bu21077muv e

Datasheet
Capacitive Controller ICs
Capacitive Switch Controller IC
BU21077MUV
General Description
Key Specifications
BU21077MUV is a capacitive switch controller for switch
operation.
BU21077MUV has programmable MPU and it control the
sensing sequence and how to use value of sensor. It is
possible to reduce operational current with devising a
sensing sequence.
■
■
Input Voltage Range
Operating Temperature Range
2.7 to 5.5V
-20 to +85°C
Package
VQFN020V4040
4.00 ㎜×4.00 ㎜×1.00 ㎜
Features
■
■
■
■
■
Programmable MPU
8 Capacitive Sensor Ports
2-Wire Serial Bus Interface
Single Power Supply
Built-in Power-On-Reset and Oscillator
Applications
■
■
■
■
■
Portable Device such as Smart Phone, PDA.
Electronic Device with Multi Switches
Information Appliance such as Projector
AV Appliance such as Digital TV, HDD Recorder
PC / PC Peripheral Equipment such as Laptop PC
Typical Application Circuit
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Datasheet
BU21077MUV
NC
SIN4
SIN3
NC
15
SIN2
Pin Configurations
11
16
10
SIN1
SIN5
SIN0
SIN6
BU21077MUV
TOP VIEW
AVDD
SIN7
DVDD
TEST
RSTB
INT
SCL
SDA
NC
VSS
6
1
VDD
20
5
Figure 2. Pin Configurations
Pin Descriptions
Pin
No.
Pin Name
1
VDD
Power
Power
-
-
I/O
Equivalent
Circuit
-
2
VSS
Ground
Ground
-
-
-
I/O
Functions
Note
Power
Initial
Condition
3
NC
-
-
-
-
-
4
SCL
In
Host-I/F SCL pin
VDD
Hi-Z
b
5
SDA
InOut
Host-I/F SDA pin
VDD
Hi-Z
b
6
INT
Out
Interrupt output
VDD
Hi-Z
b
7
TEST
In
Test input
VDD
Hi-Z
c
8
SIN7
InOut
Sensor 7
AVDD
Hi-Z
a
9
SIN6
InOut
Sensor 6
AVDD
Hi-Z
a
10
SIN5
InOut
Sensor 5
AVDD
Hi-Z
a
11
NC
-
-
-
-
12
SIN4
InOut
Sensor 4
AVDD
Hi-Z
a
13
SIN3
InOut
Sensor 3
AVDD
Hi-Z
a
14
SIN2
InOut
Sensor 2
AVDD
Hi-Z
a
15
NC
-
16
SIN1
InOut
Fix ‘L’ at the normal operation
-
-
-
-
Sensor 1
-
AVDD
Hi-Z
a
AVDD
Hi-Z
a
-
-
-
17
SIN0
InOut
Sensor 0
18
AVDD
Power
LDO output for analog blocks
19
DVDD
Power
LDO output for digital blocks
20
RSTB
In
Reset bar input
Active ‘L’
-
-
-
VDD
Hi-Z
c
I/O Equivalent Circuits
Figure 3. I/O Equivalent Circuit (a)
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Figure 4. I/O Equivalent Circuit (b)
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Figure 5. I/O Equivalent Circuit (c)
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Datasheet
BU21077MUV
Block Diagram
Figure 6. Block Diagram
Description of Blocks
●Sensor AFE, C/V Converter
Convert from capacitance to voltage for each sensor.
●A/D Converter
Convert from analog value to digital value.
●LDO25
2.5V output LDO for Sensor AFE, C/V Converter, and A/D converter.
●LDO15
1.5V output LDO for OSC and Logic blocks.
●OSC
Oscillator.
●POR
Power-On-Reset for system reset.
●MPU
Control sensor and sequence by program.
●PRAM
8kbyte Program RAM of MPU. It needs to download program from host.
●WRAM
Working RAM for MPU.
●HOST I/F
2-wire serial bus interface compatible with I2C protocol.
●AFE Control
Control sequencer for Sensor AFE, C/V Converter, and A/D Converter.
●WDTR
Watchdog timer reset. It issues a reset when the MUP is hang-upped.
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Datasheet
BU21077MUV
Absolute Maximum Ratings
(Ta = 25°C)
Parameter
Power Supply Voltage
Symbol
Rating
Unit
VDD
-0.5 to +7.0
V
Input Voltage
VIN
-0.5 to VDD + 0.3
V
Operating Temperature Range
Topr
-20 to +85
°C
Storage Temperature Range
Tstg
-55 to +125
°C
Power Dissipation
Pd
0.55
Maximum Junction Temperature
T jmax
(Note 1)
W
125
°C
(Note 1) Derate by 5.5mW/°C when operating above Ta=25°C (mounted in 1-layer 74.2×74.2×1.6mm board with 10.22mm2 surface capper area)
Pd of IC is 0.27W and derate by 2.7mW/°C when operating above Ta=25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Condition
(Ta = -20 to +85°C)
Parameter
Power Supply Voltage
Symbol
Rating
Unit
VDD
2.7 to 5.5
V
Electrical Characteristics
(Ta = 25°C, VDD = 3.3V, VSS = 0V)
Symbol
Min
Typ
Max
Input High Voltage
VIH
Input Low Voltage
VIL
VDD x 0.7
-
VDD + 0.3
V
VSS - 0.3
-
VDD x 0.3
V
Output High Voltage
Output Low Voltage
VOH
VDD - 0.5
-
VDD
V
IOH = -4mA
VOL
VSS
-
VSS + 0.5
V
IOL = +4mA
OSC Frequency 1
fOSC1
45
50
55
MHz
OSC Frequency 2
fOSC2
51.2
64
76.8
kHz
DVDD Voltage
VDVDD
1.35
1.50
1.65
V
AVDD Voltage
VAVDD
2.40
2.50
2.60
V
Parameter
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Unit
Conditions
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Datasheet
BU21077MUV
Host Interface
BU21077MUV has 2-wire serial bus interface. It is compatible with I2C protocol and BU21077MUV is a slave device.
