2016-01-08 NEW: Memory Catalog 2016 Edition available for Download

ROHM GROUP
Memory Catalog
DRAM / EEPROM / FeRAM / NOR Flash / P2ROMTM
ROHM offers a broad portfolio of memory products,
from DRAM to non-volatile memory, optimized
for a variety of applications and requirements.
Proven quality / Stable supply
Superior data retention
DRAM
NOR Flash
Proven quality / Stable supply
FeRAM
Shorter lead times / No inventory required
P2ROMTM *
*
Guaranteed delivery / High reliability
EEPROM
01
Production Programmed ROM
ROHM GROUP
Memory Catalog
Volatile Memory
DRAM
P.03
FP/EDO [4Mb/16Mb/64Mb, 5V/3.3V]
SDRAM [16Mb-256Mb, 3.3V]
SDRAM for SiP (Bare Chips)
Video Memory [3Mb/4Mb/5Mb/6Mb/10Mb/26Mb, 5V/3.3V]
Non-Volatile Memory
EEPROM
P.07
I2C BUS (2-Wire)
Microwire BUS (3-Wire)
SPI BUS
Ultra-Compact WL-CSP
Plug&Play EEPROM
FeRAM
P.13
Parallel BUS FeRAM [256Kb, 3.3V]
I2C BUS FeRAM [64Kb-1Mb, 3.3V]
SPI BUS FeRAM [32Kb-2Mb, 3.3V]
NOR Flash
P.15
Parallel BUS NOR Flash [64Mb-1Gb, 3.3V]
P2ROMTM
Parallel BUS Standard P2ROMTM [8Mb-512Mb, 3.3V]
Parallel BUS Page Mode P2ROMTM [16Mb-16Gb, 3.3V]
SPI BUS P2ROMTM [16Mb-128Mb, 3.3V]
02
P.17
DRAM Series Lineup
Broad DRAM Lineup
[Capacity] bit
4M
FP/EDO Series
Asynchronous Clock
Automotive-Grade
High-Speed EDO
Low Power
Copper Frame
Standard Package
Stable Supply
16M
MSM514xxxx Series
MSM5416258B Series
MSM51V4xxxx Series
MSM54V16258B Series
MSM514400xP Series
MSM514260EP Series
MSM51V4xxxxP Series
MSM54V16258BP Series
37 models
SDRAM Series
Synchronous Clock
Automotive-Grade
Expanded Temp
JEDEC Standard
Driveability Setting
Copper Frame
166MHz Operation
Stable Supply
No damping R needed
DRAM
Bare Chip
Guaranteed KGD
Automotive-Grade
SiP Failure Analysis
Test Program Offered
Chip Traceability
Assembly Solutions
32 models
9 models
MD56V62160M Series
4 models
AAAAAA
MUSIC
CCCCCcccccc
DDD
E_EEE
Frame
memory
1
4
7
C
2
8
5
0
4 models
Frame
memory
Car Navigation
Displays, Communication Equipment
Surveillance Cameras
Data
buffers
Business Printers
Broadcast/Industrial Equipment
3
6
9
Set
Medical Equipment
Frame
memory
Data
buffers
PC,Gaming,
Communication
Gaming Systems/PC Peripherals
Home Communication
Sound buffers,
shock-proof
designs
AV Systems
11 models
MD56V72160C Series
Car Audio
BBBbbbbb
Displays,
communication
equipment
Frame memory,
sound buffers
8 models
5 models
Shock-proof
designs
Automotive
Industrial Equipment
MD56V62xxxx Series
MD56V72160C Series
MD56V82160A Series
MD56V62xxxx-xxTAP Series MD56V72160C-xxTAP Series MD56V82160A-xxTAP Series
MD56V62160M-xxTAP Series
MD58W82160A Series (DDR)
MSM56V16160x Series
Application Examples
256M
2 models
12 models
166MHz Operation
128M
MD51V65165E Series
MSM56V16800F Series
MSM56V16160x Series
MSM56V16160xP Series
SDRAM for SiP Series
16Mbit Industry-Small Size
64M
MSM511xxxxx Series
MSM51V1xxxxx Series
MSM511816xFP Series
MSM51V1xxxxxP Series
Data
buffers
TVs/Compact Panels
Component Audio
Sound
buffers
Data
buffer
Sound buffers,
shock-proof
designs
Business Communication
Frame/work
memory
Frame
memory
Musical Instruments
Wide video memory lineup optimized for a range of panel types, from compact to full HD
3M
Video Memory Series
FIFO
Asynchronous IN/OUT Clock
IN/OUT Clock Rate Independent Control
Self-Refresh Function
Automotive-Grade
2-Port Independent Clock
Write Master Function
Cascade Function
4M
MSM8104160A Series
MS81V04160A Series
MS81V04166A Series
MS81V04160AP Series
MSM5412222B Series
MSM54V12222B Series
MS81V03120 Series
Top Address Designation
5M/6M
6 models
MS81V05200-13TAZ03
MS81V06160 Series
8 models
3 models
10M
26M
MS81V10160 Series
Compact Panels/Image Processing Equipment
1
4
7
Sample Panel Sizes
C
2
8
5
Set
3
6
9
0
Surveillance Cameras/Broadcast•Industrial Equipment/Commercial Printers
Medical Equipment
NTSC / PAL
Half HD
VGA / WVGA
www.lapis-semi.com/en
3 models
Car Navigation
Frame
memory
Industrial Equipment
MS81V26000 Series
MS81V26000-25TPZP3
2 models
Application Examples
AV Systems /
Automotive
[Capacity] bit
XGA
03
Full HD
DRAM
DRAM FP/EDO Series
FP/EDO Series
×4
4Mb
×8
×4
16Mb ×8
×16
×4
4Mb
×8
×16
×4
3.3V
1K
512
4K
2K
4K
1K
1K
4K
4K
64Mb
1K
16Mb
4Mb
3.3V
16Mb
Icon
Descriptions
×4
×16
1K
512
1K
×4
1K
×16
512
×4
2K
×16 1K
DRAM type
Thin
Other Features
Package
TSOP(II)28
TSOP(II)28
MSM514265E
MSM5416258B
TSOP(II)44/40
TSOP(II)44/40
TSOP(II)26/24
MSM5117405F
MSM5117805F
TSOP(II)26/24
TSOP(II)28
TSOP(II)50/44
MSM5118165F
TSOP(II)50/44
TSOP(II)26/20
TSOP(II)28
MSM54V16258B
MSM54V16258BSL
MSM51V4265E
MSM51V16400F
TSOP(II)44/40
TSOP(II)44/40
TSOP(II)44/40
TSOP(II)26/24
MSM51V16405F
MSM51V17400F
TSOP(II)26/24
TSOP(II)26/24
MSM51V17405F
MSM51V17805F
MSM51V17800F
MSM51V16160F
TSOP(II)26/24
TSOP(II)28
TSOP(II)50/44
MSM51V16165F
MSM51V18160F
TSOP(II)50/44
TSOP(II)50/44
MSM51V18165F
MD51V65165E
MSM514400DP/EP
MSM514260EP
MSM5118160FP
TSOP(II)50/44
TSOP(II)50
TSOP(II)26/20
TSOP(II)44/40
TSOP(II)50/44
MSM5118165FP
MSM51V4400EP
TSOP(II)50/44
TSOP(II)26/20
MSM54V16258BP
MSM51V4265EP
MSM51V17400FP
High-speed EDO
access function
Access Time
TSOP(II)26/20
MSM5116400F
MSM5117400F
MSM5117800F
MSM5116160F
MSM5118160F
MSM51V4400E
MSM51V4800E
Pin-Compatible with Standard Packages
I/O
×4bit
4Mbit
16Mbit
Capacity
(H=1.2mm)
Features/Part No.
MSM514400E
MSM514800E
MSM514800ESL
MSM514260E
4K
Automotive
5V
FP (Fast Page) DRAM and EDO (Extended Data Out) DRAM are asynchronous clock-type CMOS DRAM products.
