REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 02-07-11 R. Monnin Drawing updated to reflect current requirements. – gt REV SHEET REV A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rajesh Pithadia STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Rajesh Pithadia APPROVED BY Raymond Monnin MICROCIRCUIT, LINEAR, 12-BIT ANALOG-TODIGITAL CONVERTER WITH MICROPROCESSOR INTERFACE, MONOLITHIC SILICON DRAWING APPROVAL DATE 99-10-18 AMSC N/A REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-99582 23 5962-E393-02 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 99582 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q X X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function 774T 12-bit A/D converter with microprocessor interface 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator CDIP2-T28 Terminals Package style 28 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 2 1.3 Absolute maximum ratings. 1/ VCC to digital common ............................................................................................... VEE to digital common ............................................................................................... VLOGIC to digital common ........................................................................................... Analog common to digital common ........................................................................... 0 V to +16.5 V 0 V to -16.5 V 0 V to +7 V ±1 V Control inputs (CE, CS , AO, 12/ 8 , R/ C ) to digital common .................................... Analog inputs (REFIN, BIPOFF, 10 VIN) to analog common ..................................... 20 VIN to analog common .......................................................................................... REFOUT .................................................................................................................... -0.5 V to VLOGIC +0.5 V ±16.5 V ±24 V Indefinite short to common, momentary short to VCC 1.29 W 2/ +275°C -65°C to 150°C 77°C/W 18°C/W +175°C Power dissipation (at TA = 75°C) (PD) ....................................................................... Lead temperature (soldering, 10 seconds) ............................................................... Storage temperature ................................................................................................. Thermal resistance, junction-to-ambient (θJA) ........................................................... Thermal resistance, junction-to-case (θJC) ................................................................ Junction temperature (TJ) .......................................................................................... 1.4 Recommended operating conditions. +VSUPPLY .................................................................................................................... -VSUPPLY .................................................................................................................................................................................. VLOGIC ........................................................................................................................ VREF ........................................................................................................................... Analog input voltage, 10VIN ....................................................................................... Analog input voltage, 20 VIN ...................................................................................... Logic level low (VIL) ................................................................................................... Logic level high (VIH) ................................................................................................. Ambient operating temperature range (TA) ............................................................... +15 V -15 V +5 V +10 V ±5 V or 0 to +10 V 3/ 0 V to 0.8 V 2.0 V to +5 V -55°C to 125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - 1/ 2/ 3/ Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Power dissipation derating factor at TA > +75°C is 12.9 mW/°C. The 20 V input range (pin 14) is functional but performance is not guaranteed. Table I is guaranteed for only the 0 V to +10 V and ±5 V ranges (pin 13). The 20 V input (pin 14) should be left open. The 20 V input is tied to the 10 V input through 5 kΩ and will effect circuit operation if connected to any potential. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 3 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Bipolar input voltage range 2/ Unipolar input voltage range 2/ Input voltage Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type 1, 2, 3 01 VIN VIN 1, 2, 3 VIH Logic “1” 1, 2, 3 VIL Logic “0” 1, 2, 3 01 01 Limits Unit Min -5 Max +5 -10 +10 0 +10 0 +20 V V +2.0 V (CE, CS , R/ C , AO, 12/ 8 ) Power supply current from VCC Power supply current from VEE +0.8 ICC 1, 2, 3 01 15 mA IEE 1 01 28 mA 01 15 2, 3 Power supply current from VLOGIC ILOG Power dissipation 2/ 3/ PD 30 1 2, 3 Calculated worst case of 2 conditions 17 1 01 720 2, 3 Input low current IIL VLOGIC = 5.5 V, VIN(LOGIC) = 0.0 V mA mW 760 1, 2, 3 01 -5 µA 5 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Input high current High impedance state output current Symbol IIH IZL Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit VLOGIC = 5.5 V, VIN(LOGIC) = 2.0 V 1, 2, 3 01 Min -5 5 VIN(LOGIC) = 5.5 V 1, 2, 3 01 -5 5 VLOGIC = 5.5 V, VIN = 11.0 V min, Output code = 111111111111, 1, 2, 3 01 -5 5 µA 1, 2, 3 01 -5 5 µA 0.5 V Max µA Set R/ C = Logic “0” Output bits 1 thru 12 measured separately, VOUT = 0.0 V all bits High impedance state output current IZH VLOGIC = 5.5 V, VIN = -1.0 V max, Output code = 000000000000, Set R/ C = Logic “0” Output bits 1 thru 12 measured separately, VOUT = 5.5 V all bits Output logic voltage levels Reference voltage VOL VLOGIC = 4.5 V, Output code = 000000000000, Measure output bits 1 thru 12 & STS, IL = 1.6 mA 1, 2, 3 01 VOH VLOGIC = 4.5 V, Output code = 111111111111, Measure bits 1 thru 12, IL = -0.5 mA 1, 2, 3 01 2.4 VREF Output code = 000000000000, Bipolar VFSR = 20 V, IL = 2.0 mA 1 01 9.970 10.030 9.950 10.050 2,3 V V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit 1 01 Min -1 -1.5 1.5 1 01 -1 1 LSB Max +PSS1 13.5 V ≤ VCC ≤ 16.5 V, Output transition = 11111111111X 00000000000X 4/ +PSS2 11.4 V ≤ VCC ≤ 12.6 V, Output transition = 11111111111X 00000000000X 4/ Power supply sensitivity to VLOGIC +PSS3 4.5 V ≤ VLOGIC ≤ 5.5 V, Output transition = 11111111111X 00000000000X 4/ 1, 2, 3 01 -0.5 0.5 LSB Power supply sensitivity to VEE -PSS1 -16.5 V ≤ VEE ≤ -13.5 V, Output transition = 11111111111X 00000000000X 4/ 1 01 -1 1 LSB -2 2 Power supply sensitivity to VCC 2, 3 2, 3 Unipolar offset voltage -12.6 V ≤ VEE ≤ -11.4 V, Output transition = 11111111111X 00000000000X 4/ 1 01 -1 1 LSB VIO Output transition = 00000000000X 1 01 -2 2 LSB -3 3 01 -4 4 -6 6 -0.3 0.3 2, 3 -0.55 0.55 1 -0.3 0.3 BZ 4/ Output transition = XXXXXXXXXXXX, bipolar, VFSR = 20 V 1 AE 1 Output transition = 00000000000X to 11111111111X 4/ BPAE Bipolar, VFSR = 20 V 4/ LE Abbreviated test, 01 2, 3 Integral linearity error Differential linearity error DLE LSB 4/ 2, 3 Gain error LSB -PSS2 2, 3 Bipolar zero 1 1 01 Bipolar mode 20 V range 4/ 2, 3 Abbreviated test, Bipolar mode 20 V range 4/ 1, 2, 3 01 % of FSR % of FSR -0.55 0.55 -1/2 1/2 -1 1 -1 1 LSB LSB See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Input resistance RIN10V Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type 1 01 10 V span input 2, 3 RIN20V 20 V span input dVIO/dT Output transition = 00000000000X 1 2, 3 Unipolar offset voltage drift Limits Unit Min 3.75 Max 6.25 3 7 7.50 12.50 kΩ kΩ 6 14 2, 3 01 -1 1 LSB 4/ Bipolar zero drift dBZ/dT Output transition = XXXXXXXXXXXX, bipolar, VFSR = 20 V 4/ 2, 3 01 -2 2 LSB Gain error drift dAE/dT Output transition = 00000000000X to 11111111111X 4/ 2, 3 01 -10 10 LSB dBPAE dT Bipolar, VFSR = 20 V 2, 3 01 -10 10 LSB 7, 8 01 VIN = -1 V max. Output code = 000000000000, 8 bit cycle 9, 10, 11 01 8.5 µs VIN = 11 V max. Output code = 111111111111, 12 bit cycle 9, 10, 11 11 µs 200 ns Functional tests Conversion time 4/ See 4.4.1c 5/ STS delay from R/ C tC 2/ 5/ tDS Low to high transition, referenced to high to low 9 01 9 01 R/ C transition. Output code = 000000000000 tHRL Low R/ C pulse width 2/ 5/ Minimum R/ C pulse width required to start a conversion 50 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Data valid after R/ C low 2/ 5/ tHDR Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type 9 01 Output data valid, referenced to high to low Limits Min 25 Unit Max ns R/ C transition, Output code = 000000000000 & 111111111111 STS delay after data valid 2/ 5/ tHS STS high to low, transition referenced to valid output data, Output code = 000000000000 & 111111111111 9 01 High R/ C pulse width 2/ 5/ tHRH Minimum R/ C pulse width required to enable output bits, Output code = 000000000000 & 111111111111 9 01 Data access time tDDR Output data valid, referenced to low to high 9 01 150 ns 9 01 200 ns 2/ 5/ 300 ns 150 ns R/ C transition, Output code = 000000000000 & 111111111111 STS delay from CE tDSC 2/ 5/ Low to high transition, referenced to low to high CE transition, Output code = 000000000000 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 9 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit CE pulse width 2/ 5/ tHEC Minimum CE pulse width required to start a conversion 9 01 Min 50 Max CS to CE setup 2/ 5/ tSSC Minimum time required 9 01 50 ns 9 01 50 ns 9 01 50 ns 9 01 50 ns ns from a high to low CS . Transition to low to high CE transition for a conversion to start from CE CS low during CE high 2/ 5/ tHSC Minimum time required from a low to high CE. Transition to low to high CS transition for a conversion to start R/ C to CE set up 2/ 5/ tSRC Minimum time required from a high to low R/ C . Transition to low to high CE transition for a conversion to start from CE R/ C low during CE high 2/ 5/ tHRC Minimum time required from a low to high CE. Transition to low to high R/ C transition for a conversion to start tSAC Minimum time required from a low to high or high to low A0 . Transition to low to high CE. Transition to initiate an 8-bit or 12-bit conversion, respectively 9 01 0 ns A0 valid during CE high 2/ 5/ tHAC Minimum time required from a low to high CE. Transition to low to high or high to low A0 transition to guarantee a 