Datasheet Omnipolar Detection Hall IC (Dual Outputs for both S and N Pole Polarity Detection) BU52075GWZ General Description Key Specifications The BU52075GWZ is omnipolar Hall IC incorporating a polarity determination circuit that enables separate operation (output) of both the South and North poles. The polarity judgment is based on the output processing configuration. This Hall IC product can be in tablets, smart phones, and other applications in order to detect open and close of the cover. And this Hall IC product can be in digital video cameras and other applications involving display panels in order to detect the front/back location or determine the rotational direction of the panel. VDD Voltage Range: Operate Point: Hysteresis: Period: Supply Current (AVG): Output Type: Operating Temperature Range: Package 1.65V to 3.6V ±9.5mT(Typ) 0.9mT(Typ) 50ms(Typ) 5.0µA (Typ) CMOS -40°C to +85°C W(Typ) x D(Typ) x H(Max) 0.80mm x 0.80mm x 0.40mm UCSP35L1 Features Omnipolar Detection (Polarity Detection for both S and N Poles with Separate, Dual Outputs) Micro Power Operation (Small Current Using Intermittent Operation Method) Ultra-compact CSP4 Package (UCSP35L1) Polarity Judgment and Separate Output on both Poles (OUT1=S-pole Output; OUT2=N-pole Output) High ESD Resistance 8kV(HBM) Applications Tablets, Smart Phones, Notebook Computers, Digital Video Cameras, Digital Still Cameras, etc. Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions VDD 0.1µF B1 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH TIMING LOGIC The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. GND VDD LATCH × B2 OUT1 SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL A2 OUT2 A1 GND Pin No. Pin Name Function A1 GND Ground A2 OUT2 Output (React to the north pole) B1 VDD B2 OUT1 (TOP VIEW) A1 (BOTTOM VIEW) A2 A2 A1 B2 B1 Power supply B1 B2 Output (React to the south pole) 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Contents General Description ....................................................................................................................................................1 Features .......................................................................................................................................................................1 Applications ................................................................................................................................................................1 Key Specifications ......................................................................................................................................................1 Package W(Typ) x D(Typ) x H(Max) ........................................................................................................................1 Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions ......................................1 Absolute Maximum Ratings (Ta = 25°C) ...................................................................................................................3 Recommended Operating Conditions (Ta= -40°C to +85°C) ...................................................................................3 Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.80V Ta=25°C)......................................3 Measurement Circuit ..................................................................................................................................................4 Typical Performance Curves .....................................................................................................................................5 Figure 6. Operate Point, Release Point vs Ambient Temperature ......................................................................5 Figure 7. Operate Point, Release Point vs Supply Voltage .................................................................................5 Figure 8. Period vs Ambient Temperature ............................................................................................................5 Figure 9. Period vs Supply Voltage .......................................................................................................................5 Figure 10. Supply Current vs Ambient Temperature ...........................................................................................6 Figure 11. Supply Current vs Supply Voltage.......................................................................................................6 Description of Operations ..........................................................................................................................................7 Intermittent Operation at Power ON .......................................................................................................................10 Magnet Selection ......................................................................................................................................................10 Slide-by Position Sensing ........................................................................................................................................ 