILH2_CRM.
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STR5A450 Series
(B-2-1-2-7) Current detection resistor, ROCP
(B-2-1-2-9) Inductor current spec.
Upper value at VDCIN_MAX of the ROCP range is given
below.
The peak current in OCP operation, IOCP, is given
below.
Denoting ROCP(H) as a smaller value of either ROCP(H)2
for VDCIN_MAX or ROCP(H)1 for VDCIN_MIN in Section
(B-2-1-1-8), the range of ROCP is given below.
The saturation current of the inductor should be
enough larger than IOCP.
The rating current refers to the equation of RMS in
Section (B-2-1-1-10).
If ROCP setting has no range, try the procedure 1 in
Section (B-2-1-1-4).
If ROCP setting is out of the previous range, try to set it
again, and then try to calculate again from Section
(B-2-1-1-5).
(B-2-1-2-8) IDRMS2, ILRMS2
These are given by substituting ILH2, ILL2, DON2, and
DCCM2 for ILH1, ILL1, DON1, and DCCM1 in the equation of
Section (B-2-1-1-10), respectively.
(B-2-2) Parameter Calculation assigned LUSER
Parameter calculation assigned LUSER at VDCIN_MIN and
VDCIN_MAX is similar to the way of Section (B-2-1-2)
Parameters for VDCIN_MAX.
Parameters assigned LUSER are given by substituting
the input voltage and LUSER for VDCIN_MAX and LCALC.
If the conditions of calculation aren’t satisfied,
increase LUSER setting, or decrease IOUT setting, and then
try to calculate again.
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STR5A450 Series
10.3.3 Inverting Convertor
(I-1) Input and Output Condition
The definition refers to Section 10.3.1. |VOUT| is the absolute value of VOUT.
VDCIN_MIN
Lower value is a higher value or more of either VST_MAX or
Upper value is VDC(MAX) or less.
.
VDCIN_MAX
|VOUT|
. In addition,IOUT also depends on the OCP setting.
IOUT
where,
VDZ1
Lower value is a higher value or more of either 0 or
Upper value is
ROCP
Lower value is ROCP(L) =
.
.
, or more.
(I-2) Calculation
There are two calculation ways: LCALC Calculation,
and Parameter Calculation assigned LUSER.
(I-2-1-1-2) Choosing the operation mode, and KRP1 or
DDCM1
● Choosing CCM
KRP1 is set in the following range.
(I-2-1) LCALC Calculation
The inductance, LCALC, is given by choosing the
operation mode at VDCIN_MIN. The parameters of both
VDCIN_MIN and VDCIN_MAX are given by LCALC.
The condition of IOUT :
(I-2-1-1) Parameters for VDCIN_MIN
(I-2-1-1-1) On-duty in continuous operation, DCCM1,
and Average inductor current, ILAVG1
The condition of DCCM1 : < 0.5
● Choosing CRM
The condition of IOUT :
● Choosing DCM
On-duty, DDCM1, is set in the following range.
The condition of IOUT :
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STR5A450 Series
(I-2-1-1-3) Inductor current
DON1 is denoted the on-duty. LLH1, ILL1, and ILR1 are
the upper inductor current, the lower inductor current,
and the ripple inductor current, respectively.
ROCP setting is set in the previous range.
The switching frequency, fSW1, and the peak inductor
current at OCP depend on ROCP. When ROCP is set low,
fSW1 becomes low, and the peak current becomes
large.
● Choosing CCM
(I-2-1-1-5) Switching frequency, fSW1
The fSW1 is given by the following with the ILH1 of the
choosing operation mode and ROCP.
The following K is a coefficient.
fSW1 is given below by using K.
● Choosing CRM
where,
For
For
, set to fMIN.
, set to fTYP.
(I-2-1-1-6) On-time, tON1
● Choosing DCM
By DON1 and fSW1 of the choosing operation mode,
If tON1 is less than 500 ns, try the procedure 1 in
Section (I-2-1-1-4) to increase it.
(I-2-1-1-7) OCP threshold voltage, VOCP1
(I-2-1-1-4) Upper
ROCP(H)_TMP1
temporary
value
of
ROCP,
VOCP1 is given below by tON1.