A broad lineup and stable, long-term supply eliminate customer supply concerns.
512
×8
×16
4Mb
Extensive lineup / Stable, long-term supply
Features/Part No.
2K
16Mb
Video Memory Series
When ordering, please include the part number along with the access time and package type.
Refresh
Cycle
×16
5V
SDRAM for SiP Series
TSOP(II)44/40
TSOP(II)44/40
TSOP(II)26/24
MSM51V18165FP
Low power
(Refresh Current)
to
×8bit
4Mbit / 16Mbit
4Mbit
TSOP(II)50/44
Access time
Operating
temp.
Copper frame
*Actual size shown
×16bit
16Mbit
64Mbit
300mill
1.27mm Pitch
300mill
1.27mm Pitch
400mill
1.27mm Pitch
400mill
0.8mm Pitch
400mill
0.8mm Pitch
400mill
0.8mm Pitch
TSOP(II)26/20
TSOP(II)26/24
TSOP(II)28
TSOP(II)44/40
TSOP(II)50/44
TSOP(II)50
04
www.lapis-semi.com/en
DRAM
Standard
Supply Memory Data
Voltage Capacity Bits
DRAM SDRAM Series
DRAM
DRAM FP/EDO Series
Standard
When ordering, please include the part number(s) along with the access time(s) and package(s). Note: xx in the part number are placeholders for the cycle time rank.
×8
16Mb
4K/
64
×16
64Mb
2.5V
256Mb
×16
8K/
64
Automotive
DRAM
16Mb
64Mb
3.3V
4K/
64
×16
4K/16
4K/64
128Mb
4K/16
8K/16
256Mb
8K/64
Icon
Descriptions
Video Memory Series
SDRAM (Synchronous DRAM) is a synchronous-clock-type CMOS DRAM product.
A broad lineup and stable, long-term supply eliminate customer supply concerns.
Max.
Frequency
Supply Memory Data Refresh Cycles
Voltage Capacity Bits (cycles/ms) Features/Part No.
128Mb
SDRAM for SiP Series
Extensive lineup / Stable, long-term supply
SDRAM Series
3.3V
DRAM SDRAM Series
DRAM
Type
MSM56V16800F
MSM56V16160F
MSM56V16160K
MSM56V16161N
MD56V62160E
MD56V62160M
MD56V72160C
MD56V82160A
MD58W82160A
Thin
Package
Other Features
TSOP(II)44
TSOP(II)50
TSOP(II)50
TSOP(II)50
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)66
MSM56V16160FP
MSM56V16160KP
MSM56V16161NP
MD56V62160E-10TAP
MD56V62160M-xxTAP
MD56V62161M-xxTALQ1L
MD56V72160C-xxTAP
MD56V72161C-xxTALQ1L
MD56V82160A-xxTALQ3L
MD56V82160A-xxTAP
to
Max. Operating
Frequency
TSOP(II)50
TSOP(II)50
TSOP(II)50
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
Cycle
Time
to
Copper Frame
Pin-Compatible with Standard Packages (JEDEC Standard)
I/O
×8bit
16Mbit
Capacity
(H=1.2mm)
Cycle Time
Driveability
Adjustment
Halogenfree
Operating
Temperature
*Actual size shown
16Mbit
×16bit
64Mbit /128Mbit / 256Mbit
Top
Top
Top
400mill
0.8mm Pitch
400mill
0.8mm Pitch
400mill
0.8mm Pitch
TSOP(II)50
TSOP(II)54
TSOP(II)44
*JEDEC (JEDEC Solid State Technology Association) is a trade organization for the standardization of semiconductor technologies.
DRAM
Stable, long-term supply / Guaranteed KGD
DRAM for SiP Series
DRAM for SiP (System in Package) applications that achieve greater space savings and lower costs are offered
as bare dies (wafers) that provide the same level of reliability as packaged products (KGD).
(Bare Chip)
Standard
*Part numbers of SDRAM products for SiP will become custom part numbers for each customer.
Max.
Frequency
Supply Memory Data Refresh Cycles
Voltage Capacity Bits (cycles/ms) Features/Part No.
16Mb
3.3V
64Mb
128Mb
×16
4K/
32
MSM56V16160K
MSM56V16160N
MD56V62160M
MD56V72160C
4K/
32
MSM56V16160K
MSM56V16160N
MD56V62160M
MD56V72160C
Automotive
16Mb
3.3V
64Mb
128Mb
Icon
Descriptions
×16
DRAM Type
www.lapis-semi.com/en
Max. Operating
Frequency
to
Cycle Time
05
Operating Temp.
Cycle Time
Guaranteed KGD
Other Features
DRAM
2-Port
CLK
2
Port
CLK
3Mb ×12
2
4Mb ×16 Port
CLK
3.3V
5Mb ×10
6Mb
×16
10Mb
26Mb ×24
Automotive
4Mb ×16
3.3V
26Mb ×24
Max.
Frequency Access/Cycle Times
Features/Part No.
2
Port
CLK
Other Features
MSM5412222B
MS8104160A
MSM54V12222B
MS81V03120
MS81V04160A
MS81V04166A
MS81V05200
MS81V06160
MS81V10160
MS81V26000
TSOP(II)44
MS81V04160AP
MS81V26000-25TPZP3
QFP100
QFP100
TSOP(II)44
TSOP(II)70
QFP100
QFP100
TSOP(II)70
TSOP(II)70
TSOP(II)70
TQFP100
TQFP100
Max. operating
frequency
to
DRAM type
Operating
temperature
to
Copper
frame
Access/cycle times
2-port WCLK pin setting
*Actual size shown
Capacity
4Mbit
Standard
FIFO cascade
connection function
Top address
designation
Pin-Compatible with Standard Packages
Capacity
Package
DRAM
3Mb ×12
4Mb ×16
Icon
Descriptions
LAPIS Semiconductor’s DRAM video memory series features FIFO (First In First Out) technology that enables independent
serial read/write control of each dedicated clock using differing and asynchronous clock rates. In addition, a self-refresh
control circuit is built in that eliminates the need for external refresh, making them ideal for processing video data.
When ordering, please include the part number along with the access time and package type.
Supply Memory Data
Voltage Capacity Bits
5V
Video Memory Series
SDRAM for SiP Series
Supports a variety of panels (i.e. compact, full HD) / Stable long-term supply
Video Memory Series
Standard
DRAM SDRAM Series
DRAM FP/EDO Series
14mm × 14mm
0.5mm Pitch
QFP100
3Mbit / 5Mbit / 6Mbit / 10Mbit
Thin
26Mbit
400mill
0.8mm Pitch
400mill
0.5mm Pitch
TSOP(II)44
TSOP(II)70
(H=1.2mm Max.)
14mm × 14mm
0.5mm Pitch
TQFP100
External Dimensions [Unit: mm]
0.80
0.10
0.17±0.05
25 +0.08
0.37 -0.07
0.16
0.10 SEATING PLANE
0.16
M
INDEX MARK 1
MIRROR FINISH
0.71 TYP.
18.41±0.10
0.10
0.08
0.22 +-0.07
0.17±0.05
0.10
SEATING PLANE
M
0.17±0.05
25
+0.08
0.37 -0.07
0.16 M
26
0.145±0.050
1
25
+0.08
-0.07
0.80
75
0.32
0.16 M
SEATING PLANE
50
26
100
25
0.22±0.05
51
76
26
0.50
20.95±0.10
0.10
50
1
0.16 M
SEATING PLANE
●P-QFP100-1414-0.50-K
51
0.08 M
0.08 SEATING PLANE
06
INDEX MARK
MIRROR FINISH
0.88 TYP.
SEATING PLANE
100
INDEX MARK
MIRROR FINISH
1.00 TYP.
0.145±0.05
10.76±0.2
11.76±0.2
10.16±0.1
50
●TQFP100-P-1414-0.50-K
75
0.17±0.05
●TSOP II 50-P-400-0.80-1K
26
76
22
0.37 +0.08
-0.07
0.80
0.10
10.76
0.10
36
35
0.50
0.80
SEATING PLANE
11.76±0.20
10.16±0.10
0.145±0.05
INDEX MARK 1
MIRROR FINISH
0.88TYP.
