bu24036mwv e

Datasheet
System Lens Drivers
μ-step System Lens Driver
for Digital Still Cameras
BU24036MWV
●General Description
BU24036MWV is a system Lens Driver that uses μ
-step driving to make the configuration of the
sophisticated, high precision and low noise lens driver
system possible. This IC has a built-in driver for both DC
moor and voice coil motor and a μ-step controller that
decreases CPU power. Therefore, multifunctional lens
can be applied.
●Key Specifications
 I/O Power Supply Voltage:
 Digital Power Supply Voltage:
 Driver Power Supply Voltage:
 Output Current (1ch-4ch,6ch):
 Output Current (5ch):
 Input Clock Frequency:
 FET ON Resistance (1ch,2ch):
 FET ON Resistance (3ch,4ch):
 FET ON Resistance (5ch,6ch):
 Operating Temperature Range:
●Features
 Built-in 6 channels Driver block
1ch-4ch: Voltage control type H-bridge
(Adaptable to STM 2systems)
5ch: Voltage / Current control type H-bridge
6ch: Current control type H-bridge
 Built-in 2 channels PI driving circuit
 Built-in 1 channels Waveforming circuit
 Built-in FLL digital servo circuit
 Built-in PLL circuit
 Built-in STM control circuit : Autonomous control
(cache / updown mode), Clock IN control
●Package
UQFN040V5050
1.62V to 3.6V
2.7V to 3.6V
2.7V to 5.5V
±500mA(Max)
±600mA(Max)
1MHz to 28MHz
2.0Ω(Typ)
1.5Ω(Typ)
1.0Ω(Typ)
-20℃ to +85℃
5.00mm x 5.00mm x 1.00mm
●Applications
 Digital still cameras
UQFN040V5050
●Typical Application Circuit
Example1
DVDD
DVSS
SI
SO
DVDDIO
PIOUT2
PIOUT1
Photo interrupter
VDDAMP
MVCC12
I
MVCC34
MGND56
MGND12
MGND34
SENSE5
RNF5
OUT5A
OUT5B
Logic
1ch
Driver
5ch
Driver
2ch
Driver
SENSE6
3ch
Driver
OUT6A
OUT6B
6ch
Driver
TEST
FCLK
CSB
SCLK
SDATA
STATE11
STATE21
STATE12
STATE22
INA
INB
RNF6
4ch
Driver
OUT1A
OUT1B
M
OUT2A
OUT2B
OUT3A
OUT3B
M
OUT4A
OUT4B
Main Host
○Product structure:Silicon monolithic integrated circuit
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○This product is not designed for protection against radioactive rays
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BU24036MWV
●Pin Configuration
TEST
OUT4B
MGND34
OUT4A
OUT3B
MVCC34
OUT3A
SDATA
CSB
SCLK
(Top view)
30
29
28
27
26
25
24
23
22
21
18
OUT6B
STATE12
34
17
RNF6
SO
35
16
OUT6A
INA
36
15
MGND56
INB
37
14
OUT5B
DVDDIO
38
13
RNF5
DVSS
39
12
OUT5A
DVDD
40
11
SENSE5
1
2
3
4
5
6
7
8
9
10
VDDAMP
33
PIOUT2
STATE22
PIOUT1
SENSE6
OUT2B
19
MGND12
32
OUT2A
FCLK
OUT1B
STATE11
MVCC12
20
OUT1A
31
SI
STATE21
●Pin Description
No.
Pin Name
Power
Supply
Function
No.
