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Description
1- 88
®
July 1998
Features
• Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . 500V
• Ability to Interface and Drive N-Channel Power
Devices
• Floating Bootstrap Power Supply for Upper Rail
Drive
• CMOS Schmitt-Triggered Inputs with Hysteresis
and Pull-Down
• Single Low Current Bias Supply
• Latch-Up Immune CMOS Logic
• Peak Drive . . . . . . . . . . . . . . . . . . . . . . . . . Up to 2.0A
• Gate Drive Rise Time
. . . . . . < 25ns (Typ)
Applications
The HIP2500 is a high voltage integrated circuit (HVIC) optimized
to drive N-Channel MOS gated power devices in half bridge topologies. It provides the necessary control for PWM motor drive,
power supply, and UPS applications. The SD pin allows external
shutdown of gate drive to both upper and lower gate outputs. Undervoltage lockout will not allow gating when the bias voltage is too
low to drive the external switches into saturation.
The HIP2500IB is a SOIC or small outline IC form of the
HIP2500. The HIP2500IB drives high side and low side referenced power switches just like the HIP2500IP.
The HIP2500IP1 is a 16 lead Plastic DIP form of the HIP2500.
Pins 4 and 5 removed from lead frame to provide extra creepage and strike distances in high voltage applications.
• High Frequency Switch-Mode Power Supply
• Induction Heating and Welding
Please see Application Note AN9010 for more information.
• Switch Mode Amplifiers
• AC and DC Motor Drives
Functional Block Diagram
• Electronic Lamp Ballasts
• Battery Chargers
HIP2500
• UPS Inverters
• Noise Cancellation in Amplifier Systems
TEMP.
RANGE (oC)
UV
VDD
LEVEL
SHIFT
VB
S
LATCH
DRIVER
HO
R
VS
HIN
Ordering Information
PART
NUMBER
Half Bridge 500VDC Driver
The HIP2500IP is pin and function compatible to the International Rectifier IR2110. The HIP2500 has superior ability to
accept negative voltages from the VS pin to the COM pin due to
forward recovery of the lower flyback diode.
• Up to 400kHz Operation
(+125oC) .
HIP2500
PACKAGE
PKG NO.
HIP2500IP
-40 to +85
14 Ld PDIP
E14.3
HIP2500IP1
-40 to +85
16 Ld PDIP
E16.3
HIP2500IB
-40 to +85
16 Ld SOIC (W)
M16.3
SD
VCC
LOGIC
LIN
UV
DRIVER
LO
COM
VSS
Pinouts
HIP2500 (PDIP)
TOP VIEW
HIP2500 (SOIC)
TOP VIEW
HIP2500 (PDIP)
TOP VIEW
LO
1
14 NC
LO
1
16
NC
LO
1
16
NC
COM
2
13 VSS
COM
2
15
VSS
COM
2
15
VSS
VCC
3
14
LIN
VCC
3
14
LIN
NC
4
13
SD
13
SD
NC
5
12
HIN
12
HIN
VCC
3
12 LIN
NC
4
11 SD
VS
5
10 HIN
VB
VS
6
11
VDD
VS
6
11
VDD
6
9
VDD
VB
7
10
NC
VB
7
10
NC
HO
7
8
NC
HO
8
9
NC
HO
8
9
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
1
File Number
2801.9
HIP2500
Absolute Maximum Ratings
Full Temperature Range Unless
Otherwise Noted, All Voltages Referenced to VSS Unless Otherwise Noted.