M
●TSOP II 70-P-400-0.50-K
70
20.95±0.1
50
1
INDEX MARK 1
MIRROR FINISH
1.0±0.2
0.17±0.05
25
0.5
0.10
0.22±0.05
1.4±0.2
0~10°
0.25
27
+ 0.08
0.32 -0.07
0.80
23
11.76±0.20
10.16±0.10
0.10
26
18.41±0.1
□16.8±0.2
□14.0±0.1
INDEX MARK 1
MIRROR FINISH
0.88 TYP.
0.16 M
28
11.76±0.20
10.16±0.10
INDEX MARK
MIRROR FINISH
0.71 TYP.
1
20.95±0.10
INDEX MARK
MIRROR FINISH
0.81 TYP.
SEATING PLANE
●TSOP II 50-P-400-0.80-K
10.76
10.76
0.17±0.05
0.08
0.37 +-0.07
●TSOP II 54-P-400-0.80-K
22.22±0.10
SEATING PLANE
11.76±0.20
10.16±0.10
50
0.10 SEATING PLANE
54
0.20 M
22 0.145±0.050
0.32 +0.08
-0.07
0.16 M
0.80
11.76±0.2
10.16±0.1
23
22
0.80
INDEX MARK
1
MIRROR FINISH
0.81 TYP.
0.17±0.05
+0.08
0.4 -0.07
●TSOP II 50/44-P-400-0.80-K
11.76±0.2
10.16±0.1
INDEX MARK 1
MIRROR FINISH
0.81 TYP.
14
1.27
0.10
●TSOP II 44-P-400-0.80-K
18.41±0.1
1
44
23
1.00 TYP.
INDEX MARK
MIRROR FINISH
0.95 TYP.
0.10 SEATING PLANE
44
44
10.76±0.2
13 0.17±0.05
+ 0.08
0.42 -0.07
0.21 M
18.41±0.10
□16.00±0.20
□14.00±0.10
1.27
●TSOP II 44/40-P-400-0.80-K
●TSOP II 44-P-400-0.80-1K
15
11.76±0.2
10.16±0.1
INDEX MARK
1
MIRROR FINISH
0.95 TYP.
28
14
9.22±0.2
7.62±0.1
26
18.41±0.1
1.0±0.2
2.4MAX.
0.05~0.25 2.1±0.10
●TSOP II 28-P-400-1.27-K
17.14±0.1
11.76±0.20
10.16±0.10
●TSOP II 26/24-P300-1.27-3K
0.6TYP.
0.67±0.15
0.08 M
SEATING PLANE
www.lapis-semi.com/en
Serial EEPROM Series Lineup
[Capacity] bit
1K
2
I C BUS
MicroWire
BUS
4K
8K
16K
32K
64K
BR24G04xxx-3
Series
BR24G08xxx-3
Series
BR24G16xxx-3
Series
BR24G32xxx-3
Series
BR24G64xxx-3
Series
128K
256K
512K
1M
Consumer
(fSCL=400kHz)
BR24G01xxx-3 BR24G02xxx-3
Series
Series
Consumer
(fSCL=1MHz)
BR24G01xxx-3A BR24G02xxx-3A BR24G04xxx-3A BR24G08xxx-3A BR24G16xxx-3A BR24G32xxx-3A BR24G64xxx-3A BR24G128xxx-3A BR24G256xxx-3A BR24G512xxx-3A BR24G1Mxxx-3A
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
Automotive-Grade
BR24A01xxx-WM BR24A02xxx-WM BR24A04xxx-WM BR24A08xxx-WM BR24A16xxx-WM BR24A32xxx-WM BR24A64xxx-WM
Series
Series
Series
Series
Series
Series
Series
Consumer
(Selectable bit format)
BR93G46xxx-3 BR93G56xxx-3
Series
Series
Consumer
(BR93xxRxx-W series
compatibility)
Consumer
(Different pin layout)
Automotive-Grade
Consumer
SPI BUS
2K
Automotive-Grade
BR93G66xxx-3
Series
BR93G76xxx-3
Series
BR24G128xxx-3 BR24G256xxx-3
Series
Series
BR93G86xxx-3
Series
BR93G46xxx-3A BR93G56xxx-3A BR93G66xxx-3A BR93G76xxx-3A BR93G86xxx-3A
Series
Series
Series
Series
Series
BR93G46xxx-3B BR93G56xxx-3B BR93G66xxx-3B BR93G76xxx-3B BR93G86xxx-3B
Series
Series
Series
Series
Series
BR93H46Rxxx-2C BR93H56Rxxx-2C BR93H66Rxxx-2C BR93H76Rxxx-2C BR93H86Rxxx-2C
Series
Series
Series
Series
Series
BR25L010xxx-W BR25L020xxx-W BR25L040xxx-W BR25L080xxx-W BR25L160xxx-W BR25G320xxx-3 BR25G640xxx-3 BR25G128xxx-3 BR25G256xxx-3 BR25G512xxx-3 BR25G1Mxxx-3
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
BR25H010xxx-2C BR25H020xxx-2C BR25H040xxx-2C BR25H080xxx-2C BR25H160xxx-2C BR25H320xxx-2C BR25H640xxx-2C BR25H128xxx-2C
Series
Series
Series
Series
Series
Series
Series
Series
BR25A256xxx-3M BR25A512xxx-3M BR25A1Mxxx-3M
Series
Series
Series
Application
Examples
TVs
TV
STBs
STB
DEGITAL CATV
SLRs
AV Equipment
DVCs
DVD/BD Players
Refrigerators
Washing Machines
Printers
MFPs
2:13
Searc
Mobile Phones/Fax Machines
PC
Peripherals
glekripip
Ente
forigprip opoew@ r Num
vk0rg9- bd;::see [email protected]@
ber
sdf:lv@ b@:
;rpogiei
rwmc.a;
pwvkp;@ w:q:;]]x;
k0fe9g- d-fg0^ro
9-0^0^\- bh@:re
co[wep[ c
\fewlt:w ow0visi
Mail
v
@eo[@
e4@
we[^gv
Call
090
123
456
Pho
ne Boo
Music
h
el
Yamada
2345
2ldirpv
Internet
78
Canc
k
Hanako
0901
Alarm
678
@kfdo
Phone
p.ne.jp
Book
Mail
Kyoto
Nagur
a kouen
Call
Gaming Systems
Mice/Keyboards
Monitors
18:30
19:15 Arrival Time
×
100m
G
60km/hr
Menu
IC
○○
521m
000
○○ Hot Springs
442
Car AV/Navigation
3km
1000m
C
EEPROM
EEPROM
AC
Home
Appliances
Cancel
Navigation
Car AC
Instrument Clusters
Automotive
40
50
60
100 120
80
70
30
130
60
80
20
140
40
10
160
20
0
0
1356
C
230km
H
E
230km
F
Body/ECU
Powertrain
ABS
LCD Panels
Camera Modules
Modules
Wi-fi/BT Modules
Power Supply Modules
Memory Modules
Power Meters
XXX
XXX
XXX
XXX
XXXXXXXXXXXXXXXXX
111111111111111111
Industrial
Equipment
Security Cameras
Inverters
www.rohm.com
07
EEPROM
I2C BUS (2-Wire) Series
SPI BUS Series
Ultra-Compact WL-CSP
Plug & Play EEPROM
Standard 2-wire serial EEPROMs
I2C BUS (2-Wire) Series
Standard
Microwire BUS (3-Wire) Series
I2C BUS simplifies wiring configuration, making it ideal for a variety of applications, from AV and industrial
equipment to PCs and peripherals. ROHM’s broad lineup includes both standard 400kHz models as well as
high-speed 1MHz units.