Pin Name
Power
Supply
1
SI
DVDD
Waveforming input
21
SCLK
DVDDIO
SCLK logic input
2
OUT1A
MVCC12
1ch Driver A output
22
CSB
DVDDIO
CSB logic input
3
MVCC12
-
1ch, 2ch
Driver power supply
23
SDATA
DVDDIO
SDATA logic input
4
OUT1B
MVCC12
1ch Driver B output
24
OUT3A
MVCC34
3ch Driver A output
5
OUT2A
MVCC12
2ch Driver A output
25
MVCC34
-
3ch, 4ch
Driver power supply
6
MGND12
-
1ch, 2ch Driver ground
26
OUT3B
MVCC34
3ch Driver B output
7
OUT2B
MVCC12
2ch Driver B output
27
OUT4A
MVCC34
4ch Driver A output
8
PIOUT1
DVDD
PI driving output 1
28
MGND34
-
9
PIOUT2
VDDAMP
PI driving output 2
29
OUT4B
MVCC34
4ch Driver B output
10
VDDAMP
-
5ch, 6ch Power supply of
current driver control
30
TEST
DVDDIO
TEST logic input
11
SENSE5
VDDAMP
Negative input for 5ch
current driver
31
STATE21
DVDDIO
STATE21 logic input/output
12
OUT5A
RNF5
5ch Driver A output
32
FCLK
DVDDIO
FCLK logic input
13
RNF5
-
5ch Driver power supply
33
STATE22
DVDDIO
STATE22 logic output
14
OUT5B
RNF5
5ch Driver B output
34
STATE12
DVDDIO
STATE12 logic output
15
MGND56
-
5ch,6ch Driver ground
35
SO
DVDDIO
Waveforming output
16
OUT6A
RNF6
6ch Driver A output
36
INA
DVDDIO
INA logic input
17
RNF6
-
6ch Driver power supply
37
INB
DVDDIO
INB logic input
18
OUT6B
RNF6
6ch Driver B output
38
DVDDIO
-
I/O power supply
19
SENSE6
VDDAMP
Negative input for 6ch
current driver
39
DVSS
-
ground
20
STATE11
DVDDIO
STATE11 logic input/output
40
DVDD
-
Digital power supply
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Function
3ch, 4ch Driver ground
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20.May.2016 Rev.003
BU24036MWV
DVDD
DVDD
DVDD
DVDD
POR
TSD
SI
SO
PIOUT2
PIOUT1
●Block Diagram
DVDD
VDDAMP
MVCC12
MVCC12
PREDRIVER
OUT1A
OUT1B
DVDDIO
DVSS
MGND12
Speed control
Logic
Analog Feed-Back
VDDAMP
MVCC12
MVCC12
SENSE5
DVDD
RNF5
PREDRIVER
DAC5
OUT2A
OUT2B
+
-
RNF5
OUT5A
OUT5B
PREDRIVER
MGND12
Analog Feed-Back
MGND56
Logic
SENSE6
MVCC34
MVCC34
PREDRIVER
OUT3A
OUT3B
VDDAMP
RNF6
DVDD
MGND34
DAC6
+
-
Analog Feed-Back
OUT6A
OUT6B
MVCC34
MVCC34
MGND56
PREDRIVER
OUT4A
OUT4B
MGND34
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STATE22
STATE12
STATE21
STATE11
SDATA
CSB
SCLK
FCLK
INB
INA
TEST
Analog Feed-Back
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20.May.2016 Rev.003
BU24036MWV
●Description of Blocks
Stepping Motor Driver (1ch-4ch Driver)
Built-in stepping motor driver of PWM driving type.
Maximum 2 stepping motors can be driven independently.
Built-in voltage feedback circuit of D-class type.
3ch/4ch drivers can also drive independently for DC motor or voice coil motor.
(1) Control
It corresponds to both the Clock IN and the Autonomous control.
(ⅰ)Clock IN Control
Set the registers for the stepping motor control.
The stepping motor is rotated and synchronized with the input clock in the STATE pin.
It is possible to select the mode of stepping motor control from μ-step, 1-2 phase excitation, 2 phase excitation and
the number of edge for electrical angle cycle from 4, 8, 32, 64, 128, 256, 512 or 1024.
ON/OFF
Direction
Torque
Host
CSB
SCLK
SDATA
3
SIF
(Speed・Amount)
STM
Control
Logic
SIN wave
Control
Logic
PWM
Control
Logic
H.B.
STM
H.B.
STATEx1
(ⅱ)Autonomous Control
The stepping motor is rotated by setting the registers for the stepping motor control.
It is possible to select the mode of stepping motor control from μ-step (1024 portion), 1-2 phase excitation and
2 phase excitation.
