95635.pdf

NOTICE OF REVISION (NOR)
THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.
1. DATE
(YYMMDD)
99-06-01
Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing
data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this
burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense,
Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA
22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.
PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE
GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM.
4. ORIGINATOR
a. TYPED NAME (First, Middle Initial,
Last)
b. ADDRESS (Street, City, State, Zip Code)
Defense Supply Center Columbus
3990 East Broad Street
Columbus, OH 43216-5000
9. TITLE OF DOCUMENT
MICROCIRCUIT, DIGITAL, 16-BIT MICROCONTROLLER, RADIATION
HARDENED, MONOLITHIC SILICON
2. PROCURING
ACTIVITY NO.
3. DODAAC
5. CAGE CODE
67268
6. NOR NO.
5962-R066-99
7. CAGE CODE
67268
8. DOCUMENT NO.
5962-95635
11. ECP NO.
10. REVISION LETTER
a. CURRENT
C
Form Approved
OMB No. 0704-0188
N/A
b. NEW
D
12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES
All
13. DESCRIPTION OF REVISION
Sheet 1:
Revisions ltr column; add “D”.
Revisions description column; add “Changes in accordance with NOR 5962-R066-99”.
Revisions date column; add “99-06-01”.
Revision level block; change from “C” to “D”.
Rev status of sheets; for sheet 1, change from “C” to “D”. For sheets 4 and 28 through 33, add “D”.
Sheets 4: Add new paragraph as follows: “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A
to this document.”
Revision level block; add “D”.
Sheets 28 through 33: Add attached appendix A.
Continued on next sheets.
14. THIS SECTION FOR GOVERNMENT USE ONLY
a. (X one)
X
(1) Existing document supplemented by the NOR may be used in manufacture.
(2) Revised document must be received before manufacturer may incorporate this change.
(3) Custodian of master document shall make above revision and furnish revised document.
b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT
DSCC-VAC
d. TITLE
Chief, Custom Microelectronics Team
15a. ACTIVITY ACCOMPLISHING REVISION
DSCC-VAC
DD Form 1695, APR 92
c. TYPED NAME (First, Middle Initial, Last)
Monica L. Poelking
e. SIGNATURE
Monica L. Poelking
b. REVISION COMPLETED (Signature)
Thanh V. Nguyen
Previous editions are obsolete.
f. DATE SIGNED
(YYMMDD)
99-06-01
c. DATE SIGNED
(YYMMDD)
99-06-01
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 2 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
10. SCOPE
10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices
using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes
consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or
Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
10.2 PIN. The PIN shall be as shown in the following example:
5962
F
Federal
Stock class
designator
RHA
designator
(see 10.2.1)
95653
01
V
9
A
Device
type
(see 10.2.2)
Device
class
designator
(see 10.2.3)
Die
code
Die
Det ails
(see 10.2.4)
Drawing Number
10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A
dash (-) indicates a non-RHA die.
10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
01
HS-RTX2010RH
16-bit microcontroller
radiation hardened, SOS
10.2.3 Device class designator.
Device class
Q or V
Device requirements documentation
Certification and qualification to the die requirements of MIL-PRF-38535.
10.2.4 Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each
product and variant supplied to this appendix.
10.2.4.1 Die Physical dimensions.
Die Types
Figure number
01
A-1
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
28
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 3 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
10.2.4.2 Die Bonding pad locations and Electrical functions.
Die Types
Figure number
01
A-1
10.2.4.3 Interface Materials.
Die Types
Figure number
01
A-1
10.2.4.4 Assembly related information.
Die Types
Figure number
01
A-1
10.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
20. APPLICABLE DOCUMENTS
20.1 Government specifications, standards, bulletin, and handbooks. Unless otherwise specified, the following
specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of
Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
HANDBOOK
DEPARTMENT OF DEFENSE
MIL-HDBK-103 – List of Standard Microcircuit Drawings (SMD’s).
(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific
acquisition functions should be obtained from the contracting activity or as directed by the contracting activity).
20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
29
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 4 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
30. REQUIREMENTS
30.1 Item Requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit or function as described herein.
30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.
30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be
as specified in 10.2.4.2 and on figure A-1.
30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.
30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.
30.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4 of the body of
this document.
30.3 Electrical performance characteristics and post- irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.
30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
40. QUALITY ASSURANCE PROVISIONS
40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The
modifications in the QM plan shall not affect the form, fit or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
30
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 5 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the
manufacturer’s QM plan. As a minimum it shall consist of:
a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007.
b) 100% wafer probe (see paragraph 30.4).
c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010 or the
alternate procedures allowed within MIL-STD-883 TM5004.
40.3 Conformance inspection.
40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see
30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of
packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs
4.4.4.1, 4.4.4.1.1, and 4.4.4.2.
50. DIE CARRIER
50.1 Die carrier requirements. The requirements for the die carrier shall be in accordance with the manufacturer’s QM plan
or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical
and electrostatic protection.