−40℃ to +85℃ Operation
BR24Gxxxxxx-3 Series (fSCL=400kHz)
Part No.
Features
Functions
BR24G01
BR24G02
BR24G04
BR24G08
BR24G16
BR24G32
BR24G64
BR24G128
BR24G256
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
MSOP8
DIP-T8
SOP8
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
FVT-3
DIP-T8
SOP8
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
-3A
F-3A
FJ-3A
VSON008X2030
BR24Gxxxxxx-3A Series (fSCL=1MHz)
Functions
BR24G01
BR24G02
BR24G04
BR24G08
BR24G16
BR24G32
BR24G64
BR24G128
BR24G256
BR24G512
BR24G1M
Automotive
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
EEPROM
Part No.
Features
−40°C to +105°C Operation
BR24Axxxxxx-WM Series
Part No.
Features
Functions
SOP8
F-WM
BR24A01A
BR24A02
BR24A04
BR24A08
BR24A16
BR24A32
BR24A64
Icon
Descriptions
to
Package Type and Package Code (Suffix)
SOP-J8
F-WM
F-WM
F-WM
F-WM
F-WM
F-WM
Capacity (bits)
400kHz operation
possible at Vcc=1.6V
Double-cell
construction
1MHz operation
possible at Vcc=1.7V
Double-reset
configuration
Supply
voltage range
Operating
temp. range
Write time
Page Write
function included
ESD tolerance (HBM)
*Actual size shown
DIP-T8
SOP8
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
Package
Lineup
08 XX
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EEPROM
I2C BUS (2-Wire) Series
Plug & Play EEPROM
Ultra-Compact WL-CSP
ROHM serial EEPROMs feature Microwire BUS I/F and a wide guaranteed operating temperature range
(+80C/+125C max.). Original double cell construction and double reset functionality provide superior
reliability. The BR93Hxx series also delivers an electrostatic discharge resistance of 6kV, making it ideal for
applications with stringent reliability requirements such as automotive systems.
−40℃ to +85℃ Operation
BR93Gxxxxx-3/-3A/-3B Series
Features
SPI BUS Series
Standard 3-wire serial EEPROMs
Microwire BUS (3-Wire) Series
Standard
Microwire BUS (3-Wire) Series
Part No.
Functions
BR93G46
BR93G56
BR93G66
BR93G76
BR93G86
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
DIP-T8
SOP8
MSOP8
VSON008X2030
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
Pin Layout
CS
VCC
CS
VCC
DU
SK
DU
SK
DU
VCC
NC
CS
GND
SK
DI
BR93Gxx-3
DO
ORG
DI
GND
DO
Selectable bit format
(8bit or 16bit)
Automotive
BR93Gxx-3A
BR93LxxRxx-W series compatible
Functions
EEPROM
DO
DI
Capacity (bits)
Ready/Busy status
display function
Double cell
construction
MSOP8
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
Supply
voltage range
Double reset
configuration
Noise cancellation
function
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
SOP8
BR93H46
BR93H56
BR93H66
BR93H76
BR93H86
to
GND
−40℃ to +85℃ Operation
Part No.
Icon
Descriptions
BR93Gxx-3B
Rotated pin layout
BR93Hxxxxxx-2C Series
Features
NC
Operating
temp. range
Write time
Write All function
ESD tolerance (HBM)
*Actual size shown
DIP-T8
SOP8
SOP-J8
TSSOP-B8
Package
Lineup
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09
MSOP8
VSON008X2030
EEPROM
I2C BUS (2-Wire) Series
Plug & Play EEPROM
ROHM offers EEPROMs that feature SPI BUS I/F for universal compatibility and a maximum operation frequency of
20MHz, ensuring support for applications requiring high-speed operation. In addition, original double cell
construction and double reset functionality result in unmatched reliability.
−40℃ to +85℃ Operation
BR25L/Gxxxxxx-W/3 Series
Features
Ultra-Compact WL-CSP
Ideal for high-speed, multi-function applications
SPI BUS Series
Standard
SPI BUS Series
Microwire BUS (3-Wire) Series
Part No.
Function
BR25L010
BR25L020
BR25L040
BR25L080
BR25L160
BR25G320
BR25G640
BR25G128
BR25G256
BR25G512
BR25G1M
Automotive
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
MSOP8
SOP8
F-W
FJ-W
F-W
FJ-W
F-W
FJ-W
F-W
FJ-W
F-W
FJ-W
F-3
FJ-3
F-3
FJ-3
F-3
FJ-3
F-3
FJ-3
F-3
FJ-3
F-3
FJ-3
VSON008X2030
−40°C to +105°C Operation
BR25Axxxxxx-3M Series
Part No.
Function
BR25A256
BR25A512
BR25A1M
Automotive
Package Type and Package Code (Suffix)
SOP-J8
SOP8
F-3M
FJ-3M
F-3M
FJ-3M
F-3M
FJ-3M
EEPROM
Features
−40°C to +125°C Operation
BR25Hxxxxxx-2C Series
Features
Part No.
Function
BR25H010
BR25H020
BR25H040
BR25H080
BR25H160
BR25H320
BR25H640
BR25H128
Icon
Descriptions
to
Capacity
(bits)
Built-in status
register
Double
cell structure
Ready/Busy status
display function
Package Type and Package Code (Suffix)
SOP-J8
TSSOP-B8
SOP8
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
F-2C
FJ-2C
Operating
temp. range
Supply
voltage range
Double
reset configuration
F-2C
10MHz operation
possible at Vcc=4.5V
Write time
20MHz operation
possible at Vcc=4.5V
MSOP8
Page Write function
ESD tolerance (HBM)
*Actual size shown
SOP8
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
Package
Lineup
10
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EEPROM
I2C BUS (2-Wire) Series
SPI BUS Series
ROHM’s ultra-compact WL-CSP EEPROMs are designed for applications with space restrictions such as camera and
communication modules. A broad lineup is offered for optimum compatibility.
Size (mm)
Part No.
Functions
SPI BUS I/F
I2C BUS I/F
Operating
temp. range
Page Write
function
Write time
Pull-Up
Resistor
Resin
Package
Y
(Typ.)
Height
(Max.)
φ
Pitch
1.27
1.50
0.55
0.25
0.5
VCSP50L1
1.95
1.06
0.55
0.25
0.5
VCSP50L1
1.60
1.00
0.55
0.25
0.5
VCSP50L1
0.94
0.94
0.33
0.20
0.4
UCSP30L1
1.30
0.77
0.35
0.20
0.4
UCSP30L1
1.10
1.15
0.55
0.25
0.4
UCSP50L1
1.30
0.77
0.40
0.20
0.4
UCSP35L1
1.45
0.77
0.33
0.20
0.4
UCSP30L1
1.50
1.00
0.35
0.20
0.4
1.50
1.00
0.30
0.20
0.4
UCSP25L1
1.50
1.00
0.36
0.20
0.4
UCSP25L1
2.44
1.99
0.55
0.25
0.5
VCSP50L2
2.09
1.85
0.55
0.25
0.5
VCSP50L2
1.74
1.65
0.55
0.25
0.5
VCSP50L1
2.00
2.63
0.40
0.25
0.5
VCSP35L2
1.60
1.00
0.55
0.25
0.5
VCSP50L1
to
Microwire I/F
Solder Ball (mm)
X
(Typ.)
