DATASHEET

ACS03MS
TM
Radiation Hardened Quad 2-Input
NAND Gate with Open Drain
January 1996
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Features
Pinouts
• Devices QML Qualified in Accordance with MIL-PRF-38535
• Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96703 and Intersil’s QM Plan
14 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T14,
LEAD FINISH C
TOP VIEW
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
• Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day
(Typ)
• SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg
• Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse
• Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse
A1 1
14 VCC
B1 2
13 B4
Y1 3
12 A4
A2 4
11 Y4
B2 5
10 B3
Y2 6
9 A3
GND 7
8 Y3
• Latch-Up Free Under Any Conditions
• Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
• Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current ≤ 1µA at VOL, VOH
• Fast Propagation Delay . . . . . . . . . . . . . . . . 15ns (Max), 10ns (Typ)
Description
The Intersil ACS03MS is a Radiation Hardened quad 2-input NAND gate
with open drain outputs. The open drain output can drive resistive loads
from a separate supply voltage.
14 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP3-F14,
LEAD FINISH C
TOP VIEW
A1
1
14
VCC
B1
2
13
B4
Y1
3
12
A4
A2
4
11
Y4
B2
5
10
B3
Y2
6
9
A3
GND
7
8
Y3
The ACS03MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of a radiation hardened,
high-speed, CMOS/SOS Logic Family.
The ACS03MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a
Ceramic Dual-In-Line Package (D suffix).
Ordering Information
PART NUMBER
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
5962F9670301VCC
-55oC to +125oC
MIL-PRF-38535 Class V
14 Lead SBDIP
5962F9670301VXC
-55oC to +125oC
MIL-PRF-38535 Class V
14 Lead Ceramic Flatpack
ACS03D/Sample
25oC
Sample
14 Lead SBDIP
ACS03K/Sample
25oC
Sample
14 Lead Ceramic Flatpack
ACS03HMSR
25oC
Die
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
Spec Number
File Number
518779
3064.1
ACS03MS
Functional Diagram
An
Yn
Bn
TRUTH TABLE
INPUTS
OUTPUT
An
Bn
Yn
L
L
Z (Note 2), H (Note 3)
L
H
Z (Note 2), H (Note 3)
H
L
Z (Note 2), H (Note 3)
H
H
L
NOTES:
1. L = Low, H = High, Z = High Impedance
2. Without Pull-up Resistor
3. With Pull-up Resistor
2
Spec Number
518779
ACS03MS
Die Characteristics
DIE DIMENSIONS:
68 mils x 79 mils
1730mm x 2010mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm 2
BOND PAD SIZE:
110µm x 110µm
4.3 mils x 4.3 mils
Metallization Mask Layout
ACS03MS
B1
(2)
VCC
(14)
A1
(1)
B4
(13)
Y1 (3)
(12) A4
A2 (4)
(11) Y4
B2 (5)
(10) B3
Y2 (6)
(9) A3
(7)
GND
(8)
Y3
Spec Number
3
518779
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