bh1745nuc e

Datasheet
Ambient light sensor ICs
Digital 16bit Serial Output Type
Color Sensor IC
BH1745NUC
General Description
Key Specifications
BH1745NUC is digital color sensor IC with I2C bus
interface. This IC senses Red, Green and Blue light
(RGB) and converts them to digital values. The high
sensitivity, wide dynamic range and excellent Ircut
characteristics makes this IC the most suitable to obtain
the illuminance and color temperature of ambient light
for adjusting LCD backlight of TV, mobile phone and
tablet PC. It is possible to detect very wide range light
intensity. (0.005 – 40k lx)





VCC Voltage Range:
Maximum Sensitivity:
Current Consumption:
Standby Mode Current:
Operating Temperature Range:
Package(s)
WSON008X2120
2.3V to 3.6V
0.005Lx/step
130μA (Typ)
0.8μA (Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
2.10mm x 2.00mm x 0.6mm
Features









The Excellent Ircut Characteristics with an Ircut Filter
The High Sensitivity and Wide Dynamic Range
(0.005 – 40k lx)
Supports Low Transmittance (Dark) Window
2
Correspond to I C Bus Interface ( f/s mode support )
Low Current by Power Down Function
Rejecting 50Hz/60Hz Light Noise
Correspond to 1.8V Logic Interface
Programmable Interrupt Function
2
It is possible to select 2 type of I C bus slave address.
(ADDR =’L’: “0111000”, ADDR =’H’: “0111001”)
WSON008X2120
Applications
LCD TV, Mobile phone, NOTE PC, Tablet PC, Portable
game machine, Digital camera, Digital video camera,
PDA, LCD display
Typical Application Circuits
1.8V – 3.6V
2.3V – 3.6V
(ex. 0.1µF)
ADC
ADC Logic
+
GREEN
2
I C Interface
ADC
+
SDA
SDA
SCL
SCL
1.65V – 5.5V
Micro
Controller
or
Baseband
Processor
INT Interface
ADC
INT
RED
IRCUT FILTER
BLUE
VCC
INT
CLEAR
ADDR
ADDR
ADC
TEST
OSC
POR
TEST
GND
○Product structure:Silicon monolithic integrated circuit.
○This product is not designed protection against radioactive rays.
○This product does not include laser transmitter.
○This product does not include optical load.
○This product includes Photo detector, ( Photo Diode ) inside of it.
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BH1745NUC
Pin Configuration
TOP VIEW
ADDR
1
8
NC
VCC
2
7
INT
GND
3
6
SDA
TEST
4
5
SCL
Pin Description
Pin No.
Pin Name
Function
2
1
ADDR
2
VCC
I C bus slave address terminal
Power supply terminal
3
GND
GND terminal
4
TEST
Test terminal. Connect to GND.
5
SCL
I C bus Interface SCL terminal.
6
SDA
7
INT
8
NC
I C bus Interface SDA terminal.
Nch open drain output.
Interrupt setting is defined by internal register. Register value is
2
possible to configure by I C bus.
Non connect (Open).
2
2
Block Diagram
ADC
ADC Logic
PD
+
GREEN
2
I C Interface
ADC
SDA
SCL
+
PD
INT Interface
ADC
RED
IRCUT FILTER
BLUE
VCC
INT
PD
CLEAR
ADDR
ADC
TEST
PD
OSC
POR
GND
Description of Blocks
・Ircut Filter
This filter passes visible light and blocks infrared light.
・RED, GREEN, BLUE, CLEAR
Red, Green, Blue, and Clear color pass filter
・PD
Photodiodes (PD) convert light into current.
・ADC
AD converter for obtaining digital 16bit data.
2
・ADC Logic + I C Interface + INT Interface
2
ADC control logic and I C bus Interface and Interrupt function Interface.
・OSC
Internal oscillator (typ 720 kHz). It is clock for internal logic.
・POR
Power on reset. All registers are reset after VCC is supplied.
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
VCCMAX
-0.3 to +4.5
V
VADDRMAX,VSDAMAX,
VSCLMAX, VTESTMAX
-0.3 to +4.5
V
VINTMAX
7
V
Operating Temperature
TOPR
-40 to +85
°C
Storage Temperature
TSTG
-40 to +100
°C
INT, SDA Sink Current
IMAX
7
mA
Power Dissipation
PD
0.40
VCC, Supply Voltage
ADDR, SDA, SCL, TEST Terminal Voltage
INT Terminal Voltage
(Note 1)
W
(Note 1) Reduce by 5.33mW/°C over 25°C, when mounted on 2-layer PCB of 114.3mm × 76.2mm × 1.6mm.
