751F-05

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−28 WB
CASE 751F
ISSUE J
DATE 23 SEP 2015
SCALE 1:1
−X−
D
28
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBER
PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN
EXCESS OF B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
H
E
0.25
Y
M
M
−Y−
1
14
PIN 1 IDENT
A
L
0.10
G
B
0.025
M
T X
S
A1
Y
−T−
DIM
A
A1
B
C
D
E
G
H
L
M
SEATING
PLANE
C
M
S
SOLDERING FOOTPRINT
GENERIC
MARKING DIAGRAM*
8X
11.00
28X
MILLIMETERS
MIN
MAX
2.35
2.65
0.13
0.29
0.35
0.49
0.23
0.32
17.80
18.05
7.40
7.60
1.27 BSC
10.05
10.55
0.41
0.90
0_
8_
28
1.30
1
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AWLYYWWG
28
1
XXXXX
A
WL
Y
WW
G
28X
0.52
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1.27
PITCH
14
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
15
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
98ASB42345B
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOIC−28 WIDE BODY
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ASB42345B
PAGE 2 OF 2
ISSUE
REVISION
DATE
H
ADDED SOLDERING FOOTPRINT. REQ. BY S. BROW.
11 JUN 2007
J
REMOVED −05 FROM CASE CODE NAME. REQ. BY N. CALZADA.
23 SEP 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. G
Case Outline Number:
751F
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