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September 2004
HA-2500/883
Precision High Slew Rate Operational Amplifier
Features
Description
• This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
HA-2500/883 is a monolithic operational amplifier which is
optimized to deliver excellent slew rate, bandwidth, and settling time specifications. The outstanding dynamic features
of this internally compensated device are complemented
with low offset voltage and offset current.
• High Slew Rate . . . . . . . . . . . . . . . . . . . . . . .25V/µs (Min)
30V/µs (Typ)
This dielectrically isolated amplifier is ideally suited for applications such as data acquisition, RF, video, and pulse conditioning circuits. Guaranteed slew rates of ±25V/µs minimum
make it an excellent component in fast, accurate data acquisition and pulse amplification designs. To insure compliance,
all devices are 100% tested for AC performance characteristics over the full temperature limits.
• Wide Power Bandwidth . . . . . . . . . . . . . . . 350kHz (Min)
• High Input Impedance . . . . . . . . . . . . . . . . . 25MΩ (Min)
50MΩ (Typ)
• Low Offset Current . . . . . . . . . . . . . . . . . . . 25nA (Max)
10nA (Typ)
• Low Quiescent Current . . . . . . . . . . . . . . . . . 6mA (Max)
A typical 12MHz gain bandwidth product and 500kHz full
power bandwidth make this device well suited to RF and
video applications. With guaranteed offset voltages of 5mV
plus external offset adjust flexibility and low offset current,
this amplifier is particularly useful in signal conditioning
designs.
• Fast Settling Time (0.1% of 10V Step) . . . . 330ns (Typ)
• High Gain Bandwidth Product . . . . . . . . . 12MHz (Typ)
• Internally Compensated For Unity Gain Stability
Applications
Part Number Information
• Data Acquisition Systems
PART NUMBER
• RF Amplifiers
• Video Amplifiers
HA2-2500/883
TEMP.
RANGE (oC)
-55 to 125
PACKAGE
8 Pin Can
PKG.
NO.
T8.C
• Signal Generators
• Pulse Amplification
Pinout
HA-2500/883
(METAL CAN)
TOP VIEW
COMP
8
BAL
1
+
2
-IN
+IN
V+
7
6 OUT
5
3
BAL
4
V-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002, 2004. All Rights Reserved
1
Spec Number
511002-883
FN3734.3
HA-2500/883
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . . V+ to VPeak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
ESD Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <2000V
Thermal Resistance (Typical, Note 1)
θJA
θJC
Metal Can Package . . . . . . . . . . . . . . . . . 160oC/W 75oC/W
Package Power Dissipation Limit at 75oC for TJ ≤ 175oC
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625mW
Package Power Dissipation Derating Factor Above 75oC
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3mW/oC
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
VINCM ≤ 1/2 (V+ - V-)
RL ≥ 2kΩ
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω , RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETER
Input Offset
Voltage
Input Bias Current
SYMBOL
VIO
+IB
-IB
