ha2520 883

HA-2520/883
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October 11, 2004
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1- 888®
Uncompensated, High Slew Rate
Operational Amplifier
FN3735.3
Features
The HA-2520/883 is a monolithic operational amplifier which
delivers an unsurpassed combination of specifications for
slew rate, bandwidth and settling time. This dielectrically
isolated amplifier is designed for closed loop gains of 3 or
greater without external compensation. In addition, this high
performance component also provides low offset current and
high input impedance.
The 100V/µs (min) slew rate and fast settling time of this
amplifier make it ideal for pulse amplification and data
acquisition designs. To insure compliance with slew rate and
transient response specifications, the device is 100% tested
for AC performance characteristics over full temperature.
This device is a valuable component for RF and video
circuitry requiring wideband operation. For accurate signal
conditioning designs, the HA-2520/883’s superior dynamic
specifications are complemented by 25nA (max) offset
current and offset voltage adjust capability.
• This Circuit is Processed in Accordance to MIL-STD-883
and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
• High Slew Rate . . . . . . . . . . . . . . . . . . . . . .100V/µs (Min)
120V/µs (Min)
• Wide Power Bandwidth . . . . . . . . . . . . . . . . 1.5MHz (Min)
• Wide Gain Bandwidth. . . . . . . . . . . . . . . . . . .10MHz (Min)
20MHz (Typ)
• High Input Impedance . . . . . . . . . . . . . . . . . . 50MΩ (Min)
100MΩ (Typ)
• Low Offset Current . . . . . . . . . . . . . . . . . . . . . . 25nA (Min)
10nA (Typ)
• Fast Settling (0.1% of 10V Step) . . . . . . . . . . 200ns (Typ)
• Low Quiescent Supply Current . . . . . . . . . . . . 6mA (Max)
Pinout
HA-2520/883
(METAL CAN)
TOP VIEW
Part Number Information
PART
NUMBER
TEMP. RANGE
(oC)
PACKAGE
PKG. NO.
HA2-2520/883
-55oC to +125oC
8 Pin Can
T8.C
COMP
8
BAL
1
7
V+
Applications
-IN
• Data Acquisition Systems
• RF Amplifiers
+
2
+IN
6 OUT
5
3
BAL
4
• Video Amplifiers
V-
• Signal Generators
• Pulse Amplification
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HA-2520/883
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . .40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . V+ to VPeak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+175oC
Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .<2000V
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . .+300oC
θJC
Thermal Resistance
θJA
Metal Can Package . . . . . . . . . . . . . . . . . 160oC/W 75oC/W
Package Power Dissipation Limit at +75oC for TJ ≤ +175oC
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625mW
Package Power Dissipation Derating Factor Above +75oC
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3mW/oC
Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . -55oC to +125oC
Operating Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
VINCM ≤ 1/2 (V+ - V-)
RL ≥ 2kΩ
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379
for details.
