Datasheet Download

SML-P1 Series
PICOLEDTM
Data Sheet
lFeatures
lOutline
• Ultra compact, thin size 1.0×0.6mm
• Original device technology enables high brightness and high reliability
• Lead Free/RoHS Compliant.
lSize
1006 (0402)
1.0×0.6mm (t=0.2mm)
Color
Type
V
U
U2
D
Y3
Y
W
Y2
M2
M
F
P
E
B
WB
lRecommended Solder Pattern
lDimensions
Tolerance : ±0.05
(unit : mm)
(unit : mm)
lSpecifications
Part No.
Chip
Structure
Emitting
Color
Absolute Maximum Ratings (Ta=25ºC)
Peak Forward Reverse
Operating Temp. Storage Temp.
Dissipation Current
Current Voltage
PD(mW) IF(mA) IFP(mA) VR(V)
Topr(ºC)
Tstg(ºC)
Power Forward
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag VF Reverse Current IR
Typ.
(V)
IF
Max.
VR
(mA)
(mA)
(V)
SML-P12VT (R)
Red
SML-P12UT (R)
50
2.0
SML-P12U2T (R)
SML-P12DT (R)
Orange
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
AIGaInP
Yellow
on GaAs
52
20
100*1
5
SML-P12Y2T (R)
SML-P12M2T (R)
Yellowish
Green
SML-P12MT (R)
SML-P13FT (R)
Green
SML-P13PT (R)
InGaN
Blue
54
10
5
2.2
52
2.1
3.0
33
10
50*1
2.9
White
SCMP13WBC8W
20
-40 to +85 -40 to +100
Bluish
Green
SMLP13EC8T
SMLP13BC8T
2.1
5
100
Dominant Wavelength lD Luminous Intensity IV*3
IF
Min. Typ.
Min.*2 Typ. Max.*2 IF
(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
625
630
635
25
60
615
620
625
40
85
610
615
620
25
70
602
605
608
63
100
593
596
599
40
90
587
590
593
40
100
582
585
588
25
70
577
580
583
16
50
573
576
579
10
25
569
572
575
10
25
563
566
569
6.3
18.0
20
557
560
563
4.0
10.0
520
527
535
56
110
465
470
475
5
(x, y) (0.30, 0.30)
9.0
25
90
150
20
5
*1 : Duty 1/10, 1kHz *2 : Reference *3 : Measurement tolerance : 10%
lThermal Resistance
θj-s
θj-a
643ºC/W
899ºC/W
Conditions
Circuit Board
Glass epoxy circuit board
Circuit Board Dimensions 30×10×0.8mmt
Pad Size
1.5mm2 (Cathode)
*The above value is a result of actual measurement performed
on randomly selected product. The value does not have any meanings of guarantee.
*PICOLEDTM is ROHM's pending trademark.
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1/10
2016.03 - Rev.I
Data Sheet
SML-P1 Series
lElectrical Characteristics Curves
reference
FORWARD CURRENT : IF [mA]
100
Ta=25ºC
10
1.0
1.5
2.0
Fig.2 Luminous Intensity Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]
SML-P12VT8 (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)
Fig.1 Forward Current
- Forward Voltages
Fig.4 Derating
Ta=25ºC
1.0
0.8
SML-P12VT8 (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)
0.1
0
5
10
15
MAXIMUM FORWARD CURRENT : [mA]
RELATIVE LUMINOUS INTENSITY
1.2
0.2
SML-P12VT8 (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)
20
AMBIENT TEMPERATURE : Ta [ºC]
FORWARD CURRENT : IF [mA]
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© 2015 ROHM Co., Ltd. All rights reserved.