PCB incorporates thermal via. Copper foil area on the reverse side of PCB : 74.2mm×74.2mm
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
VCC Voltage
VCC
2.3
2.5
3.6
V
INT Terminal Voltage
VINT
-
-
5.5
V
SDA,SCL Terminal Voltage
VI2C
-
-
3.6
V
Electrical Characteristics (Unless otherwise specified, VCC=2.5V, Ta=25°C, Registers are default value)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC1
-
130
250
µA
MODE_CONTROL2(42h)=10h,
*(Note 2)
Ev = 100 lx
Standby Mode Current
ICC2
-
0.8
1.5
µA
No Input Light
Red Data Count Value
DRED
3400
4000
4600
count
MODE_CONTROL2(42h)=12h,
2 (Note 3)
EV = 20µW/cm
DGREEN
2847
3350
3853
count
MODE_CONTROL2(42h)=12h,
2 (Note 4)
EV = 20µW/cm
Blue Data Count Value
DBLUE
2014
2370
2726
count
Clear Data Count Value
DCLEAR
128
160
192
count
Dark Count Value
S0_0
0
0
3
count
RGBC Data Update Period
TINT
-
160
225
msec
INT Output ‘L’ Voltage
VINTL
0
-
0.4
V
SCL SDA Input 'H' Voltage
VIH
1.26
-
-
V
SCL SDA Input 'L' Voltage
VIL
-
-
0.54
V
SCL SDA Input 'H'/’L’ Current
IIHL
-10
-
10
µA
VOL
0
-
0.4
V
ADDR Input 'H' Voltage
VADDRH
VCC*0.7
-
-
V
ADDR Input 'L' Voltage
VADDRL
-
-
VCC*0.3
V
Green Data Count Value
2
I C SDA Output 'L' Voltage
MODE_CONTROL2(42h)=12h,
2 (Note 5)
EV = 20µW/cm
MODE_CONTROL2(42h)=12h,
2 (Note 4)
EV = 20µW/cm
MODE_CONTROL2(42h)=12h,
No input light
MODE_CONTROL2(42h)=10h
IINT = 3mA
IOL = 3mA
(Note 2) White LED is used as optical source.
(Note 3) Red LED is used as optical source.
(Note 4) Green LED is used as optical source.
(Note 5) Blue LED is used as optical source.
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2
I C Bus Timing Characteristics (Unless otherwise specified VCC=2.5V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
fSCL
0
-
400
kHz
tHD;STA
0.6
-
-
µs
2
tLOW
1.3
-
-
µs
2
tHIGH
0.6
-
-
µs
tSU;STA
0.6
-
-
µs
2
tHD;DAT
0
-
-
µs
2
tSU;DAT
100
-
-
ns
2
tSU;STO
0.6
-
-
µs
tBUF
1.3
-
-
µs
2
tVD;DAT
-
-
0.9
µs
2
tVD;ACK
-
-
0.9
µs
2
I C SCL Clock Frequency
Conditions
2
I C Hold Time ( Repeated ) START
Condition
I C 'L' Period of the SCL Clock
I C 'H' Period of the SCL Clock
2
I C Set up time for a Repeated
START Condition
I C Data Hold Time
I C Data Setup Time
I C Set up Time for STOP Condition
2
I C Bus Free Time between a STOP
and START Condition
I C Data Vaild Time
I C Data Vaild Acknowledge Time
tSU;DAT
1.26V
S DA
0.54V
・・・
cont.
0.54V
tHD ;DAT
tVD ;DAT
tHIGH
1.26V
S CL
1.26V
0.54V
tHD ;STA
S
0.54V
1.26V
1.26V
0.54V
・・・
cont.