● For
, VOCP1 = VOCP(H)_MIN
● For
,
The temporary range of the current detection resistor,
ROCP, is given below.
where, DPC (mV/µs)、tON1 (µs)
(I-2-1-1-8) Current detection resistor, ROCP
If ROCP setting has no range, try the following
procedure 1.
Upper value at VDCIN_MIN of the ROCP range is given
below.
● Procedure 1 :
For CCM, reduce KRP1 or IOUT.
For CRM, change to CCM.
For DCM, increase DDCM1, or change to CRM or CCM.
After these changes, try to calculate again from
Section (I-1) Input and Output Condition.
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STR5A450 Series
The range of ROCP is given below.
(I-2-1-2-2) Operation mode check
1) At first, calculate the following coefficients
ROCP setting in Section (I-2-1-1-8) and LCALC
calculated in Section (I-2-1-1-9) are used.
If ROCP setting has no range, try the procedure 1 in
Section (I-2-1-1-4).
If ROCP setting is out of the previous range, try to set it
again, and then try to calculate again from Section
(I-2-1-1-5).
(I-2-1-1-9) Inductance, LCALC
By ILH1, ILL1, and fSW1 of the choosing operation
mode,
The value should be the minimum considered a
negative tolerance of inductance and a decline of DC
superposition characteristics.
If LCACL is less than 100 µH, try the procedure 1 of
Section (I-2-1-1-4) to increase it.
(I-2-1-1-10) Drain RMS current and Inductor RMS
current : IDRMS1, ILRMS1
The conduction loss of RDS(ON) of power MOSFET is
estimated to be
.
2) Calculate Upper inductor current, ILH2
3) Calculate Switching frequency, fSW2
where,
For fSW2 < fMIN, set to fMIN.
For fTYP < fSW2, set to fTYP.
When fSW2 is fMIN or fTYP, calculate ILH2 again by the
following.
This value is equivalent to the rating for inductor.
(I-2-1-2) Parameters for VDCIN_MAX
(I-2-1-2-1) On-duty in continuous operation, DCCM2,
and Average inductor current, ILAVG2
For fMIN ≤ fSW2 ≤ fTYP, ILH2 is the value of the previous
2).
If ILH2 is IDLIM or more, try the procedure 1 in Section
(I-2-1-1-4) to decrease it.
4) Calculate Lower inductor current, ILL2
The condition of DCCM2 : < 0.5
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STR5A450 Series
5) The operation mode is given by the following.
● For ILL2 > 0, CCM
● For ILL2 = 0, CRM
● For ILL2 < 0, DCM
(I-2-1-2-3) DON2, fSW2, ILH2, ILL2 of the operation mode
result
I LH (A)
5
I LH2_DCM
ILH_dcm
3
I LH2_CRM
ILH_crm
2
These parameters are different in the operation mode
results of Section (I-2-1-2-2)-5).
1
● Resulting in CCM
0
fSW2 is the value of Section (I-2-1-2-2)-3).
I LH2_f
ILH_f
4
f MIN
fmin
f TYP
fmax
20 25 30 35 40 45 50 55 60 65 70 f SW (kHz)
Figure 10-5 ILH2 and fSW2 of DCM Graph in which the
intersection of ILH_f and ILH_DCM is in the range of fMIN to
fTYP.
ILH2 is the value of Section (I-2-1-2-2)-3)
ILL2 is the value of Section (I-2-1-2-2)-4)
I LH (A)
5
I LH2_f
ILH_f
4
I LH2_DCM
ILH_dcm
3
I LH2_CRM
ILH_crm
2
● Resulting in CRM
f MIN
fmin
1
f TYP
fmax
0
20 25 30 35 40 45 50 55 60 65 70 f SW (kHz)
fSW2 is the value of Section (I-2-1-2-2)-3).
● Resulting in DCM
1) Draw the graph of the following equations.
By using this, find the values of fSW2 and ILH2 of
DCM.
Figure 10-6 ILH2 and fSW2 of DCM Graph in which the
intersection of ILH_f and ILH_DCM is out of the range of
fMIN to fTYP.
