an1828

Application Note 1828
ZL9006MEVAL1Z, ZL9010MEVAL1Z 6A and 10A
Evaluation Board Setup Procedure
Figure 1 represents a typical implementation of the ZL9006M,
ZL9010M. For PMBus operation, it is recommended to tie the
Enable pin (EN) to “disable” mode.
Recommended Equipment
• 0V to 15V power supply with at least 5A source current
capability
• Electronic load capable of sinking current up to 10A
• Digital multimeters (DMMs)
• 100MHz quad-trace oscilloscope
VIN = 4.5V TO 13.5V
TIE TO USB-TO-SMBus DONGLE
BOARD. FOR MULTIPLE BOARD
OPERATIONS, TIE TO THE
CONNECTION OF "TO SEQUEL" ON
THE OTHER ZL9006/9010M BOARD
+
The ZL9006M, ZL9010M functions as a switch mode power
supply with added benefits of auto compensation,
programmable power management features, parametric
monitoring, and status reporting capabilities.
The ZL9006M, ZL9010M is packaged in a thermally enhanced,
compact (17.2mmx11.45mm) and low profile (2.5mm)
over-molded high-density array (HDA) package module
suitable for automated assembly by standard surface mount
equipment. The ZL9006M, ZL9010M is Pb-free and RoHS
compliant.
-
The ZL9006M, ZL9010M is a variable output, step-down
PMBus-compliant digital power supply. Included in the module
is a high-performance digital PWM controller, power MOSFETs,
an inductor, and all the passive components required for a
highly integrated DC/DC power solution. This power module
has built-in auto-compensation algorithms, which eliminate
the need for manual compensation design work. The
ZL9006M, ZL9010M operates over a wide input voltage range
and supports an output voltage range of 0.6V to 3.6V, which
can be set by external resistors or via PMBus. Only bulk input
and output capacitors are needed to finish the design. The
output voltage can be precisely regulated to as low as 0.6V
with ±1% output voltage regulation over line, load, and
temperature variations.
+ V VIN
PMBus ADDRESS SELECTION
OUTPUT VOLTAGE SELECTION WITH
PINSTRAP SETTING.
SET THE MAX ALLOWED VOLTAGE
FOR PMBus PROGRAMMING.
ENABLE OR DISABLE THE
MODULE WITH PINSTRAP SETTING.
SET TO "DISABLE" MODE OR
FLOATING FOR PMBus PROGRAMMING.
FLOATING OR TIE TO THE
NEXT BOARD FOR PMBus
PROGRAMMING ON MULTIPLE
BOARD OPERATIONS.
PGOOD LED
VOUT
+V VOUT = 0.6V TO 3.3V
LOAD
(0A~6A/10A)
FIGURE 1. ZL9006M, ZL9010M BOARD IMAGE
March 19, 2013
AN1828.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright Intersil Americas LLC 2013. All Rights Reserved.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
Application Note 1828
Quick Start
The inputs are P2A (VIN) and P2B (GND). The outputs are P1A
(VOUT) and P1B (GND). Refer to Figure 1 for connections. There
are two ways to evaluate this evaluation board: I2C/PMBus
programing (Steps 1 through 4) and quick pinstrap power-up
(Step 6).
1. Install the PowerNavigator™ software using the CD included
in the ZL9006M, ZL9010M kit. For PMBus operation, connect
the USB-to-PMBus dongle board to J7 of the ZL9006M,
ZL9010M board and connect the USB cable from the
computer to the dongle board.
2. Connect a power supply capable of sourcing at least 5A to the
input (VIN P2A & GND P2B) of the ZL9006M, ZL9010M
evaluation board, with a voltage between 4.5V to 13.5V.
Connect an electronic load or the device to be powered to the
output (VOUT P1A & GND P1B) of the board. All connections,
the low voltage and high current VOUT lines should be able to
carry the desired load current and should be made as short as
possible.