ON/OFF
Direction
Speed
Torque
Amount
Host
3
CSB
SCLK
SDATA
MO
STATEx1
BUSY
STATEx2
SIF
STM
Control
Logic
SIN wave
Control
Logic
PWM
Control
Logic
H.B.
STM
H.B.
Cache Method
Built-in Cache registers.
Cache registers enable the setting of subsequent process while the motor is in operation. Through these registers,
operations are done continuously.
The state of rotation command (ACT), state of Cache registers (BUSY), motor operation position (MO), and state of
excitation (MO&EN) are synchronized with the motor rotation and can be selected to be the output of the STATE pin.
Up Down Method
It is possible to set Up, Constant and Down operation before the motor operates.
The state of rotation command (ACT), Cache register (BUSY), motor position (MO), and excitation (MO&EN)
synchronized with the motor rotation are the output of the STATE pin.
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●Description of Blocks
Voltage / Current Driver (5ch Driver)
Built-in voltage driver of PWM driving type / constant current driver.
Built-in digital FLL speed control logic for voltage driver.
(1) Control
(ⅰ)Register Control
■Voltage Driver (at speed control = OFF)
The PWM drive is executed by the PWM duty ratio, the PWM direction and the PWM ON/OFF which are controlled by
the register settings.
Host
PWM duty
Direction
ON/OFF
3
CSB
SCLK
SDATA
SIF
PWM
Control
Logic
H.B.
M
■Voltage Driver (at speed control = ON)
The speed control drive is executed by the target speed value, the direction, the coefficient value of PI filter and the
turning ON/OFF which are controlled by the register settings.
The motor speed is adjusted by comparing the target speed with the motor speed detected at the signal of
photo-interrupter.
Target speed
PI filter
Direction
3
ON/OFF
CSB
SCLK
SDATA
SIF
Host
DCM
Speed control
Logic
PWM
Control
Logic
H.B.
DCM
PI Dr
PI
Comp
■Current Driver
The constant current drive is executed by the output current value, the current direction and the current ON/OFF which
are controlled by the register settings.
Host
Current value
Direction
ON/OFF 3
CSB
SCLK
SDATA
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SIF
Control
Logic
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Current control
DAC
C.C.
VCM
TSZ02201-0M3M0BC16070-1-2
20.May.2016 Rev.003
BU24036MWV
●Description of Blocks
(ⅱ)External Pin Control
■Voltage Driver (only at speed control = OFF)
The PWM drive is executed by the PWM duty ratio which is controlled by the register setting. The PWM direction and
PWM ON/OFF are controlled by INA/INB pin.
PWM duty
3
CSB
SCLK
SDATA
SIF
Host
Direction, ON/OFF
INA
Direction, ON/OFF
INB
PWM
Control
Logic
H.B..
M
■Current Driver
The constant current drive is executed by the output current value which is controlled by the register setting. Constant
current driving direction and turning ON/OFF are controlled by INA/INB pin.
Current value
3
CSB
SCLK
SDATA
SIF
Host
Direction, ON/OFF
INA
Direction, ON/OFF
INB
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Control
Logic
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Current control
DAC
C.C.
VCM
TSZ02201-0M3M0BC16070-1-2
20.May.2016 Rev.003
BU24036MWV
●Description of Blocks
Current Driver (6ch Driver)
Built-in constant current driver.
The voltage of RNF pin and the external resistor (RRNF) determine the amount of output current. The internal
high-precision amplifier (CMOS gate input) is used for the constant current control. If any resistance component exists
in the wirings of RNF pin and the external resistor (RRNF), the precision can be reduced. To avoid this, pay utmost
attention to the wirings.
(1) Control
(ⅰ)Register Control
The constant current drive is executed by the output current value, the current direction and the current ON/OFF which
are controlled by the register settings.
Host
Current value
Direction
ON/OFF 3
CSB
SCLK
SDATA
SIF
Control
Logic
Current control
DAC
C.C.
VCM
(ⅱ)External Pin Control
The constant current drive is executed by the output current value which is controlled by the register setting. Constant
current driving direction and turning ON/OFF are controlled by INA/INB pin.