WP
Double cell
construction
Capacity (bits)
UCSP30L1
Double reset
configuration
Ready/Busy status
display function
Built-in
status register
External Dimensions [Unit: mm]
www.rohm.com
3
4
0.2±0.1
S
1.27 0.42±0.1
0.1 S
1.27
0.4±0.1
0.15±0.1
0.1
1 2 3 4
(0.52)
11
0.15±0.1
S
0.1 S
0.65
+0.06
0.22 -0.04
0.08
M
0.65
9
0.3MIN
7
5.0±0.2
6.4±0.3
4.4±0.2
1
0.3MIN
7
16
6.4 ± 0.3
4.4 ± 0.2
1
8
0.15 ± 0.1
0.1
0.22 ± 0.1
1.15±0.1
0.1S
0.42±0.1
2
14
1
0.10
1.27
1
1.15 ± 0.1
S
0.545
0.10
+0.1
0.17 -0.05
0.3MIN
4
●SSOP-B16
5.0 ± 0.2
8 7 6 5
6.4 ±0.3
4.4 ±0.2
3
8
0.1 1.15±0.1
1
14
●SSOP-B14
3.0±0.2
(MAX 3.35 include BURR)
0.3MIN
2
6.2±0.3
4.4±0.2
0.595
●SSOP-B8
8.7±0.2
(MAX 9.05 include BURR)
6.2±0.3
4.4±0.2
5
0.45MIN
6
6.0±0.3
3.9±0.2
7
0.3MIN
0.9±0.15
8
●SOP14
4.9±0.2
(MAX 5.25 include BURR) 4°+6°
-4°
8 7 6 5
1.5±0.1
0.11
●SOP-J8
+6°
4°-4°
1.375±0.1
0.175
●SOP8
5.0±0.2
(MAX 5.35 include BURR)
1.5±0.1
0.11
EEPROM
BU9833GUL-W
BU9847GUL-W
BU9889GUL-W
BRCB008GWZ-3
BRCA016GWZ-W
BRCB016GWL-3
BRCD016GWZ-3
BRCB032GWZ-3
BRCB064GWZ-3
BRCE064GWZ-3
BRCG064GWZ-3
BU9897GUL-W
BU9832GUL-W
BU9829GUL-W
BR25S128GUZ-W
BU9891GUL-W
Icon
Descriptions
Plug & Play EEPROM
Ideal for compact modules
Ultra-Compact WL-CSP
Features
Ultra-Compact WL-CSP
Microwire BUS (3-Wire) Series
0.65
8
0.1
0.22±0.1
0.15±0.1
Package
Image
EEPROM
I2C BUS (2-Wire) Series
SPI BUS Series
Plug & Play EEPROMs
for Memory Modules
Features
Microwire BUS (3-Wire) Series
Optimized for specialized applications
These EEPROMs are specifically designed for Plug & Play memory modules.
Write Protect
TSSOP-B8
Write Protect function via one-time ROM
FVT-W
Set/cancel-enabled Write Protect,
Write Protect via one-time ROM
FVT-3
Functions
Part No.
BR34L02
BR34E02
Icon
Descriptions
Double cell
construction
Capacity (bits)
I2C BUS I/F
Plug & Play EEPROM
Ultra-Compact WL-CSP
VSON008X2030
Supports Serial
Presence Detect
Double reset
configuration
For DDR1/2/3
*Actual size shown
TSSOP-B8
VSON008X2030
Package
Lineup
EEPROM
Plug & Play EEPROMs
for Displays
These EEPROMs are designed for Plug & Play display applications.
BR24C21
BU9882
BU9883
BU99022
DDC1TM/DDC2TM compatible
EEPROM for displays
SOP8
SOP-J8
SSOP-B8
F
FJ
FV
DDC2TM compatible dual-port
EEPROM for displays
SOP14
SSOP-B14
F-W
FV-W
2Kbit x 3ch EEPROM
for HDMI ports
NUX-3
DDC1/2B
compatibility
Double reset
configuration
Double cell
construction
SSOP-B16
VSON008X2030
Package
FV-W
2Kbit x 2ch EEPROM
Bit structure
and no. of ch.
Icon
Descriptions
Package Type and Package Code (Suffix)
Feature Descriptions
Functions
Part No.
HDMI support
*Actual size shown
SOP8
SOP-J8
SSOP-B8
SOP14
SSOP-B14
SSOP-B16
Package
Lineup
S
0.08 S
+0.05
0.65 0.245 -0.04
0.08 M
0.65
1PIN MARK
S
+0.05
0.22 -0.04
0.08 S
+0.05
0.145 -0.03
0.08 S 1.5±0.1
C0.25 0.5
1
8
0.25
4
5
+0.05
0.25 -0.04
8
5
1
4
S
12
6.5±0.3
1PIN MARK
3.4±0.3
0.51MIN
2 3 4
3.0±0.1
0.29±0.15
0.6±0.2
4.0±0.2
2.8±0.1
1
9.3±0.3
3.2±0.2
1.2MAX
1.0±0.05
0.1±0.05
+0.05
0.145 -0.03
0.475
●DIP-T8
2.0±0.1
+0.03
0.02 -0.02
(0.12)
1 2 34
0.525 1PIN MARK
8 7 6 5
0.9MAX
0.75±0.05
0.08±0.05
6.4±0.2
4.4±0.1
0.5±0.15
1.0±0.2
8765
4±4
●VSON008X2030
+6°
4° -4°
1.4±0.1
2.9±0.1
(MAX 3.25 include BURR)
0.6MAX
●MSOP8
3.0±0.1
(MAX 3.35 include BURR)
0.3±0.1
●TSSOP-B8
VSON008X2030
7.62
0.3±0.1
2.54
0°-15°
0.5±0.1
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EEPROM
Features
Optimized for specialized applications
FeRAM Series Lineup
Optimized for continuous data logging and emergency backup applications
[Capacity] bit
32K
256K
MR44V064A
I 2C
SPI
64K
1M
2M
MR44V100A
MR44V064B
MR45V032A
MR45V064B
MR45V256A
Parallel
MR45V100A
MR45V200A
MR48V256C
Car Navigation
Automotive
AAAAAA
BBBbbbbb
CCCCCcccccc
DDD
E_EEE
MUSIC
Car Audio
Body Electrical Systems (i.e. power windows, seats)
PLCs (Programmable Controllers)
Industrial
Equipment
Copiers and MFPs
Smart Meters (Electricity/Gas/Water)
Surveillance Cameras
Gaming Systems
FeRAM
Gaming/Entertainment
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13
XXX
XXX
XXX
XXX
XXXXXXXXXXXXXXXXX
111111111111111111
FeRAM
FeRAM Series
High endurance (>1 trillion times) / 150ns Write speed non-volatile memory
FeRAM Series
Compared to conventional flash memory, ROHM’s non-volatile FeRAM provides 100,000 times faster rewrite
speed and 1,000,000 times the endurance, making it ideal for data backup during power outages and frequent
data logging.
Parallel Bus FeRAM MR48Vxxxx Series
Supply
Voltage
Memory
Capacity
2.7V to
3.6V
Data
Bits
Functions
×8
256Kb
Max. Operating
Frequency
Part No.
No. of Read/
Write Cycles
Data Retention
Period
Other
Features
MR48V256C
Package
TSOP(I)28
I2C Bus FeRAM MR44Vxxxx Series
2.5V to
3.6V
2.0V to
3.6V
2.0V to
3.6V
64Kb
MR44V064A
MR44V064B
MR44V100A
×8
1Mb
SOP8
SOP8
SOP8
SPI Bus FeRAM MR45Vxxxx Series
2.7V to
3.6V
2.0V to
3.6V
3.0V to
3.6V
2.0V to
3.6V
2.7V to
3.6V
32Kb
MR45V032A
MR45V064B
MR45V256A
MR45V100A
MR45V200A
64Kb
256Kb
×8
1Mb
2Mb
Icon
Descriptions
I2C BUS I/F
Parallel I/F
SOP8
SOP8
SOP8
SOP8 / DIP8
DIP8
Max. operating
frequency
SPI BUS I/F
Endurance
(no. of cycles)
Data
retention
Operating
temp. range
*Actual size shown
SOP8
TSOP(I)28
Package
Lineup
6mm × 4.9mm
1.27 pitch
6.5mm × 9.2mm
2.54 pitch
FeRAM
8mm × 13.4mm
0.55 pitch
DIP8
1.27
0.10
0.42±0.10
0.42MIN
SEATING PLANE
15
0.80±0.20
0~8
0.50 TYP.
0.60±0.15
6.5±0.2
INDEX MARK
8
1
5
4
2.7±0.2
14
0.17±0.05
9.2±0.2
0.10
8±0.10
0~10
0.20+0.05/-0.01
INDEX MARK
MIRROR FINISH
28
5.29
4
11.8±0.10
1
●DIP8
2.55 TYP.
1
1.375±0.10
5
0.175
6.00±0.30
3.90±0.20
INDEX MARK
0.545
8
13.4±0.20
0.55 0.425 TYP.