Input Offset
Current
Common Mode
Range
IIO
+CMR
-CMR
Large Signal
Voltage Gain
+AVOL
-AVOL
Common Mode
Rejection Ratio
+CMRR
-CMRR
CONDITIONS
VCM = 0V
VCM = 0V, +RS = 100kΩ, -RS = 100Ω
VCM = 0V, +RS = 100Ω, -RS = 100kΩ
VCM = 0V,+RS = 100kΩ, -RS = 100kΩ
V+ = 5V, V- = -25V
V+ = 25V, V- = -5V
VOUT = 0V and +10V, RL = 2kΩ
VOUT = 0V and -10V, RL = 2kΩ
∆VCM = +10V, V+ = +5V, V- = -25V,
VOUT = -10V
∆VCM = -10V, V+ = +25V, V- = -5V,
VOUT = +10V
GROUP A
SUBGROUPS
TEMP (oC)
MIN
MAX
UNITS
1
25
-5
5
mV
2, 3
125, -55
-8
8
mV
1
25
-200
200
nA
2, 3
125, -55
-400
400
nA
1
25
-200
200
nA
2, 3
125, -55
-400
400
nA
1
25
-25
25
nA
2, 3
125, -55
-50
50
nA
1
25
+10
-
V
2, 3
125, -55
+10
-
V
1
25
-
-10
V
2, 3
125, -55
-
-10
V
4
25
20
-
kV/V
5, 6
125, -55
15
-
kV/V
4
25
20
-
kV/V
5, 6
125, -55
15
-
kV/V
1
25
80
-
dB
2, 3
125, -55
80
-
dB
1
25
80
-
dB
2, 3
125, -55
80
-
dB
Spec Number
2
511002-883
HA-2500/883
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω , RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETER
Output Voltage
Swing
SYMBOL
+VOUT
-VOUT
Output Current
+IOUT
-IOUT
Quiescent Power
Supply Current
+ICC
-ICC
Power Supply
Rejection Ratio
+PSRR
-PSRR
Offset Voltage
Adjustment
+VIOAdj
-VIOAdj
CONDITIONS
GROUP A
SUBGROUPS
TEMP (oC)
MIN
MAX
UNITS
4
25
10
-
V
5, 6
125, -55
10
-
V
4
25
-
-10
V
5, 6
125, -55
-
-10
V
4
25
10
-
mA
5, 6
125, -55
7.5
-
mA
4
25
-
-10
mA
5, 6
125, -55
-
-7.5
mA
1
25
-
6
mA
2, 3
125, -55
-
6.5
mA
1
25
-6
-
mA
2, 3
125, -55
-6.5
-
mA
1
25
80
-
dB
2, 3
125, -55
80
-
dB
1
25
80
-
dB
2, 3
125, -55
80
-
dB
1
25
VIO-1
-
mV
2, 3
125, -55
VIO-1
-
mV
1
25
VIO+1
-
mV
2, 3
125, -55
VIO+1
-
mV
RL = 2kΩ
RL = 2kΩ
VOUT = -10V
VOUT = +10V
VOUT = 0V, IOUT = 0mA
VOUT = 0V, IOUT = 0mA
∆VSUP = 10V, V+ = +20V, V- = -15V,
V+ = +10V, V- = -15V
∆VSUP = 10V, V+ = +15V, V- = -20V,
V+ = +15V, V- = -10V
Note 2
Note 2
NOTE:
2. Offset adjustment range is [VIO (Measured) ±1mV] minimum referred to output. This test is for functionality only to assure adjustment
through 0V.
TABLE 2. ECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +1V/V, Unless Otherwise Specified.
PARAMETER
Slew Rate
SYMBOL
CONDITIONS
GROUP A
SUBGROUPS
TEMP (oC)
MIN
MAX
UNITS
+SR
VOUT = -5V to +5V, 25% ≤ +SR ≤ 75%
7
25
25
-
V/µs
8A, 8B
125, -55
20
-
V/µs
7
25
25
-
V/µs
8A, 8B
125, -55
20
-
V/µs
-SR
VOUT = +5V to -5V, 75% ≥ -SR ≥ 25%
Spec Number
3
511002-883
HA-2500/883
TABLE 2. ECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +1V/V, Unless Otherwise Specified.
PARAMETER
SYMBOL
CONDITIONS
GROUP A
SUBGROUPS
TEMP (oC)
MIN
MAX
UNITS
tr
VOUT = 0 to +200mV, 10% ≤ tr ≤ 90%
7
25
-
50
ns
8A, 8B
125, -55
-
60
ns
7
25
-
50
ns
8A, 8B
125, -55
-
60
ns
7
25
-
40
%
8A, 8B
125, -55
-
50
%
7
25
-
40
%
8A, 8B
125, -55
-
50
%
Rise and Fall
Time
tf
Overshoot
+OS
-OS
VOUT = 0 to -200mV, 10% ≤ tf ≤ 90%
VOUT = 0 to +200mV
VOUT = 0 to -200mV
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Characterized at: VSUPPLY = ±15V, RLOAD = 2kΩ, CLOAD = 50pF, Unless Otherwise Specified.