0.54V
tLOW
1/fSCL
9 th clock
1 st clock cycle
tBUF
・ ・ ・ S DA
tSU;STA
tVD ;ACK
tHD ;STA
tSU;STO
1.26V
・ ・ ・ S CL
0.54V
Sr
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Typical Performance Curves
1.0
10
Blue
Green
8
Red
Calculated Illuminance [lx]
Sensitivity Ratio
0.8
0.6
0.4
Clear
0.2
4
2
0.0
400
6
0
500
600
700 800 900
Wavelength [nm]
1000 1100
-40
0
20
40
Ta [ ℃ ]
60
80
100
Figure 2. Temperature Dependency of
Dark ( 0 lx ) Sensor out from RGBC
(MODE_CONTROL2=10h)
Figure 1. RGBC Spectral Response
1.2
1.2
1.0
1.0
0.8
0.8
-
0.6
1pin
+
Ratio
Ratio
-20
0.4
0.6
0.4
-
-
-
+
+
1pin
+
0.2
0.2
0.0
0.0
-90
-60
-30
0
30
60
90
Angle [deg]
-60
-30
0
30
60
90
Angle [deg]
Figure 3. Directional Characteristics 1
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-90
Figure 4. Directional Characteristics 2
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Typical Performance Curves
- continued
8000
Fluorescent
Light
White LED
1.00
7000
1.06
Incandescent
Light (Dimming)
0.98
Halogen Light
1.06
White LED
1.03
Calculated CCT [K]
Fluorescent light
Incandescent
Light
6000
5000
4000
Incandescent light
Halogen light
3000
Incandescent light
(Dimming)
2000
0.0
0.5
1.0
1.5
2.0
4000
6000
8000
CCT [K]
Ratio
Figure 5. Light Source Dependency of
lx calculation from RGBC
(Fluorescent Light is set to “1”)
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2000
Figure 6. Light Source Dependency of
CCT calculation from RGBC
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Command Set
Address
TYPE
Default
Register Name
Register Function
40h
RW
0Bh
SYSTEM_CONTROL
System control
41h
RW
00h
MODE_CONTROL1
Function setting
42h
RW
00h
MODE_CONTROL2
Function setting
44h
RW
00h
MODE_CONTROL3
Function setting
50h
R
00h
RED_DATA_LSBs
Low byte of RED
51h
R
00h
RED_DATA_MSBs
High byte of RED
52h
R
00h
GREEN_DATA_LSBs
Low byte of GREEN
53h
R
00h
GREEN_DATA_MSBs
High byte of GREEN
54h
R
00h
BLUE_DATA_LSBs
Low byte of BLUE
55h
R
00h
BLUE_DATA_MSBs
High byte of BLUE
56h
R
00h
CLEAR_DATA_LSBs
Low byte of CLEAR
57h
R
00h
CLEAR_DATA_MSBs
High byte of CLEAR
58h
R
00h
DINT_DATA_LSBs
Low byte of Internal Data
59h
R
00h
DINT_DATA_MSBs
High byte of Internal Data
60h
RW
00h
INTERRUPT
Interrupt setting
61h
RW
01h
PERSISTENCE
Persistence setting
62h
RW
FFh
TH_LSBs
Higher threshold low byte
63h
RW
FFh
TH_MSBs
Higher threshold high byte
64h
RW
00h
TL_LSBs
Lower threshold low byte
65h
RW
00h
TL_MSBs
Lower threshold high byte
92h
R
E0h
MANUFACTURER ID
Manufacturer ID
○ SYSTEM_CONTROL ( 40h )
Field
Bit
TYPE
SW reset
7
RW
INT reset
6
RW
5:0
R
Part ID
Description
0 : initial reset is not started
1 : initial reset is started
0 : INT pin status is not initialized.
1 : INT pin become inactive ( high impedance )
001011
Default value 0Bh
○ MODE_CONTROL1 ( 41h )
Bit
TYPE
Description
Reserved
Field
7:3
RW
Measurement
time
2:0
RW
Write 000000
RGBC Measurement time. RGBC each data are updated by the following
time.
000 : 160msec
001 : 320msec
010 : 640msec
011 : 1280msec
100 : 2560msec
101 : 5120msec
110 : Forbidden to use
111 : Forbidden to use
Default value 00h
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○ MODE_CONTROL2 ( 42h )
Field
Bit
TYPE
7
R
Reserved
6:5
RW
RGBC_EN
4
RW
Reserved
3:2
RW
ADC GAIN
1:0
RW
VALID
Description
0 : RGBC data is not updated after last writing MODE_CONTROL1,2,3
register or last reading MODE_CONTROL2 register.
1 : RGBC data is updated after last writing MODE_CONTROL1,2,3 register
or last reading MODE_CONTROL2 register.
Write 00
0 : RGBC measurement is inactive and becomes power down.
1 : RGBC measurement is active.
Write 00
GAIN setting for RGBC measurement.
00 : 1X
01 : 2X
10 : 16X
11 : Forbidden to use
Default value 00h
○ MODE_CONTROL3 ( 44h )
Field
MODE_CONTROL3
Bit
7:0
TYPE
RW
Description
Write 02h.
