Reliability Data Report Product Family R357 LT1461 / LT1634 Reliability Data Report Report Number: R357 Report generated on: Wed Jun 18 10:34:29 PDT 2014 OPERATING LIFE TEST PACKAGE TYPE SOIC/SOT/MSOP TO-92 Totals SAMPLE SIZE 453 100 553 OLDEST DATE NEWEST DATE K DEVICE HRS 1 CODE CODE (+125°C) 9714 9908 - 1028 9924 - 441 175 616 No. of FAILURES 2,3 0 0 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SOIC/SOT/MSOP Totals SAMPLE SIZE 77 77 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) 1251 - 1251 - 147 147 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP TO-92 Totals 24250 1649 25,899 OLDEST DATE NEWEST DATE CODE CODE 9726 9733 - 1322 1315 - 1509 53 1,562 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 9726 0104 9746 - 1322 0104 1315 - 3143 5 120 3,268 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 9744 9740 - 1322 1315 - 2213 65 2,278 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP PLASTIC DIP TO-92 Totals 21003 50 1201 22,254 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP TO-92 Totals 15932 654 16,586 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =2.98 FITS (3) Mean Time Between Failure in Years = 38359 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning 0 0 0 Reliability Data Report Report Number: R357 Report generated on: Wed Jun 18 10:34:29 PDT 2014 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP Totals 902 902 OLDEST DATE NEWEST DATE CODE CODE 0804 - 0906 - K DEVICE HRS No. of FAILURES 892 892 0 0