Datasheet Download

System motor driver for CD/DVD Player
5ch System Motor Driver
for Car AV
BD8205EFV-M
General Description
Key Specifications
■
BD8205EFV-M is a 5-Channel system motor driver
developed for DC motors (Spindle motor, Sled motor,
Loading motor) and coils (Tracking, Focus) drive for
actuator. This IC can drive the motor and the coil of a
CD/DVD drive.
■
■
■
■
Features
■ 5CH BTL Driver
■ POWVCC1 for CHs 1, 2, and 3 (DC motors) and
POWVCC2 for CHs 4 and 5 (actuator) are
independent for efficient drive configuration.
■ Built-in protection functions (TSD, UVLO, BIAS
Drop Mute)
■ AEC-Q100 Qualified
Driver Power Supply Voltage Range
POWVCC1
6V to10V
POWVCC2
4.3V toVPOW VCC1
Operating Temperature Range
-40°C to +85°C
Output Offset (CHs 1,2,3)
±100mV (Max)
Output Offset (CHs 4,5)
±50mV (Max)
Maximum Output Range (All CHs)
6V (Typ)
Package
W(Typ)
D(Typ)
H(Max)
7.80mm × 7.60mm × 1.00mm
HTSSOP-B24
Application
Car Audio
HTSSOP-B24
Typical Application Circuit
M
M
M
Spindle
Sled
Loading
Tracking
MUTE3
VREG
VO5P
PREGND
POWGND1
POWGND2
VO5M
VO4M
VO3P
VO3M
VO2P
VO2M
BD8205EFV-M
VO1P
VO1M
POWVCC2
MUTE1245
POWVCC1
VO4P
BIAS
IN5
IN4
IN3
IN2
IN1
DSP
Focus
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays
1/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Pin Configuration
Pin Descriptions
(TOP VIEW)
1
POWGND1
POWVCC1
24
2
VO1M
IN1
23
3
VO1P
IN2
22
4
VO2M
IN3
21
5
VO2P
IN4
20
6
VO3M
IN5
19
7
VO3P
BIAS
18
8
VO4M
MUTE3
17
9
VO4P
PREGND
16
10
VO5M
MUTE1245
15
11
VO5P
VREG
14
12
POWGND2
POWVCC2
13
Figure 2. Pin Configuration
No.
Pin Name
Function
1
POWGND1
2
VO1M
CH1 driver negative output
3
VO1P
CH1 driver positive output
4
VO2M
CH2 driver negative output
5
VO2P
CH2 driver positive output
6
VO3M
CH3 driver negative output
7
VO3P
CH3 driver positive output
8
VO4M
CH4 driver negative output
9
VO4P
CH4 driver positive output
10
VO5M
CH5 driver negative output
CH5 driver positive output
Power GND1
11
VO5P
12
POWGND2
Power GND2
13
POWVCC2
Power supply voltage 2
14
VREG
15
MUTE1245
Power supply for internal logic
16
PREGND
17
MUTE3
18
BIAS
19
IN5
CH5 input
20
IN4
CH4 input
21
IN3
CH3 input
22
IN2
CH2 input
23
IN1
CH1 input
24
POWVCC1
Mute control input for CHs 1, 2, 4, 5
Pre GND
Mute control input for CH 3
Standard voltage input
Power supply voltage 1
Control
Logic
VREG
T.S.D.
POWVCC1 UVLO
BIAS Drop Mute
POWVCC2
VO5P
VO5M
LEVEL
SHIFT
VO4P
VO4M
LEVEL
SHIFT
VO3P
VO3M
LEVEL
SHIFT
VO2P
VO2M
LEVEL
SHIFT
VO1P
VO1M
POWVCC1
LEVEL
SHIFT
Regulator
MUTE1245
MUTE3
BIAS
IN5
IN4
IN3
IN2
IN1
Block Diagram
Figure 3. Block Diagram
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage 1
VPOWVCC1
12
V
Power Supply Voltage 2
VPOWVCC2
Input Pin Voltage 1
Input Pin Voltage 2
VPOWVCC1
V
VIN1
(Note 1)
12
V
VIN2
(Note 2)
7
V
1.10
Package Dissipation
Pd
(Note 3)
W
3.99 (Note 4)
Operating Temperature Range
Topr
-40 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Maximum Junction Temperature
(Note 1) This is applicable to pins MUTE1245 and MUTE3.
(Note 2) This is applicable to pins IN1, IN2, IN3, IN4, IN5, and BIAS.