In DCM, ILH value at the intersection of ILH2_f and
ILH2_DCM is bigger than that of ILH2_CRM.
2) Set Switching frequency, fSW2
When fSW at the intersection of ILH2_f and ILH2_DCM is
in the range of fMIN to fTYP as shown in Figure 10-5,
fSW2 is set to that value. When fSW is out of the range
as shown in Figure 10-6, fSW2 is set to the limited
value which is fMIN or fTYP of the over range side.
3) Calculate On-duty, DON2
The condition of DDCM2 : < DCCM2
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STR5A450 Series
4) Calculate ILH2, ILL2, and ILR2
ILH2 is the value at the intersection of fSW2 which is
given in the previous 2) and ILH2_DCM. Otherwise, ILH2
is given below.
(I-2-1-2-8) IDRMS2、ILRMS2
These are given by substituting ILH2, ILL2, DON2, and
DCCM2 for ILH1, ILL1, DON1, and DCCM1 in the equation of
Section (I-2-1-1-10), respectively.
(I-2-1-2-9) Inductor current spec.
The peak current in OCP operation, IOCP, is given
below.
(I-2-1-2-4) ILH2
If ILH2 is IDLIM or more, try the procedure 1 in Section
(I-2-1-1-4) to decrease it.
(I-2-1-2-5) On-time, tON2
The saturation current of the inductor should be
enough larger than IOCP.
The rating current refers to the equation of RMS in
Section (I-2-1-1-10).
(I-2-2) Parameter Calculation assigned LUSER
If tON2 is less than 500 ns, try the procedure 1 in
Section (I-2-1-1-4) to increase it.
(I-2-1-2-6) OCP threshold voltage, VOCP2
VOCP2 is given below by tON2.
● For
, VOCP2 = VOCP(H)_MIN
● For
,
Parameter calculation assigned LUSER at VDCIN_MIN and
VDCIN_MAX is similar to the way of Section (I-2-1-2)
Parameters for VDCIN_MAX.
Parameters assigned LUSER are given by substituting
the input voltage and LUSER for VDCIN_MAX and LCALC.
If the conditions of calculation aren’t satisfied,
increase LUSER setting, or decrease IOUT setting, and then
try to calculate again.
where, DPC (mV/µs)、tON1 (µs)
(I-2-1-2-7) Current detection resistor, ROCP
Upper value at VDCIN_MAX of the ROCP range is given
below.
Denoting ROCP(H) as a smaller value of either ROCP(H)2
for VDCIN_MAX or ROCP(H)1 for VDCIN_MIN in Section
(I-2-1-1-8), the range of ROCP is given below.
If ROCP setting has no range, try the procedure 1 in
Section (I-2-1-1-4).
If ROCP setting is out of the previous range, try to set it
again, and then try to calculate again from Section
(I-2-1-1-5).
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STR5A450 Series
4) VCC Trace Layout
This is the trace for supplying power to the IC, and
thus it should be as small loop as possible. If C4 and
the IC are distant from each other, placing a
capacitor such as film capacitor Cf about 0.1 μF to
1.0 μF close to the VCC pin and the GND pin is
recommended.
10.4 PCB Trace Layout
Since the PCB circuit trace design and the component
layout significantly affects operation, EMI noise, and
power dissipation, the high frequency PCB trace should
be low impedance with small loop and wide trace.
In addition, the ground traces affect radiated EMI
noise, and wide, short traces should be taken into
account.
Figure 10-7 and Figure 10-8 show the circuit design
example.
5) FB Trace Layout
The divided voltage by R2+R3 and R1 of output
voltage is input to the FB pin.
To increase the detection accuracy, R3 and R1
should be connected to the bottom of C3 and the
GND pin, respectively. The trace between R1, R2
and the FB pin should be as short as possible.
1) Main Circuit Trace Layout
This is the main trace containing switching currents,
and thus it should be as wide trace and small loop as
possible.
2) Freewheeling Loop Layout
This is the trace for the current of freewheeling
diode, D3, and thus it should be as wide trace and
small loop as possible.
6) Thermal Considerations
Since the internal power MOSFET has a positive
thermal coefficient of RDS(ON), consider it in thermal
design.
