TSOP373.., TSOP375.. Datasheet

TSOP373.., TSOP375..
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detectors and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
22531-1
• Insensitive to supply voltage ripple and noise
• Material categorization:
for definitions of compliance
www.vishay.com/doc?99912
please
see
DESCRIPTION
The TSOP373.., TSOP375.. series are miniaturized receiver
modules for infrared remote control systems. A PIN diode
and a preamplifier are assembled on a PCB, the epoxy
package contains an IR filter. The demodulated output
signal can be directly connected to a microprocessor for
decoding.
ORDERING CODE
Taping:
TSOP37...TT - top view taped
TSOP37...TR - side view taped
The TSOP373.. series devices are optimized to suppress
almost all spurious pulses from energy saving lamps like
CFLs. AGC3 may also suppress some data signals if
continuously transmitted.
New designs should prefer the TSOP373.. series containing
the newer AGC3. The TSOP375.. series contain a very
robust AGC5. This series should only be used for critically
noisy environments.
These components have not been qualified according to
automotive specifications.
PARTS TABLE
NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC3)
VERY NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC5)
36 kHz
TSOP37336 (1)
TSOP37536
38 kHz
TSOP37338 (2)(3)(4)(5)
TSOP37538
40 kHz
TSOP37340
TSOP37540
56 kHz
TSOP37356
AGC
Carrier
frequency
TSOP37556
Package
Belobog
Pinning
1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm)
3.95 W x 3.95 H x 0.8 D
Mounting
SMD
Application
Best remote control code
Rev. 1.6, 10-Nov-15
Remote control
(1)
MCIR
(2)
Mitsubishi
1
(3)
RECS-80 Code
(4)
r-map
(5)
XMP-1, XMP-2
Document Number: 82446
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170_5
4, 5
Transmitter
with
TSALxxxx
VS
30 kΩ
R1
IR receiver
VS
Input
OUT
Demodulator
Band
pass
AGC
VO
GND
GND
Control circuit
µC
OUT
2, 3,
6, 7, 8
PIN
+ VS
C1
Circuit
1
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-5
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Supply voltage
TEST CONDITION
VS
-0.3 to +6
V
Supply current
IS
3
mA
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Storage temperature range
Operating temperature range
Power consumption
Tamb ≤ 85 °C
UNIT
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS
2.5
-
5.5
V
VS = 3.3 V, Ev = 0
ISD
0.27
0.35
0.45
mA
Supply voltage
Supply current
UNIT
Ev = 40 klx, sunlight
ISH
-
0.45
-
mA
Ev = 0, IR diode TSAL6200,
IF = 200 mA, test signal see Fig. 1
d
-
45
-
m
Output voltage low
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see Fig. 1
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min.
-
0.12
0.25
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee max.
30
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 75
-
deg
Transmission distance
Rev. 1.6, 10-Nov-15
2
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TSOP373.., TSOP375..
