bd9631gu e

Datasheet
Switching Regulator ICs
with Built in FET (5V)
BD9631GU
Key Specifications
General Description




VBAT Supply Voltage:
2.5V to 5.5V
Oscillating Frequency 1:
1.0 MHz(Typ)
Oscillating Frequency 2:
500kHz(Typ)
ON-Resistance:
1.2Ω(Typ)
CH2 PMOS
CH3 PMOS
0.45Ω(Typ)
CH3 NMOS
0.30Ω(Typ)
CH4 PMOS DOWN,UP side
0.45Ω(Typ)
CH4 NMOS DOWN,UP side
0.30Ω(Typ)
CH5 PMOS,NMOS
0.35Ω(Typ)
CH6 Load Switch
0.40Ω(Typ)
CH7 PMOS
4.00Ω(Typ)
CH7 NMOS
0.70Ω(Typ)
 Operating Temperature Range
-20°C to +85°C
BD9631GU is a system switching regulator IC for
DSC/DVC applications to generate plural voltage high
efficiently from battery. Component for Power FET and
phase compensation are embedded so it is suitable for
compact type DSC/DVC application.
Features
 7ch DC/DC converter, 1ch LDO embedded
Startup ch,Motor
・CH1 Boost
-
・CH2 LDO
FET embedded Analog
・CH3 Buck
FET embedded Core
・CH4 Buck-Boost FET embedded Digital
・CH5 Buck
FET embedded Memory
・CH6 Boost
-
LED
・CH7 Boost
FET embedded CCD
・CH8 Reverse
-
CCD
 Low voltage operation 2.5[V]
 CH1 supply voltage output for internal circuit
 CH1 PWM / PFM selectable
 CH3 High speed response by current control
 CH4 Boost-Buck auto switching
 CH6,CH7 integrated Boost output shutdown
・CH7: Back Gate Control Function
・CH6: Load Switch integrated
 Soft-start correspondence to each channel ch
・CH3→CH4 Sequence Control integrated
・CH7→CH8 2-types Sequence Control integrated
 Output Current Limiter (CH2,CH3),
Short Circuit Protection Function(CH4 to CH8)
integrated
 Error Amp Phase Compensation integrated
 Operating Frequency
1[MHz](CH1,CH3 to CH5), 500[KHz](CH6 to CH8)
○Product structure:Silicon monolithic integrated circuit
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Package
VCSP85H4
W (Typ) x D (Typ) x H (Max)
4.26mm x 4.26mm x 1.00mm
○This product has no designed protection against radioactive rays
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TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Pin Configuration
BOTTOM VIEW
H
H1
VOUT4
USW4
PGND4
PGND4
DSW4
VBAT4
H8
G
VBAT3
VOUT4
USW4
XSHDN1
XSHDN34
DSW4
VBAT4
VOUT7
F
SW3
FB4
XSHDN5
XSHDN2
CONT78
XSHDN78
XLVS
SW7
E
PGND3
FB3
VCC
CTL34
PWM/PFM
XSHDN6
FB7
PGND7
D
PGND1
RESERVE
PREV1
AGND1
AGND2
VREF
RT
PGND8
C
OUT1
VDCO
PREV6
FB1
RESERVE
FB8
OUT8
B
VOUT2
VBAT
FB2
OUT6
FB6.1
FB6
FB5
VBAT8
A
A1
VBAT6
LSO6
PGND6
PGND5
SW5
VBAT5
A8
1
2
3
4
5
6
7
8
Pin Descriptions
Terminal No.
Name
Equivalent Circuit
TEST terminal
Terminal No.