12-bit or 8-bit conversion, respectively 9 01 50 ns Access time from CE 2/ 5/ tDD Output data valid, referenced to low to high CE transition, Output code = 000000000000 & 111111111111 9 01 A0 to CE set up 2/ 5/ 150 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 10 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min 25 Unit Max Data valid after CE low 2/ 5/ tHD Output data valid, referenced to high to low CE transition, Output code = 000000000000 & 111111111111 9 01 Output float delay 2/ 5/ tHL Output delay to HI-Z, referenced to high to low CE transition, Output code = 000000000000 & 111111111111 9 01 CS to CE setup 2/ 5/ tSSR Minimum time from CS high to low transition to CE low to high transition to guarantee data valid is controlled by CE, Output code = 000000000000 & 111111111111 9 01 50 ns R/ C to CE setup 2/ 5/ tSRR Minimum time from R/ C low to high transition to CE low to high transition to guarantee data valid is controlled by CE, Output code = 000000000000 & 111111111111 9 01 0 ns tSAR Minimum time from A0 high to low or low to high transition to CE low to high transition to guarantee the correct byte gets enabled. 9 01 50 ns tHSR Minimum time from CE high to low transition to 9 01 0 ns 9 01 0 ns A0 to CE setup 2/ 5/ CS valid after CE low 2/ 5/ ns 150 ns CS low to high transition to guarantee high impedance state is controlled by CE. R/ C high after CE low 2/ 5/ tHRR Minimum time from CE high to low transition to R/ C high to low transition to guarantee device will disable before another conversion is initiated. See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 11 TABLE I. Electrical performance characteristics - Continued. Test A0 valid after CE low Symbol 2/ 5/ tHAR Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type 9 01 Minimum time from CE high to low transition to A0 high to low or low to high transition to guarantee enabled byte does not change until device is disabled. Limits Min 50 Unit Max ns 1/ VCC = +15 V, VEE = -15 V, VLOGIC = 5.0 V, 10 V input range only. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. 3/ PD = (VCC X ICC + VEE X IEE + VLOGIC X ILOGIC). Power dissipation shall be calculated using the two output code conditions 0000 0000 0000 and 1111 1111 1111. 4/ X represents the transition point between adjacent code words. 5/ See figure 4. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 12 Device type Case outline Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 01 X Terminal symbol VLOGIC 12/ 8 CS AO R/C CE VCC REF OUT AC REF IN VEE BIP OFF 10 V INPUT 20 V INPUT DC DB0(LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11(MSB) STS FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 13 CE CS X 1 0 0 ↓ ↓ 0 0 0 0 0 0 X ↑ ↑ 1 1 1 1 1 1 1 R/ C X X 0 0 0 0 ↓ ↓ 1 1 1 12/ 8 X X X X X X X X 1 0 0 AO X X 0 1 0 1 0 1 X 0 1 OPERATION None None Initiate 12-bit conversion Initiate 8-bit conversion Initiate 12-bit conversion Initiate 8-bit conversion Initiate 12-bit conversion Initiate 8-bit conversion Enable 12-bit output Enable 8 MSBs only Enable 4 LSBs plus 4 trailing zeroes FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 14 FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 15 CONVERT START TIMING FIGURE 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 16 READ CYCLE TIMING FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 17 LOW PULSE FOR R/ C - OUTPUTS ENABLED AFTER CONVERSION FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 18 HIGH PULSE FOR R/ C - OUTPUTS ENABLED WHILE R/ C HIGH, OTHERWISE HIGH-Z FIGURE 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 19 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 93 (see MIL-PRF-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B or as modified in the device manufacturer’s quality management (QM) plan. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 20 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) 1 Final electrical parameters (see 4.2) 1,2,3,7,8, 9,10,11 Group A test requirements (see 4.4) 1,2,3,7,8, 9,10,11 1,2,3,7,8, 9,10,11 1,2,3,7,8, 9,10,11 Group C end-point electrical parameters (see 4.4) 1 1 1,2,3,7,8, 9,10,11 Group D end-point electrical parameters (see 4.4) 1 1 1 Group E end-point electrical parameters (see 4.4) 1 1/ 1 1,2,3,7,8, 9,10,11 ---- 1/ 1,2,3,7,8, 9,10,11 ---- 2/ ---- 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 21 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. VLOGIC Logic supply 12/ 8 Data mode select CS AO Chip select Byte address/short cycle R/ C CE VCC REF OUT AC REF IN VEE BIP OFF DC STS Read/convert Chip enable Positive supply Reference output Analog common Reference input Negative supply Bipolar offset Digital common Status bit STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 22 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-99582 A REVISION LEVEL A SHEET 23 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-07-11 Approved sources of supply for SMD 5962-99582 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9958201QXC 34371 HI1-774T/883 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 34371 Vendor name and address Intersil 2401 Palm Bay Blvd P.O. Box 883 Melbourne, FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.