77053.pdf

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
G
Add two packages, F-5 and C-2. Change to military drawing format. Made
changes to 1.3, table I, 6.4, figure 1, and editorial changes throughout. Add
one vendor CAGE 34371.
89-09-13
M. Frye
H
Add new device type 02. Editorial changes throughout. Add vendor CAGE
1ES66. Change PDA from 10 percent to 5 percent. Make changes to 1.3 and
table I. Remove vendor CAGE 32293.
92-11-13
M. Frye
J
Changes in accordance with NOR 5962-R134-95.
95-05-09
M. Frye
K
Drawing updated to reflect current requirements. Incorporate NOR revision J.
Editorial changes throughout. - drw
00-09-15
R. Monnin
L
Drawing updated to current requirements. Editorial changes throughout. - drw
03-02-12
R. Monnin
M
Make correction to Marking paragraph 3.5. - ro
05-04-08
R. Monnin
CURRENT CAGE CODE 67268
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
M
M
M
M
M
M
M
M
M
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
PMIC N/A
PREPARED BY
A. J. Foley
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
C. R. Jackson
APPROVED BY
N. A. Hauck
MICROCIRCUIT, CMOS, QUAD ANALOG SWITCH,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
77-11-04
REVISION LEVEL
M
SIZE
CAGE CODE
A
14933
SHEET
DSCC FORM 2233
APR 97
1 OF
77053
9
5962-E222-05
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
77053
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
02
DG201A
HI-201
Circuit function
Quad SPST analog switch
Quad SPST analog switch, with dielectric isolation
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
2
E
F
X
Descriptive designator
CQCC1-N20
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CDFP4-F16
Terminals
Package style
20
16
16
16
Square leadless chip carrier package
Dual-in-line package
Flat pack
Flat pack
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (between V+ and V-):
Device type 01 .....................................................................
Device type 02 .....................................................................
Digital input voltage (VIN):
Device type 01 .....................................................................
Device type 02 .....................................................................
Analog input voltage (VS) ........................................................
Current (any terminal except S or D):
Device type 01 .....................................................................
Device type 02 .....................................................................
Continuous current, S or D:
Device type 01 .....................................................................
Device type 02 .....................................................................
Peak current, S or D
(pulsed at 1 ms, 10 percent duty cycle maximum):
Device type 01 .....................................................................
Device type 02 .....................................................................
Storage temperature range......................................................
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
44 V dc
40 V dc
V- -0.3 V dc to V+
V- -4 V dc to V+ +4 V dc
V- -2 V dc to V+ +2 V dc
30 mA
25 mA
20 mA
25 mA
70 mA
40 mA
-65°C to +150°C
SIZE
77053
A
REVISION LEVEL
M
SHEET
2
1.3 Absolute maximum ratings – continued.
Power dissipation (PD)............................................................. 750 mW 1/
Lead temperature (soldering, 10 seconds) .............................. +275°C
Thermal resistance, junction-to-case (θJC).............................. See MIL-STD-1835
Junction temperature (TJ):
Device type 01 .....................................................................
Device type 02 .....................................................................
V+ to ground:
Device type 01 .....................................................................
Device type 02 .....................................................................
V- to ground:
Device type 01 .....................................................................
Device type 02 .....................................................................