Name
Equivalent Circuit
1-A
A1
O・G
1- E
PGND3
2-A
VBAT6
Load switch input terminal
V
2- E
FB3
CH3 DRIVER GND terminal
CH3 feedback terminal
3-A
LSO6
Load switch output terminal
O
3- E
VCC
Analog power supply terminal
G
O・G
V
CH3,CH4 output voltage
switching terminal
O・G
CH1 PWM/PFM select terminal
O・G
4-A
PGND6
CH6 DRIVER GND terminal
G
4- E
CTL34
5-A
PGND5
CH5 DRIVER GND terminal
G
5- E
PWM/PFM
6-A
SW5
CH5 switching terminal
O
6- E
XSHDN6
CH6 shutdown terminal
O・G
7-A
VBAT5
CH7 feedback terminal
G
8-A
A8
CH7 DRIVER GND terminal
G
1-B
VOUT2
CH2 output terminal
2-B
VBAT
3-B
FB2
4-B
OUT6
5-B
FB6.1
6-B
FB6
7-B
FB5
8-B
CH5 DRIVER power supply terminal
V
7- E
FB7
O・G
8- E
PGND7
O
1- F
SW3
CH3 switching terminal
O
Battery input terminal
V
2- F
FB4
CH4 feedback terminal
O・G
CH2 feedback terminal
G
3- F
XSHDN5
CH5 shutdown terminal
O・G
CH6 gate connecting terminal
O
4- F
XSHDN2
CH2 shutdown terminal
O・G
CH7,CH8 sequence control terminal
TEST terminal
CH6 feedback terminal
(Constant voltage side)
CH6 feedback terminal
(Constant voltage side)
G
5- F
CONT78
O・G
6- F
XSHDN78
CH7,CH8 shutdown terminal
O・G
CH5 feedback terminal
G
7- F
XLVS
CH4 gate connecting terminal
O
VBAT8
CH8 DRIVER power supply terminal
V
8- F
SW7
CH7 switching terminal
O
1-C
OUT1
CH1 gate connecting terminal
O
1- G
VBAT3
CH3 DRIVER power supply terminal
V
2-C
VDCO
CH2LDO power supply terminal
V
2- G
VOUT4
CH4 output terminal
O
3-C
-
-
-
3- G
USW4
CH4 Boost side switching terminal
O
4-C
PREV6
CH6 DRIVER power supply terminal
V
4- G
XSHDN1
CH1 shutdown terminal
5-C
FB1
CH1 feedback terminal
G
5- G
XSHDN34
CH3,CH4 shutdown terminal
6-C
RESERVE
O・G
6- G
DSW4
CH4 Buck side switching terminal
CH8 feedback terminal
G
7- G
VBAT4
CH4 DRIVER power supply terminal
V
CH8 gate connecting terminal
O
8- G
VOUT7
CH7 output terminal
O
CH1 DRIVER GND terminal
G
1- H
H1
Reserve terminal
G
G
O・G
O
7-C
FB8
8-C
OUT8
1-D
PGND1
2-D
RESERVE
O・G
2- H
VOUT4
CH4 output terminal
O
3-D
PREV1
CH1 DRIVER power supply terminal
V
3- H
USW4
CH4 Boost side switching terminal
O
4-D
AGND1
Analog GND terminal
G
4- H
PGND4
CH4 DRIVER GND terminal
G
5-D
AGND2
Analog GND terminal
G
5- H
PGND4
CH4 DRIVER GND terminal
G
6-D
VREF
Internal circuit power
CH8 reference voltage
(Note 1)
6- H
DSW4
CH4 Buck side switching terminal
O
7-D
RT
Triangle wave setting resistor terminal
(Note 2)
7- H
VBAT4
CH4 DRIVER power supply terminal
V
8-D
PGND8
G
8- H
H8
Reserve terminal
CH8 DRIVER GND terminal
TEST terminal
TEST terminal
O・G
O・G
The letter on the right side of each pin explanation indicates the reaction if the terminal are not used.
O・・・OPEN
G・・・GND
O・G・・・OPEN or GND
V・・・Power supply (VBAT)
(Note 1)・・・1.0[µF] Pull_down
(Note 2)・・・100[KΩ] Pull_down
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TSZ22111・15・001
2/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Block Diagram
[CH1]
Boost
PREV1
VOUT1
VOUT1
VBAT
PFM
FB1
PRE
DRIVER
PWM
OUT1
PGND1
MAX.
DUTY
PWM/PFM
[CH2]
LDO
VDCO
LDO
control
VOUT2
VOUT2
FB2
[CH3]
Buck
VOUT3
VBAT3
FB3
SLOPE
PRE
DRIVER
SW3
CURRENT
SENSE
PGND3
VBAT
VOUT3
VOUT4
VOUT4
USW4
VOUT4
FB4
PGND4
VBAT
VBAT4
[CH4]
Buck-Boost
Buck-Boost
PWMCOMP
PRE
DRIVER
DSW4
MAX.
DUTY
CTL34
XLVS
LVS
VBAT
VOUT5
VBAT5
FB5
[CH5]
Buck
Buck
PWMCOMP
PRE
DRIVER
VOUT5
SW5
PGND5
MAX.
DUTY
VOUT1 VBAT
VOUT6
PREV6
FB6
VBAT6
[CH6]
Boost
PRE
DRIVER
VOUT6
LSO6
OUT6
MAX.
DUTY
PGND6
FB6.1
VOUT7
[CH7]
Boost
VOUT7
FB7
PRE
DRIVER
MAX.
DUTY
SW7
PGND7
VOUT8
[CH8]
Reverse
VOUT7
VBAT
VBAT
VBAT8
FB8
PRE
DRIVER
VREF
MAX.