(Note 3) Glass epoxy substrate dimensions are 70mm×70mm×1.6mm, 1 layer substrate, (Copper foil 0mm×0mm)
Reduce power dissipation capability by 8.8mW for each degree above 25°C.
(Note 4) Glass epoxy substrate dimensions are 70mm×70mm×1.6mm, 4 layer substrate, (Copper foil 70mm×70mm)
Reduce power dissipation capability by 32.0mW for each degree above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta = -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
Pre Block Power Supply,
DC Motor System Power Supply (Note 1)
VPOWVCC1
6
8
10
V
Actuator System Power Supply (Note 1)
VPOWVCC2
4.3
8
VPOWVCC1
V
(Note 1) Please decide the power supply voltage after considering power dissipation.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Electrical Characteristics (Unless otherwise noted Ta=25°C, V POW VCC1 =V POW VCC2 =8V, V BIAS =1.65V, RL=8Ω)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
IQ
-
13
30
mA
Output Offset (CHs 1, 2, 3)
VOOF123
-100
0
100
mV
Output Offset (CHs 4, 5)
VOOF45
-50
0
50
mV
Maximum Output Range
(CHs 1, 2, 3, 4, 5)
VOM
5.3
6.0
-
V
Closed Circuit Loop Gain
(CHs 1, 2, 3)
GV123
24.0
25.7
27.4
dB
Closed Circuit Loop Gain (CHs 4, 5)
GV45
15.5
17.5
19.5
dB
Input Impedance (CHs 1, 2, 3)
RIN123
13
20
27
kΩ
Input Impedance (CHs 4, 5)
RIN45
30
47
64
kΩ
MUTE1245,3 Low Level Voltage
VML
-
-
0.5
V
MUTE1245,3 High Level Voltage
VMH
2.0
-
-
V
MUTE1245,3 Input Current
IMUTE
32
52
74
μA
BIAS Drop Mute
VBIAS
0.5
0.7
0.9
V
BIAS Input Current
IBIAS
32
52
74
μA
UVLO Detection Voltage
VUVLOD
3.4
3.8
4.2
V
UVLO Release Voltage
VUVLOR
3.6
4.0
4.4
V
VREG Voltage
VVREG
-
5.0
-
V
Quiescent Current
Condition
At no-load, VMUTE1245,3=H
< Driver >
Total RON=2.5Ω(Typ)
Equivalent
< Others >
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/19
VMUTE1245,3=3.3V
VBIAS=1.65V
CVREG=0.1μF
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Electrical Characteristics
(Unless otherwise noted Ta=-40°C to 85°C, V POWVCC1 =V POW VCC2 =8V, V BIAS =1.65V, RL=8Ω)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
IQ
-
13
33
mA
Output Offset (CHs 1, 2, 3)
VOOF123
-100
0
100
mV
Output Offset (CHs 4, 5)
VOOF45
-50
0
50
mV
Maximum Output Range
(CHs 1, 2, 3, 4, 5)
VOM
4.8
6.0
-
V
Closed Circuit Loop Gain
(CHs 1, 2, 3)
GV123
24.0
25.7
27.4
dB
Closed Circuit Loop Gain (CHs 4, 5)
GV45
15.5
17.5
19.5
dB
Input Impedance (CHs 1, 2, 3)
RIN123
10
20
28
kΩ
Input Impedance (CHs 4, 5)
RIN45
28
47
66
kΩ
MUTE1245,3 Low Level Voltage
VML
-
-
0.4
V
MUTE1245,3 High Level Voltage
VMH
2.0
-
-
V
MUTE1245,3 Input Current
IMUTE
22
52
108
μA
BIAS Drop Mute
VBIAS
0.3
0.7
1.1
V
BIAS Input Current
IBIAS
22
52
108
μA
UVLO Detection Voltage
VUVLO
3.4
3.8
4.2
V
UVLO Release Voltage
VUVLOR
3.6
4.0
4.4
V
VREG Voltage
VVREG
-
5.0
-
V
Quiescent Current
Condition
At no-load, VMUTE1245,3=H
< Driver >
Total RON=2.5Ω(Typ)
Equivalent
< Others >
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/19
VMUTE1245,3=3.3V
VBIAS=1.65V
CVREG=0.1μF
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Typical Performance Curves
30
28
IC Current:IQ [mA]
CH1 Gain : GV123 [dB]
VPOWVCC1,2=4.5V to 10V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
Ta=25℃
25
20
15
10
27
26
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN1=VBIAS+0.1V