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = f0, t = 10 ms)
0.8
ton, toff - Output Pulse Width (ms)
Ee
t
tpi *)
T
*) tpi ≥ 6/f0 is recommended for optimal function
Output Signal
VO
1)
2)
VOH
14337
3/f0 < td < 9/f0
tpi - 4/f0 < tpo < tpi + 6/f0
ton
0.7
0.6
0.5
toff
0.4
0.3
0.2
λ = 950 nm,
optical test signal, Fig. 3
0.1
0
0.1
VOL
td
1)
tpo
t
2)
Fig. 1 - Output Function
Ee min./Ee - Relative Responsivity
tpo - Output Pulse Width (ms)
0.30
Output pulse width
0.20
0.15
Input burst length
0.10
λ = 950 nm,
optical test signal, Fig. 1
0
0.1
10
100
1000
10 000
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.7
t
600 µs
t = 60 ms
94 8134
Output Signal, (see Fig. 4)
VOH
VOL
t on
t off
1.1
1.3
Fig. 5 - Frequency Dependance of Responsivity
Ee min. - Threshold Irradiance (mW/m2)
600 µs
0.9
f/f0 - Relative Frequency
16925
Optical Test Signal
t
4.0
Correlation with ambient light sources:
2
3.5 10 W/m = 1.4 klx (std. illum. A, T = 2855 K)
10 W/m2 = 8.2 klx (daylight, T = 5900 K)
3.0
2.5
Wavelength of ambient
illumination: λ = 950 nm
2.0
1.5
1.0
0.5
20757
Fig. 3 - Output Function
Rev. 1.6, 10-Nov-15
1.0
10 000
Fig. 2 - Output Pulse Width vs. Irradiance
VO
1000
0.0
1
Ee - Irradiance (mW/m²)
20760
Ee
100
1.2
0.35
0.05
10
Fig. 4 - Output Pulse Diagram
0.40
0.25
1
Ee - Irradiance (mW/m2)
20759
0
0.01
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m2)
Fig. 6 - Sensitivity in Bright Ambient
3
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1.0
f = 100 Hz
0.9
S(λ)rel - Relative Spectral Sensitivity
Ee min. - Threshold Irradiance (mW/m2)
1.0
0.8
f = 10 kHz
0.7
0.6
f = 20 kHz
0.5
0.4
f = 30 kHz
0.3
f = fo
0.2
0.1
0
1
20753
10
100
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750 800 850 900 950 1000 1050 1100 1150
1000
λ - Wavelength (nm)
VsRMS - AC Voltage on DC Supply Voltage (mV)
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
1
Max. Envelope Duty Cycle
0.9
f = 38 kHz, Ee = 2 mW/m²
0.8
-20°
-10°
0°
10°
20°
-30°
0.7
30°
-40°
0.6
40°
-50°
0.5
50°
60°
-60°
0.4
-70°
0.3
TSOP373..
0.2
70°
-80°
80°
0.1
TSOP375..
0
0
20
40
60
80
100
0.1
21947
120
0.3
0.5
0.7
0.9
Burst Length (number of cycles/burst)
Fig. 11 - Directivity
0.30
0.30
Ee min. - Sensitivity (mW/m2)
Ee min. - Threshold Irradiance (mW/m2)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
0.25
0.20
0.15
0.10
0.05
0.25
0.20
0.15
0.10
0.05
0.00
0
-30
-10
10
30
50
70
1
90
Fig. 9 - Sensitivity vs. Ambient Temperature
Rev. 1.6, 10-Nov-15
2
3
4
5
VS - Supply Voltage (V)
Tamb - Ambient Temperature (°C)
Fig. 12 - Sensitivity vs. Supply Voltage
4
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SUITABLE DATA FORMAT
IR Signal
The TSOP373.., TSOP375.. series is designed to suppress
spurious output pulses due to noise or disturbance signals.
The devices can distinguish data signals from noise due to
differences in frequency, burst length, and envelope duty
cycle. The data signal should be close to the device’s
band-pass center frequency (e.g. 38 kHz) and fulfill the
conditions in the table below.
When a data signal is applied to the TSOP373.., TSOP375..
in the presence of a disturbance, the sensitivity of the
receiver is automatically reduced by the AGC to insure that
no spurious pulses are present at the receiver’s output.
Some examples which are suppressed are:
0
• DC light (e.g. from tungsten bulbs sunlight)
5
• Continuous signals at any frequency
10
15
20
Time (ms)
16920
Fig. 13 - IR Signal from Fluorescent Lamp
with Low Modulation
IR Signal
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see Fig. 13 or Fig. 14)
0
16921
5
10
15
20
Time (ms)
Fig. 14 - IR Signal from Fluorescent Lamp
with High Modulation
TSOP373..
TSOP375..