+0.08
0.22 -0.07 0.10 M
●TSOP(I)28
4.90±0.20
5.25MAX(include BURR)
1.20 MAX.
1.00±0.05
0.05~0.15
0.25
●SOP8
SEATING PLANE
External Dimensions [Unit: mm]
1.5±0.1
7.6
0.5 TYP.
2.54
8.8
14
+0.11
0.25 -0.05
XX
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NOR Flash Series Lineup
[Capacity] bit
Memory Capacity
64M
128M
256M
512M
Application Examples
Store programs, bitmaps,
and font data
T Vs
Store sound data
Electronic Musical Instruments
AV Equipment
STBs
DEGITAL CATV
Store programs
DVD Players/DVCs
Store programs
Store programs, fonts,
and user manuals
Printers
PC Peripherals
l
Electronic Dictionaries and Translators
Save contents and
gaming data
Electrica
Book
Store programs and
translations
Gaming Systems
Store program, voice, and
video data
Electronic Toys
Educational Toys
Store programs and contents
Entertainment (Control Programs)
Entertainment
Entertainment (Audio Data)
Store program, audio, and
video data
Entertainment (Image Data)
Car Navigation
Automotive
Car Audio
AAAAAA
MUSIC
BBBbbbbb
CCCCCcccccc
DDD
E_EEE
Power Windows
Usage Examples
Control Program Storage
Font/Bitmap Data Storage
Content Storage
NOR Flash
2G
MR29VXXX12B Series
MR29VXXX52B Series
NOR Flash
Gaming Systems
and Toys
1G
Manual/Advertising Storage
Configuration Storage
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15
NOR Flash
NOR Flash Series
NOR Flash Series
NOR Flash memory provides worry-free data retention characteristics
ROHM’s NOR Flash memory utilizes a floating gate structure for superior data retention characteristics and
integrates an ECC circuit that further improves quality and reliability for automotive applications.
Standard Parallel Bus NOR Flash
Data
Bits
Supply Memory
Voltage Capacity
1Gb
Planned
512Mb
Planned
Planned
Page Size
(Word x bit)
2.7V to
3.6V
128Mb
MR39V01G12B
MR39V51212B
MR39V25612B
MR29V12812B
MR29V06412B
8×16
64Mb
Planned
Cell
Type
Part No.
16×16
×8×16
256Mb
Functions
Data
Bits
1Gb
Planned
512Mb
Planned
Planned
Page Size
(Word x bit)
2.7V to
3.6V
256Mb
×8×16
64Mb
Icon
Descriptions
Flash function
type
TSOP(I)56
TSOP(I)48
Cell
Type
Address
Access Time
Page
Access Time
Other Features
Package
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)48
Access time
Memory cell type
Package
TSOP(I)56
MR39V01G52B
MR39V51252B
MR39V25652B
MR29V12852B
MR29V06452B
8×16
Other Features
TSOP(I)56
Part No.
16×16
128Mb
Planned
Functions
Page
Access Time
TSOP(I)56
Parallel Bus NOR Flash with ECC
Supply Memory
Voltage Capacity
Address
Access Time
Page access time
Error correction
function
Operating temp.
range
*Actual size shown
TSOP48(I)
14mm×20mm
0.5mm Pitch
12mm×20mm
0.5mm Pitch
NOR Flash
Package
Lineup
TSOP56(I)
29
SEATING PLANE
0.10
0.50
28
+0.06
0.15 -0.05
56
1.20MAX.
1.00±0.05
0.05~0.15
0.25
0.80±0.20
0~5
0.50TYP.
0.60±0.15
20.00±0.20
18.40±0.10
0.25TYP.
0.22±0.05 0.10 M
25
INDEX MARK
MIRROR FINISH 1
14.00±0.10
24
+0.06
0.15 -0.05
48
●TSOP56(I)
SEATING PLANE
0.10
1
0.25
12.00±0.10
INDEX MARK
MIRROR FINISH
20.00±0.20
18.40±0.10
1.20MAX.
1.00±0.05
0.05~0.15
●TSOP48(I)
0.50 0.25TYP.
+0.08
0.22 -0.07
0.10 M
External Dimensions [Unit: mm]
0.80±0.20
0~5
0.50TYP.
0.60±0.15
16
XX
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Non-Volatile Memory
P2ROMTM (Production Programmed ROM) Lineup
[Capacity] bit
Memory Capacity
Standard Parallel
BUS P2ROMTM
8M
16M
32M
64M
128M
256M
512M
1G
2G
MR26T51203L
MR27T802F
MR27V802F
MR27T25603L
MR27T12800L
MR27Txxx02L Series
MR26V6455J
Parallel BUS
Page Mode
P2ROMTM
MR27V12850L
MR36V01G52B
MR37Vxxx52x Series
MR26V51252R
MR27Vxxx52x Series
MR37V12841A
SPI BUS
P2ROMTM
MR27Vxxx41L Series
Application Examples
Store program, bitmap, and
font data
TVs
Store sound data
Electronic Musical Instruments
AV Equipment
STBs
DIGITAL CATV
Store programs
DVD Players/DVCs
Store programs
Store programs, fonts
and user manuals
Printers
PC Peripherals
Electronic Dictionaries/Interpreters
Store content data
l
Electrica
Book
Gaming Systems
Store program, audio,
and video data
Electronic Toys
Gaming Systems
and Toys
Store program and content data
Educational Toys
Store program and content data
Entertainment (Control Programs)
Entertainment
Entertainment (Audio Data)
Store program, audio, and
video data
Usage Examples
Entertainment (Video Data)
Control Program Storage
Font/Bitmap Data Storage
P2ROMTM
Content Storage
Manual/Advertising Storage
Configuration Data Storage
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17
P2ROM
Standard Parallel BUS
P2ROMTM Series
TM
Standard Parallel BUS
P2ROMTM Series
2.7V to
3.6V
512Mb
256Mb
Data
Bits
×8
×16
Functions
SPI BUS
P2ROMTM Series
Ideal for NOR Flash and Mask ROM applications that do not require rewriting
Users seeking basic performance can select from a range of capacities (8Mbit to 512Mbit) to suit set requirements. In addition to
memory featuring an original pin layout and Mask ROM compatible products, LAPIS Semiconductor has been focused on
supplying memory capable of x8bit/x16bit BUS switching that are pin-compatible with NOR Flash. Plus, superior data reliability
eliminates the need for ECC required with NAND Flash.
Original Pin Layout
Supply Memory
Voltage Capacity
Parallel BUS Page Mode
P2ROMTM Series
3.0V
Access Time
Part No.