60. NOTES
60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with
MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and
logistics purposes.
60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone
(614)-692-0674.
60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined with
MIL-PRF-38535 and MIL-STD-1331.
60.4 Sources of Supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA
and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
31
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 6 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
FIGURE A-1
o DIE PHYSICAL DIMENSIONS
Die Size:
Die Thickness:
9240 x 9530 microns.
21 2 mils.
o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS
The following metallization diagram supplies the locations and electrical functions of the bonding pads. The internal
metallization layout and alphanumeric information contained within this diagram may or may not represent the actual circuit
defined by this SMD.
NOTE: Pad numbers reflect terminal numbers when placed in case outline Y (see figure 1).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
32
Document No: 5962-95635
Revision: D
NOR No: 5962-R066-99
Sheet: 7 of 7
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-95635
o INTERFACE MATERIALS
7.0kA 1kA
10.0kA 1kA
Metal 1:
Metal 2 (Top):
AlSi
AlSi
Backside Metallization
None
Glassivation
Type:
Thickness
PSG
13kA 1.5kA
Substrate:
Silicon on Sapphire (SOS)
o ASSEMBLY RELATED INFORMATION
Substrate Potential:
Insulator.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-95635
A
REVISION LEVEL
D
SHEET
33
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 99-06-01
Approved sources of supply for SMD 5962-95635 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include
the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has
been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and
QML-38535.
Standard
microcircuit drawing
PIN
Vendor
CAGE
number
Vendor
similar
PIN 1/
5962F9563501V9A
34371
HS0-RTX2010RH-Q
1/ Caution. Do not use this number for item acquisition.
Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
34371
Vendor name
and address
Harris Semiconductor
P.O. Box 883
Melbourne, FL 32902-0883
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
NOTICE OF REVISION (NOR)
THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.
1. DATE
(YYMMDD)
98-11-10
Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing
data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this
burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense,
Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA
22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.
PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE
GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM.
4. ORIGINATOR
a. TYPED NAME (First, Middle Initial,
Last)
b. ADDRESS (Street, City, State, Zip Code)
Defense Supply Center Columbus
3990 East Broad Street
Columbus, OH 43216-5000
9. TITLE OF DOCUMENT
MICROCIRCUIT, DIGITAL, 16-BIT MICROCONTROLLER, RADIATION
HARDENED, MONOLITHIC SILICON
2. PROCURING
ACTIVITY NO.
3. DODAAC
5. CAGE CODE
67268
6. NOR NO.
5962-R014-99
7. CAGE CODE
67268
8. DOCUMENT NO.
5962-95635
11. ECP NO.
10. REVISION LETTER
a. CURRENT
B
Form Approved
OMB No. 0704-0188
N/A
b. NEW
C
12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES
All
13. DESCRIPTION OF REVISION
Sheet 1:
Revisions ltr column; add "C".
Revisions description column; add "Changes in accordance with NOR 5962-R014-99".
Revisions date column; add "98-11-10".
Revision level block; change from “B” to "C".
Rev status of sheets; for sheets 1 and 5, change from “B” to “C”. For sheet 21, add "C".
Sheet 5:
Table I, Low output voltage, VOL, conditions column; change IOL from “4.0 V” to “4.0 mA”
Table I, Input leakage current, II, pre-irradiation limits; change from “-1.0 µA Min.” to “-5.0 µA Min.” and from “1.0 µA Max.”
to “5.0 µA Max.” for subgroups 1 and 3. Change from “-5.0 µA Min.” to “-10.0 µA Min.” and from “5.0 µA Max.”
to “10.0 µA Max.” for subgroup 2. Post-irradiation limits; change from “-5.0 µA Min.” to “-10.0 µA Min.” and from “5.0 µA Max.”
to “10.0 µA Max.” for subgroup 1.
Table I, Standby power suppy current, ICCSB, pre-irradiation limits; change from “500 µA Max.” to “3.0 mA Max.” for subgroups 1 and 3.
Revision level block; change from “A” to "C".
Sheet 21: Table IIA, Interim electrical parameters; delete subgroup 9 for device classes M, Q, and V.
Revision level block; add "C".
14. THIS SECTION FOR GOVERNMENT USE ONLY
a. (X one)
X
(1) Existing document supplemented by the NOR may be used in manufacture.
(2) Revised document must be received before manufacturer may incorporate this change.
(3) Custodian of master document shall make above revision and furnish revised document.
b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT
DSCC-VAC
d. TITLE
Chief, Custom Microelectronics
15a. ACTIVITY ACCOMPLISHING REVISION
DSCC-VAC
DD Form 1695, APR 92
c. TYPED NAME (First, Middle Initial, Last)
Monica L. Poelking
e. SIGNATURE
Monica L. Poelking
b. REVISION COMPLETED (Signature)
Thanh V. Nguyen
Previous editions are obsolete.
f. DATE SIGNED
(YYMMDD)
98-11-10
c. DATE SIGNED
(YYMMDD)
98-11-10
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