3. Check the connections of "VOUT select" and "address select".
Make sure that the selections are correct. When changing the
output voltage through the I2C/PMBus, the voltage pinstrap
sets the maximum allowed voltage. Thus, check the pinstrap
setting on J5 before programming to a higher output voltage.
For single board operations, the "address select" connection
can be floating or any address listed on the board. But for
multiple board operations, each board should have a unique
address.
4. Move the ENABLE switch to “DISABLE” and turn on the power
to program the power module using powerNavigator
evaluation software. It allows modification of all
ZL9006/9010M PMBus parameters. See Application Note
AN2033 for PMBus command details. Use the mouse-over
pop-ups for PowerNavigator help.
5. After programming, the ENABLE switch can then be moved to
“ENABLE” and the ZL9006M, ZL9010M can be tested.
Alternately, the PMBus ONOFF, CONFIG, and OPERATION
commands can be used.
6. Pinstrap power-up option: if no I2C/PMBus device is available
to program the power module, the pinstrap option can allow
users to power up the device to check the electrical functions
without I2C/PMBus connections. Simply follow Step 2 to
connect the wires, then turn on the ENABLE switch. There are
two pinstrap functions to be configured: Voltage and PMBus
address. Ensure that input power is turned off, and then set
the address and voltage pinstraps using J4 and J5. If no
voltage is selected on J5, the default output voltage is 1.5V.
For different input and output voltages, the switching frequency
will need to be adjusted, as shown in Table 1. The default
frequency is 615kHz.
2
TABLE 1. RECOMMENDED FREQUENCY FOR DIFFERENT INPUT AND
OUTPUT VOLTAGES
V0UT--VIN
3.3V
5.0V
12.0V
0.6 - 1.5
300kHz
400kHz
400kHz
1.5 - 2.5
300kHz
615kHz
615kHz
2.5 - 3.6
300kHz
471kHz
800kHz
Evaluation Board Information
The evaluation board size is 3 inches x 3 inches. It is a 4-layer
board, containing 2-ounce copper on the top and bottom layers
and 1-ounce copper on all internal layers. The board can be used
as a 6A/10A reference design. Refer to the “Layout” section
beginning on page 4. The board is made up of FR4 material and
all components including the solder attachment are lead-free.
Thermal Considerations and Current Derating
Board layout is very critical in order to make the module operate
safely and deliver maximum allowable power. To work in the high
temperature environments and carry large currents, the board
layout needs to be carefully designed to maximize thermal
performance. To achieve this, select enough trace width, copper
weight and the proper connectors.
This evaluation board is designed for running 6A/10A at room
temperature without additional cooling systems needed.
However, if the output voltage is increased or the board is
operated at elevated temperatures, then the available current is
derated. Refer to the derated current curves in the datasheets
(FN8422 and FN7959) to determine the output current available.
For layout of designs using the ZL9006M, ZL9010M, the thermal
performance can be improved by adhering to the following
design tips:
1. Use the top and bottom layers to carry the large current. VOUT,
SW, PGND and VIN should have large, solid planes. Place
enough thermal vias to connect the power planes in different
layers under and around the module.
2. SW pad is switching node that generate switching noise. Keep
the pad under the module. For noise-sensitive applications, it
is recommended to keep SW pads only on the top and inner
layers of the PCB; do not place SW pads exposed to the
outside on the bottom layer of the PCB. To improve the
thermal performance, the SW pads can be extended in the
inner layer, as shown in SW pad on layer 3 (Figure 6). Make
sure that layer 2 and layer 4 have the GND layers to cover the
extended areas of phase pads at layer 3 to avoid noise
coupling.
3. If the ambient temperature is high or the board space is
limited, airflow is needed to dissipate more heat from the
modules. A heat sink can also be applied to the top side of the
module to further improve the thermal performance (heat
sink recommendation: Aavid Thermalloy, part number
375224B00032G, www.aavid.com). Place the heat sink on
the module’s top surface on the power side that has the VIN
and VOUT pads underneath.