2.7V
Access Time
Other Features
Package
MR26T51203L
MR27T25603L
TSOP(II)50
TSOP(II)50
Mask ROM Compatible Pin Layout
2.7V to
3.6V
128Mb
×8
×16
MR27T12800L
TSOP(I)48
NOR Flash Compatible Pin Layout
128Mb
64Mb
2.7V to
3.6V
3.0V to
3.6V
32Mb
16Mb
×8
×16
8Mb
MR27T12802L
MR27T6402L
MR27T3202L
MR27T1602L
MR27T802F
MR27V802F
Bare Chip
64Mb
32Mb
16Mb
Thin
SOP44 / TSOP(I)48 / TFBGA48
SOP44 / TSOP(I)48
SOP44 / TSOP(I)48
×8
×16
P2ROMTM
type
MR27V12800L-xxxWE
MR27V6402L-xxxWE
MR27V3202L-xxxWE
MR27V1602L-xxxWE
MR27V802F-xxxWA
to
Access time
Pin-Compatible with Standard Packages
Capacity
SOP44 / TSOP(I)48 / TFBGA48
Pad Size
8Mb
Icon
Description
SOP44 / TSOP(I)48 / TFBGA48
xxx in the part numbers are placeholders for the ROM code
128Mb
3.0V to
3.6V
TSOP(I)56
Chip
Chip
Chip
Chip
Operating
temperature
Pad size
*Actual size shown
8Mbit / 16Mbit / 32Mbit / 64Mbit / 128Mbit
128Mbit / 256Mbit
256Mbit / 512Mbit
Top
Top
Top
12mm×20mm
0.5mm Pitch
14mm×20mm
0.5mm Pitch
400mill
0.8mm Pitch
TSOP(I)56
TSOP(II)50
TSOP(I)48
Capacity
Chip
5
8Mbit / 16Mbit / 32Mbit / 64Mbit
16Mbit / 32Mbit
Capacity
64Mbit
Top
Top
Bottom
Top
Bottom
6.4mm × 10mm
0.8mm Pitch
6.0mm × 8.0mm
0.8mm Pitch
Compact
TFBGA48
TFBGA48
SOP44
P2ROMTM
Standard
600mill
1.27mm Pitch
18
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P2ROM
Standard Parallel BUS
P2ROMTM Series
TM
Parallel BUS Page Mode
P2ROMTM Series
Parallel BUS Page Mode
P2ROMTM Series
SPI BUS
P2ROMTM Series
Ideal replacements for NOR Flash and Mask ROM
In addition to x8/x16bit BUS switchable parallel interface page mode memory widely used in NOR Flash and
Mask ROM Flash applications, ROHM offers high-speed, large capacity products that feature expanded BUS
width memory ideal for storing audio and video data.
Original Pin Layout
Supply
Voltage
Memory
Capacity
Data
Bits
Page Size
(Word x bit)
3.0V to
3.6V
64Mb
×16
×32
8×32
Functions
3.0V
Access Time
Part No.
Page
Access Time Other Features
Package
MR26V6455J
SSOP70
MR27V12850L
TSOP(I)48
Mask ROM Compatible Pin Layout
3.0V to
3.6V
128Mb
×8
×16
8×16
NOR Flash Compatible Pin Layout
MR36V01G52B
MR26V51252R
MR37V25652T
MR27V12852L
MR37V12852B
MR37V6452B
MR27V6452L
MR27V3252J
MR27V1652L
1Gb
512Mb
256Mb
3.0V to
3.6V
128Mb
×8
×16
8×16
64Mb
32Mb
16Mb
Bare Chips
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)48
SOP44/TSOP(I)48 / TSOP(I)56
SOP44 / TSOP(I)48
SOP44 / TSOP(I)48
xxx in the part numbers below are placeholders for the ROM code
Pad Size
256Mb
3.0V to
3.6V
128Mb
64Mb
×8
×16
MR27V25653L-xxxWA
MR27V12850L-xxxWE
MR27V6452L-xxxWE
MR27V1652L-xxxWA
8×16
16Mb
Icon
Descriptions
P2ROMTM
Type
Access
time
to
16Mbit / 32Mbit / 64Mbit / 256Mbit / 512Mbit / 1Gbit / 2Gbit / 4Gbit / 8Gbit
I/O
Capacity
to
Pin-compatible with standard packages
×8bit / ×16bit / ×32bit
I/O
Capacity
Top
500mill
0.8mm Pitch
600mill
1.27mm Pitch
SSOP70
SOP44
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www.lapis-semi.com/en
Chip
Chip
Chip
Operating
temperature
*Packages shown are 40% of actual size
Thin
×8bit / ×16bit
16Mbit / 32Mbit / 64Mbit / 128Mbit / 256Mbit / 512Mbit / 1Gbit
Top
Top
12mm × 20mm
0.5mm Pitch
14mm × 20mm
0.5mm Pitch
TSOP(I)48
TSOP(I)56
P2ROMTM
Standard
Top
Page access
time
Chip
19
Pad size
P2ROM
Standard Parallel BUS
P2ROMTM Series
TM
Supply Memory
Voltage Capacity
Data
Bits
128Mb
3.0V to
3.6V
64Mb
32Mb
×1
16Mb
SPI BUS
P2ROMTM Series
Contributes to greater space savings, reduced noise, and lower
material costs
SPI BUS
P2ROMTM Series
SPI Bus
Parallel BUS Page Mode
P2ROMTM Series
These P2ROMTM series utilize SPI (Serial Peripheral Interface) for broad compatibility. A wide range of memory
capacities (16Mbit to 128Mbit) is available in a single package type, making it easy to change memory size without
board requiring board modifications.
Functions
Fast
Read
Part No.
MR37V12841A
MR27V6441L
MR27V3241L
MR27V1641L
Bare Chips
Read
Other Features
Package
SOP16
SOP16
SOP16
SOP16
xxx in the part numbers below are placeholders for the ROM code
Pad Size
3.0V to
3.6V
64Mb
32Mb
×1
16Mb
Icon
Descriptions
MR27V6441L-xxxWA
MR27V3241L-xxxWE
MR27V1641L-xxxWA
Operating
frequency
P2ROMTM
Type
Chip
Chip
Chip
Operating
temperature
Pad size
Pin-compatible with standard packages *Actual size shown
×1bit ×2bit ×4bit
I/O
16Mbit / 32Mbit / 64Mbit / 128Mbit
Capacity
Top
375mill
1.27mm Pitch
Standard
P2ROMTM
SOP16
XX
20
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www.lapis-semi.com
P2ROM
Standard Parallel BUS
P2ROMTM Series
TM
Parallel BUS Page Mode
P2ROMTM Series
SPI BUS
P2ROMTM Series
External Dimensions [Unit: mm]
0.15 S B
6.4
0.8
1.2
SEATING PLANE
0.10
1
0.80
+0.05
0.16 -0.04
22
+0.08
0.37 -0.07
0.16 M
48
1
24
25
+0.06
0.15 -0.05
0.10 SEATING PLANE
0.10 S
20.95±0.10
0.10
SEATING PLANE
SEATING PLANE
●SOP44-P-600-1.27-K
14.00±0.10
0.50
0.17±0.05
25
+0.08
0.37 -0.07
0.16 M
0.80±0.20
0~8
+0.06
0.15 -0.05
70
P2ROMTM
+0.08
0.32 -0.07
0.16
SEATING PLANE
0.86TYP.
0.10
28.60±0.15
36
15.90±0.20
12.70±0.10
70
0.80
0.17±0.05
35
+0.08
0.32-0.07
0.16 M
3.05 MAX.
2.70±0.20
1
INDEX MARK
MIRROR FINISH
1.60±0.20
SEATING PLANE
21
0.05~0.25
0.25
0~8
0.10
0.80
0.90±0.10
M
1.60±0.20
0~8
0.25
0.80±0.20
0.70TYP.
0.17±0.05
35
0.80
0.70TYP.
0~10
●SSOP70-P-500-0.80-K
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1
0.05~0.25 2.70±0.20
SEATING PLANE
0.20 M
INDEX MARK
MIRROR FINISH
1.50±0.20
0.25
0.10
+0.08
0.42 -0.07
3.10MAX.
1.27
0.74TYP.
0.17±0.05
0.05~0.25 2.65±0.20
22
36
12.70±0.10
15.90±0.20
15.24
13.00±0.20
23
1
0~5
0.50TYP.
0.60±0.15
0.85TYP.
28.60±0.15
28.15±0.20
16.00±0.30
29
28
0.50±0.10
0.60
●P-SSOP70-500-0.80-EK-MC
44
INDEX MARK
MIRROR FINISH
56
1.20MAX.