11 Position of the Hall Element (Reference) ............................................................................................................... 11 Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) .......... 11 I/O Equivalence Circuit ............................................................................................................................................. 11 Operational Notes .....................................................................................................................................................12 Ordering Information ................................................................................................................................................14 Marking Diagrams .....................................................................................................................................................14 Physical Dimension, Tape and Reel Information ...................................................................................................15 Revision History .......................................................................................................................................................16 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit (Note 1) Power Supply Voltage VDD -0.1 to +4.5 V Output Current IOUT ±0.5 Power Dissipation Pd 0.10 (Note 2) W Operating Temperature Range Topr -40 to +85 °C Storage Temperature Range Tstg -40 to +125 °C mA (Note 1) Not to exceed Pd (Note 2) Mounted on 24mm x 20mm x 1.6mm glass epoxy board. Reduce 1.00mW per 1°C above 25°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Power Supply Voltage Symbol Min Typ Max Unit VDD 1.65 1.80 3.60 V Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.80V Ta=25°C) Parameter Symbol Min Typ Max BopS - 9.5 11.6 BopN -11.6 -9.5 - BrpS 6.5 8.6 - BrpN - -8.6 -6.5 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 ms Output High Voltage VOH VDD -0.2 - - V Output Low Voltage VOL - - 0.2 V IDD(AVG) - 5 8 µA Average IDD(EN) - 2.8 - mA During startup time value IDD(DIS) - 1.8 - µA During standby time value Operate Point mT Release Point mT Hysteresis Period Supply Current Supply Current During Startup Time Supply Current During Standby Time Unit Conditions Output: OUT1 (React to the south pole) Output: OUT2 (React to the north pole) Output: OUT1 (React to the south pole) Output: OUT2 (React to the north pole) mT (Note 3) BrpN<B<BrpS IOUT=-0.5mA (Note 3) B<BopN, BopS<B IOUT=+0.5mA (Note 3) B = Magnetic Flux Density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Measurement Circuit Bop/Brp Tp 200Ω VDD VDD VDD OUT1 /OUT2 100µF GND OUT1 /OUT2 VDD Oscilloscope V GND The period is monitored by an oscilloscope Bop and Brp are measured by applying an external magnetic field Figure 1. Bop,Brp Measurement Circuit Figure 2. Tp Measurement Circuit VOH VDD OUT1 /OUT2 100µF VDD GND IOUT V Figure 3. VOH Measurement Circuit VOL VDD 100µF VDD OUT1 /OUT2 GND V IOUT Figure 4. VOL Measurement Circuit IDD A VDD 2200µF VDD OUT1 /OUT2 GND Figure 5. IDD Measurement Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Typical Performance Curves 12.0 12.0 Bop S 8.0 Brp S VDD=1.8V 4.0 0.0 -4.0 Brp N -8.0 Brp S 8.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] Bop S Ta = 25°C 4.0 0.0 -4.0 -8.0 Brp N Bop N -12.0 Bop N -12.0 -60 -40 -20 0 20 40 60 80 1.4 100 1.8 Figure 6. Operate Point, Release Point vs Ambient Temperature 2.6 3.0 3.4 3.8 Figure 7. Operate Point, Release Point vs Supply Voltage 100 100 VDD=1.8V 90 80 80 70 70 60 60 50 40 50 40 30 30 20 20 10 10 0 0 -60 -40 -20 Ta=25°C 90 Period [ms] Period [ms] 2.2 SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] 0 20 40 60 80 1.4 100 Ambient Temperature [°C] Figure 8. Period vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1.8 2.2 2.6 3.0 Supply Voltage [V] 3.4 3.8 Figure 9. Period vs Supply Voltage 5/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Typical Performance Curves - continued 20.0 20.0 VDD=1.8V Ta=25°C 18.0 16.0 16.0 14.0 14.0 Supply Current [µA] Supply Current [µA] 18.0 12.0 10.0 8.0 6.0 12.0 10.0 8.0 6.0 4.0 4.0 2.0 2.0 0.0 0.0 -60 -40 -20 0 20 40 60 80 100 1.4 Ambient Temperature [°C] 2.2 2.6 3.0 3.4 3.8 Supply Voltage [V] Figure 10. Supply Current vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1.8 Figure 11. Supply Current vs Supply Voltage 6/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Description of Operations Micropower Operation (Small Current Consumption Using Intermittent Sensing) The dual output omnipolar detection Hall IC uses intermittent sensing save energy. At startup the Hall elements, amplifier, comparator, and other detection circuits power on and magnetic detection begins. During standby, the detection circuits power off, thereby reducing current consumption. The detection results are held while standby is active, and then output. IDD Period 50ms Startup Time Standby Time t Reference Period: 50ms (MAX100ms) Reference Startup Time: 48µs Figure 12 (Offset Cancellation) VDD I B × ＋ Hall Voltage － GND Figure 13 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When the Hall elements are connected as shown in Figure 13 and a magnetic field is applied perpendicular to the Hall elements, a voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90° angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. 