711BC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.2x1.2, 0.8P
CASE 711BC
ISSUE O
1
SCALE 4:1
DATE 15 SEP 2015
A B
D
PIN ONE
REFERENCE
ÏÏ
ÏÏ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL B
E
DETAIL B
TOP VIEW
A3
SIDE VIEW
A
0.05 C
ALTERNATE
CONSTRUCTION
4X
A1
(0.12)
0.05 C
4X
NOTE 4
C
SIDE VIEW
SEATING
PLANE
4X
D2
1
0.05
e/2
b
C A B
NOTE 3
e
2
M
4X
DETAIL A
L
(0.12)
DIM
A
A1
A3
b
b1
D
D2
E
E2
e
L
L1
MILLIMETERS
MIN
MAX
0.35
0.45
0.00
0.05
0.13 REF
0.25
0.35
0.15
0.25
1.15
1.25
0.58
0.68
1.15
1.25
0.58
0.68
0.80 BSC
0.25
0.35
0.13
0.23
GENERIC
MARKING DIAGRAM*
E2
XXM
1
L1
3
4
DETAIL A
XX = Specific Device Code
M = Date Code
b1
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
PACKAGE
OUTLINE
4X
1.50
0.25
C 0.195
0.22
4X
0.80 PITCH
0.35
2X
0.63
1
4X
0.48
45 5
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON04908G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XDFN4, 1.2X1.2, 0.8P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON04908G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. HYLAND.
DATE
15 SEP 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. O
Case Outline Number:
711BC