1.00±0.05
0.05~0.15
0.16 M
0.80
0.95±0.05
1
INDEX MARK
MIRROR FINISH
0.88TYP.
0.17±0.05
1
3.05MAX.
0.10
+0.08
0.37-0.07
0.25
25
0.80
0.05~0.25
1
20.00±0.20
18.40±0.10
INDEX MARK
MIRROR FINISH
10.76
11.76±0.20
10.16±0.10
10.76
11.76±0.2
10.16±0.1
INDEX MARK
MIRROR FINISH
0.88TYP.
26
0.22±0.05
50
26
1.20MAX.
20.95±0.1
50
0.85TYP.
●P-TSOP I 56-1420-0.50-K-MC
0.25TYP.
●P-TSOP II 50-400-0.80-K-MC
0.10 M
●TSOP II 50-P-400-0.80-K
SEATING PLANE
20.00±0.20
18.40±0.10
INDEX MARK
MIRROR FINISH
23
0.10
0.10 S
0.25
INDEX MARK
MIRROR FINISH
0.81TYP.
f0.08 M S AB
0.10
f0.08 M S AB
INDEX MARK
f0.51±0.05
0.50 0.25TYP.
+0.08
0.22-0.07
0.10 M
f0.51±0.05
HGFEDCBA
1.20MAX.
1.00±0.05
0.05~0.15
(1.0)
HGFEDCB A
6
5
4
3
2
1
SEATING PLANE
0.20 S
0.50TYP.
0.60±0.15
12.00±0.10
6
5
4
3
2
1
0.20 S
S
A
●TSOP I 48-P-1220-0.50-1K
18.41±0.1
44
A
B
0.35±0.05
1.2MAX.
S
x4
0.15
0~5
10.76
6.0
INDEX MARK
0.80
(1.2)
0.15 S A
0.80±0.20
●TSOP II 44-P-400-0.80-K
11.76±0.2
10.16±0.1
8.0
0.80
0.15 S B
●P-TFBGA48-6.0X8.0-0.80
×4
0.15
0.8
B
0.25
+0.06
0.15 -0.05
0.15 S A
2.2
0.35±0.05
1.1±0.1
28
SEATING PLANE
0.10
0.10 M
29
10.0
INDEX MARK
MIRROR FINISH
0.25
0.80TYP.
0.88±0.15
56
1.20MAX.
1.00±0.05
0.05~0.15
M
1
0.22±0.05
1.27
20.00±0.20
18.40±0.10
0.50
0.42+0.08/-0.07 0.12
0.705 TYP.
INDEX MARK
MIRROR FINISH
14.00±0.10
8
INDEX MARK
MIRROR FINISH
1.41±0.20
0.17±0.05
1
8.53 TYP.
10.32±0.20
7.50±0.10
9
0.15±0.10
4 ±4
0.25
10.30±0.20
16
●P-TFBGA48-6.4X10.0-0.80
0.25TYP.
●P-TSOP I 56-1420-0.50-K
2.50±0.15
2.35±0.20
●P-SOP16-375-1.27-K
0.80
0.90±0.10
0~5
0.50TYP.
0.60±0.15
Major ROHM Group Offices/Centers (Japan)
Sales Offices
R&D Centers
Kyoto
Nagoya
Tokyo
Fukuoka
Yokohama
Matsumoto
Mito
Nishi-Tokyo
Kyoto Technology Center (Head Office)
Kyoto Technology Center (Kyoto Ekimae)
Yokohama Tecnology Center
LAPIS Semiconductor (Shin-Yokohama)
LAPIS Semiconductor Miyazaki Design Center
Sendai
Takasaki
Utsunomiya
Production Facilities
ROHM Hamamatsu Co., Ltd. LAPIS Semiconductor Miyagi Co., Ltd.
LAPIS Semiconductor Miyazaki Co., Ltd.
ROHM Wako Co., Ltd.
ROHM Apollo Co., Ltd.
AGLED Co., Ltd.
ROHM Mechateck Co., Ltd.
QA Centers
Kyoto QA Center
Yokohama QA Center
ROHM Mechatech
LAPIS Semiconductor
Miyagi
Kyoto (HQ) Takasaki
Sendai
ROHM Wako
Matsumoto
Utsunomiya
Fukuoka
ROHM Apollo
AGLED
Nagoya
ROHM
Hamamatsu
LAPIS Semiconductor
Miyazaki Design Center
LAPIS Semiconductor
Miyazaki
Sales Offices
Mito
NishiTokyo
Production Facilities
Tokyo
Yokohama/
LAPIS Semiconductor (HQ)
R&D Centers
QA Centers
Trade Name / LAPIS Semiconductor Co., Ltd.
Address / 2-4-8 Shinyokohama,Kouhoku-ku,
Yokohama 222-8575, Japan
TEL+81-45-476-9212
Date of Establishment / October 1, 2008
President: Noriaki Okada
Major ROHM Group Offices/Centers (Global)
Production Facilities
Sales Offices
ASIA
ROHM Semiconductor Korea Corporation
ROHM Semiconductor Trading (Dalian) Co., Ltd.
ROHM Semiconductor (Shanghai) Co., Ltd.
ROHM Semiconductor (Shenzhen) Co., Ltd.
ROHM Semiconductor Hong Kong Co., Ltd.
ROHM Semiconductor Taiwan Co., Ltd.
ROHM Semiconductor Singapore Pte. Ltd.
ROHM Semiconductor Philippines Corporation
ROHM Semiconductor (Thailand) Co., Ltd.
ROHM Semiconductor Malaysia Sdn. Bhd.
ROHM Semiconductor India Pvt. Ltd.
AMERICA ROHM Semiconductor U.S.A., LLC
ROHM Semiconductor do Brasil Ltda.
EUROPE ROHM Semiconductor GmbH
Sales Offices
Production Facilities
R&D Centers
QA Centers
ASIA
AMERICA Kionix, Inc.
EUROPE SiCrystal AG
ROHM Korea Corporation
ROHM Electronics Philippines, Inc.
ROHM Integrated Systems (Thailand) Co., Ltd.
ROHM Semiconductor(China) Co., Ltd.
ROHM Electronics Dalian Co., Ltd.
ROHM-Wako Electronics (Malaysia) Sdn. Bhd.
ROHM Mechatech Philippines, Inc.
ROHM Mechatech (Thailand) Co., Ltd.
ROHM Mechatech (Tianjin) Co., Ltd.
R&D Centers
QA Centers
Korea Design Center
Shanghai Design Center
Shenzhen Design Center
Taiwan Design Center
India Design Center
AMERICA America Design Center (Santa Clara)
America Design Center (San Diego)
EUROPE Europe Design Center
ASIA
Korea QA Center
Shanghai QA Center
Shenzhen QA Center
Taiwan QA Center
Singapore QA Center
Thailand QA Center
AMERICA USA QA Center
EUROPE Europe QA Center
ASIA
ROHM Semiconductor(China)
ROHM Mechatech (Tianjin)
GmbH
ROHM Integrated Systems(Thailand)
ROHM Mechatech (Thailand)
SiCrystal
Dalian
ROHM Electronics Dalian
Hong Kong
Thailand
Korea
ROHM Korea
Shanghai
Taiwan
Shenzhen
India
U.S.A.
Santa Clara
Detroit
Kionix
San Diego
Philippines
ROHM-Wako Electronics (Malaysia)
Malaysia
Singapore
ROHM Electronics Philippines
ROHM Mechatech Philippines
22
Brazil
www.rohm.com
• All DRAM, FeRAM, NOR Flash, and P2ROMTM products that appear in this catalog have been developed and manufactured by LAPIS Semiconductor
• P2ROMTM is a trademark of LAPIS Semiconductor
• All products mentioned in this catalog (including LAPIS Semiconductor products) are sold by ROHM Co., Ltd.
• P2ROMTM is a trademark of LAPIS Semiconductor
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