HIP1031 Half Amp High Side Driver with Overload Protection December 1997 Features Description • Over Operating Range. . . . . . . . . . . . . . -40oC to 125oC - VSAT at 0.6A . . . . . . . . . . . . . . . . . . . . . . . . . 1.0V Max - Power Supply Range . . . . . . . . . . . . . . . . 4.5V to 25V The HIP1031 is a High Side Driver Power Integrated Circuit designed to switch power supply voltage to an output load. It is the equivalent of a PNP pass transistor operated as a protected high side current switch in the saturated ON state with low forward voltage drop at the maximum rated current. It has low output leakage and low idle current in the OFF state. • Over-Voltage Shutdown Protected • Negative Output Voltage Clamp The Functional Block Diagram for the HIP1031 shows the protection control circuit functions of over-current, overvoltage and over-temperature. A small metal resistor senses overcurrent in the power supply path of the pass transistor and load. Overvoltage detection and shutdown of the output driver occurs when a comparator determines that the supply voltage has exceeded a comparator reference level. Overtemperature is sensed from a VBE differential sense element that is thermally close to the output drive transistor. In addition to the input detected overvoltage protection, negative peak voltage of an inductive load is clamped with an internal zener diode. An internal bandgap supply voltage source provides a stable voltage reference over the chip operating temperature range, providing bias and reference control for the protection circuits. • Over-Current Limiting • Thermal Limiting Protection • Load Dump . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60VPEAK • Reverse Battery Protection . . . . . . . . . . . . . . . . .To -16V • CMOS/TTL Logic Level Control Input Applications • Motor Driver/Controller • Driver for Solenoids, Relays & Lamps • MOSFET and IGBT Driver • Driver for Temperature Controller Ordering Information PART NUMBER TEMP. RANGE (oC) HIP1031AS -40 to 125 PACKAGE 5 Ld TS-001AA SIP Pinout The HIP1031 is particularly well suited for driving lamps, relays, and solenoids in automotive and industrial control applications where voltage and current overload protection at high temperatures is required. The HIP1031 is supplied in a 5 lead TS-001AA Power SIP package. PKG. NO. Z5.067C Functional Block Diagram HIP1031 (SIP) TOP VIEW VCC VOUT RS 2 1 VBATT SUPPLY OVERVOLTAGE SHUTDOWN CURRENT LIMIT THERMAL LIMIT NEG. CLAMP ZENER CONTROL CIRCUIT LOAD 5 VIN (CONTROL) 4 GND 3 TAB GND 2 VOUT (LOAD) 1 VCC (SUPPLY) VIN 5 HIP1031 CONTROL 3 GND CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 1 TAB 4 GND File Number 3596.6 HIP1031 Absolute Maximum Ratings Thermal Information Supply Voltage, VCC. . . . . . . . . . . See O.V. Shutdown Limit, VOVSD Input Voltage, VIN (Note 1) . . . . . . . . . . . . . . . . . . . . . . -0.8V to +7V Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . Internally Limiting Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . ±60VPEAK Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W) Plastic SIP Package . . . . . . . . . . . . . . 50 4 Maximum Power Dissipation, (Note 3) At TA = 125oC, Infinite Heat Sink. . . . . . . . . . . . . . . . . . . . . 6.25W Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Input Control Voltage, VIN , may range from -0.85V to +7V for a VCC supply voltage of 0V to +25V. 2. θJA is measured with the component mounted on an evaluation PC board in free air. 3. The worst case thermal resistance, θJC for the SIP TS-001AA 5 pin package is 4oC/W. The calculation for dissipation and junction temperature rise due to dissipation is: PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT) TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink. Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal resistance, θJC+θHS . For example: Where θJC = 4oC/W and given θHS = 6o/W as the thermal resistance of an external Heat Sink, the junction-to-air thermal resistance, θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree from TAMB to the maximum rated junction temperature of 150oC. If TAMB = 100oC, the maximum PD is (150 - 100) x 0.1W/oC = 5W. Electrical Specifications PARAMETER Operating Voltage Range Over-Voltage Shutdown TA = -40οC to 125οC, VIN = 2V, VCC = +12V, Unless Otherwise Specified SYMBOL TEST CONDITIONS VCC VOVSD RL = 1kΩ, VIN = 2V MIN TYP MAX UNITS 4.5 - 25 V 26 33 38 V - 150 - oC (VCC - 62) (VCC - 37) (VCC - 28) V 0.7 1.1 1.7 A Over-Temperature Limiting TSD Negative Pulse Output Clamp Voltage VCL ICL = -100mA, VCC = 4.5V to 25V, VIN = 0.8V Short Circuit Current Limiting ISC (Note 4) Input Control ON VIH 2.0 - - V Input Control OFF VIL - - 0.8 V Input Current High IIH VIN = 5.5V, VCC = 6V to 24 10 - 40 µA Input Current Low IIL VIN = 0.8V, VCC = 6V to 24V 10 - 30 µA Supply Current, Full Load, Input Control ON ICCMAX VIN = 2V; IOUT = 0.55A - - 0.6 A Supply Current, No Load, Input Control OFF ICCMIN VIN = 0V; IOUT = 0A - 55 150 µA IOUT = 0.6A, VCC = 4.5V to 25V - - 1.0 V VIN = 0.8V, VCC = 6V to 24V - - 50 µA Input-Output Forward Voltage Drop (VCC - VOUT) Output Leakage VSAT IOUT_LK Turn-On Time tON RL = 80Ω, TA = 125°C - 6 20 µs Turn-OFF Time tOFF RL = 80Ω, TA = 125°C - 17 65 µs NOTE: 4. Short Circuit current will be reduced when Thermal Shutdown occurs. Testing of a short circuit current may require a short duration pulse. 2 HIP1031 Typical Application HIP1031 HIGH SIDE DRIVER 0.47µF LOADS: RELAYS SOLENOIDS LAMPS MOTORS POWER SUPPLY VCC VOUT RS 2 1 OVERVOLTAGE SHUTDOWN CURRENT LIMIT THERMAL LIMIT NEG. CLAMP ZENER CONTROL CIRCUIT TYPICAL LOAD VSAT VIN 5 HIP1031 CMOS/TTL INPUT VBATT VOUT 3 LOGIC SWITCH TO VIN TAB GND 4 GND VCL GND VCLAMP Typical Performance Curves 16 WITH EXT. 6oC/W HEAT SINK 0.8 WITH EXT. 0oC/W HEAT SINK (INFINITE HEAT SINK) 12 FORWARD VOLTAGE DROP (V) DISSIPATION WATTS (W) 14 10 8 6 4 2 0 -50 HIP1031 VSAT WITH 20Ω RESISTIVE LOAD 0.7 0.6 VSAT AT IOUT = 0.75A 0.5 0.4 0.3 VSAT AT IOUT = 0.5A 0.2 VSAT AT IOUT = 0.25A 0.1 0 -25 0 25 50 75 100 125 150 -50 AMBIENT TEMPERATURE (oC) -25 0 25 50 75 AMBIENT TEMPERATURE (oC) FIGURE 1. DISSIPATION DERATING CURVES FIGURE 2. TYPICAL VSAT CHARACTERISTIC vs TEMPERATURE 3 100 125 HIP1031 Single-In-Line Plastic Packages (SIP) ØP E Z5.067C (ALTERNATE VERSION) 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE A A1 INCHES Q H1 D L1 b1 c L 60o 1 2 3 4 5 e b J1 e1 MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.170 0.180 4.32 4.57 - A1 0.048 0.052 1.22 1.32 3, 4 b 0.030 0.034 0.77 0.86 3, 4 b1 0.031 0.041 0.79 1.04 3, 4 c 0.018 0.022 0.46 0.55 3, 4 D 0.590 0.610 14.99 15.49 - E 0.395 0.405 10.04 10.28 - e 0.067 TYP 1.70 TYP 5 e1 0.268 BSC 6.80 BSC 5 H1 0.235 0.255 5.97 6.47 - J1 0.095 0.105 2.42 2.66 6 L 0.530 0.550 13.47 13.97 - L1 0.110 0.130 2.80 3.30 2 ØP 0.149 0.153 3.79 3.88 - Q 0.105 0.115 2.66 2.92 Rev. 1 4/96 NOTES: 1. These dimensions are within allowable dimensions of Rev. A of JEDEC TS-001AA outline dated 8-89. 2. Solder finish uncontrolled in this area. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. 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