Current value
CSB
SCLK
3 SDATA
Host
Direction, ON/OFF
INA
Direction, ON/OFF
INB
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SIF
Control
Logic
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Current control
DAC
C.C.
VCM
TSZ02201-0M3M0BC16070-1-2
20.May.2016 Rev.003
BU24036MWV
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Power Supply Voltage
Input Voltage
Input / Output Current
*1
Symbol
Limit
Unit
Remark
DVDDIO
DVDD
-0.3 to +4.5
V
MVCC
-0.3 to +7.0
V
VIN
-0.3 to supply voltage+0.3
V
±500
mA
MVCC12, MVCC34, RNF6
±600
mA
RNF5
+50
mA
PIOUT1
+150
mA
PIOUT2
MVCC12, MVCC34,
VDDAMP
IIN
Storage Temperature Range
TSTG
-55 to +125
℃
Operating Temperature Range
TOPE
-20 to +85
℃
PD
2600
mW
Symbol
Limit
Unit
DVDDIO
1.62 to 3.6
V
Digital Power Supply Voltage
DVDD
2.7 to 3.6
V
DVDD≦MVCC
Driver Power Supply Voltage
MVCC
2.7 to 5.5
V
MVCC12, MVCC34, RNF5
RNF6, VDDAMP
Clock Operating Frequency
FCLK
1 to 28
MHz
Permissible Dissipation
*1
*2
*2
Must not exceed PD.
To use at a temperature higher than Ta=25 C, derate 26mW per 1 C
(At mounting 74.2mm x 74.2mm x 1.6mm / 4 layer Board)
●Recommended Operating Rating (Ta=25℃)
Parameter
I/O Power Supply
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Remark
Reference clock
TSZ02201-0M3M0BC16070-1-2
20.May.2016 Rev.003
BU24036MWV
●Electrical Characteristics
(Unless otherwise specified, Ta25C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
Limit
Parameter
Symbol
Unit
MIN
TYP
MAX
Conditions
<Current Consumption>
Quiescence
CMD_RS=0
ISSDO
-
0
10
μA
(DVDD)
ISSD
-
50
95
μA
(MVCC)
ISSM
-
0
10
μA
-
0.1
1
IDDD
-
6
10
mA CMD_RS=STB=CLK_EN=1
FCLK=24MHz
CLK_DIV setting : 0h
mA No load
Low-level Input Voltage
VIL
DVSS
-
0.3DVDDIO
V
High-level Input Voltage
VIH
0.7DVDDIO
-
DVDDIO
V
Low-level Input Current
IIL
0
-
10
μA VIL=DVSS
High-level Input Current
IIH
0
-
10
μA VIH=DVDDIO
Low-level Output Voltage
VOL
DVSS
-
0.2DVDDIO
V
IOL=1.0mA
High-level Output Voltage
VOH
0.8DVDDIO
-
DVDDIO
V
IOH=1.0mA
PIVO
-
0.15
0.5
V
IIH=30mA
Vth
1.4
1.5
1.6
V
Vth setting : 20h
-
2.0
2.5
Ω
-
1.5
2.0
Ω
Operation
(DVDDIO)
(DVDDIO) IDDDO
(DVDD)
<Logic Block>
<PI Driving Circuit>
Output Voltage
<Waveforming Circuit>
Detective Voltage Error
<Voltage Driver Block 1ch-4ch>
ON-resistance
Ron
IO=±100mA (the sum of high
and low sides, 1ch, 2ch driver)
IO=±100mA (the sum of high
and low sides, 3ch, 4ch driver)
OFF-leak Current
IOZ
-10
0
+10
μA Output HiZ setting
Average Voltage Accuracy
between different Output Pins
Vdiff
-5
-
+5
%
Vdiff setting : 2Bh
Ω
IO=±100mA (the sum of high
and low sides)
<Voltage/Current Driver Block 5ch>
ON-resistance
Ron
-
1.0
1.5
OFF-leak Current
IOZ
-10
0
+10
μA Output HiZ setting
IO
190
200
210
At current driver mode
mA DAC setting : 80h
RRNF=1Ω
ON-resistance
Ron
-
1.0
1.5
OFF-leak Current
IOZ
-10
0
+10
μA Output HiZ setting
IO
190
200
210
mA
Output Current
<Current Driver Block 6ch>
Output Current
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Ω
IO=±100mA (the sum of high
and low sides)
DAC setting : 80h
RRNF=1Ω
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20.May.2016 Rev.003
BU24036MWV
●Typical Performance Curves
(Unless otherwise specified, Ta25C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
80
80
Static Current [uA]
100
Static Current [uA]
100
60
40
20
60
40
20
0
0
2.0
2.5
3.0
3.5
4.0
-50
-25
DVDD [V]
10
8
8
Static Current [uA]
Static Current [uA]
50
75
100
75
100
Figure 2. DVDD Static Current
