s4101 e

S4101
Data Sheet
N-channel SiC power MOSFET bare die
VDSS
1200V
RDS(on) (Typ.)
40mW
ID
55A*1
lFeatures
lInner circuit
1) Low on-resistance
2) Fast switching speed
(1) Gate
(2) Drain
(3) Source
3) Fast reverse recovery
4) Easy to parallel
*1 Body Diode
5) Simple to drive
lApplication
・Solar inverters
・DC/DC converters
・Switch mode power supplies
・Induction heating
・Motor drives
lAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Value
Unit
VDSS
1200
V
ID *1
55
A
ID,pulse *2
137
A
Gate - Source voltage
VGSS
-4 to 22
V
Junction temperature
Tj
175
°C
Tstg
-55 to +175
°C
Drain - Source voltage
Continuous drain current
Tc = 25°C
Pulsed drain current
Range of storage temperature
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1/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristics (Ta = 25°C)
Values
Parameter
Drain - Source breakdown
voltage
Symbol
V(BR)DSS
Conditions
Unit
Min.
Typ.
Max.
1200
-
-
V
Tj = 25°C
-
1
10
mA
Tj = 150°C
-
2
-
VGS = 0V, ID = 1mA
VDS = 1200V, VGS = 0V
Zero gate voltage
drain current
IDSS
Gate - Source leakage current
IGSS+
VGS = +22V, VDS = 0V
-
-
100
nA
Gate - Source leakage current
IGSS-
VGS = -4V, VDS = 0V
-
-
-100
nA
VGS (th)
VDS = 10V, ID = 10mA
2.7
-
5.6
V
-
40
50
mW
Tj = 125°C
-
60
-
f = 1MHz, open drain
-
7
-
Gate threshold voltage
VGS = 18V, ID = 20A
Static drain - source
on - state resistance
Gate input resistance
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RDS(on) *3 Tj = 25°C
RG
2/11
W
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Transconductance
gfs *3
VDS = 10V, ID = 20A
-
8.3
-
Input capacitance
Ciss
VGS = 0V
-
1337
-
Output capacitance
Coss
VDS = 800V
-
76
-
Reverse transfer capacitance
Crss
f = 1MHz
-
27
-
Effective output capacitance,
energy related
Co(er)
VGS = 0V
VDS = 0V to 600V
-
122
-
Turn - on delay time
td(on) *3
VDD = 400V, ID = 18A
-
21
-
VGS = 18V/0V
-
39
-
td(off) *3
RL = 22W
-
49
-
tf *3
RG = 0W
-
24
-
-
283
-
tr *3
Rise time
Turn - off delay time
Fall time
Turn - on switching loss
Turn - off switching loss
Eon *3
Eoff
*3
S
pF
pF
ns
VDD = 600V, ID=20A
VGS = 18V/0V
RG = 0W L=250mH
*Eon includes diode
reverse recovery
mJ
-
118
-
lGate Charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Total gate charge
Qg *3
VDD = 600V
-
107
-
Gate - Source charge
Qgs *3
ID = 20A
-
22
-
Gate - Drain charge
Qgd
VGS = 18V
-
41
-
VDD = 600V, ID = 20A
-
9.6
-
Gate plateau voltage
*3
V(plateau)
nC
V
*1 Limited
For Tj=175°C
only byand
maximum
thermaltemperature
dissiparion to
allowed.
ambience of 165W or more.
Limited only by maximum temperature allowed.
*2 PW  10ms, Duty cycle  1%
*3 Pulsed
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3/11
2015.10 - Rev.A
Data Sheet
S4101
lBody diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Inverse diode continuous,
forward current
Symbol
Conditions
IS *1
Unit
Min.
Typ.
Max.
-
-
55
A
-
-
137
A
-
3.2
-
V
-
25
-
ns
-
115
-
nC
-
9
-
A
Tc = 25°C
Inverse diode direct current,
pulsed
ISM *2
Forward voltage
VSD *3
Reverse recovery time
trr
*3
Reverse recovery charge
Qrr *3
Peak reverse recovery current
Irrm *3
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VGS = 0V, IS = 20A
IF = 20A, VR = 600V
di/dt = 1100A/ms
4/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.1 Typical Output Characteristics(I)
Fig.2 Typical Output Characteristics(II)
25
50
20V
18V
16V
40
20V
Drain Current : ID [A]
12V
Drain Current : ID [A]
18V
16V
20
14V
Ta = 25ºC
Pulsed
30
20
10V
10
14V
15
12V
10V
10
Ta = 25ºC
Pulsed
5
VGS= 8V
VGS= 8V
0
0
0
2
4
6
8
10
0
Drain - Source Voltage : VDS [V]
2
3
4
5
Drain - Source Voltage : VDS [V]
Fig.3 Tj = 150ºC Typical Output
Characteristics(I)
Fig.4 Tj = 150ºC Typical Output
Characteristics(II)
25
50
16V
14V
12V
20V
18V
40
20V
10V
Drain Current : ID [A]
Drain Current : ID [A]
1
30
20
VGS= 8V
10
10V
20
12V
15
14V
16V
18V
VGS= 8V
10
5
Ta = 150ºC
Pulsed
Ta = 150ºC
Pulsed
0
0
0
2
4
6
8
0
10
Drain - Source Voltage : VDS [V]
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1
2
3
4
5
Drain - Source Voltage : VDS [V]
5/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.5 Typical Transfer Characteristics (I)
Fig.6 Typical Transfer Characteristics (II)
50
100
VDS = 10V
Pulsed
VDS = 10V
Pulsed
40
Drain Current : ID [A]
Drain Current : ID [A]
10
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
1
0.1
30
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