Default value 00h
○ RED_DATA_LSBs ( 50h )
Register
RED_DATA_LSBs
TYPE
R
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ RED_DATA_MSBs ( 51h )
Register
RED_DATA_MSBs
TYPE
R
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
○ GREEN_DATA_LSBs( 52h )
Register
GREEN_DATA_LSBs
TYPE
R
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ GREEN_DATA_MSBs( 53h )
Register
GREEN_DATA_MSBs
TYPE
R
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
○ BLUE_DATA_LSBs ( 54h )
Register
BLUE_DATA_LSBs
TYPE
R
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ BLUE_DATA_MSBs ( 55h )
Register
BLUE_DATA_MSBs
TYPE
R
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
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○ CLEAR_DATA_LSBs( 56h )
Register
TYPE
CLEAR_DATA_LSBs
R
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ CLEAR_DATA_MSBs( 57h )
Register
TYPE
CLEAR_DATA_MSBs
R
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
○ DINT_DATA_LSBs( 58h )
Register
TYPE
Reserved
R
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ DINT_DATA_MSBs( 59h )
Register
TYPE
Reserved
R
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
DINT registers output data for internal calculation of BH1745NUC. This register is unnecessary to read. It is used for IC
Test only.
○ INTERRUPT ( 60h )
Field
Bit
TYPE
7
R
6:5
R
4
RW
3:2
RW
Reserved
1
RW
INT ENABLE
0
RW
INT STATUS
Reserved
INT LATCH
INT SOURCE
Description
INT STATUS of RGBC
0 : Interrupt signal is inactive
1 : Interrupt signal is active
Reserved
0 : INT pin is latched until INTERRUPT register is read or initialized.
1 : INT pin is updated after each measurement.
INT source select
00 : Red channel
01 : Green channel
10 : Blue channel
11 : Clear channel
Write 0
0 : INT pin disable.
1 : INT pin enable.
Default value 00h
○ PERSISTENCE ( 61h )
Field
Bit
TYPE
Description
Reserved
7:2
R
PERSISTENCE
1:0
RW
Reserved
Interrupt persistence function.
00 : Interrupt status is toggled at each measurement end.
01 : Interrupt status is updated at each measurement end.
10 : Interrupt status is updated if 4 consecutive threshold judgments are
the same.
11 : Interrupt status is updated if 8 consecutive threshold judgments are
the same.
Default value 01h
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○ TH_LSBs ( 62h )
Register
TH_LSBs
TYPE
RW
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value FFh
○ TH_MSBs ( 63h )
Register
TH_MSBs
TYPE
RW
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value FFh
○ TL_LSBs ( 64h )
Register
TL_LSBs
TYPE
RW
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
2
2
2
2
2
2
2
2
0
Default value 00h
○ TL_MSBs ( 65h )
Register
TL_MSBs
TYPE
RW
7
2
15
6
2
14
5
2
13
4
2
12
3
2
11
2
2
10
1
0
9
2
2
8
Default value 00h
○ MANUFACTURER ID ( 92h )
Register
Manufacturer ID
TYPE
7
6
5
4
3
2
1
0
R
1
1
1
0
0
0
0
0
Default value E0h
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Explanation of Software Reset Command
All registers are reset and BH1745NUC becomes power down by Software reset command.
Explanation of Accessing MODE_CONTROL
If master Writes to MODE_CONTROL1(41h), MODE_CONTROL2(42h) and MODE_CONTROL3(44h) register,
RGBC measurement currently in progress is interrupted immediately and re-started from the beginning,
and VALID register returns to ‘L’. When the re-started measurement is finished, VALID register turns to ‘H’.
Power on Sequence
Please note the below behavior when application design.
1) Power on time: t1
"t1" should be more than 2ms. The IC becomes active state after 2ms by which VCC voltage goes beyond 2.0V from
less than 0.4V.
2) Power off time: t2
"t2" should be more than 1ms. The period that VCC is less than 0.4V should be more than 1ms before power supply.
* "active state" means the state that the IC operates correctly.
When power supply, INT terminal is hi-impedance state.
Once VCC goes below 2.0V, power supply sequence should follow below sequence.
2.0V
VCC
0.4V
t1
t2
t1
BH1745NUC
Undefined behavior
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BH1745NUC
2
I C Bus Communication
1) Slave address "0111000" (ADDR = ‘L’) or “0111001” (ADDR = ‘H’)
2) Main write format
1. Case of Indicate register address
ST
2.
Slave Address
W
0
ACK
Indicate register address
ACK
SP
Case of write to data register after indicating register address
ST
Slave Address
Data specified at register
address field
W
0
ACK
ACK
・・・・・・
ACK
Indicate register address
ACK
Data specified at register
address field + N
ACK
SP
BH1745NUC continues to receive data with address increments until master issues stop condition.
Write cycle is 40h - 41h - 42h - 43h …57h - 58h - 59h …FFh - 00h - 01h …3Fh - 40h……
All registers are included in write-chain.