AN1828.0
March 19, 2013
ZL9006M, ZL9010M Board Schematic
VAUX
2
1
4
3
6
5
8
7
10 9
4. 75K
OUT
I/O
S YNC_ I O
R5
DNP
R 16
R 15
49. 9
PG_ 0
IN
10K
10K
10K
R 14
10K
C145
DNP
R 21
OPE N
392
VOUT
DDC
MS T R_ E N
MS T R_ S YNC
PG
IN
1
3
5
7
9
I/O
OUT
4. 7UF
1
2
J101
1
2
VI N
VI N
GND
SW
GND
P 2A
P 2B
VOUT
TP9
OUT
VOUT
C122
100UF
OPEN
C121
C112
330UF
C111
OPEN
OPEN
C110
OPEN
C108
OPEN
C107
C106
OPEN
100UF
C105
C104
VR
100UF
A7
IN
E
F 10
P GND
PGND
IN
PGND
P 1A
P 1B
E
E
C2
1
TP7
J102
2
1
2
VOUT
MONI T OR
T S W- 1 0 2 - 0 7 - G- S
1
3
5
7
9
OPEN
VR
E
22UF
D
C151
C1
330UF
C101
C102
22UF
22UF
C103
VD D
VD D
A8
R145
T I E GR OUNDS HE R E
V1
J5
2
4
6
8
10
1
3
5
7
9
2
4
6
8
10
J 4 ADDRE S S S E L E CT I ON
RE F
VAL UE ADDRE S S
R1 0 2 5 1 . 1 K
0 X6 1
R1 0 3 5 6 . 2 K
0 X6 2
R1 0 4 6 1 . 9 K
0 X6 3
R1 0 5 6 8 . 1 K
0 X6 4
R1 0 6 7 5 . 0 K
0 X6 5
TP5
TS W- 105- 07- T- D
R141
VT RK
DNP
E
C115
IN
VDD
OPEN
OPEN
C152
DNP
R117
133K
3. 30V
110K
2. 50V
R110
R109
61. 9K
1. 80V
R108
31. 6K
1. 20V
R107
1. 00V
D
21. 5K
IN
R111
0X65
0X64
0X63
0X62
R 13
R 12
C150
A6
A4
A3
A5
DDC
EN
XTE M P
ISE NB
S GND
P AD5
D
0X61
J 10
R129
T S W- 1 0 2 - 0 7 - G- S
P AD4
V O UT
DNP
D
7
10 9
H9
DNP
R115
1
DG ND
S GND
5
8
E
P AD2
SW
F C0
R116
75K
R106
R105
68. 1K
R104
61. 9K
R103
56. 2K
R102
51. 1K
U101
E
2
4
6
8
10
2
4
6
8
10
T S W- 105- 07- T - D
VIN
L8
C1
P AD3
P AD1
P GND
F B-
1
3
5
7
9
1
3
5
7
9
I/O
OUT
3
6
49. 9
1
3
5
7
9
IN
S ALR T
K1
D1
1
4
Application Note 1828
J4
2
4
6
8
10
VI N
S DA
J1
S CL
S DA
S AL RT
T P6
SA
S CL
H1
F CO
B6
S YNC
F1
G1
I/O
B3
A1
SA
0
L7
R184
S YNC
F B+
T P3
E1
L6
D
D
I/O
PG
S YNC_ I O
DNP
J7
2
I/O
R4
I/O
V TR K
R114
C126
S GND
VDD
I/O
IN
V 25
T P2
V25
OPEN
3
E
S DA
PG
OUT
IN
L1
D
2
4
6
8
10
I/O
S AL RT
VDD
D
EN
OPE N
OUT
OUT
C100
E
VI 2C
MMBT 3 9 0 4
I/O
100K
GND
T P1
DDC
V 25
2
R101
1
SS
T P4
OF F
Q1
2 N7 0 0 2 L
2
XT E MP
S CL
Q101
IN
L4
IN
PG
1
EN
2
J1
3
1
3
100PF
ON
S S L _ L XA3 0 2 5 I GC
A2
3. 32K
TP8
3
V 25
2
V1
4
R ED
L3
G RN
1
V 25
3
R2
V1
3. 32K
L2
IN
LED101
L1
D2
VI 2C
VT RK
DDC
EN
OUT
R1
R3
IN
10K
D1
VR
E
J 5 OUT P UT VOL T AGE S E L E CT
RE F
VAL UE
VOUT
R1 0 7
21. 5K
1. 00V
R1 0 8
31. 6K
1. 20V
R1 0 9
61. 9K
1. 80V
R1 1 0
110K
2. 50V
R1 1 1
133K
3. 30V
DRAWN B Y:
DAT E:
E NG INE E R:
R ELEASE D B Y:
DAT E:
T IT LE :
UPDAT ED B Y:
DAT E:
T I M KL E MANN
FIGURE 2. ZL9006M, ZL9010M BOARD SCHEMATIC
02/ 14/ 2013
T ES TE R
J I AN YI N
ZL 9 0 0 6 M
E VAL UAT I ON BOAR D
S CHE MAT I C
MAS K#
F ILENAME:
DAT E:
HRDWR ID
ZL 9 0 0 6 ME VAL 1 Z
S HE E T
1
RE V.