Temperature Dependency
10
6
4
6
4
2
2
0
0
2.0
25
Ambient Temperature [℃]
Figure 1. DVDD Static Current
Voltage Dependency
1.0
0
3.0
-50
4.0
-25
0
25
50
DVDDIO [V]
Ambient Temperature [℃]
Figure 3. DVDDIO Static Current
Voltage Dependency
Figure 4. DVDDIO Static Current
Temperature Dependency
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BU24036MWV
10
10
8
8
IO=±100mA
Static Current [uA]
Static Current [uA]
●Typical Performance Curves
(Unless otherwise specified, Ta25C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
6
4
IO=±100mA
6
4
2
2
0
0
2.0
3.0
4.0
5.0
-50
6.0
-25
0
25
5
5
4
4
IO=±100mA
3
Ron [Ω]
Ron [Ω]
IO=±100mA
2
3
2
1
1
0
0
4.0
5.0
-50
6.0
-25
0
25
50
75
MVCC [V]
Ambient Temperature [℃]
Figure 7. Output ON-Resistance
MVCC Dependency
(Voltage driver block)
Figure 8. Output ON-Resistance
Temperature Dependency
(Voltage driver block)
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TSZ22111・15・001
100
Figure 6. MVCC Static Current
Temperature Dependency
Figure 5. MVCC Static Current
Voltage Dependency
3.0
75
Ambient Temperature [℃]
MVCC [V]
2.0
50
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100
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BU24036MWV
●Typical Performance Curves
(Unless otherwise specified, Ta25C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
5
5
4
4
IO=±100mA
Ron [Ω]
Ron [Ω]
IO=±100mA
3
2
1
3
2
1
0
0
2.0
3.0
4.0
5.0
6.0
-50
-25
MVCC [V]
0
25
50
75
100
Ambient Temperature [℃]
Figure 9. Output ON-Resistance
MVCC Dependency
(Current driver block)
Figure 10. Output ON-Resistance
Temperature Dependency
(Current driver block)
5
400
4
Output Current [mA ]
Output Voltage [V]
300
3
2
200
100
1
0
0
0
32
64
96
128
32
Serial setting code
96
128
160
192
224
256
Serial setting code
Figure 11. Average Voltage Accuracy
between different output pins
(Voltage driver block)
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TSZ22111・15・001
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Figure 12. Output Current
(Current driver block, RRNF = 1.0Ω, RL = 5.0Ω)
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●Typical Performance Curves
(Unless otherwise specified, Ta25C, DVDDIO=DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
0.20
3000
2600mW
2500
Power Dissipation [mW]
PIOUT [ V]
0.15
0.10
IIH=30mA
0.05
2000
1500
1040mW
1000
500
0.00
85℃
0
2.0
2.5
3.0
3.5
4.0
0
DVDD [V]
50
75
100
125
150
Ambient Temperature [℃]
Figure 13. Output Voltage
DVDD Dependency
(PI driving circuit)
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Figure 14. Power Dissipation Curve
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●Timing Chart
(Unless otherwise specified, Ta=25℃, DVDDIO=DVDD=3.0V)
Parameter
Symbol
SCLK input cycle
SCLK L-level input time
SCLK H-level input time
SDATA setup time
SDATA hold time
CSB H-level input time
CSB setup time
CSB hold time
FCLK input cycle
FCLK L-level input time
FCLK H-level input time
tSCLK
tSCLKL
tSCLKH
tsSDATA
thSDATA
tCSBH
tsCSB
thCSB
tFCLK
tFCLKL
tFCLKH
Specification
More than 100 nsec
More than 50 nsec
More than 50 nsec
More than 50 nsec
More than 50 nsec
More than 380 nsec
More than 50 nsec
More than 50 nsec
More than 36 nsec
More than 18 nsec
More than 18 nsec
0.7DVDDIO
0.3DVDDIO
CSB
tSCLK
thCSB
tSCLKH
tsCSB
tCSBH
tSCLKL thCSB
tsCSB
0.7DVDDIO
0.3DVDDIO
SCLK
tsSDATA
thSDATA
0.7DVDDIO
0.3DVDDIO
SDATA
tFCLKL
tFCLK
tFCLKH
0.7DVDDIO
0.3DVDDIO
FCLK
(note1) FCLK is asynchronous with SCLK.
