565AL

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SSOP24 NB
CASE 565AL−01
ISSUE O
DATE 06 JUL 2010
SCALE 1:1
0.20 C D
D
2X
A
0.20 C D
L2
ÉÉ
ÉÉ
E1
PIN 1
REFERENCE
e
D
13
24
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 PER SIDE.
DIMENSION E1 DOES NOT INLCUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.15 PER SIDE. D AND E1 ARE
DETERMINED AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT
DATUM H.
E
L
DETAIL A
1
12
B
GAUGE
PLANE
C
SEATING
PLANE
0.25 C D
24X
TOP VIEW
b
0.25
A
2X 12 TIPS
M
C A-B D
A2
H
0.10 C
h
x 45°
M
0.10 C
24X
A1
SIDE VIEW
C
SEATING
PLANE
c
END VIEW
24X
24
24X
13
XXXXXXXXXG
AWLYYWW
1.12
XXXX = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
6.40
1
0.65
PITCH
12
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
ON SEMICONDUCTOR STANDARD
1
NEW STANDARD:
October, DESCRIPTION:
2002 − Rev. 0
*This information is generic. Please refer
to device data sheet for actual part
marking.
98AON52092E
© Semiconductor Components Industries, LLC, 2002
SSOP24 NB
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
1.25
1.50
0.20
0.30
0.19
0.25
8.65 BSC
6.00 BSC
3.90 BSC
0.65 BSC
0.22
0.50
0.40
1.27
0.25 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT
0.42
DETAIL A
DIM
A
A1
A2
b
c
D
E
E1
e
h
L
L2
M
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON52092E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. MARQUIS.
DATE
06 JUL 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 01O
Case Outline Number:
565AL
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