711AE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.5x1.5, 0.5P
CASE 711AE
ISSUE B
DATE 27 AUG 2015
SCALE 4:1
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20mm FROM TERMINAL TIP.
L
A
B
L1
DETAIL A
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
ALTERNATE TERMINAL
CONSTRUCTIONS
E
PIN ONE
REFERENCE
ÉÉ
ÉÉ
EXPOSED Cu
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
L2
TOP VIEW
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
DETAIL B
0.05 C
A3
GENERIC
MARKING DIAGRAM*
A1
0.05 C
C
SIDE VIEW
DETAIL A
e
SEATING
PLANE
1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
5X
L
3
1
MILLIMETERS
MIN
MAX
0.35
0.45
0.00
0.05
0.13 REF
0.20
0.30
1.50 BSC
1.50 BSC
0.50 BSC
0.40
0.60
--0.15
0.50
0.70
L2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
6
4
6X
RECOMMENDED
MOUNTING FOOTPRINT*
b
0.10 C A
BOTTOM VIEW
0.05 C
B
5X
6X
NOTE 3
0.35
0.73
1.80
0.83
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON56376E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
XDFN6, 1.5 X 1.5, 0.5 P
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON56376E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA
04 APR 2011
A
CORRECTED GENERIC MARKING DIAGRAM. REQ. BY I. CAMBALIZA.
10 APR 2013
B
CORRECTED GENERIC MARKING DIAGRAM FROM TWO CHARACTERS TO
THREE. REQ. BY I. HYLAND.
27 AUG 2015
ON Semiconductor and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. B
Case Outline Number:
711AE