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETERS
Input Offset
Voltage
Input Bias Current
SYMBOL
CONDITIONS
VCM = 0V
VIO
+IB
VCM = 0V, +RS = 100kΩ, -RS = 100Ω
-IB
Input Offset
Current
Common Mode
Range
VCM = 0V, +RS = 100Ω, -RS = 100kΩ
IIO
VCM = 0V, +RS = 100kΩ, -RS = 100kΩ
+CMR
V+ = 5V, V- = -25V
-CMR
Large Signal
Voltage Gain
V+ = 25V, V- = -5V
+AVOL
VOUT = 0V and +10V, RL = 2kΩ
-AVOL
Common Mode
Rejection Ratio
VOUT = 0V and -10V, RL = 2kΩ
∆VCM = +10V, V+ = +5V, V- = -25V,
VOUT = -10V
+CMRR
∆VCM = -10V, V+ = +25V, V- = -5V,
VOUT = +10V
-CMRR
Output Voltage
Swing
+VOUT
RL = 2kΩ
RL = 2kΩ
-VOUT
2
HA-2520/883
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
1
+25oC
-8
8
mV
2, 3
+125oC, -55oC
-10
10
mV
1
+25oC
-200
200
nA
2, 3
+125oC, -55oC
-400
400
nA
1
+25oC
-200
200
nA
2, 3
+125oC, -55oC
-400
400
nA
1
+25oC
-25
25
nA
2, 3
+125oC, -55oC
-50
50
nA
1
+25oC
+10
-
V
2, 3
+125oC, -55oC
+10
-
V
1
+25oC
-
-10
V
2, 3
+125oC, -55oC
-
-10
V
4
+25oC
10
-
kV/V
5, 6
+125oC, -55oC
7.5
-
kV/V
4
+25oC
10
-
kV/V
5, 6
+125oC, -55oC
7.5
-
kV/V
1
+25oC
80
-
dB
2, 3
+125oC, -55oC
80
-
dB
1
+25oC
80
-
dB
2, 3
+125oC, -55oC
80
-
dB
4
+25oC
10
-
V
5, 6
+125oC, -55oC
10
-
V
4
+25oC
-
-10
V
5, 6
+125oC, -55oC
-
-10
V
HA-2520/883
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETERS
Output Current
SYMBOL
CONDITIONS
+IOUT
VOUT = -10V
-IOUT
Quiescent Power
Supply Current
VOUT = +10V
VOUT = 0V, IOUT = 0mA
+ICC
-ICC
Power Supply
Rejection Ratio
VOUT = 0V, IOUT = 0mA
∆VSUP = 10V, V+ = +20V, V- = -15V, V+
= +10V, V- = -15V
+PSRR
∆VSUP = 10V, V+ = +15V, V- = -20V, V+
= +15V, V- = -10V
-PSRR
Offset Voltage
Adjustment
+VIOAdj
Note 1
-VIOAdj
Note 1
HA-2520/883
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
4
+25oC
10
-
mA
5, 6
+125oC, -55oC
7.5
-
mA
4
+25oC
-
-10
mA
5, 6
+125oC, -55oC
-
-7.5
mA
1
+25oC
-
6
mA
2, 3
+125oC, -55oC
-
6.5
mA
1
+25oC
-6
-
mA
2, 3
+125oC, -55oC
-6.5
-
mA
1
+25oC
80
-
dB
2, 3
+125oC, -55oC
80
-
dB
1
+25oC
80
-
dB
2, 3
+125oC, -55oC
80
-
dB
1
+25oC
VIO-1
-
mV
2, 3
+125oC, -55oC
VIO-1
-
mV
1
+25oC
VIO+1
-
mV
2, 3
+125oC, -55oC
VIO+1
-
mV
NOTE:
2. Offset adjustment range is [VIO (Measured) ±1mV] minimum referred to output. This test is for functionality only to assure adjustment through 0V.
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +3V/V, Unless Otherwise Specified.
PARAMETERS
Slew Rate
SYMBOL
CONDITIONS
VOUT = -5V to +5V, 25% ≤ +SR ≤ 75%
+SR
VOUT = +5V to -5V, 75% ≥ -SR ≥ 25%
-SR
Rise and Fall Time
VOUT = 0 to +200mV, 10% ≤ TR ≤ 90%
TR
VOUT = 0 to -200mV, 10% ≤ TF ≤ 90%
TF
Overshoot
+OS
VOUT = 0 to +200mV
VOUT = 0 to -200mV
-OS
3
HA-2520/883
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
7
+25oC
100
-
V/µs
8A, 8B
+125oC, -55oC
84
-
V/µs
7
+25oC
100
-
V/µs
8A, 8B
+125oC, -55oC
84
-
V/µs
7
+25oC
-
50
ns
8A, 8B
+125oC, -55oC
-
55
ns
7
+25oC
-
50
ns
8A, 8B
+125oC, -55oC
-
55
ns
7
+25oC
-
40
%
8A, 8B
+125oC, -55oC
-
45
%
7
+25oC
-
40
%
8A, 8B
+125oC, -55oC
-
45
%
HA-2520/883
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Characterized at: VSUPPLY = ±15V, RLOAD = 2kΩ, CLOAD = 50pF, AV ≥ 3, CCOMP = 0pF, Unless Otherwise Specified.