PARAMETER
Differential Input
Resistance
SYMBOL
RIN
CONDITIONS
VCM = 0V
Full Power
Bandwidth
FPBW
VPEAK = 10V
Minimum Closed
Loop Stable Gain
CLSG
RL = 2kΩ, CL = 50pF
Quiescent Power
Consumption
PC
VOUT = 0V, IOUT = 0mA
NOTES
TEMP (oC)
MIN
MAX
UNITS
3
25
25
-
MΩ
3, 4
25
350
-
kHz
3
-55 to 125
1
-
V/V
3, 5
-55 to 125
-
195
mW
NOTES:
3. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These parameters are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization
based upon data from multiple production runs which reflect lot to lot and within lot variation.
4. Full Power Bandwidth guarantee based on Slew Rate measurement using FPBW = Slew Rate/(2πVPEAK).
5. Quiescent Power Consumption based upon Quiescent Supply Current test maximum. (No load on outputs.)
TABLE 4. ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
SUBGROUPS (SEE TABLES 1 AND 2)
Interim Electrical Parameters (Pre Burn-In)
1
Final Electrical Test Parameters
1 (Note 6), 2, 3, 4, 5, 6, 7, 8A, 8B
Group A Test Requirements
1, 2, 3, 4, 5, 6, 7, 8A, 8B
Groups C and D Endpoints
1
NOTE:
6. PDA applies to Subgroup 1 only.
Spec Number
4
511002-883
HA-2500/883
Die Characteristics
WORST CASE CURRENT DENSITY:
DIE DIMENSIONS:
0.3 x 105A/cm2
57 x 65 x 19 milss
1450 x 1650 x 483µm
SUBSTRATE POTENTIAL (Powered Up):
METALLIZATION:
Unbiased
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
TRANSISTOR COUNT:
HA-2500/883: 40
GLASSIVATION:
PROCESS: Bipolar Dielectric Isolation
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
Metallization Mask Layout
HA-2500/883
+IN
BAL
-IN
COMP
V-
V+
BAL
OUT
Spec Number
5
511002-883
HA-2500/883
Burn-In Circuits
HA2-2500/883 METAL CAN
V+
C3
C1
D1
8
1
7
+
2
6
5
3
4
R1
V-
C2
D2
NOTES:
R1 = 1MΩ, ±5%, 1/4W (Min)
C1 = C2 = 0.01µF/Socket (Min) or 0.1µF/Row (Min)
C3 = 0.01µF/Socket (10%)
D1 = D2 = 1N4002 or Equivalent/Board
|(V+) - (V-)| = 30V
Spec Number
6
511002-883
HA-2500/883
Metal Can Packages (Can)
T8.C MIL-STD-1835 MACY1-X8 (A1)
REFERENCE PLANE
A
8 LEAD METAL CAN PACKAGE
e1
L
L2
L1
INCHES
ØD2
A
A
k1
Øe
ØD ØD1
2
N
1
β
Øb1
Øb
F
α
k
C
L
BASE AND
SEATING PLANE
Q
BASE METAL
Øb1
LEAD FINISH
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between
L2 and 0.500 from the reference plane. Diameter is uncontrolled
in L1 and beyond 0.500 from the reference plane.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.165
0.185
4.19
4.70
-
Øb
0.016
0.019
0.41
0.48
1
Øb1
0.016
0.021
0.41
0.53
1
Øb2
0.016
0.024
0.41
0.61
-
ØD
0.335
0.375
8.51
9.40
-
ØD1
0.305
0.335
7.75
8.51
-
ØD2
0.110
0.160
2.79
4.06
-
e
0.200 BSC
5.08 BSC
-
e1
0.100 BSC
2.54 BSC
-
F
-
0.040
-
1.02
-
k
0.027
0.034
0.69
0.86
-
k1
0.027
0.045
0.69
1.14
2
L
0.500
0.750
12.70
19.05
1
L1
-
0.050
-
1.27
1
L2
0.250
-
6.35
-
1
Q
0.010
0.045
0.25
1.14
-
α
45o BSC
45o BSC
3
β
45o BSC
45o BSC
3
N
8
8
4
2. Measured from maximum diameter of the product.
Rev. 0 5/18/94
3. α is the basic spacing from the centerline of the tab to terminal 1
and β is the basic spacing of each lead or lead position (N -1
places) from α, looking at the bottom of the package.
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
6. Controlling dimension: INCH.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Spec Number
7
511002-883
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