626B

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP−7 (PDIP−8 LESS PIN 7)
CASE 626B
ISSUE D
DATE 22 APR 2015
SCALE 1:1
D
A
E
H
8
5
E1
1
4
NOTE 8
c
b2
B
END VIEW
TOP VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
NOTE 3
L
SEATING
PLANE
A1
C
M
D1
e
8X
SIDE VIEW
b
0.010
eB
END VIEW
M
C A
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.355 0.400
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
9.02
10.16
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
NOTE 6
GENERIC
MARKING DIAGRAM*
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC − IN
4. AC IN
5. GROUND
6. OUTPUT
7. NOT USED
8. VCC
XXXXXXXXX
AWL
YYWWG
XXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
98AON12198D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
PDIP−7 (PDIP−8 LESS PIN 7) 1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON12198D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. JONES
22 NOV 2002
A
ADDED TOLERANCE BOX. CHANGED PIN 7 TO “NOT USED”. REQ BY M. JONES
08 JAN 2003
B
CHANGED DIMENSION N MIN VALUE TO 0.51 MM. REQ. BY J. FLYNN.
13 NOV 2012
C
REDRAWN TO UNIFORM FABRICATION SITE SPECIFICATIONS. REQ. BY J.
LETTERMAN.
29 MAY 2013
D
CORRECTED DIMENSION REFERENCE IN NOTE 6 FROM E3 TO eB. REQ. BY
JJ. YEOH.
22 APR 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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© Semiconductor Components Industries, LLC, 2015
April, 2015 − Rev. D
Case Outline Number:
626B
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