(note2) Duty of FCLK, SCLK are free.
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●Serial interface
Control commands are framed by a 16-bit serial input (MSB first) and are sent through the CSB, SCLK, and SDATA pins.
The 4 higher-order bits specify addresses, while the remaining 12 bits specify data. Data of every bit is sent through SDATA
pin, which is retrieved during the rising edge of SCLK. Data becomes valid when CSB is Low and is registered during the
rising edge of CSB.
CSB
SCLK
SDATA
x D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Address
x
Data
<Register map>
Address[3:0]
Data[11:0]
15
14
13
12
11
0
0
0
0
A_Mode[1:0]
0
0
0
1
0
0
1
0
0
1
0
0
0
0
1
1
0
1
1
0
1
0
1
1
1
1
0
0
1
1
1
1
0
1
1
0
10
9
8
7
6
5
A_SEL[2:0]
4
3
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
0
1
1
0
A_BEXC
0
0
A_BSL
1
1
A_EN
A_RT
1
2
0
A_Cycle[5:0]
0
0
A_Cycle[13:6]
0
0
0
A_Start_POS[3:0]
A_POS[1:0]
A_AEXC
0
0
A_ASL
0
A_UPDW
_Stop
A_PS
A_Stop
0
0
A_Pulse[9:0] / A_UPDW_Cycle[9:0]
B_Mode[1:0]
B_SEL[2:0]
B_different_output_voltage[6:0]
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
0
1
1
0
B_BEXC
0
0
B_BSL
1
0
0
0
0
0
1
0
1
3_State_CTL[1:0]
3_PWM_Duty[6:0]
1
1
0
4_State_CTL[1:0]
4_PWM_Duty[6:0]
1
1
1
0
B_EN
B_RT
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
1
1
0
0
1
1
1
0
SPC_
Limit_Out
B_Cycle[5:0]
B_Cycle[13:6]
0
0
B_Start_POS[3:0]
3_CHOP[1:0]
B_POS[1:0]
B_AEXC
0
0
0
0
0
B_ASL
4_CHOP[1:0]
B_UPDW
_Stop
B_PS
B_Stop
B_CTL
A_CTL
B_Pulse[9:0] / B_UPDW_Cycle[9:0]
B_ANSEL A_ANSEL
0
0
CacheM
0
0
0
0
0
DET_SEL
0
Chopping[1:0]
Edge
0
0
0
0
0
0
0
5_Mode CLK_EN
0
0
SPEN[1:0]
EXT_CTL[1:0]
CLK_DIV[3:0]
0
0
0
0
PI_CTL2 PI_CTL1
0
0
TARSP[7:0]
PSP[2:0]
0
0
0
0
ISP[2:0]
1
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
1
1
0
0
0
1
0
0
0
1
0
1
0
0
0
Waveform_Vthh[5:0]
1
0
1
1
0
0
Waveform_Vthl[5:0]
1
1
0
0
0
0
Addresses other
than those above
1
A_different_output_voltage[6:0]
SPC_Limit[3:0]
5_IOUT[7:0]
5_PWM_Duty[6:0]
5_CHOP[1:0]
0
0
0
0
0
5_State_CTL[1:0]
6_State_CTL[2:0]
6_IOUT[7:0]
0
STB
0
0
STM_RS CMD_RS
Setting prohibited
(Note 1) The notations A and B in the register map correspond to Ach and Bch respectively. Ach is defined as 1ch and 2ch driver, Bch as 3ch and 4ch driver.