Since the copper area under the IC and the GND pin
trace act as a heatsink, its traces should be as wide as
possible.
3) Control Ground Trace Layout
Since the operation of IC may be affected from the
large current of the main trace that flows in control
ground trace, the control ground trace should be
separated from main trace and connected at single
point grounding.
(4) Loop of the power supply should be small
(7) Trace of D/ST pin should be
wide for heat release
D1
D/ST
VCC
D/ST
GND
D/ST
FB
5
3
8
C1
C2
R1
2
D2
R2
ROCP
S/OCP
D/ST
R3
VOUT
(+)
1
U1
(6) Components connected
to FB pin should be
connected as close to
FB pin as possible.
C3
C4
6
7
4
L1
D3
C5
R4
(-)
(1) Main trace should be wide
trace and small loop
(5)ROCP should be
connected as close to
S/OCP pin as possible.
(3)Control GND trace should be
connected at a single point as
close to ROCP as possible.
(2) Freewheeling Loop trace
should be wide trace and
small loop
Figure 10-7 Peripheral circuit example around the IC for Buck converter
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STR5A450 Series
(4) Loop of the power supply should be small
(7) Trace of D/ST pin should be
wide for heat release
D1
D/ST
VCC
D/ST
GND
D/ST
FB
5
8
C3
C4
3
6
7
4
C2
R1
2
D2
R2
ROCP
S/OCP
D/ST
(6) Components connected
to FB pin should be
connected as close to
FB pin as possible.
R3
VOUT
D3
(-)
1
U1
C5
C1
R4
L1
(+)
(1) Main trace should be wide
trace and small loop
(5)ROCP should be
connected as close to
S/OCP pin as possible.
(3)Control GND trace should be
connected at a single point as
close to ROCP as possible.
(2) Freewheeling Loop trace
should be wide trace and
small loop
Figure 10-8 Peripheral circuit example around the IC for Inverting converter
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STR5A450 Series
11. Reference Design of Power Supply
11.1 Buck Converter
As an example, the following show the power supply specification, the circuit schematic, the bill of materials, and the
transformer specification.
● Power supply specification
IC
Input voltage
Maximum output power
Output voltage
Output current
STR5A453D
AC 85 V to AC 265 V
15 W (max.)
15 V
1A
● Circuit schematic
U1
D6
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
1
7
F1
C4
D1
D2
D4
D3
C6
R2
R3
R4
2
L1
8
C5
3
6
CN1
4
1
CN2
D7
(+)
L2
R1
C1
C2
C11
D5
C8
ZD1
R5
3
(-)
TC_STR5A450_5_R2
● Bill of materials
Ratings(1)
Recommended Sanken Parts
F1
Fuse
250 V, 2 A
C1
Film capacitor
275 V, 0.1 μF
C2
Electrolytic capacitor
400 V, 56 μF
(2)
C4
Ceramic capacitor
50 V, 470 pF
C5
Electrolytic capacitor
50 V, 10 μF, 2012
C6
Ceramic capacitor
50 V, 2.2 μF, 2012
C8
Electrolytic capacitor
50 V, 330 μF
C11
Ceramic capacitor
2 kV, 22 pF
D1, D2, D3, D4
Diode
600 V, 1 A
D5
Fast recovery diode
600 V, 3 A
RL4A
D6
Fast recovery diode
90 V, 1 A
SJPB-D9
D7
Fast recovery diode
600 V, 0.5 A
AG01A
ZD1
Zener diode
Vz = 22 V, SOD-323
(2)
L1
CM inductor
8.2 mH
L2
Inductor
180 μH
R1
Resistor
0.33 Ω, 1 W
(2)
R2
Resistor
10 kΩ, 1/8 W, 1608
(2)
R3
Resistor
47 kΩ, 1/8 W, 1608
(2)
R4
Resistor
4.7 kΩ, 1/8 W, 1608
(2)
R5
Resistor
6.8 kΩ, 1/4 W, 2012
U1
AC/DC convertor IC
650 V/1.9 Ω
STR5A453D
(1)
Unless otherwise specified, the voltage rating of capacitor is 50 V or less and the power rating of resistor is 1/8 W or less.