+150°C
+175°C
+25 V
+20 V
-25 V
-20 V
1.4 Recommended operating conditions.
Positive supply voltage (V+) .................................................... +15 V dc
Negative supply voltage (V-).................................................... -15 V dc
Minimum digital high level input voltage (VIH).......................... +2.4 V dc
Maximum digital low level input voltage (VIL)........................... +0.8 V dc
Ambient operating temperature range (TA).............................. -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
____
1/ For case E, derate at 12 mW/°C above TA = +75°C. For case 2, F and X, derate at 10 mW/°C above TA = +75°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Device
type
Limits 2/
1, 2, 3
All
±15
V
1, 3
01
175
Ω
Min
Analog signal range
Drain-source ON
resistance
VS
RDS(ON)
3/
VD = ±10 V, VIN = 0.8 V,
ID = ±1 mA
2
VS = ±10 V, VIN = 0.8 V,
Unit
Group A
subgroups
Max
250
1
02
70
ID = m1 mA,
all unused channels,
2, 3
VA = 2.4 V
Off input leakage current
IS(OFF)
VIN = 2.4 V, VS = ±14 V,
1
VD = m14 V
Off output leakage current
On leakage current
ID(OFF)
ID(ON)
100
VIN = 2.4 V, VS = ±14 V
01
±1
02
±2
2, 3
All
±100
1
01
±1
02
±2
2, 3
All
±200
0.8
1
VIN = 0.8 V,
Low level input voltage
VIL
1, 2, 3
All
High level input voltage
VIH
1, 2, 3
All
Low level input leakage
IIL
1
01
VIN = 0 V
current
1
02
1
VIN = 2.4 V, 15 V
current
nA
V
2.4
V
±1
µA
±0.5
±1
2, 3
IIH
nA
±10
2
VIN = 0.8 V
nA
±100
2, 3
VD = VS = ±14 V
High level input leakage
±2
All
01
±1
µA
±10
2
1
02
±0.5
±1
2, 3
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Min
Switch ON time
tON
RL = 1 kΩ, CL = 35 pF,
ns
800
01
VIN = 5 V
VIN = 2.4 V
650
01
4
6.5
1, 2
3
3
4.5
02
2
1, 2
1.5
3
2
01
-4
3
-6.5
1, 2
-3
3
-4.5
02
mA
1.5
3
1, 2
VIN = 0.8 V
ns
500
3
1, 2
VIN = 0 V
500
650
02
1, 2
VIN = 2.4 V
3/
600
1, 2
VIN = 0 V
VIN = 0.8 V
1/
2/
02
10, 11
VIN = 5 V
I-
9
9
VIH = +4 V, VIL = 0 V
Negative supply current
1000
10, 11
RL = 1 kΩ, CL = 100 pF,
I+
01
9
RL = 1 kΩ, CL = 35 pF,
VIH = +3 V, VIL = 0 V
Positive supply current
9, 10, 11
10, 11
VIH = +4 V, VIL = 0 V
tOFF
Max
VIH = +3 V, VIL = 0 V
RL = 1 kΩ, CL = 100 pF,
Switch OFF time
Unit
Limits 2/
mA
-1.5
3
-2
1, 2
-1.5
3
-2
Unless otherwise specified, V+ = +15 V dc and V- = -15 V dc.
The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only.
Negative current shall be defined as conventional current flow out of a device terminal.
Guaranteed, if not tested, to the limits specified.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
6
Device type
Case outlines
01
E, F, and X
Terminal
number
02
2
E
2
Terminal symbols
1
IN1
NC
IN1
NC
2
D1
IN1
D1
IN1
3
S1
D1
S1
D1
4
V-
S1
V-
S1
5
GND
V-
GND
V-
6
S4
NC
S4
NC
7
D4
GND
D4
GND
8
IN4
S4
IN4
S4
9
IN3
D4
IN3
D4
10
D3
IN4
D3
IN4
11
S3
NC
S3
NC
12
NC
IN3
VREF 1/
IN3
13
V+
D3
V+
D3
14
S2
S3
S2
S3
15
D2
NC
D2
VREF 1/
16
IN2
NC
IN2
NC
17
---
V+
---
V+
18
---
S2
---
S2
19
---
D2
---
D2
20
---
IN2
---
IN2
1/ VREF is normally floating, but voltage up to 10 V can be applied to raise the threshold voltage.
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
7
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.3.2 Groups C and D inspections.
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2)
TA = +125°C, minimum.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
8
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Interim electrical parameters
(method 5004)
Final electrical test parameters
(method 5004)
Group A test requirements
(method 5005)
Groups C and D end-point
electrical parameters
(method 5005)
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
--1*,2,3,9
1,2,3,9,10,11
1
* PDA applies to subgroup 1.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
77053
A
REVISION LEVEL
M
SHEET
9
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 05-04-08
Approved sources of supply for SMD 77053 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
77053012A
17856
DG201AAZ/883
77053012C
1ES66
DG201AAZ/883B
7705301EA
17856
DG201AAK/883
1ES66
DG201AAK/883B
Reference
military specification
PIN
7705301FA
3/
7705301XA
17856
DG201AAL/883
7705301XC
1ES66
DG201AAL/883B
77053022A
3/
HI4-201/883
77053022C
1ES66
HI4-201/883B
7705302EA
1ES66
HI1-201/883B
3/
HI1-201/883
M38510/12302BEA
1/ The lead finish shown for each PIN representing a hermetic package is the most
readily available from the manufacturer listed for that part. If the desired lead finish
is not listed contact the vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
1ES66
Maxim Integrated Products
120 San Gabriel Drive
Sunnyvale, CA 94086-5125
17856
Siliconix Incorporated
2201 Laurelwood Road
Santa Clara, CA 95054-1516
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.