DATASHEET

HI-200, HI-201
Data Sheet
September 15, 2015
FN3121.9
Dual/Quad SPST, CMOS Analog Switches
Features
HI-200/HI-201 (dual/quad) are monolithic devices comprising
independently selectable SPST switches which feature fast
switching speeds (HI-200 240ns, and HI-201 185ns)
combined with low power dissipation (15mW at 25oC). Each
switch provides low “ON” resistance operation for input signal
voltage up to the supply rails and for signal current up to
80mA. Rugged DI construction eliminates latch-up and
substrate SCR failure modes.
• Pb-Free Available (RoHS Compliant)
• Analog Voltage Range . . . . . . . . . . . . . . . . . . . . . . . 15V
• Analog Current Range . . . . . . . . . . . . . . . . . . . . . . . 80mA
• Turn-On Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240ns
• Low rON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
• Low Power Dissipation . . . . . . . . . . . . . . . . . . . . . . .15mW
All devices provide break-before-make switching and are
TTL and CMOS compatible for maximum application
versatility. HI-200/HI-201 are ideal components for use in
high frequency analog switching. Typical applications
include signal path switching, sample and hold circuit, digital
filters, and operational amplifier gain switching networks.
• TTL/CMOS Compatible
Ordering Information
• Digital Filters
PART NUMBER
HI3-0200-5Z
(Note) (No
longer available
or supported)
HI1-0201-2
TEMP.
RANGE (°C)
0 to 75
PACKAGE
14 Ld PDIP*
(Pb-free)
PKG.
DWG. #
E14.3
Applications
• High Frequency Analog Switching
• Sample and Hold Circuits
• Operational Amplifier Gain Switching Networks
Functional Diagram
V+
VREF
INPUT
-55 to 125
16 Ld CERDIP
SOURCE
F16.3
HI3-0201-5Z
(Note)
0 to 75
16 Ld PDIP*
(Pb-free)
E16.3
HI4P0201-5Z
(Note) (No
longer available
or supported)
0 to 75
20 Ld PLCC
(Pb-free)
N20.35
HI9P0201-5Z
(Note)
0 to 75
16 Ld SOIC
(Pb-free)
M16.15
HI9P0201-9Z
(Note)
-40 to 85
16 Ld SOIC
(Pb-free)
M16.15
LOGIC
INPUT
GATE
REFERENCE,
LEVEL SHIFTER,
AND DRIVER
SWITCH
CELL
GATE
DRAIN
OUTPUT
V-
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
TRUTH TABLE
LOGIC
HI-200
HI-201
0
ON
ON
1
OFF
OFF
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both
SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pb-free
PDIPs can be used for through hole wave solder processing only. They
are not intended for use in Reflow solder processing applications.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas LLC
Copyright Intersil Americas LLC. 1999, 2001, 2004, 2005,2015. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HI-200, HI-201
(Switches Shown For Logic “1” Input)
10 IN1
9 OUT1
8 VREF
IN1
3
14 IN2
V- 4
13 V+
GND
5
12 VREF
IN4
6
11 IN3
OUT4
7
10 OUT3
A4
8
9 A3
IN1
4
V-
5
NC
6
GND
7
IN4
OUT2
15 OUT2
A2
2
3
2
1
20
19
LE
AB
L
AI
AV
ER
G
8 ON
L
NO
9
10
R
O
ED
RT 18 IN2
O
PP
SU
17 V+
16 NC
15 VREF
14 IN3
11
12
13
OUT3
LA
OUT1
OUT4
G
OUT2 N6
LO
O
N V- 7
ER
AI
AV
16 A2
A3
NC 4
IN2 5
1
NC
GND 3
A1
NC
NC 2
14 A1
ED
RT
13 ONC
