DATASHEET

ACS04MS
Data Sheet
November 1998
File Number
Radiation Hardened Hex Inverter
Features
The Radiation Hardened ACS04MS is a Hex Inverter. This
device simply inverts the level present on each input. All
inputs are buffered and the outputs are designed for
balanced propagation delay and transition times.
• QML Qualified Per MIL-PRF-38535 Requirements
The ACS04MS is fabricated on a CMOS Silicon on Sapphire
(SOS) process, which provides an immunity to Single Event
Latch-up and the capability of highly reliable performance in
any radiation environment. These devices offer significant
power reduction and faster performance when compared to
ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS04MS are
contained in SMD 5962-98603. A “hot-link” is provided
on our homepage with instructions for downloading.
www.intersil.com/data/sm/index.asp
4541
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-Up Free Under Any Conditions
- Total Dose. . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si)
- SEU Immunity . . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm2)
• Input Logic Levels. . . . VIL = (0.3)(VCC), VIH = (0.7)(VCC)
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . ±8mA (Min)
• Quiescent Supply Current . . . . . . . . . . . . . . 100µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 15ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
Ordering Information
ORDERING NUMBER
INTERNAL MKT. NUMBER
5962F9860301VCC
ACS04DMSR-03
ACS04D/SAMPLE-03
ACS04D/SAMPLE-03
5962F9860301VXC
ACS04KMSR-03
ACS04K/SAMPLE-03
5962F9860301V9A
TEMP. RANGE (oC)
PACKAGE
DESIGNATOR
-55 to 125
14 Ld SBDIP
CDIP2-T14
25
14 Ld SBDIP
CDIP2-T14
-55 to 125
14 Ld Flatpack
CDFP4-F14
ACS04K/SAMPLE-03
25
14 Ld Flatpack
CDFP4-F14
ACS04HMSR-03
25
Die
N/A
Pinouts
ACS04MS
(SBDIP)
TOP VIEW
ACS04MS
(FLATPACK)
TOP VIEW
A1 1
14 VCC
A1
1
14
VCC
Y1 2
13 A6
Y1
2
13
A6
A2 3
12 Y6
A2
3
12
Y6
Y2 4
11 A5
A3 5
10 Y5
Y3 6
9 A4
GND 7
8 Y4
1
Y2
4
11
A5
A3
5
10
Y5
Y3
6
9
A4
GND
7
8
Y4
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
ACS04MS
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ±25µm (20.6 mils ±1 mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ±0.15µm
SPECIAL INSTRUCTIONS:
METALLIZATION: AI
Bond VCC First
Metal 1 Thickness: 0.7µm ±0.1µm
Metal 2 Thickness: 1.0µm ±0.1µm
ADDITIONAL INFORMATION:
Worst Case Current Density: <2.0 x 105 A/cm2
Transistor Count: 82
SUBSTRATE POTENTIAL:
Unbiased Insulator
Metallization Mask Layout
ACS04MS
Y1
(2)
A1
(1)
VCC
(14)
A6
(13)
A2 (3)
(12) Y6
Y2 (4)
(11) A5
NC
NC
A3 (5)
(10) Y5
(6)
Y3
(7)
GND
(8)
Y4
(9)
A4
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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