Thermal Information
Floating Supply Voltage, V B . . . . . . . . . . . . . . .VS-0.5V to VS+18.0V
(Positive Terminal)
Floating Supply Voltage, V S . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
(Common Terminal)
High Side Channel Output Voltage, VHO . . . . . . . . -0.5V to VB+0.5V
Fixed Supply Voltage, V CC . . . . . . . . . . . . . . . . . . . . . -0.5V to 18.0V
Low Side Channel Output Voltage, V LO . . . . . . . .-0.5V to VCC+0.5V
Logic Supply Voltage, V DD . . . . . . . . . . . . . . . . . . . . . -0.5V to 18.0V
Logic Input Voltage, VIN . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.5V
[HIN, LIN & SD (Shutdown)]
VDD to COM and VCC to VSS Voltage. . . . . . . . . . . . . -0.5V to 18.0V
Thermal Resistance (Note 1, Typical)
θJA
HIP2500IP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75oC/W
HIP2500IP1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
80oC/W
HIP2500IB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90oC/W
See Maximum Power Dissipation vs Temperature Curve
Junction Temperature Range . . . . . . . . . . . . . . . . . -40oC to +125oC
Storage Temperature Range, TS . . . . . . . . . . . . . . -40oC to +150oC
Operating Ambient Temperature Range, TA . . . . . . . -40oC to +85oC
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Recommended DC Operating Conditions
Floating Supply Voltage, V B . . . . . . . . . . . . . . . . VS+10V to VS+15V
(Floating Terminal)
High Side Channel Output Voltage, VHO . . . . . . . . . . . . . .10V to VB
(With Respect to VS)
Fixed Supply Voltage, V CC . . . . . . . . . . . . . . . . . . . . . . . .10V to 15V
Low Side Channel Output Voltage, V LO . . . . . . . . . . . . . . 0V to VCC
Logic Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . 4V to VCC
Floating Supply Voltage, V S . . . . . . . . . . . . . . . . . . . . -4.0V to 500V
(Common Terminal)
VSS and COM potentials to be equal.
Electrical Specifications VCC = (VB - VS) = VDD = 15V, COM = VSS = 0, Unless Otherwise Noted
TJ = +25oC
PARAMETER
TJ = -40o C TO +125oC
SYMBOL
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
Quiescent VCC Current
IQCC
-
1.5
1.9
-
-
2.0
mA
Quiescent VBS Current
IQBS
-
300
400
-
300
435
µA
Quiescent VDD Current
IQDD
-
0.1
1
-
-
1.8
µA
IS (500V)
-
0.4
3.0
-
-
-
µA
Logic Input Pulldown Current, VIN = VDD
(HIN, LIN, SD)
IN+
-
12
20
-
-
22
µA
Logic Input Leakage Current, VIN = VSS
(HIN, LIN, SD)
IN-
-
0
1
-
0
1
µA
Logic Input Positive Going Threshold (Note 2)
V TH+
7.5
8.0
8.5
7.5
8.0
8.6
V
Logic Input Negative Going Threshold (Note 2)
VTH-
5.5
5.9
6.3
5.5
5.9
6.4
V
Undervoltage Positive Going Threshold
UV+
8.0
9.35
9.99
7.8
-
9.99
V
Undervoltage Negative Going Threshold
UV-
7.7
9.05
9.69
7.5
-
9.69
V
Undervoltage Hysteresis (VCC )
UVHYS (VCC)
250
-
450
170
-
530
mV
Undervoltage Hysteresis (VBS)
UVHYS (VBS)
250
-
450
170
-
530
mV
Output High Open Circuit Voltage (HO, LO)
VOUT +
14.95
15
-
14.95
15
-
V
Output Low Open Circuit Voltage (HO, LO)
VOUT -
-
-
0.05
-
-
0.05
V
Output High Short Circuit Current (Sourcing)
IOUT +
1.65
2.1
-
1.15
1.6
-
A
Output Low Short Circuit Current (Sinking)
IOUT -
1.85
2.3
-
1.35
1.7
-
A
DC CHARACTERISTICS
Quiescent Leakage Current
NOTE:
2. See Figure 8 for logic supply voltages other than 15.0V.
2
HIP2500
Switching Specifications
TJ = +25oC
PARAMETER
SYMBOL
TJ = -40o C TO +125oC
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
HIGH SIDE CHANNEL WITH 500V OFFSET, CL = 1000pF
High Side Turn-On Propagation Delay
tON
320
420
525
230
-
725
ns
High Side Turn-Off Propagation Delay
tOFF
260
385
450
190
-
625
ns
High Side Rise Time
tR
-
25
50
-
25
50
ns
High Side Turn-Off Fall Time
tF
-
25
50
-
25
50
ns
Low Side Turn-On Propagation Delay
tON
250
365
450
190
-
600
ns
Low Side Turn-Off Propagation Delay
tOFF
175
295
370
125
-
475
ns
Low Side Turn-On Rise Time
tR
-
25
50
-
30
50
ns
Low Side Turn-Off Fall Time
tF
-
25
50
-
30
50
ns
High Side Shutdown
tSDHO
300
400
490
200
-
650
ns
Low Side Shutdown
tSDLO
175
320
400
125
-
500
ns
Mt
0
-
125
0
-
185
ns
Minimum On Output Pulse Width (HO, LO)
PWOUT(MIN)
-
35
50
-
35
55
ns
Minimum Off Output Pulse Width (HO, LO)
PWOUTMIN
275
440
640
250
440
650
ns
Minimum On Input Pulse Width (HIN, LIN)
PWON(MIN)
-
100
145
-
100
175
ns
Minimum Off Input Pulse Width (HIN, LIN)
PWOFF(MIN)
-
110
200
-
110
220
ns
Deadtime LO Turn-Off to HO Turn-On
DHtON
-
125
-
-
125
-
ns
Deadtime HO Turn-Off to LO Turn-On
DLtON
-
-20
-
-
-20
-
ns
dVS/dt
-
-
50
-
-
50
V/ns
LOW SIDE CHANNEL, CL = 1000pF
Shutdown Propagation Delay
HIGH SIDE CHANNEL WITH 500V OFFSET, CL = 1000pF
Turn-On Propagation Delay Matching
(Between HO and LO)
MAXIMUM TRANSIENT CONDITIONS
Offset Supply Operating Transient
Logic Truth Table
HIN
LIN
UVH
UVL
SD
HO
LO
0
0
0
0
0
0
0
Normal Off
0
1
0
0
0
0
1
Lower On
1
0
0
0
0
1
0
Upper On
1
1
0
0
0
1
1
Both On
X
X
X
X
1
0
0
Chip Disabled
X
X
1
1
X
0
0
VCC UV Lockout and VBS Lockout
X
1
1
0
0
0
1
VBS UV Lockout
1
X
0
1
0
1
0
VCC UV Lockout
3
COMMENTS
HIP2500
HIGH VOLTAGE POWER DISSIPATION (W)
MAXIMUM POWER DISSIPATION (W)
Typical Performance Curves
2.5
HIP2500-IP
HIP2500-IP1
2.25
2
HIP2500-IB
1.75
1.5
1.25
1
0.75
0.5
0.25
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
1.0
VBIAS = 15V
CL = 100pF
TA = +25o C
0.1
0.01
0.001
10
100
AMBIENT TEMPERATURE ( C)
FIGURE 2. HIGH VOLTAGE POWER DISSIPATION vs
SWITCHING FREQUENCY
FIGURE 1. MAXIMUM POWER DISSIPATION vs TEMPERATURE
MAX VSS OFFSET
LOGIC SUPPLY
OFFSET VOLTAGE (V)
POWER DISSIPATION (W)
6
VS = VSS = COM
VBS = VCC = 15VDC
TA = +25 oC
1.0
2100pF
0.1
907pF
100pF
0.01
10
1000
SWITCHING FREQUENCY (kHz)
o
10
VS = 400V
VS = 300V
VS = 200V
VS = 100V
4
2
0
-2
MIN VSS OFFSET
100
SWITCHING FREQUENCY (kHz)
-4
1000
10
12
14
16
SUPPLY VOLTAGE (V)
NOTE: All switching losses assumed to be in IC.