Ex) If register address field is 42h, then BH1745NUC writes data like seeing in below.
42h - 43h - 44h - 45h - 46h ……… 3Eh - 3Fh - 40h……. It is continued until master issues stop condition.
*There is no registers in address 00h-3Fh, 43h, 45h – 4Fh, 5Ah – 5Fh and 66h – 91h, 93h-FFh, but it is necessary to
access these registers when writing some data with address increments. It is recommended to access 40h – 42h, 50h
– 50h – 57h and 60h – 65h individually.
3) Main read format
1. Case of read data after indicate register address (Master issues restart condition)
ST
ST
Slave Address
Slave Address
Data specified at register
address field + 1
W
0
ACK
R
1
ACK
ACK
・・・・・・
Slave Address
R
1
ACK
Data specified at register
address field + 1
ACK
・・・・・・
Indicate register address
Data specified at register address
field
ACK
Data specified at register
address field + N
ACK
ACK
NACK
SP
2. Case of read data
ST
Data specified at register address
field
ACK
Data specified at register address
field + N
ACK
NACK
SP
BH1745NUC outputs data from specified address field until master issues stop condition.
Read cycle is 40h - 41h - 42h - 43h …57h - 58h - 59h …FFh - 00h - 01h …3Fh - 40h……
All registers are included in read-chain.
Ex) If register address field is 50h, then BH1745NUC outputs data like seeing in below.
50h – 51h - 52h ……FFh – 00h - 01h…3Fh - 40h… It is continued until master issues stop condition.
*There is no registers in address 00h-3Fh, 43h, 45h – 4Fh, 5Ah – 5Fh and 66h – 91h, 93h-FFh, but it is necessary to
access these registers when reading data with address increments. It is recommended to access 40h – 44h, 50h – 50h
– 57h, 60h – 65h and 92h individually. When master access to register address that does not exists, FFh is read.
from slave to master
from master to slave
2
*BH1745NUC operates as I C bus slave device.
2
*Please refer formality I C bus specification of NXP semiconductor
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Interrupt Function
Interrupt function compares the measurement result selected from RGBC data by INT SOURCE register (60h<3:2>) to
preset interrupt threshold level. Interrupt status is monitored by INT pin. Interrupt function is able to be controlled by
INTERRUPT register (60h).
Interrupt persistence is defined at PERSIST register (61h).
INT pin is Nch open drain terminal so this terminal should be pull-up to some kind of voltage source by an external
resister.
There are two output modes about interrupt function (latched mode and unlatched mode).
INT terminal is high impedance when VCC is supplied.
INT terminal becomes inactive by writing INT reset command, reading INTERRUPT register, writing 0 to INT ENABLE bit
of INTERRUPT register or software reset.
INT terminal keeps just previous state when power down command is sent. So to set INT terminal to high impedance
before power down command is sent is recommended. VCC current (approximately 25µA at VCC=2.5V) is consumed
during INT terminal is ‘L’.
Ex1 )
In case of unlatch mode if the Data measurement value is within the range set by interrupt threshold ‘H’ and ‘L’ value, the
interrupt becomes inactive. And if the measurement value is out of the range set by threshold ‘H’ and ‘L’ value, the
interrupt becomes active.
In case of latch mode once the interrupt becomes active, it keeps the status until INT reset command is done or
INTERRUPT register is read.
Master writes “Interrupt reset” command.
INT Terminal
H
persistence = 1
L
H
persistence = 4
L
DATA
(selected from RGBC)
Interrupt threshold H level
sequential measurement results
Interrupt threshold L level
time
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BH1745NUC
I/O Equivalent Circuit
PIN No.
1
Pin Name
ADDR
Equivalent Circuit
VCC
2
VCC
3
GND
4
TEST
5
SCL
6
SDA
7
INT
8
NC
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
P
+
N
P
+
N
N
P
N
Parasitic
Elements
N
P+
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure xx. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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BH1745NUC
Ordering Information
B
H
1
7
4
5
Part Number
N
U
C
-
Package
NUC : WSON008X2120
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
WSON008X2120(TOP VIEW)
Part Number Marking
A
C
1 PIN MARK
LOT Number
Optical design for the device
2mm
1mm
1.05mm
2.1mm
0.29mm
sensitive area 0.6 x 0.6mm
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Physical Dimension, Tape and Reel Information
Package Name
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BH1745NUC
Revision History
Date
Revision
Changes
30.Jun.2014
001
New Release
23.May.2016
002
Correct description of VALID register.
Correct register name.
Correct “Operational Notes”.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
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responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
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3.
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4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
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2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
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