D
1
AN1828.0
March 19, 2013
Application Note 1828
Layout
FIGURE 3. ASSEMBLY TOP
FIGURE 4. SILK SCREEN TOP
FIGURE 5. TOP LAYER COMPONENT SIDE
FIGURE 6. LAYER 2
4
AN1828.0
March 19, 2013
Application Note 1828
Layout
(Continued)
FIGURE 7. LAYER 3
FIGURE 8. BOTTOM LAYER SOLDER SIDE
FIGURE 9. SILK SCREEN BOTTOM
FIGURE 10. SILK SCREEN BOTTOM (MIRRORED)
5
AN1828.0
March 19, 2013
Application Note 1828
Layout
(Continued)
FIGURE 11. ASSEMBLY BOTTOM
6
AN1828.0
March 19, 2013
Bill of Materials
PART NUMBER
QTY
REF DES
MANUFACTURER
DESCRIPTION
7
1
C2
AVX
Ceramic Capacitor
2N7002L
1
Q1
On Semi
N-Channel 60V 115mA MOSFET
5002
9
TP1-TP9
Keystone
Miniature White Test Point 0.100 Pad 0.040 Thole
575-4
4
P1A, P1B, P2A, P2B
Keystone
Solder Mount Banana Plug
6TPF330M9L
1
C112
Sanyo-Poscap
TPF Series Low Esr Products Capacitor
APXA160ARA331MJCOG
1
C101
Nippon
AL Polymer PXA Series Capacitor (RoHS Comp.)
BAT54XV2T1
2
D1, D2
On-semi
30V 200mW Schottky Barrier Diode
BLM15BD102SN1D
1
L1
Murata
Chip Ferrite Bead
GRM21BR71C475KA73L
1
C1
Murata
Ceramic Capacitor
GRM32ER61E226KE15L
2
C102, C103
Murata
Ceramic Chip Capacitor
H1045-00101-50V5
1
C150
Generic
Multilayer Capacitor
H1045-OPEN
5
C100, C115, C145, C151, C152 Generic
Multilayer Capacitor
H1046-OPEN
1
C126
Generic
Multilayer Capacitor
H1082-00107-6R3V20
4
C104, C105, C108, C122
Generic
Ceramic Chip Capacitor
H1082-OPEN
3
C106, C107, C121
Generic
Ceramic Chip Capacitor
H2505-DNP-DNP-1
6
R5, R114-R117, R141
Generic
Metal Film Chip Resistor (Do Not Populate)
H2506-DNP-DNP-1
1
R145
Generic
Metal Film Chip Resistor (Do Not Populate)
H2511-00R00-1/16W1
1
R184
Generic
Thick Film Chip Resistor
H2511-01002-1/16W1
5
R3, R12-R15
Generic
Thick Film Chip Resistor
H2511-01003-1/16W1
1
R101
Generic
Thick Film Chip Resistor
H2511-01103-1/16W1
1
R110
Generic
Thick Film Chip Resistor
H2511-01333-1/16W1
1
R111
Generic
Thick Film Chip Resistor
H2511-02152-1/16W1
1
R107
Generic
Thick Film Chip Resistor
H2511-03162-1/16W1
1
R108
Generic
Thick Film Chip Resistor
H2511-03321-1/16W1
2
R1, R2
Generic
Thick Film Chip Resistor
H2511-03920-1/16W1
1
R21
Generic
Thick Film Chip Resistor
H2511-04751-1/16W1
1
R16
Generic
Thick Film Chip Resistor