Minimum burst length
6 cycles/burst
6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 35 cycles
≥ 10 cycles
6 to 24 cycles
≥ 10 cycles
35 cycles
24 cycles
> 6 x burst length
> 25 ms
2000
2000
For bursts greater than
a minimum gap time in the data stream is needed of
Maximum number of continuous short bursts/second
MCIR code
Preferred
Yes
RCMM code
Preferred
Yes
XMP-1, XMP-2 code
Suppression of interference from fluorescent lamps
Preferred
Yes
Mild and complex disturbance
patterns are suppressed (example:
signal pattern of Fig. 13 and 14)
Critical disturbance
patterns are suppressed,
e.g. highly dimmed LCDs
Note
• For data formats with long bursts (more than 10 carrier cycles) please see the datasheet for TSOP372.., TSOP374.. .
Rev. 1.6, 10-Nov-15
5
Document Number: 82446
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TSOP373.., TSOP375..
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
4 x 0.75 = 3
Not indicated tolerances ± 0.1
0.475
0.55
(0.7)
(0.95)
(0.3)
(0.3)
technical drawings
according to DIN
specifications
(1.8)
0.75± 0.05
Pinning from topview
6
GND
(GND)
GND
(0.3)
(0.4)
7(2)
8
(8 x)
0.55
0.35± 0.05
1.5
0.15
(GND)
Vs
1
(Vs)
Out
Pin 1 identification
(GND)
0.8
3
2
3
4
5
(2)
(2)
(2)
Proposed pad layout from
component side
(dim. for reference only)
3.95
(3.4)(1)
(2.75)
(0.8)(4x)
(3.95)
3.95
(1)(2.75)
(1)(1.9)
(3.95)
(3)
Pin 1 Identification
marking area
(0.35) (4 x)
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
Notes
(1) Optically effective area
(2) Pins connected internally. It is not necessary to connect externally.
Rev. 1.6, 10-Nov-15
6
Document Number: 82446
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TSOP373.., TSOP375..
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ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
19800
50
100
150
t (s)
200
250
300
max. 2 cycles allowed
ORDERING INFORMATION
ORDERING CODE
TSOP37..TT1
TSOP37..TT2
PACKAGING
Tape and reel
VOLUME (1)
MOQ: 1800 pcs
MOQ: 7000 pcs
REMARKS
3.95 mm x 3.95 mm x 0.75 mm
Note
(1) MOQ: minimum order quantity
Rev. 1.6, 10-Nov-15
7
Document Number: 82446
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TAPING VERSION TSOP37... DIMENSIONS in millimeters
Tape and reel dimensions:
Unreel direction
TT1 Ø 180 ± 2 = 1800 pcs.
TT2 Ø 330 ± 2 = 7000 pcs.
Tape position
coming out from reel
2±
Ø 60 min.
Reel size "Y"
ØY
0.5
Ø 21 ± 0.8
Ø 13 ± 0.2
Label posted here
(12.4)
18.4 max.
Empty leader 400 mm min.
Parts mounted
100 mm min. with cover tape
Leader and trailer tape:
Empty trailer 200 mm min.
Direction of pulling out
Technical drawings
according to DIN
specifications
(Ø 1.5)
(2)
(5.5)
(0.3)
(4)
Drawing-No.: 9.700-5347.01-4
Issue: 1; 14.11.11
Rev. 1.6, 10-Nov-15
12 ± 0.3
(8)
(1.2)
(1.75)
X 2:1
Not indicated tolerances ± 0.1
8
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LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
RECOMMENDED METHOD OF STORAGE
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Aluminum bag
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
Label
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
Reel
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen)
or
15973
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
FINAL PACKING
24 h at 125 °C + 5 °C not suitable for reel or tubes.
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
Rev. 1.6, 10-Nov-15
An EIA JEDEC® standard J-STD-020 level 3 label is included
on all dry bags.
9
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LEVEL
Caution
This bag contains
MOISTURE-SENSITIVE DEVICES
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
3
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
If blank, see adjacent
bar code label
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
260
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
BAR CODE PRODUCT LABEL (example)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
168
a) Mounted within:___________________hours
of factory conditions
If blank, see adjacent bar code label
≤30°C/60% RH, or
b) Stored per J-STD-033
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
22178
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
22650
EIA JEDC standard J-STD-020 level 3 label is included
on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
Rev. 1.6, 10-Nov-15
10
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000