FIGURE 3. LOW VOLTAGE POWER DISSIPATION vs
FREQUENCY
FIGURE 4. VSS OFFSET vs VCC SUPPLY VOLTAGE
4
HIP2500
Typical Performance Curves
(Continued)
MAX VS OFFSET VOLTAGE (NEGATIVE)
OFFSET SUPPLY LEAKAGE
CURRENT (µA)
10
200V
500V
400V
300V
100V
1.0
0.1
0
20
40
60
80
100
TEMPERATURE (o C)
120
10
8
7
4
3
2
10
11
10
VCC UV+
9.2
9.15
VBS UV+
9.1
9.05
VCC UV-
9.0
VBS UV-
8.95
8.9
-40
-20
0
20
60
80
40
TEMPERATURE (oC)
100
120
150
-50
5
6
8
10
12
14
16
18
FIGURE 8. INPUT LOGIC THRESHOLD vs SUPPLY VOLTS
120
18V IQBS1
18V IQBS0
RISE AND FALL TIMES (ns)
200
VTH-
4
LOGIC SUPPLY VOLTAGE (V)
(VDD TO VSS)
350
250
VTH+
6
2
450
300
18
8
140
FIGURE 7. UNDERVOLTAGE LOCKOUT vs TEMPERATURE
400
17
TJ = -40o C TO +125oC
9.3
9.25
12
13
14
15
16
BOOTSTRAP SUPPLY VOLTAGE
FIGURE 6. MAXIMUM NEGATIVE V S OFFSET VOLTAGE vs VBS
VOLTAGE
LOGIC THRESHOLD (V)
UNDERVOLTAGE LOCKOUT (V)
VCC = 12V
5
9.35
VBS SUPPLY CURRENT (µA)
VCC = 15V
6
140
FIGURE 5. OFFSET SUPPLY LEAKAGE vs TEMPERATURE
VCC = 15V AND 12V
TJ = +25o C
9
14V IQBS1
14V IQBS0
10V IQBS1
10V IQBS0
0
50
100
JUNCTION TEMPERATURE (oC)
100
80
60
40
20
0
100
150
tR
tF
1000
1E4
LOAD CAPACITANCE (pF)
FIGURE 10. RISE AND FALL TIME vs LOAD CAPACITANCE
FIGURE 9. QUIESCENT VBS SUPPLY CURRENT vs
TEMPERATURE
5
HIP2500
Typical Performance Curves
30
-40
0
25
125
2.5
28
RISE AND FALL TIME (ns)
PEAK OUTPUT CURRENT (A)
3.0
(Continued)
2.0
1.5
1.0
-40
25
0.5
0
0
125
0
2
4
6
8
SOURCE DRIVER
SINK DRIVER
10
12
14
tF
26
24
tR
22
20
18
16
14
12
10
-50
16
0
SOURCE/SINK DRAIN-SOURCE VOLTAGE
FIGURE 11. DRIVER SINK/SOURCE V-I CHARACTERISTIC
150
460
26
PROPAGATION DELAY (ns)
28
RISE AND FALL TIME (ns)
100
FIGURE 12. RISE AND FALL TIME vs TEMPERATURE
30
tF
24
22
20
tR
18
16
14
12
10
10
50
TEMPERATURE (oC)
11
12
13
14
15
440
HtOFF
400
380
LtON
360
340
320
300
10
16
HtON
420
LtOFF
11
12
13
14
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 13. RISE AND FALL TIME vs SUPPLY VOLTAGE
PROPAGATION DELAY (ns)
16
FIGURE 14. PROPAGATION DELAY vs SUPPLY VOLTAGE
700
HtON
600
HtOFF
500
LtON
400
LtOFF
300
200
-50
15
0
50
100
JUNCTION TEMPERATURE (o C)
FIGURE 15. PROPAGATION DELAYS AT VCC = 15V
6
150
HIP2500
Dual-In-Line Plastic Packages (PDIP)
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
A2
-C-
SEATING
PLANE
A
L
D1
e
B1
D1
B
0.010 (0.25) M
A1
eC
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8
eA
C
0.008
0.014
D
0.735
0.775
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
e
eA
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.100 BSC
-
L
0.115
14
0.355
19.68
2.54 BSC
0.300 BSC
eB
N
0.204
18.66
7.62 BSC
0.430
-
0.150
2.93
14
5
6
10.92
7
3.81
4
9
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
7
HIP2500
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
A2
-C-
SEATING
PLANE
A
L
D1
e
B1
D1
B
0.010 (0.25) M
A1
eC
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
D
0.735
0.775
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
e
eA
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.100 BSC
-
L
0.115
16
0.355
19.68
2.54 BSC
0.300 BSC
eB
N
0.204
18.66
7.62 BSC
0.430
-
0.150
2.93
16
5
6
10.92
7
3.81
4
9
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
8
HIP2500
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
INDEX
AREA
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
µα
e
A1
B
0.25(0.010) M C A M
C
0.10(0.004)
B S
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
α
NOTES:
MILLIMETERS
MAX
A1
e
-C-
MIN
16
0o
16
7
8o
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
9
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