HA-2520/883
PARAMETERS
Differential Input
Resistance
Full Power
Bandwidth
SYMBOL
CONDITIONS
RIN
GBWP
NOTES
TEMPERATURE
MIN
MAX
UNITS
VCM = 0V
1
+25oC
50
-
MΩ
VO = 200mV, fO = 10kHz
1
+25oC
10
-
MHz
VO = 200mV, fO = 1MHz
1
+25oC
10
-
MHz
1, 2
+25oC
1.6
-
MHz
1
-55oC to +125oC
+3
-
V/V
1, 3
-55oC to +125oC
-
195
mW
Full Power
Bandwidth
FPBW
VPEAK = 10V
Minimum Closed
Loop Stable Gain
CLSG
RL = 2kΩ, CL = 50pF
Quiescent Power
Consumption
PC
VOUT = 0V, IOUT = 0mA
NOTES:
3. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These parameters
are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization based upon
data from multiple production runs which reflect lot to lot and within lot variation.
4. Full Power Bandwidth guarantee based on Slew Rate measurement using FPBW = Slew Rate/(2πVPEAK).
5. Quiescent Power Consumption based upon Quiescent Supply Current test maximum. (No load on outputs.)
TABLE 4. ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
Interim Electrical Parameters (Pre Burn-In)
Final Electrical Test Parameters
SUBGROUPS (SEE TABLES 1 AND 2)
1
1 (Note 4), 2, 3, 4, 5, 6, 7, 8A, 8B
Group A Test Requirements
1, 2, 3, 4, 5, 6, 7, 8A, 8B
Groups C and D Endpoints
1
NOTE:
6. PDA applies to Subgroup 1 only.
4
HA-2520/883
Die Characteristics
DIE DIMENSIONS:
WORST CASE CURRENT DENSITY:
0.26 x 105 A/cm2
SUBSTRATE POTENTIAL (Powered Up):
67 x 57 x 19 mils ± 1 mils
1700 x 1440 x 483µm ± 25.4µm
Unbiased
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
TRANSISTOR COUNT:
HA-2520/883: 40
GLASSIVATION:
PROCESS:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
Bipolar Dielectric Isolation
Metallization Mask Layout
5
COMP
V+
OUT
BAL
-IN
+IN
BAL
V-
HA-2520/883
Metal Can Packages (Can)
T8.C MIL-STD-1835 MACY1-X8 (A1)
REFERENCE PLANE
A
8 LEAD METAL CAN PACKAGE
e1
L
L2
L1
INCHES
SYMBOL
ØD2
0.185
4.19
4.70
-
0.019
0.41
0.48
1
Øb1
0.016
0.021
0.41
0.53
1
N
Øb2
0.016
0.024
0.41
0.61
-
ØD
0.335
0.375
8.51
9.40
-
α
ØD1
0.305
0.335
7.75
8.51
-
ØD2
0.110
0.160
2.79
4.06
-
1
β
Øb
k
C
L
e
BASE AND
SEATING PLANE
Q
BASE METAL
Øb1
NOTES
0.165
k1
Øb1
MAX
0.016
Øe
F
MIN
A
A
2
MILLIMETERS
MAX
Øb
A
ØD ØD1
MIN
LEAD FINISH
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between
L2 and 0.500 from the reference plane. Diameter is uncontrolled
in L1 and beyond 0.500 from the reference plane.
e1
0.200 BSC
5.08 BSC
0.100 BSC
-
2.54 BSC
-
F
-
0.040
-
1.02
-
k
0.027
0.034
0.69
0.86
-
k1
0.027
0.045
0.69
1.14
2
12.70
19.05
1
1.27
1
L
0.500
0.750
L1
-
0.050
L2
0.250
-
6.35
-
1
Q
0.010
0.045
0.25
1.14
-
α
-
β
45o BSC
45o BSC
45o BSC
45o BSC
N
8
8
2. Measured from maximum diameter of the product.
3. α is the basic spacing from the centerline of the tab to terminal 1
and β is the basic spacing of each lead or lead position (N -1
places) from α, looking at the bottom of the package.
3
3
4
Rev. 0 5/18/94
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
6. Controlling dimension: INCH.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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6