7/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ (Magnetic Field Detection Mechanism) S N S S N S N Flux Direction Flux Direction Figure 14 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. OUT1 N S S N High OUT1[V] Flux High N S Flux High Low B Brp S N-pole 0 Magnetic Flux Density [mT] Bop S S-pole Figure 15. S-pole Detection The OUT1 pin detects and outputs for the S-pole only. Since the OUT1 pin output is unipolar, the output does not respond to the N-pole. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ OUT2 N S N S S N OUT2[V] Flux High Flux High High Low B Bop N Brp N N-pole 0 Magnetic Flux Density [mT] S-pole Figure 16. N-pole Detection The OUT2 pin detects and outputs for the N-pole only. Since the OUT2 pin output is unipolar, the output does not respond to the S-pole. The dual output omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. The point where magnetic flux density restores a HIGH output is known as the release point, Brp. This detection and adjustment mechanism is designed to prevent noise, oscillation, and other erratic system operation. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Intermittent Operation at Power ON Power ON VDD Startup Time Standby Time Standby Time Startup Time Supply Current (Intermittent Action) Indefinite Interval OUT High (No Magnetic Field Present) Indefinite Interval OUT (Magnetic Field Present) Low Figure 17 The dual output omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Figure 17. The IC outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period of 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period, ambient temperature, and supply voltage. Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment applications. Figure 18 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm x 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Figure 19 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52075GWZ operating point max of 11.6mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 5.5mm, 6.8mm, and 7.7mm, respectively. To increase the magnet’s detection distance, either increases the magnet’s thickness or sectional area. 15 t=3mm Magnetic Flux Density [mT] t=1mm 12 9 t=2mm 6 5.5mm 6.8mm 3 7.7mm 0 0 2 4 6 8 10 12 14 16 18 20 Distance betw een Magnet and Hall IC [mm] Figure 18. Magnetic Flux Density vs Distance between Magnet and Hall IC X Magnet Y t Magnet Material: NEOMAX-44H (Material) Maker: NEOMAX CO.,LTD. t Fig.2 X=Y=4mm Fig.2 BU520t=1mm,2mm,3mm L:BU52011 Variable Fig. Fig.2 HFV Density Measuring Point Magnet Size 11HFV …Flux 2 BU52 Fig. Figure 19. Magnet Dimensions and BU520152 BU520 BU5 011H 15GUL 2011 BU52011HFV FluxFig.2 Density Measuring Point FV GUL BU5 HFV BBU52015GUL B 201 Bop,Brp op,Brp Fig.2 BU52011HFV BU52 1HF op,Brp 温 www.rohm.com BU5 温 度 特温度特性 015G V TSZ02201-0M2M0F414030-1-2 度特性 BU52015GUL © 2014 ROHM Co., Ltd. All rights reserved. 10/16 201 性 UL Bop,Br TSZ22111 • 15 • 001 17.Oct.2014 Rev.001 5GU B p 温度特性 BU5 L op,Br 201 BU52075GWZ Slide-by Position Sensing d A Hall IC L Figure 20 Magnetic Flux Density [mT] Figure 20 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Figure 21, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, the sensor can switch the output ON as the magnet slides by in the process of position detection. Figure 22 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreases compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. 10.0 Flux Magnet Reverse Slide 5.0 B S Flux N Figure 21 0.0 -5.0 -10.0 0 2 4 6 8 10 Horizontal Distance from the Magnet [mm] Figure 22. Magnetic Flux Density vs Horizontal Distance from the Magnet Position of the Hall Element (Reference) UCSP35L1 0.40 0.40 0.25 (UNIT: mm) Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) UCSP35L1 SD Symbol b3 e SE e e b3 SD SE Reference value 0.40 φ0.20 0.20 0.20 (UNIT: mm) I/O Equivalence Circuit OUT1, OUT2 VDD GND The Hall ICs output pins are configured for CMOS (inverter) output removing the need for external resistance and allow direct connection to the host. Removing the need for external resistors allows for reduction of the current that would otherwise flow to the external resistor during magnetic field detection thereby supporting an overall lower current (micropower) operation. Figure 23 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Ordering Information B U 5 2 0 Part Number 7 5 G W Z Package GWZ:UCSP35L1 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams 1PIN MARK UCSP35L1 (TOP VIEW) Part Number Marking G4 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 LOT Number 14/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Physical Dimension, Tape and Reel Information Package Name UCSP35L1(BU52075GWZ) Unit [mm] < Tape and Reel Information > Tape Embossed carrier tape Quantity 6000pcs Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 BU52075GWZ Revision History Date Revision 17.Oct.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/16 TSZ02201-0M2M0F414030-1-2 17.Oct.2014 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. 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