bas21hmfh e

Switching Diode
Datasheet
BAS21HMFH
Dimensions (Unit : mm)
Series
AEC-Q101 Qualified
Land Size Figure (Unit : mm)
2.40
Application
General rectification
1.00MIN
1.90
High frequency switching
SOT-23
0.80MIN
Structure
Cathode
Features
1) Small power mold type
(SOT-23)
ROHM : SSD3
JEDEC : SOT-23
Taping Dimensions (Unit : mm)
Anode
Open
2) High speed switching
3) High current overload capacity
Construction
Silicon epitaxial planar type
Absolute Maximum Ratings (Ta= 25°C)
Parameter
Repetitive peak reverse voltage
Reverse voltage
Forward current
Repetitive peak forward current
Symbol
VRM
VR
IF
IFRM
Non-repetitive forward surge current
IFSM
Power dissipation
Operating junction temperature
Storage temperature
Ptot
Tj
Tstg
Conditions
Duty≦0.5
Direct reverse voltage
Direct forward current
tp ≦1s, Duty≦0.5
t=1μs
Square wave ,
Non-repetitive at Tj=25ºC
t=10ms
Glass epoxy mounted *
-
Limits
250
200
200
625
10
2
250
150
Unit
V
V
mA
mA
A
mW
°C
55 to 150 °C
* 20mm x 20mm x 0.8mm, FR-4 both side is all covered with copper.
Electrical Characteristics (Tj= 25°C)
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Reverse recovery time
Terminal capacitance
Thermal resistance
trr
Ct
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© 2015 ROHM Co., Ltd. All rights reserved.
Rth(j-a)
Conditions
IF=100mA
IF=200mA
Min. Typ. Max. Unit
0.75 0.93 1.0
V
0.8 1.05 1.25
V
Tj=25ºC
100 nA
VR=200V
Tj=150ºC 100 A
IF=30mA, IR=30mA, RL=100Ω, Irr=0.1×IR
50
ns
VR=0V, f=1MHz
2.5
pF
Junction to ambient
250 °C/W
1/4
2016.06 - Rev.A
Data Sheet
BAS21HMFH
Electrical characteristic curves
1000
0.1
REVERSE CURRENT : IR(nA)
FORWARD CURRENT : IF(A)
1
Tj = 150°C
Tj = 125°C
Tj = 75°C
0.01
Tj = 25°C
100
Tj = 125°C
Tj = 150°C
10
Tj = 75°C
1
Tj = 25°C
0.1
Tj = 40°C
Tj = 40°C
0.01
0.001
0
0
200 400 600 800 1000 1200 1400 1600 1800
FORWARD VOLTAGE : VF(mV)
VF-IF CHARACTERISTICS
100
150
200
250
REVERSE VOLTAGE : VR(V)
VR-IR CHARACTERISTICS
10
100
Tj = 25°C
f = 1MHz
PEAK SURGE
FORWARD CURRENT : IFSM(A)
CAPACITANCE BETWEEN
TERMINALS : Ct(pF)
50
1
0.1
0
5
10
15
20
25
time
10
1
Tj = 25°C
0.1
0.001
30
0.01
0.1
1
10
100
TIME : t(ms)
IFSM-t CHARACTERISTICS
REVERSE VOLTAGE : VR(V)
VR-Ct CHARACTERISTICS
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© 2015 ROHM Co., Ltd. All rights reserved.
IFSM
2/4
2016.06 - Rev.A
Data Sheet
BAS21HMFH
Electrical characteristic curves
120
POWER DISSIPATION : Pd(%)
TRANSIENT
THERMAL IMPEDANCE : Rth (°C/W)
1000
Rth(j-a)
100
Rth(j-c)
10
20mm x 20mm x 0.8mm glass epoxy(FR-4)
Both side is all covered with copper
(35um thickness)
1
0.001
0.01
0.1
1
10
100
100
80
60
40
20
0
1000
0
TIME : t(s)
Rth-t CHARACTERISTICS
25
50
75
100
125
AMBIENT TEMPERATURE : Ta(°C)
Pd-Ta CHARACTERISTICS
Io
0A
Io
0A
0V
T
0.25
D=t/T
VR=VRmax
Tj=150°C
D=0.5
0.20
half sin wave
0.15
D=0.2
0.10
D=0.1
0.05
VR
t
0.35
T
D.C.
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
D.C.
0.30
0V
VR
t
0.35
150
0.00
D=t/T
VR=VRmax
Tj=150°C
0.30
0.25
D=0.5
0.20
half sin wave
0.15
D=0.2
0.10
D=0.1
0.05
0.00
0
30
60
90
120
150
0
60
90
120
150
CASE TEMPERATURE : Tc(°C)
DERATING CURVE (Io-Tc)
AMBIENT TEMPERATURE : Ta(°C)
DERATING CURVE (Io-Ta)
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© 2015 ROHM Co., Ltd. All rights reserved.
30
3/4
2016.06 - Rev.A
Data Sheet
BAS21HMFH
Electrical characteristic curves
0.50
0.45
D.C.
FORWARD POWER
DISSIPATION : Pf (W)
0.40
D=0.5
0.35
0.30
0.25
0.20
half sin wave
D=0.2
D=0.1
0.15
0.10
0.05
Tj = 150°C
0.00
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
Io-Pf CHARACTERISTICS
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© 2015 ROHM Co., Ltd. All rights reserved.
4/4
2016.06 - Rev.A
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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trade act, please consult with ROHM in case of export.
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1.
All information and data including but not limited to application example contained in this document is for reference
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2.
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3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
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Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003