PP
SU
R 12 V+
O
E
11 NC
BL
HI-201 (PLCC)
TOP VIEW
A1
A2 1
HI-201 (CERDIP, PDIP, SOIC)
TOP VIEW
A4
HI-200 (PDIP)
TOP VIEW
OUT1
Pinouts
Schematic Diagrams
TTL/CMOS REFERENCE CIRCUIT VREF CELL
HI-200
TTL/CMOS REFERENCE CIRCUIT VREF CELL
HI-201
V+
V+
R6
300
R2
5K
QP2
QP1
QP3
QP4
MP13
QP5
QN2
GND
QN2
VLL
GND
MN15
MN16
MN17
V-
R7
100K
VREF
QN4
QP5
TO P2
R3
24.2K
D3
R5
7.9K
QP4
QN1
MN14
R4
5.4K
QP3
MP13
TO P2
R3
24.2K
QP2
QP1
VREF
QN4
QN1
D3
R6
600
R2
5K
MN14
R4
5.4K
MP14
QP6
MN15
V-
VLL
QN3
R5
7.9K
MN16
MN17
R7
100K
GND
GND
2
FN3121.9
September 15, 2015
HI-200, HI-201
Schematic Diagrams
(Continued)
SWITCH CELL
A’
QN11
V+
INPUT
QN12
QP11
OUTPUT
QN13
V-
QP12
A’
DIGITAL INPUT BUFFER AND LEVEL SHIFTER
V+
QP3
QP1
QP5
QP4
A’
V+
QN1
D1
QP6
QP7
QN6
QN7
QP8
QP10
QP9
TO VLL
TO VREF
200
QN8
D2
QN9
QN10
QP2
A
VA’
QN2
QN4
QN5
QN3
V-
3
FN3121.9
September 15, 2015
HI-200, HI-201
Absolute Maximum Ratings
Thermal Information
Supply Voltage (V+ to V-). . . . . . . . . . . . . . . . . . . . . . . . . 44V (22)
VREF to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V, -5V
Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . (V+) +4V to (V-) -4V
Analog Input Voltage (One Switch) . . . . . . . . . . (V+) +2V to (V-) -2V
Thermal Resistance (Typical, Note 1)
JA (oC/W)
JC (oC/W)
CERDIP Package . . . . . . . . . . . . . . . . .
75
20
PLCC Package. . . . . . . . . . . . . . . . . . .
80
N/A
PDIP Package* . . . . . . . . . . . . . . . . . .
95
N/A
SOIC Package . . . . . . . . . . . . . . . . . . .
110
N/A
Maximum Storage Temperature. . . . . . . . . . . . . . . . -65oC to 150oC
Maximum Junction Temperature (Hermetic Packages) . . . . . 175oC
Maximum Junction Temperature (Plastic Packages). . . . . . . 150oC
Maximum Lead Temperature (Soldering, 10s). . . . . . . . . . . . 300oC
(PLCC and SOIC - Lead Tips Only)
Operating Conditions
Temperature Ranges
HI-201-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
HI-201-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25oC to 85oC
HI-200-5, HI-201-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
HI-201-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Supplies = +15V, -15V; VREF = Open; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V
TEST
CONDITIONS
-2
-4, -5, -9
TEMP
(oC)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
HI-200
25
-
240
500
-
240
-
ns
HI-201
25
-
185
500
-
185
-
ns
Full
-
1000
-
-
1000
-
ns
HI-200
25
-
330
500
-
500
-
ns
HI-201
25
-
220
500
-
220
-
ns
Full
-
1000
-
-
1000
-
ns
HI-200
25
-
70
-
-
70
-
dB
HI-201
25
-
80
-
-
80
-
dB
Input Switch Capacitance, CS(OFF)
25
-
5.5
-
-
5.5
-
pF
Output Switch Capacitance, CD(OFF)
25
-
5.5
-
-
5.5
-
pF
Output Switch Capacitance, CD(ON)
25
-
11
-
-
11
-
pF
Digital Input Capacitance, CA
25
-
5
-
-
5
-
pF
Drain-to-Source Capacitance, CDS(OFF)
25
-
0.5
-
-
0.5
-
pF
Input Low Threshold, VAL
Full
-
-
0.8
-
-
0.8
V
Input High Threshold, VAH
Full
2.4
-
-
2.4
-
-
V
Full
-
-
1.0
-
-
1.0
A
Full
-15
-
+15
-15
-
+15
V
25