Ta=-40℃ to 85℃
25
5
1
3
5
7
9
11
Supply Voltage :VPOWVCC1,2 [V]
13
24
-50
-25
0
25
50
75
100
Ta [℃]
Figure 5. CH1 Closed Circuit Loop Gain: GV123
28
28
27
27
CH3 Gain : GV123 [dB]
CH2 Gain : GV123 [dB]
Figure 4. Quiescent Current:IQ
26
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN2=VBIAS+0.1V
Ta=-40℃ to 85℃
25
26
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN3=VBIAS+0.1V
Ta=-40℃ to 85℃
25
24
24
-50
-25
0
25
50
75
100
-50
Ta[℃]
0
25
50
75
100
Ta [℃]
Figure 6. CH2 Closed Circuit Loop Gain: GV123
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
-25
Figure 7. CH3 Closed Circuit Loop Gain: GV123
6/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
20
20
19
19
CH5 Gain : GV45 [dB]
CH4 Gain : GV45 [dB]
Typical Performance Curves
18
17
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN4=VBIAS+0.1V
Ta=-40℃ to 85℃
16
18
17
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN5=VBIAS+0.1V
Ta=-40℃ to 85℃
16
15
15
-50
-25
0
25
50
75
-50
100
-25
0
25
50
75
100
Ta [℃]
Ta [℃]
Figure 8. CH4 Closed Circuit Loop Gain: GV45
Figure 9. CH5 Closed Circuit Loop Gain: GV45
6.5
Output
Voltage :VVREG [V]
6.0
5.5
5.0
4.5
VPOWVCC1,2=8V
VMUTE3=VMUTE1245=3.3V
VBIAS=1.65V
VIN4=VBIAS
Ta=-40℃ to 85℃
4.0
3.5
-50
-25
0
25
50
75
100
Ta [℃]
Figure 10. VREG Voltage:VVREG
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
7/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Description of Block
1. Driver Control Pins MUTE1245 (Pin15), MUTE3 (Pin17), BIAS (Pin18)
All driver output conditions are controlled by switching the MUTE1245 and MUTE3 pins to High and Low levels.
Shown below is the input-output logic table including BIAS drop mute.
▼Driver Logic (Normal Operation)
State
No.
1
2
3
4
5
6
7
8
Output(Note 1) (Note 2)
Input
MUTE1245
H
H
L
L
H
H
L
L
MUTE3
H
L
H
L
H
L
H
L
BIAS
H
H
H
H
L
L
L
L
CH1 (SP)
Active
Active
MUTE
MUTE
MUTE
MUTE
MUTE
Hi-Z
CH2 (SL)
Active
Active
MUTE
MUTE
MUTE
MUTE
MUTE
Hi-Z
CH3 (LD)
Active
MUTE
Active
MUTE
MUTE
MUTE
MUTE
Hi-Z
CH4 (FC)
Active
Active
MUTE
MUTE
MUTE
MUTE
MUTE
Hi-Z
CH5 (TK)
Active
Active
MUTE
MUTE
MUTE
MUTE
MUTE
Hi-Z
▼Driver Logic (UVLO, TSD Protected Operation)
State
No.
9
10
Output(Note 1) (Note 2)
Input
MUTE1245
L
MUTE3
L
Others
BIAS
L
CH1 (SP)
Hi-Z
MUTE
CH2 (SL)
Hi-Z
MUTE
CH3 (LD)
Hi-Z
MUTE
CH4 (FC)
Hi-Z
MUTE
CH5 (TK)
Hi-Z
MUTE
(Note 1) MUTE : Both positive and negative output voltages pull-up to POWVCC/2(=VREF).
(Note 2) Hi-Z : Both positive and negative outputs become Hi-Z.
2. BIAS Drop Mute
If BIAS pin voltage becomes 0.7V (Typ) or less, output of all channels turns OFF.
Please set it to a minimum of 1.2V for typical use.
3. POWVCC1 Drop Mute (UVLO)
If POWVCC1 pin voltage becomes 3.8V (Typ) or less, output of all channels turns OFF.
If POWVCC1 pin voltage becomes 4.0V (Typ) or more, output of all channels turns ON.
4. Thermal Shutdown Circuit (TSD)
Thermal shutdown circuit is designed to turn off all output channels when the junction temperature (Tj) reaches 175°C
(Typ). IC operation begins again when the junction temperature decreases to 150°C (Typ) or less.
5. VREG Voltage (Pin14)
VREG pin is the regulator output for internal blocks. 5V (Typ) is generated on this pin using POWVCC1 power supply.