(Note 2) After reset (Power ON reset), the initial condition is saved in all registers.
(Note 3) For Mode, different output voltage, Cycle, EN, and RT registers, data that are written before the access to the Pulse register becomes valid and
determines the rising edge of CSB after the access to the Pulse register.
(The Mode, different output voltage, Cycle, EN, RT, and Pulse registers contain Cache registers. Any registers other than those do not contain Cache
registers.)
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BU24036MWV
●Application Example
3ch / 4ch
μ-step
1ch / 2ch
μ-step
5ch
PWM
6ch
C.C.
STM
STM
VCM
VCM
Auto Focus
Zoom
Iris
Shutter
5ch
PWM
+FLL
6ch
C.C.
1ch / 2ch
μ-step
3ch / 4ch
μ-step
PI
Driver
(2ch)
STM
STM
DCM
VCM
LED
Auto Focus
Iris
Zoom
Shutter
A/F LED
3ch
PWM
+FLL
4ch
PWM
5ch
C.C.
6ch
C.C.
STM
DCM
M
VCM
VCM
Auto Focus
Zoom
etc.
Iris
Shutter
1ch / 2ch
μ-step
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TSZ22111・15・001
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BU24036MWV
●I/O Equivalence Circuit
Pin
Equivalent Circuit Diagram
FCLK
CSB
SCLK
SDATA
INA
INB
STATE11
STATE21
DVDDIO
Pin
Equivalent Circuit Diagram
SI
DVDDIO
DVDD
P
P
DVDDIO
STATE12
STATE22
SO
DVDDIO
DVDDIO DVDDIO
DVDDIO
P
P
PIOUT1
PIOUT2
DVDD
VDDAMP
P
OUT1A
OUT1B
OUT2A
OUT2B
P
OUT3A
OUT3B
OUT4A
OUT4B
MVCC12
P
OUT5A
OUT5B
P
P
OUT6A
OUT6B
RNF5
P
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MVCC34
P
RNF6
P
17/21
P
P
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BU24036MWV
●I/O Equivalence Circuit
Pin
SENSE5
Equivalent Circuit Diagram
Pin
SENSE6
Equivalent Circuit Diagram
VDDAMP
VDDAMP
P
P
TEST
(note1)
DVDDIO
DVDDIO
P
(note1) Short TEST pin to DVSS.
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BU24036MWV
●Operational Notes
1) Absolute maximum ratings
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be
damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you expect that any
voltage or temperature could be exceeding the absolute maximum ratings, take physical safety measures such as
fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI.
2)
GND potential
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Thermal design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (PD) in
actual operating conditions.
4)
Short circuit between pins and malfunctions
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
5)
Operation in strong magnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
6)
Power ON sequence
Set DVDD after the setting of DVDDIO or set it simultaneously. There is no restriction on the setting of MVCC.
To turn ON the DVDD, be sure to reset at CMD_RS register.
7)
Thermal shutdown
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its
operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this
function will always be activated.
8)
PI drive circuit
The output voltage of PIOUT1 should not exceed the voltage of the power supply voltage DVDD.
The output voltage of PIOUT2 should not exceed the voltage of the power supply voltage VDDAMP.
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20.May.2016 Rev.003
BU24036MWV
●Ordering Information
B
U
2
4
0
3
6
Part Number
MWV
-
Package
MWV :
UQFN040V5050
E2
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
●Marking Diagram
UQFN040V5050
(TOP VIEW)
Part Number Marking
U24036
1PIN MARK
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
LOT Number
20/21
TSZ02201-0M3M0BC16070-1-2
20.May.2016 Rev.003
BU24036MWV
●Revision History
Date
Revision
Changes
10.Oct.2012
001
New Release
2.May.2013
002
Update some English words, sentences, descriptions, grammar and formatting.
20.May.2016
003
Correct Pin Description.
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20.May.2016 Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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