H2511-049R9-1/16W1
2
R4, R129
Generic
Thick Film Chip Resistor
H2511-05112-1/16W1
1
R102
Generic
Thick Film Chip Resistor
Application Note 1828
AN1828.0
March 19, 2013
12066C226KAT2A
Bill of Materials (Continued)
PART NUMBER
QTY
REF DES
MANUFACTURER
DESCRIPTION
8
1
R103
Generic
Thick Film Chip Resistor
H2511-06192-1/16W1
2
R104, R109
Generic
Thick Film Chip Resistor
H2511-06812-1/16W1
1
R105
Generic
Thick Film Chip Resistor
H2511-07502-1/16W1
1
R106
Generic
Thick Film Chip Resistor
JUMPER-3-100
1
J1
Generic
Three Pin Jumper
MMBT3904
1
Q101
Micro Commercial Components
NPN General Purpose Amplifier
SSL-LXA3025IGC
1
LED101
Lumex
3mm x 2.5mm Surface Mount Red/Green LED
SSQ-105-02-T-D-RA
1
J10
Samtec
10 Pin Socket 2.54mm x 2.54mm (0.100) Right Angle
TSW-102-07-G-S
2
J101, J102
Samtec
2 Pin Header 2.54mm (0.100) Pitch
TSW-105-07-T-D
2
J4, J5
Samtec
10 Pin Header 2.54mm x 2.54mm (0.100)
TSW-136-10
1
J7
Samtec
10 Pin Header 2.54mm x 2.54mm (0.100)
ZL9006MIRZ or ZL9010MIRZ
1
U101
Intersil
Digital DC/DC PMBus 6A/10A Power Module
Application Note 1828
H2511-05622-1/16W1
AN1828.0
March 19, 2013
Application Note 1828
ZL9006M, ZL9010M Efficiency Curves
Test conditions: room temperature and no air flow.
100
100
95
95
90
85
EFFICIENCY (%)
EFFICIENCY (%)
90
85
80
3.3V 471kHz
2.5V 615kHz
1.8V 615kHz
1.2V 400kHz
1.0V 400kHz
0.6V 400kHz
75
70
65
60
0
1
2
3
IOUT (A)
80
75
70
3.3V 800kHz
2.5V 800kHz
1.8V 615kHz
1.2V 400kHz
1.0V 400kHz
0.6V 400kHz
65
60
55
50
45
4
5
40
6
0
FIGURE 12. ZL9006M EFFICIENCY, VIN = 5V
1
2
3
IOUT (A)
4
5
6
FIGURE 13. ZL9006M EFFICIENCY, VIN = 12V
100
100
95
95
90
90
EFFICIENCY (%)
EFFICIENCY (%)
85
85
80
75
3.3V 471kHz
2.5V 615kHz
1.8V 615kHz
1.2V 400kHz
1.0V 400kHz
0.6V 400kHz
70
65
60
55
50
0
1
2
3
4
5
IOUT (A)
6
7
80
75
70
3.3V 800kHz
2.5V 800kHz
1.8V 615kHz
1.2V 400kHz
1.0V 400kHz
0.6V 400kHz
65
60
55
50
45
8
FIGURE 14. ZL9010M EFFICIENCY, VIN = 5V
9
10
40
0
1
2
3
4
5
IOUT (A)
6
7
8
9
10
FIGURE 15. ZL9010M EFFICIENCY, VIN = 12V
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the Application Note or Technical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
AN1828.0
March 19, 2013
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