Connect a capacitor CVREG = 0.1μF (Typ) to the VREG pin for phase compensation. Operation may become unstable if
CVREG is not connected. VREG is not designed as the power supply for other parts. Therefore connect only a capacitor
to VREG pin.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
8/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
6. Output Amplitude calculation
i) SPINDLE,SLED,LOADING
R2=96.4kΩ
VIN
VOP=V REF +
VOP
IN
input
×2
VBIAS
R IN
R1=20kΩ
Level
Shift
M
96.4kΩ
x1x2x(VIN-VBIAS )
RIN+20kΩ
VREF
×2
BIAS
VOM
A*
96.4kΩ
RIN+20kΩ
VOP=V REF
96.4kΩ
x1x2x(VIN-VBIAS )
RIN+20kΩ
-
VO=(VO+) - (VO-)→It is ×4 between the output
Figure 11. SPINDLE, SLED, LOADING Closed Loop Gain calculation
 =
96.4kΩ
 +20kΩ
× 1 × 2 × 2 [dB]
※Please consider component dispersion
R1 = 20kΩ ± 18%
R2 = 96.4kΩ ± 18%
R2/R1 = 4.82 ± 2.5%
∗ A = 1 ± 18%
Example: RIN=0.
 =
96.4kΩ
20kΩ
× 1 × 2 × 2 = 25.7 [dB]
ii) FOCUS,TRACKING
R2=86.2kΩ
VIN
VOP=V REF +
VOP
IN
input
×2
VBIAS
R IN
R1=47kΩ
Level
Shift
86.2kΩ
x1.02x2x(VIN-VBIAS )
RIN+47kΩ
VREF
M
×2
BIAS
VOM
B*
86.2kΩ
RIN+47kΩ
VOP=V REF
-
86.2kΩ
x1.02x2x(VIN-VBIAS )
RIN+47kΩ
VO=(VO+) - (VO-)→It is ×4 between the output
Figure 12. FOCUS, TRACKING Closed Loop Gain calculation
 =
86.2kΩ
 +47kΩ
× 1.02 × 2 × 2 [dB]
※Please consider component dispersion
R1 = 47kΩ ± 18%
R2 = 86.2kΩ ± 18%
R2/R1 = 4.82 ± 2.5%
∗ B = 1.02 ± 26%
Example: RIN=0.
 =
86.2kΩ
47kΩ
× 1.02 × 2 × 2 = 17.5 [dB]
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Timing Chart
1. Kind of the signals
・External power supply
・Internal power supply
・Reference voltage input
・Driver input
・Mute control input
・Driver output
:
:
:
:
:
:
POWVCC1, POWVCC2
VREG
BIAS
IN1, IN2, IN3, IN4, IN5
MUTE1245, MUTE3
VO1P, VO1M, VO2P, VO2M, VO3P, VO3M, VO4P, VO4M, VO5P, VO5M,
2. Start-up Sequence
(1) Input external power supply. The slew rate recommends less than 0.045V/μs in the start-up before the power supply
voltage arrive at 5V. When the power supply voltage quickly start-up, an overshoot of the VREG voltage occurs and
may lead to internal element destruction. Keep relations of POWVCC1 >= POWVCC2 at the start-up.
(2) Input reference voltage (BIAS). Because BIAS is sequence-free, BIAS input before the external power supply at
start-up is possible.
(3) After the POWVCC1 power supply voltage arrived at 4.0V (UVLO release voltage), input the mute control.
(4) After input the mute control, input any voltage into each driver input.
Slew rate
0.045V/μs or more slowly
Pin voltage
UVLO release
4.0V(Typ)
POWVCC1, POWVCC2 : 8V
VREG : 5V(Typ)
0V
1.65V
BIAS drop mute
release 0.7V(Typ)
BIAS
0V
3.3V
Input MUTE after UVLO and
BIAS drop mute release
MUTE1245, 3
0V
Driver input
Driver output
Equal to BIAS
or Hi-Z input
Input any voltage
OFF
ACTIVE
time
Figure 13. Example of start-up sequence
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
3. Shut-down Sequence
(1) Turn off the driver input and the mute control input.
(2) Turn off the reference voltage input (BIAS). Because BIAS is sequence-free, turn off after the power supply turn off is
possible.
(3) The slew rate recommends more than -0.045V/μs in the shut-down after the power supply voltage lower than 5V.
When the power supply voltage quickly shut-down, the discharge current from CVREG becomes the overcurrent and
may lead to internal element destruction. Keep relations of POWVCC1 >= POWVCC2 at the shut-down also.