-
55
70
-
55
80

Full
-
80
100
-
72
100

PARAMETER
DYNAMIC CHARACTERISTICS
Switch ON Time, tON
Switch OFF Time, tOFF
Off Isolation
(Note 4)
DIGITAL INPUT CHARACTERISTICS
Input Leakage Current (High or Low), IA
(Note 3)
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VS
ON Resistance, rON
(Note 2)
4
FN3121.9
September 15, 2015
HI-200, HI-201
Electrical Specifications
Supplies = +15V, -15V; VREF = Open; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V (Continued)
TEST
CONDITIONS
-2
-4, -5, -9
TEMP
(oC)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
25
-
1
5
-
1
50
nA
HI-200
Full
-
100
500
-
10
500
nA
HI-201
25
-
2
5
-
2
50
nA
Full
-
-
500
-
-
250
nA
25
-
1
5
-
1
50
nA
HI-200
Full
-
100
500
-
10
500
nA
HI-201
25
-
2
5
-
2
50
nA
Full
-
35
500
-
35
250
nA
25
-
1
5
-
1
50
nA
HI-200
Full
-
100
500
-
10
500
nA
HI-201
25
-
2
5
-
2
50
nA
Full
-
-
500
-
-
250
nA
25
-
15
-
-
15
-
mW
Full
-
-
60
-
-
60
mW
25
-
0.5
-
-
0.5
-
mA
Full
-
-
2.0
-
-
2.0
mA
25
-
0.5
-
-
0.5
-
mA
Full
-
-
2.0
-
-
2.0
mA
PARAMETER
OFF Input Leakage Current, IS(OFF)
OFF Output Leakage Current, ID(OFF)
ON Leakage Current, ID(ON)
(Note 6)
(Note 6)
(Note 6)
POWER SUPPLY CHARACTERISTICS (Note 5)
Power Dissipation, PD
Current, I+
Current, I-
NOTES:
2. VOUT = 10V, IOUT = 1mA.
3. Digital Inputs are MOS gates: typical leakage is < 1nA.
4. VA = 5V, RL = 1k, CL = 10pF, VS = 3VRMS , f = 100kHz.
5. VA = +3V or VA = 0V for Both Switches.
6. Refer to Leakage Current Measurements (Figure 2).
Test Circuits and Waveforms
TA = 25oC, VSUPPLY = ±15V, VAH = 2.4V, VAL = 0.8V and VREF = Open
1mA
V
V2
2
r ON = ------------1mA
IN
OUT
VIN
FIGURE 1A. ON RESISTANCE TEST CIRCUIT
5
FN3121.9
September 15, 2015
HI-200, HI-201
Test Circuits and Waveforms
TA = 25oC, VSUPPLY = ±15V, VAH = 2.4V, VAL = 0.8V and VREF = Open (Continued)
80
100
V+ = +10V
V- = -10V
VIN = 0V
60
ON RESISTANCE ()
ON RESISTANCE ()
70
50
40
30
20
V+ = +12.5V
V- = -12.5V
50
V+ = +15V
V- = -15V
10
0
-50
-25
0
25
50
75
100
125
TEMPERATURE (oC)
FIGURE 1B. ON RESISTANCE vs TEMPERATURE
0
-15
-10
-5
0
5
ANALOG SIGNAL LEVEL (V)
10
15
FIGURE 1C. HI-200 ON RESISTANCE vs ANALOG SIGNAL
LEVEL
FIGURE 1. ON RESISTANCE
IS(OFF)
100
A
ID(OFF)
IN
OUT
A
14V
+ 14V
CURRENT (nA)
IS(OFF) / ID(OFF)
10
FIGURE 2B. OFF LEAKAGE CURRENT TEST CIRCUIT
ID(ON)
IN
1.0
OUT
A
0.1
25
50
75
100
TEMPERATURE (oC)
ID(ON)
14V
125
FIGURE 2A. LEAKAGE CURRENT vs TEMPERATURE
FIGURE 2C. ON LEAKAGE CURRENT TEST CIRCUIT
FIGURE 2. LEAKAGE CURRENTS
90
SWITCH CURRENT (mA)
80
70
60
50
40
30
20
IN
10
0
OUT
I
HI-201
0
1
2
3
4
5
6
7
VIN
VOLTAGE ACROSS SWITCH (V)
FIGURE 3A. SWITCH CURRENT vs VOLTAGE
FIGURE 3B. TEST CIRCUIT
FIGURE 3. SWITCH CURRENT
6
FN3121.9
September 15, 2015
HI-200, HI-201
Test Circuits and Waveforms
TA = 25oC, VSUPPLY = ±15V, VAH = 2.4V, VAL = 0.8V and VREF = Open (Continued)
VAH = 4V
DIGITAL
INPUT
50%
50%
VAL = 0V
tON
tOFF
80%
80%
0V
SWITCH
OUTPUT
FIGURE 4A. MEASUREMENT POINTS
VA
VA
OUTPUT
OUTPUT
VA = 0 to 15V
Vertical: 5V/Div.