IF=20mA
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
0.4
2.5
FORWARD VOLTAGE : VF [V]
0.6
SML-P12VT8 (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)
2/10
2016.03 - Rev.I
Data Sheet
SML-P1 Series
lElectrical Characteristics Curves
reference
Fig.1 Forward Current - Forward Voltages
FORWARD CURRENT : IF [mA]
100
Ta=25ºC
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
10
1
2.0
2.5
3.0
3.5
4.0
FORWARD VOLTAGE : VF [V]
Fig.2-1 Forward Voltage - Atmosphere Temperature
(P13BC8T, P13WBC8W)
Fig.2-2 Forward Voltages Atmosphere Temperature (P13EC8T)
3.1
3.1
3.0
2.9
2.8
SMLP13BC8T
SCMP13WBC8W
2.7
IF=5mA
FORWARD VOLTAGE : VF [V]
FORWARD VOLTAGE : VF [V]
IF=5mA
2.9
2.8
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
ATMOSPHERE TEMPERATURE : Ta [ºC]
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3.0
SMLP13EC8T
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
ATMOSPHERE TEMPERATURE : Ta [ºC]
3/10
2016.03 - Rev.I
Data Sheet
SML-P1 Series
lElectrical Characteristics Curves
reference
IF=20mA
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
Fig.4 Luminous Intensity - Forward Current
2.0
RELATIVE LUMINOUS INTENSITY
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.3 Luminous Intensity Atmosphere Temperature
Ta=25ºC
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
1.5
1.0
0.5
0
0
2
4
6
8
10
FORWARD CURRENT : IF [mA]
ATMOSPHERE TEMPERATURE : Ta [ºC]
MAXIMUM FORWARD CURRENT : [mA]
Fig.5 Derating
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
AMBIENT TEMPERATURE : Ta [ºC]
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4/10
2016.03 - Rev.I
Data Sheet
SML-P1 Series
lViewing Angle
reference
SCANNING ANGLE (deg)
SCANNING ANGLE (deg)
RELATIVE INTENSITY
RELATIVE INTENSITY
SCANNING ANGLE (deg)
SCANNING ANGLE (deg)
RELATIVE INTENSITY
RELATIVE INTENSITY
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5/10
SML-P12VT8 (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
2016.03 - Rev.I
Data Sheet
SML-P1 Series
lRank Reference of Brightness
Red(V,U,U2)
(Ta=25ºC, IF=20mA)
Rank
G
H
J
K
L
M
N
P
Q
R
Iv (mcd)
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100
SML-P12VT
SML-P12UT
SML-P12U2T
S
T
U
V
W
Orange(D)
1000 to 1600
(Ta=25ºC, IF=20mA)
Rank
G
H
J
K
L
M
N
P
Q
R
Iv (mcd)
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100
SML-P12DT
S
T
U
V
W
S
T
U
V
W
X
100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000
Green(M2,M,F,P)
H
1000 to 1600
(Ta=25ºC, IF=20mA)
Rank
G
H
J
K
L
M
N
P
Q
R
Iv (mcd)
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100
SML-P12Y3T
SML-P12YT
SML-P12WT
SML-P12Y2T
G
X
100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000
Yellow(Y3,Y,W,Y2)
Rank
Iv (mcd)
X
100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000
1000 to 1600
(Ta=25ºC, IF=20mA)
J
K
L
M
N
P
16 to 25
25 to 40
M
N
P
Q
9 to 14
14 to 22
22 to 36
36 to 56
M
N
P
Q
9 to 14
14 to 22
22 to 36
36 to 56
T
U
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16
Q
R
S
T
U
V
W
40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630
X
630 to 1000 1000 to 1600
SML-P12M2T
SML-P12MT
SML-P13FT
SML-P13PT
Bluish Green(E)
Rank
Iv (mcd)
G
(Ta=25ºC, IF=5mA)
H
J
K
L
0.9 to 1.4 1.4 to 2.2 2.2 to 3.6 3.6 to 5.6 5.6 to 9.0
R
S
T
U
V
W
56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900
SMLP13EC8T
Blue(B)
Rank
Iv (mcd)
(Ta=25ºC, IF=5mA)
G
H
J
K
L
0.9 to 1.4 1.4 to 2.2 2.2 to 3.6 3.6 to 5.6 5.6 to 9.0
R
S
T
U
V
W
56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900
SMLP13BC8T
White(WB)
Rank
Iv (mcd)
(Ta=25ºC, IF=5mA)
N
P
Q
14 to 22
22 to 36
36 to 56
R
S
V
W
56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900
SCMP13WBC8W
CIE y
lChromaticity Diagram
K
[Chromaticity Coordimates]
F
(Ta=25ºC, IF=5mA)
H
A
A
x
0.28
F
y
x
H
y
x
K
y
x
0.248 0.283 0.305 0.287 0.295 0.304
0.296 0.276 0.304
0.33
y
0.33
0.307 0.315
0.33
0.36
0.283 0.305 0.307 0.315 0.311 0.294
0.33
0.318
0.264 0.267 0.287 0.295 0.296 0.276 0.311 0.294
Measurement tolerance : 0.02
CIE x
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6/10
2016.03 - Rev.I
Data Sheet
SML-P1 Series
4.00
±0 . 1
lTaping
± 0. 1
φ1 .5
+0 . 1
0
5 .5 0
0 ~0 . 50
8. 0 0
3 . 50
±0 . 0 5
1 .7 5
A
1 . 10
± 0. 0 5
2 .0 0 ± 0 .0 5
0 .7 0
±0 . 0 5
+ 0 . 05
0. 2 8 - 0 .0 3
A部詳 細
Enlarged drawing of ‟A”
Packaging quantity
Pulling
Direction
+1
0
0
-3
φ60
φ 18 0
±1
φ1 3
11 . 4
(unit : mm)
(Note) Tolerance is 0.1mm, unless otherwise specified.