20
10
0
0.01
0
2
4
6
8
0
10 12 14 16 18 20
Gate - Source Voltage : VGS [V]
6
8
10 12 14 16 18 20
Fig.8 Transconductance vs. Drain Current
10
6
VDS = 10V
ID = 10mA
5
VDS = 10V
Pulsed
Transconductance : gfs [S]
Gate Threshold Voltage : V GS(th) [V]
4
Gate - Source Voltage : VGS [V]
Fig.7 Gate Threshold Voltage
vs. Junction Temperature
4
3
2
1
0
-50
2
1
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.1
0
50
100
150
0.1
200
Junction Temperature : Tj [ºC]
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1
10
Drain Current : ID [A]
6/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.9 Static Drain - Source On - State
Resistance vs. Gate - Source Voltage
Fig.10 Static Drain - Source On - State
Resistance vs. Junction Temperature
0.16
Ta = 25ºC
Pulsed
0.14
0.12
0.1
0.08
ID = 37A
0.06
ID = 20A
0.04
0.02
0
6
8
10
12
14
16
18
20
22
Static Drain - Source On-State Resistance
: RDS(on) [W]
Static Drain - Source On-State Resistance
: RDS(on) [W]
0.16
Gate - Source Voltage : VGS [V]
0.14
VGS = 18V
Pulsed
0.12
0.1
0.08
0.06
ID = 37A
0.04
ID = 20A
0.02
0
-50
0
50
100
150
200
Junction Temperature : Tj [ºC]
Fig.11 Static Drain - Source On - State
Resistance vs. Drain Current
Static Drain - Source On-State Resistance
: RDS(on) [W]
0.1
Ta = 150ºC
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
VGS = 18V
Pulsed
0.01
1
10
100
Drain Current : ID [A]
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7/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.12 Typical Capacitance
vs. Drain - Source Voltage
Fig.13 Coss Stored Energy
40
10000
Coss Stored Energy : EOSS [mJ]
Ta = 25ºC
Ciss
Capacitance : C [pF]
1000
Coss
100
Crss
10
Ta = 25ºC
f = 1MHz
VGS = 0V
30
20
10
0
1
0.1
1
10
100
0
1000
Drain - Source Voltage : VDS [V]
600
800
Fig.15 Dynamic Input Characteristics
10000
20
tf
Drain - Source Voltage : VDS [V]
Ta = 25ºC
VDD = 400V
VGS = 18V
RG = 0W
Pulsed
1000
Switching Time : t [ns]
400
Drain - Source Voltage : VDS [V]
Fig.14 Switching Characteristics
100
200
td(off)
tr
td(on)
10
1
15
Ta = 25ºC
VDD = 600V
ID = 20A
Pulsed
10
5
0
0.1
1
10
100
0 10 20 30 40 50 60 70 80 90 100110
Drain Current : ID [A]
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Total Gate Charge : Qg [nC]
8/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.16 Typical Switching Loss
vs. Drain - Source Voltage
Fig.17 Typical Switching Loss
vs. Drain Current
500
1800
Ta = 25ºC
ID=20A
VGS = 18V/0V
RG=0W
L=250mH
Switching Energy : E [mJ]
400
350
Ta = 25ºC
VDD=600V
VGS = 18V/0V
RG=0W
L=250mH
1600
Switching Energy : E [mJ]
450
Eon
300
250
200
150
Eoff
100
1400
1200
Eon
1000
800
600
400
Eoff
200
50
0
0
200
400
600
800
0
1000
Drain - Source Voltage : VDS [V]
10
20
30
40
50
60
Drain Current : ID [A]
Fig.18 Typical Switching Loss
vs. External Gate Resistance
1800
Ta = 25ºC
VDD=600V
ID=20A
VGS = 18V/0V
L=250mH
1600
Switching Energy : E [mJ]
1400
1200
1000
Eon
800
Eoff
600
400
200
0
0
5
10
15
20
25
30
External Gate Resistance : RG [W]
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9/11
2015.10 - Rev.A
Data Sheet
S4101
lElectrical characteristic curves
Fig.19 Inverse Diode Forward Current
vs. Source - Drain Voltage
Fig.20 Reverse Recovery Time
vs.Inverse Diode Forward Current
1000
VGS = 0V
Pulsed
Reverse Recovery Time : trr [ns]
Inverse Diode Forward Current : IS [A]
100
10
1
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.1
0.01
Ta = 25ºC
di / dt = 1100A / us
VR = 600V
VGS = 0V
Pulsed
100
10
0
1
2
3
4
5
6
7
8
1
Source - Drain Voltage : VSD [V]
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10
100
Inverse Diode Forward Current : IS [A]
10/11
2015.10 - Rev.A
Data Sheet
S4101
lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Switching Energy Measurement Circuit
Fig.3-2 Switching Waveforms
Eon = ID×VDS
Same type
device as
D.U.T.
VDS
Irr
Eoff = ID×VDS
Vsurge
D.U.T.
ID
ID
Fig.4-1 Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform
D.U.T.
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11/11
2015.10 - Rev.A
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
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below), please contact and consult with a ROHM representative : transportation equipment (i.e.
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equipment, nuclear power control systems, and submarine repeaters.
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R1102B