(2)
It is necessary to be adjusted based on actual operation in the application.
Symbol
Part type
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STR5A450 Series
11.2 Inverting Converter
As an example, the following show the power supply specification, the circuit schematic, the bill of materials, and the
transformer specification.
● Power supply specification
IC
Input voltage
Maximum output power
Output voltage
Output current
STR5A453D
AC 85 V to AC 265 V
15 W (max.)
– 15 V
1A
● Circuit schematic
U1
D6
D/ST
VCC
D/ST
GND
D/ST
FB
D/ST
S/OCP
5
1
7
F1
D2
D4
D3
8
C6
C4
R2
R3
R4
2
L1
D1
C5
3
6
CN1
4
1
CN2
D7
(-)
R1
D5
C1
C2
C11
L2
C8
ZD1
R5
3
(+)
TC_STR5A450_6_R2
● Bill of materials
Ratings(1)
Recommended Sanken Parts
F1
Fuse
250 V, 2 A
C1
Film capacitor
275 V, 0.1 μF
C2
Electrolytic capacitor
400 V, 56 μF
(2)
C4
Ceramic capacitor
50 V, 470 pF
C5
Electrolytic capacitor
50 V, 10 μF, 2012
C6
Ceramic capacitor
50 V, 2.2 μF, 2012
C8
Electrolytic capacitor
50 V, 330 μF
C11
Ceramic capacitor
2 kV, 22 pF
D1, D2, D3, D4
Diode
600 V, 1 A
D5
Fast recovery diode
600 V, 3 A
RL4A
D6
Fast recovery diode
90 V, 1 A
SJPB-D9
D7
Fast recovery diode
600 V, 0.5 A
AG01A
ZD1
Zener diode
Vz = 22 V, SOD-323
(2)
L1
CM inductor
8.2 mH
L2
Inductor
180 μH
R1
Resistor
0.33 Ω, 1 W
(2)
R2
Resistor
10 kΩ, 1/8 W, 1608
(2)
R3
Resistor
47 kΩ, 1/8 W, 1608
(2)
R4
Resistor
4.7 kΩ, 1/8 W, 1608
(2)
R5
Resistor
6.8 kΩ, 1/4 W, 2012
U1
AC/DC convertor IC
650 V/1.9 Ω
STR5A453D
(1)
Unless otherwise specified, the voltage rating of capacitor is 50 V or less and the power rating of resistor is 1/8 W or less.
(2)
It is necessary to be adjusted based on actual operation in the application.
Symbol
Part type
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STR5A450 Series
IMPORTANT NOTES
● All data, illustrations, graphs, tables and any other information included in this document as to anken’s products listed herein (the
“Sanken Products” are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement, etc. Please make sure that the contents set forth in this document reflect the latest revisions
before use.
● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home
appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to
Sanken. If considering use of the Sanken Products for any applications that require higher reliability (transportation equipment and
its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you
must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal,
on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. Any use
of the Sanken Products without the prior written consent of Sanken in any applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such
uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which
the Sanken Products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human
injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer
to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● No contents in this document can be transcribed or copied without anken’s prior written consent.
● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples and
evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the
Sanken Products and Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you,
users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any
other rights of you, users or any third party, resulting from the foregoing.
● All technical information described in this document the “Technical Information” is presented for the sole purpose of reference
of use of the Sanken Products and no license, express, implied or otherwise, is granted hereby under any intellectual property
rights or any other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,
as to the quality of the Sanken Products (including the merchantability, or fitness for a particular purpose or a special environment
thereof), and any information contained in this document (including its accuracy, usefulness, or reliability).
● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and
regulations that regulate the inclusion or use of any particular controlled substances, including, but not limited to, the EU RoHS
Directive, so as to be in strict compliance with such applicable laws and regulations.
● You must not use the Sanken Products or the Technical Information for the purpose of any military applications or use, including
but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Technical
Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each
country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan,
and follow the procedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including
the falling thereof, out of anken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the contents included herein.
● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer
to our official website in relation to general instructions and directions for using the Sanken Products.
STR5A450-DSE Rev.1.0s
SANKEN ELECTRIC CO.,LTD.
Jan. 29, 2016
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2015
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