Slave address of BU21077MUV is 5Ch (Shown 7-bit). And it supports Standard-mode (100 KHz) and Fast-mode (400
kHz). It has sequential read for reduce access time.
SDA
SCL
SDA
SCL
1-7
8
9
1-7
8
9
8
1-7
9
S
P
R/W
START Address
Address R/W
ACK
START
ACK
Data
Data
ACK
ACK
Data
Data
ACK
NACK
/ ACK
STOP
STOP
Figure 7. 2-wire Serial Bus Interface Data Format
Figure 8. 2-wire Serial Bus Interface Timing Chart
Parameter
Symbol
SCL Clock Frequency
Standard-mode
Min
Max
Fast-mode
Min
Max
Unit
fSCL
0
100
0
400
kHz
tHD;STA
4.0
-
0.6
-
μs
Low Period of SCL
tLOW
4.7
-
1.3
-
μs
High Period of SCL
tHIGH
4.0
-
0.6
-
μs
Data Hold Time
tHD;DAT
0.1
3.45
0.1
0.9
μs
Data Setup Time
tSU;DAT
0.25
-
0.1
-
μs
Setup Time for Repeated Start Condition
tSU;STA
4.7
-
0.6
-
μs
Setup Time for STOP Condition
tSU;STO
4.0
-
0.6
-
μs
tBUF
4.7
-
1.3
-
μs
Hold Time for ( Repeated ) START Condition
Bus Free Time Between STOP and START Condition
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Datasheet
BU21077MUV
●Byte Write
S
T
A
R
T
Slave Address
=0x5C
WA
R C
I K
T
E
S S S S S S S
A A A A A A A
6 5 4 3 2 1 0
Register Address
(n)
R R R R R R R R
A A A A A A A A
7 6 5 4 3 2 1 0
A Write Data
C to Register
K (Register Address
=n)
A S
C T
K O
P
SA : Slave Address
RA : Register Address
RD : Read Data
WD : Write Data
W W W W W W W W
D D D D D D D D
7 6 5 4 3 2 1 0
●Random Read
S
T
A
R
T
Slave Address
=0x5C
WA
R C
I K
T
E
S S S S S S S
A A A A A A A
6 5 4 3 2 1 0
A S Slave Address
C T =0x5C
K A
R
T
R R R R R R R R
S S S S S S S
A A A A A A A A
A A A A A A A
7 6 5 4 3 2 1 0
6 5 4 3 2 1 0
R A Read Data
E C from Register
A K (Register Address
D
=n)
A S Slave Address
C T =0x5C
K A
R
T
R R R R R R R R
S S S S S S S
A A A A A A A A
A A A A A A A
7 6 5 4 3 2 1 0
6 5 4 3 2 1 0
R A Read Data
E C from Register
A K (Register Address
D
=n)
Register Address
(n)
N
A
C
K
S
T
O
P
R R R R R R R R
D D D D D D D D
7 6 5 4 3 2 1 0
●Sequential Read
S
T
A
R
T
Slave Address
=0x5C
S S S S S S S
A A A A A A A
6 5 4 3 2 1 0
WA
R C
I K
T
E
Register Address
(n)
R R R R R R R R
D D D D D D D D
7 6 5 4 3 2 1 0
A
C
K
A
C
K
R
D
7
R
D
0
Read Data
from Register
(Register Address
=n+x)
N
A
C
K
S
T
O
P
R R R R R R R R
D D D D D D D D
7 6 5 4 3 2 1 0
Figure 9. 2-wire Serial Bus Protocol
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Datasheet
BU21077MUV
Power on Sequence
The power supply pin is only VDD. AVDD and DVDD are generated by built-in LDO, these are not necessary to supply
from external.
When the voltage level of RSTB change form low to High after VDD supplying, LDO is wakeup and DVDD voltage is
raised. And built-in power on reset (POR) circuit release the system reset and host interface is enable After DVDD
voltage reach the normal voltage range.
RSTB pin can not need to be controlled by host and connects to the VDD, because the BU21077MUV has POR circuit. If
the RSTB pin is connected to the VDD, the system reset is release automatically after VDD supplying.
VDD
Recommended Value of External Capacitors
C1
0.1uF
Decoupling capacitor for VDD
C2
1.0uF
Decoupling capacitor for DVDD
C3
2.2uF
Decoupling capacitor for AVDD
VDD
AVDD
DVDD
C1
C3
BU21077MUV
C2
VSS
GND
Figure 10. Arrangement of External Capacitors
Figure 11. Power on Sequence (Controlled RSTB)
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Figure 12. Power on Sequence (VDD Shorted RSTB)
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Datasheet
BU21077MUV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
2
the IC is mounted on a 74.2mm x 74.2mm x 1.6mm glass epoxy board with 10.22mm copper areas. In case of
exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd
rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
BU21077MUV
Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input terminals
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input terminals have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Datasheet
BU21077MUV
Ordering Information
B
U
2
1
0
7
7
M
U
V
-
Package
MUV: VQFN020V4040
Part Number
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN020V4040 (TOP VIEW)
Part Number Marking
BU
LOT Number
2 1 0 7 7
1PIN MARK
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Datasheet
BU21077MUV
Physical Dimension, Tape and Reel Information
Package Name
VQFN020V4040
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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Datasheet
BU21077MUV
Revision History
Date
Revision
29.Aug.2013
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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