Distribution Spotlight Innovations Embedded Thin Ultra-Compact PICOLEDTM Chip LEDs SML-P1 Series [15 Models] ROHM is expanding its industry-leading PICOLEDTM lineup of thin, ultra-compact LEDs optimized for portable devices such as smartphones and wearable tech. 7 new colors have been added to the series, increasing the number of models from 8 to 15, providing greater applicability. Applications • Smartphones, tablets • Compact portable devices • Gaming Pricing Key Features • Ultra-compact form factor reduces mounting area over conventional LEDs while maintaining brightness • Narrow pitch supports high-density mounting in high resolution displays • Extremely low profile: t=0.2mm Quantity per reel: NA Price: NA Samples available Expanded 15-color lineup Absolute Maximum Ratings 60 40 85 SML-P12U2T (R) 610 615 620 25 70 SML-P12DT (R) 602 605 608 63 100 593 596 599 587 590 593 582 585 SML-P12Y2T (R) 577 SML-P12M2T (R) 573 SML-P12Y3T (R) SML-P12YT (R) 52 20 100 SML-P12WT (R) SML-P12MT (R) SML-P13FT (R) SML-P13PT (R) 5 -40 to +85 2.1 54 2.2 52 2.1 20 10 3.0 SMLP13EC8T SMLP13BC8T -40 to +100 33 10 50 2.9 SCMP13WBC8W 5 100 5 40 90 40 100 588 25 70 580 583 16 50 576 579 10 25 569 572 575 10 25 563 566 569 6.3 18 557 560 563 4.0 10 520 527 535 56 110 465 470 475 (x, y) (0.30 , 0.30) 20 5 9.0 25 90 150 (0.08) 25 625 0.6 635 620 2.0 50 +0.05 -0.02 630 615 SML-P12UT (R) 0.2 625 SML-P12VT (R) 1 0.6 20 Element Position 1 0.6 (0.11) 5 *1: Reference value *2: 10% measurement tolerance 0.6 Part No. External Dimensions Electrical Characteristics Forward Voltage Forward Current Emission Wavelength ID Luminosity*2 IV Permissible Forward Peak Forward Current Reverse Operating Storage VF IR IFP (mA) Current Voltage Temp. Temp Loss Typ. IF Min. Typ.*1 IF IF Max. V Min.*1 Typ. Max.*1 (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA) PD (mW) IF (mA) <@1/10 duty,1kHz> VR (V) Topr (°C) Tstg (°C) (V) (mA) (μA) Tolerance: ±0.05 Unit: mm High reliability package prevents solder intrusion No resistance Resistance areas Resistance Increased reliability STOP more info: click here Solder intrusion countermeasures are implemented, taking into consideration conditions during reflow, to achieve superior reliabilty in a compact form factor. visit us: www.rohm.com