Horizontal: 100ns/Div.
VA = 0 to 4V
Vertical: 2V/Div.
Horizontal: 100ns/Div.
FIGURE 4B. WAVEFORMS WITH TTL COMPATIBLE LOGIC
INPUT
FIGURE 4C. WAVEFORMS WITH CMOS COMPATIBLE LOGIC
INPUT
FIGURE 4. SWITCH tON AND tOFF
140
OFF ISOLATION (dB)
120
100
80
RL = 1k
60
40
20
0
100Hz
1kHz
10kHz
100kHz
1MHz
FREQUENCY (Hz)
FIGURE 5. HI-201 OFF ISOLATION vs FREQUENCY
For more information see Application Notes AN520, AN521, AN531, AN532 and AN557.
7
FN3121.9
September 15, 2015
HI-200, HI-201
Application Information
Single Supply Operation
The switch operation of the HI-200/201 is dependent upon
an internally generated switching threshold voltage
optimized for 15V power supplies. The HI-200/201 does not
provide the necessary internal switching threshold in a single
supply system. Therefore, if single supply operation is
required, the HI-300 series of switches is recommended.
The HI-300 series will remain operational to a minimum +5V
single supply.
Switch performance will degrade as power supply voltage is
reduced from optimum levels (15V). So it is recommended
that a single supply design be thoroughly evaluated to
ensure that the switch will meet the requirements of the
application.
For further information see Application Notes AN520,
AN557, AN1033 and AN1034.
8
FN3121.9
September 15, 2015
HI-200, HI-201
Die Characteristics
METALLIZATION:
PASSIVATION:
Type: CuAl
Thickness: 16kÅ 2kÅ
Type: Nitride over Silox
Nitride Thickness: 3.5kÅ 1kÅ
Silox Thickness: 12kÅ 2kÅ
WORST CASE CURRENT DENSITY:
2 x 105 A/cm2 at 25mA
Metallization Mask Layout
HI-200
GND
A2
2
IN 2
OUT 2
1
10
9
3
4
5
V-
9
V+
A1
6
8
IN 1
7
OUT 1
VREF
FN3121.9
September 15, 2015
HI-200, HI-201
Die Characteristics
METALLIZATION:
PASSIVATION:
Type: CuAl
Thickness: 16kÅ 2kÅ
Type: Nitride over Silox
Nitride Thickness: 3.5kÅ 1kÅ
Silox Thickness: 12kÅ 2kÅ
WORST CASE CURRENT DENSITY:
2 x 105 A/cm2 at 25mA
Metallization Mask Layout
HI-201
OUT 1
2
IN 1
3
V-
4
GND
5
IN 4
6
OUT 4
7
A1
A2
1
16
8
9
A4
A3
15
OUT 2
14
IN 2
13
V+
12
VREF
11
IN 3
10
OUT 3
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN3121.9
September 15, 2015
HI-200, HI-201
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
September 15, 2015
FN3121.9
CHANGE
- Updated Ordering Information Table on page 1.
- Added Revision History.
- Added About Intersil Verbiage.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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Reliability reports are also available from our website at www.intersil.com/support.
11
FN3121.9
September 15, 2015
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