Pin voltage
POWVCC1, POWVCC2 : 8V
Slew rate
-0.045V/μs or more slowly
VREG : 5V(Typ)
UVLO detect
3.8V(Typ)
0V
1.65V
BIAS drop mute
detect 0.7V(Typ)
BIAS
0V
3.3V
MUTE1245, 3
Turn off MUTE before UVLO
and BIAS drop mute detect
0V
Driver input
Driver output
Input any voltage
Equal to BIAS
or Hi-Z input
ACTIVE
OFF
time
Figure 14. Example of shut-down sequence
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Application Example
POWERGND
Spindle
Input
Sled
Input
PREGND
Loading Tracking Focus
Input
Input
Input
BIAS
MUTE
POWERGND
MUTE
PREGND
CVREG
4
5
6
7
8
9
10
11
12
IN5
POWVCC2
POWGND2
3
VREG
VO5P
2
MUTE1245
VO5M
1
BIAS
PREGND
13
VO4P
14
MUTE3
15
VO4M
16
VO3P
IN4
17
VO3M
IN3
18
VO2P
IN2
19
VO2M
20
VO1P
21
VO1M
22
POWGND1
23
IN1
C PVCC21 C PVCC22
24
POWVCC1
C PVCC12 CPVCC11
THERMAL PAD
POWERGND
POWERGND
POWERGND
M
M
M
Spindle Motor
Sled Motor
Loading Motor
Tracking Coil
Focus Coil
Figure 15. Application Example
▼Channel setting example
CH1
Spindle
CH2
Sled
CH3
Loading
CH4
Tracking
CH5
Focus
▼External parts list
Component name
Component value
Product name
Manufacturer
CPVCC11
0.1μF
GCM188R11H104KA42
murata
CPVCC12
47μF
UCD1E470MCL
Nichicon
CPVCC21
0.1μF
GCM188R11H104KA42
murata
CPVCC22
47μF
UCD1E470MCL
Nichicon
CVREG
0.1μF
GCM188R11H104KA42
murata
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Power Dissipation
(4) 3.99W
(3) 2.80W
(2) 1.70W
(1) 1.10W
Figure 16. Power Dissipation
<Conditions>
・Power dissipation calculated when IC is mounted on a 70mm × 70mm × 1.6mm glass epoxy substrate.
(Power dissipation changes with the copper foil density of the board.)
・The board and the IC’s bottom thermal plate are solder-connected.
Board (1): 1-layer board (copper foil 0mm × 0mm)
Board (2): 2-layer board (copper foil 15mm × 15mm)
Board (3): 2-layer board (copper foil 70mm × 70mm)
Board (4): 4-layer board (copper foil 70mm × 70mm)
Board (1): θja = 113.6 °C/W
Board (2): θja = 73.5 °C/W
Board (3): θja = 44.6 °C/W
Board (4): θja = 31.3 °C/W
At Ta=85°C:
Board (1): Pd = 0.57W
Board (2): Pd = 0.88W
Board (3): Pd = 1.45W
Board (4): Pd = 2.07W
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
I/O Equivalence Circuits
2.VO1M, 3.VO1P, 4.VO2M, 5.VO2P, 6.VO3M, 7.VO3P
8.VO4M, 9.VO4P, 10.VO5M, 11VO5P
Pin24
Pin13
5p
5p
96k
2k
Pin2, 3, 4, 5, 6, 7
50k
50k
86k
2k
Pin8, 9, 10, 11
Pin14
50k
Pin1
50k
Pin14
Pin1 2
Pin16
Pin16
14.VREG
Pin1
15.MUTE1245, 17.MUTE3
Pin1
Pin15, 1 7
50 k
Pin14
50 k
312k
10k
100k
Pin16
Pin16 Pin16
19.IN5, 20.IN4
20 k
×3
×2
Pin18
Pin21, 22, 23
47 k
Pin16
Pin16
Pin16
18.BIAS
50k
Pin16
20k
50k
Pin16
Pin16
Pin16
21.IN3, 22.IN2, 23.IN1
Pin19, 20
47k
Pin16
※Values is typical.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating (Pd) be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of Pd stated in this specification is when the IC
is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. To prevent exceeding the power dissipation rating,
increase the board size and copper area.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. Unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 17. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Ordering Information
B
D
8
2
0
Part Number
5
E
F
V
-
Package
EFV : HTSSOP-B24
M
E
2
Packaging and forming specification
M : High reliability
E2 : Embossed tape and reel
(HTSSOP-B24)
Marking Diagram
HTSSOP-B24 (TOP VIEW)
Part Number Marking
D8205EFV
LOT Number
1PIN MARK
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
HTSSOP-B24
18/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
BD8205EFV-M
Revision History
Date
04.Dec.2014
Revision
001
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Changes
New Release
19/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Similar pages