lPart No. Construction
lPacking Specification
ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card
inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
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7/10
2016.03 - Rev.I
SML-P1 Series
Data Sheet
lPrecaution (Surface Mount Device)
1.Storage
If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand
which will influence the performance of the product. Therefore, the package is waterproof. Please use the
product following the conditions:
• Using Conditions
Classification
Temperature
Humidity
1
Before using
5 to 30ºC
30 to 70%RH
2
After opening
package
5 to 30ºC
Below 70%RH
Expiration Date
Remark
Within 1 year
Storage with waterproof package
from Receiving
Within168h
Please storing in the airtight container with
our desiccant (silica gel)
• Baking
Bake the product in case of below:
1 The expiration date is passed.
2 The color of indicator (silica gel) turned from blue to colorless or from green to pink.
(Even if the product is within the expiration date.)
• Baking Conditions
Temperature
60±3ºC
Remark
Time
12 to 24h
Humidity
Below 20%RH
• Bake products in reel.
• Reel and embossed tape are easy to be deformed when baking, so please try not to
apply stress on it.
• Recommend bake once.
2.Application Methods
2-1. Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the
products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of
luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of
current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially,
for the products with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and
result in function failure.
2-2. Operation Life Span
There’s possibility for intensity of light drop according to working conditions and environments (applied current,
surrounding temperature and humidity, corrosive gases), please call our Sales staffs for inquiries about the
concerned application below.
1 Longtime intensity of light life
2 On mode all the time
2-3.Applied Stress on Product
The top of the LED is very soft, which the silicon resin is used as sealing resin. Therefore, please pay attention
to the overstress on it which may influence its reliability.
2-4.Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier,
Switching and so on.
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8/10
2016.03 - Rev.I
SML-P1 Series
Data Sheet
3. Others
3-1. Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it
may result in low soldering ability (caused by the change in quality of the plating surface ) or optical
characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.
All of the above will cause function failure of the products.
Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of
the surrounding parts of the products and the atmospheric environment).
3-2. Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the
electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and
earthing of production equipment. The resistance values of electrostatic discharge (actual values) vary with
products, therefore, please call our Sales staffs for inquiries.
3-3. Electromagnetic Wave
Please concern the influence on LED in case of application with strong electromagnetic wave such as IH
(Induction heating).
4.Mounting
4-1. Soldering
• No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion
and moisture absorption at humidity will cause heat stress during soldering process and finally has bad
influence on the product’s reliability.
• The product is not for flow soldering.
• Do not expose the product in the environment of high temperature (over 100ºC) or rapid temperature shift
(within 3ºC of temperature gradient) during the flow soldering of surrounding parts.
• Please set appropriate reflow temperature based on our product usage conditions and specification.
• The max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts
within the usage limitation after open the moistureproof package.
• Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the
discoloration of the resin.
• For our product that has no solder resist, because of its solder amount and soldering conditions, one of its
specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its
reliability. Therefore, please be informed, concerning it before using it.
4-2. Automatic Mounting
4-2-1.Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly
on the sealing section.
4-2-2.Mini Package (Smaller than 1006 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top
cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product
stabilization. In addition, it is recommended to set ionizer to prevent electrostatic charge.
4-3. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or
damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending
or screwing with great stress of the circuit board.
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9/10
2016.03 - Rev.I
SML-P1 Series
Data Sheet
4-4. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on
product.
Stress strength according to
the mounting position:
A>B>C>D
4-5. Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right. It
will be different according to mounting situation of circuit board,
therefore, please concern before designing.
*The product has adopted the electrode structure that it should
solder with back electrode of the product. Thus, please be
informed that the shape of electrode pin of solder fillet formation
is not guaranteed.
4-6. Reflow Profile
For reflow profile, please refer to the conditions below:(*)
• Meaning of marks, Conditions
Mark
Meanings
Tsmax Maximum of pre-heating temperature
Tsmin Minimum of pre-heating temperature
Ts
Time from Tsmin to Tsmax
TL
Reference temperature
tL
Retention time for TL
TP
Peak temperature
tP
Time for peak temperature
ΔTR/Δt
Temperature rising rate
ΔTD/Δt
Temperature decreasing rate
Conditions
180ºC
140ºC
Over 60sec.
230 to 260ºC
Within 40sec.
260ºC(Max)
Within 10sec.
Under 3ºC/sec.
Over -3ºC/sec.
*Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces
before using, because stress from circuit boards and temperature variations of reflow furnaces vary by
customer’s own conditions.
4-7. Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
Temperature
Ultrasonic Cleaning
Drying
We recommend to use alcohols solvent such as, isopropyl alcohols
Under 30ºC within 3 minutes
15W / Below 1 liter (capacity of tank)
Under 100ºC within 3 minutes
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10/10
2016.03 - Rev.I
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
12) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2015 ROHM Co., Ltd. All rights reserved.
R1102A
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