REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED G Add two packages, F-5 and C-2. Change to military drawing format. Made changes to 1.3, table I, 6.4, figure 1, and editorial changes throughout. Add one vendor CAGE 34371. 89-09-13 M. Frye H Add new device type 02. Editorial changes throughout. Add vendor CAGE 1ES66. Change PDA from 10 percent to 5 percent. Make changes to 1.3 and table I. Remove vendor CAGE 32293. 92-11-13 M. Frye J Changes in accordance with NOR 5962-R134-95. 95-05-09 M. Frye K Drawing updated to reflect current requirements. Incorporate NOR revision J. Editorial changes throughout. - drw 00-09-15 R. Monnin L Drawing updated to current requirements. Editorial changes throughout. - drw 03-02-12 R. Monnin M Make correction to Marking paragraph 3.5. - ro 05-04-08 R. Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY A. J. Foley STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY C. R. Jackson APPROVED BY N. A. Hauck MICROCIRCUIT, CMOS, QUAD ANALOG SWITCH, MONOLITHIC SILICON DRAWING APPROVAL DATE 77-11-04 REVISION LEVEL M SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 1 OF 77053 9 5962-E222-05 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77053 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 DG201A HI-201 Circuit function Quad SPST analog switch Quad SPST analog switch, with dielectric isolation 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter 2 E F X Descriptive designator CQCC1-N20 GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CDFP4-F16 Terminals Package style 20 16 16 16 Square leadless chip carrier package Dual-in-line package Flat pack Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (between V+ and V-): Device type 01 ..................................................................... Device type 02 ..................................................................... Digital input voltage (VIN): Device type 01 ..................................................................... Device type 02 ..................................................................... Analog input voltage (VS) ........................................................ Current (any terminal except S or D): Device type 01 ..................................................................... Device type 02 ..................................................................... Continuous current, S or D: Device type 01 ..................................................................... Device type 02 ..................................................................... Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle maximum): Device type 01 ..................................................................... Device type 02 ..................................................................... Storage temperature range...................................................... STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 44 V dc 40 V dc V- -0.3 V dc to V+ V- -4 V dc to V+ +4 V dc V- -2 V dc to V+ +2 V dc 30 mA 25 mA 20 mA 25 mA 70 mA 40 mA -65°C to +150°C SIZE 77053 A REVISION LEVEL M SHEET 2 1.3 Absolute maximum ratings – continued. Power dissipation (PD)............................................................. 750 mW 1/ Lead temperature (soldering, 10 seconds) .............................. +275°C Thermal resistance, junction-to-case (θJC).............................. See MIL-STD-1835 Junction temperature (TJ): Device type 01 ..................................................................... Device type 02 ..................................................................... V+ to ground: Device type 01 ..................................................................... Device type 02 ..................................................................... V- to ground: Device type 01 ..................................................................... Device type 02 ..................................................................... +150°C +175°C +25 V +20 V -25 V -20 V 1.4 Recommended operating conditions. Positive supply voltage (V+) .................................................... +15 V dc Negative supply voltage (V-).................................................... -15 V dc Minimum digital high level input voltage (VIH).......................... +2.4 V dc Maximum digital low level input voltage (VIL)........................... +0.8 V dc Ambient operating temperature range (TA).............................. -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ____ 1/ For case E, derate at 12 mW/°C above TA = +75°C. For case 2, F and X, derate at 10 mW/°C above TA = +75°C. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Device type Limits 2/ 1, 2, 3 All ±15 V 1, 3 01 175 Ω Min Analog signal range Drain-source ON resistance VS RDS(ON) 3/ VD = ±10 V, VIN = 0.8 V, ID = ±1 mA 2 VS = ±10 V, VIN = 0.8 V, Unit Group A subgroups Max 250 1 02 70 ID = m1 mA, all unused channels, 2, 3 VA = 2.4 V Off input leakage current IS(OFF) VIN = 2.4 V, VS = ±14 V, 1 VD = m14 V Off output leakage current On leakage current ID(OFF) ID(ON) 100 VIN = 2.4 V, VS = ±14 V 01 ±1 02 ±2 2, 3 All ±100 1 01 ±1 02 ±2 2, 3 All ±200 0.8 1 VIN = 0.8 V, Low level input voltage VIL 1, 2, 3 All High level input voltage VIH 1, 2, 3 All Low level input leakage IIL 1 01 VIN = 0 V current 1 02 1 VIN = 2.4 V, 15 V current nA V 2.4 V ±1 µA ±0.5 ±1 2, 3 IIH nA ±10 2 VIN = 0.8 V nA ±100 2, 3 VD = VS = ±14 V High level input leakage ±2 All 01 ±1 µA ±10 2 1 02 ±0.5 ±1 2, 3 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Min Switch ON time tON RL = 1 kΩ, CL = 35 pF, ns 800 01 VIN = 5 V VIN = 2.4 V 650 01 4 6.5 1, 2 3 3 4.5 02 2 1, 2 1.5 3 2 01 -4 3 -6.5 1, 2 -3 3 -4.5 02 mA 1.5 3 1, 2 VIN = 0.8 V ns 500 3 1, 2 VIN = 0 V 500 650 02 1, 2 VIN = 2.4 V 3/ 600 1, 2 VIN = 0 V VIN = 0.8 V 1/ 2/ 02 10, 11 VIN = 5 V I- 9 9 VIH = +4 V, VIL = 0 V Negative supply current 1000 10, 11 RL = 1 kΩ, CL = 100 pF, I+ 01 9 RL = 1 kΩ, CL = 35 pF, VIH = +3 V, VIL = 0 V Positive supply current 9, 10, 11 10, 11 VIH = +4 V, VIL = 0 V tOFF Max VIH = +3 V, VIL = 0 V RL = 1 kΩ, CL = 100 pF, Switch OFF time Unit Limits 2/ mA -1.5 3 -2 1, 2 -1.5 3 -2 Unless otherwise specified, V+ = +15 V dc and V- = -15 V dc. The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. Guaranteed, if not tested, to the limits specified. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 6 Device type Case outlines 01 E, F, and X Terminal number 02 2 E 2 Terminal symbols 1 IN1 NC IN1 NC 2 D1 IN1 D1 IN1 3 S1 D1 S1 D1 4 V- S1 V- S1 5 GND V- GND V- 6 S4 NC S4 NC 7 D4 GND D4 GND 8 IN4 S4 IN4 S4 9 IN3 D4 IN3 D4 10 D3 IN4 D3 IN4 11 S3 NC S3 NC 12 NC IN3 VREF 1/ IN3 13 V+ D3 V+ D3 14 S2 S3 S2 S3 15 D2 NC D2 VREF 1/ 16 IN2 NC IN2 NC 17 --- V+ --- V+ 18 --- S2 --- S2 19 --- D2 --- D2 20 --- IN2 --- IN2 1/ VREF is normally floating, but voltage up to 10 V can be applied to raise the threshold voltage. FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 7 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 8 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) --1*,2,3,9 1,2,3,9,10,11 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 77053 A REVISION LEVEL M SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 05-04-08 Approved sources of supply for SMD 77053 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 77053012A 17856 DG201AAZ/883 77053012C 1ES66 DG201AAZ/883B 7705301EA 17856 DG201AAK/883 1ES66 DG201AAK/883B Reference military specification PIN 7705301FA 3/ 7705301XA 17856 DG201AAL/883 7705301XC 1ES66 DG201AAL/883B 77053022A 3/ HI4-201/883 77053022C 1ES66 HI4-201/883B 7705302EA 1ES66 HI1-201/883B 3/ HI1-201/883 M38510/12302BEA 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 1ES66 Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086-5125 17856 Siliconix Incorporated 2201 Laurelwood Road Santa Clara, CA 95054-1516 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.