DUTY
VOUT8
PGND8
RAMP,SAW
1[MHz]
500[KHz]
VBAT
OUT8
RT
VBAT
XSHDN1
XSHDN2
XSHDN34
XSHDN5
XSHDN6
XSHDN78
CONT78
Startup Circuit
TSD
VOUT1
VCC
CONTROL
Internal Power Supply
VREF
AGND1
AGND2
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TSZ22111・15・001
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TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Absolute Maximum Ratings(Ta=25°C)
Parameter
Supply Voltage
VOUT7 Permissible Voltage
SW7 Permissible Voltage
VOUT2 Permissible Current Output
SW3 Permissible Current Output
VOUT4 Permissible Current Output
SW5 Permissible Current Output
LSO6 Permissible Current Output
SW7 Permissible Current Output
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Symbol
VVBAT
VVBAT3,4,5,6,8
VVOUT7
VSW7
IVOUT2
ISW3
IVOUT4
ISW5
ILSO6
ISW7
Pd
Topt
Tstg
Tjmax
Rating
Unit
-0.3 to +7
V
-0.3 to +15
-0.3 to +15
0.3
0.5
1.0
0.5
0.5
0.5
1.4 (Note 1)
-20 to +85
-55 to +150
+150
V
V
A
A
A
A
A
A
W
°C
°C
°C
(Note 1) Implemented on Glass epoxy board (ROHM standard board :50 x 58 x 1.75[mm3] 8 layers)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
VBAT Supply Voltage
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Symbol
Limit
MIN
TYP
MAX
Unit
VVBAT
2.5
3.7
5.5
V
VVBAT3
2.5
3.7
5.5
V
VVBAT4
2.5
3.7
5.5
V
VVBAT5
2.5
3.7
5.5
V
VVBAT6
2.5
3.7
5.5
V
VVBAT8
2.5
3.7
5.5
V
4/25
Conditions
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Electrical Characteristics
(Unless otherwise specified , VVBAT=VVBAT3,4,5,6,8=3.7[V], VOUT1 input terminal =4.2[V], Ta=25[°C])
Parameter
Symbol
Limit
MIN
TYP
MAX
Unit
Conditions
・XSHDN1=H, PWM/PFM=L,
Other setting terminal=L
・Without load on each channel
・sum of VBAT terminal,
and VOUT1 terminal
・XSHDN1=H, PWM/PFM=H,
Other setting terminal =L
・Without load on each channel
・sum of VBAT terminal,
and VOUT1 terminal
・All setting terminal =L
・Without load on each channel
・sum of VBAT terminal,
and VOUT1 terminal
Current Consumption
(PFM)
ICC1
-
90
180
µA
Current Consumption
(PWM)
ICC2
1.00
1.50
2.25
mA
Shutdown Current
Consumption
ICC3
-
0
10
µA
H Input Voltage1
VIH1
VVBAT
-0.3
-
-
V
L Input Voltage1
VIL1
-
-
H Input Voltage2
VIH2
VVREF
-0.3
-
L Input Voltage2
VIL2
-
-
H Input Voltage3
VIH3
2.5
-
L Input Voltage3
VIL3
-
-
H Input Current1
IIH1
4.63
9.25
18.5
µA
Input Voltage=3.7[V]
XSHDN2,XSHDN34,XSHDN5,XSHDN6,
XSHDN78,PWM/PFM
H Input Current2
IIH2
12.5
25
50
µA
Input Voltage=VREF
L Input Current2
IIL2
12.5
25
50
µA
Input Voltage=0[V]
fOSC1
0.8
1.0
1.2
MHz
RRT=100[kΩ]
Oscillating Frequency 2
fOSC2
400
500
Reduced-voltage
VUVLO1
1.60
1.80
Detection Voltage
Reduced-voltage
VUVLO2
1.80
2.00
Return Voltage
【Internal Power Supply, CH8 Reference Voltage】
600
KHz
RRT=100[kΩ]
2.00
V
2.20
V
Oscillating Frequency 1
GND
+0.3
VVREF
+0.3
GND
+0.3
GND
+0.3
XSHDN1
V
V
CTL34
V
V
V
Output Voltage
VVREF
2.44
2.50
2.56
V
Output Current
IVREF
-
-
10
mA
VEREF1
0.39
0.40
0.41
V
tSS1
0.44
1.08
1.72
ms
DMAX1
76.5
85.0
93.5
%
【CH1】
Error Amp Reference
Voltage
Soft-start Period 85%
Maximum Duty
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TSZ22111・15・001
5/25
Setting terminal except for XSHDN1,CTL34
CTL34
CTL34
Load Current 10[mA]
PWM/PFM=H
Soft-start period 100% 1.27[ms](TYP)
PWM/PFM=L
PWM/PFM=H
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Electrical Characteristics –continued
(Unless otherwise specified, VVBAT=VVBAT3,4,5,6,8=3.7[V], VOUT1 Input terminal=4.2[V], Ta=25[°C])
Parameter
Limit
Symbol
Unit
MIN
TYP
MAX
Conditions
【CH2】
Reference Voltage
VREF2
0.29
0.30
0.31
V
Startup period 85%
tSS2
0.51
1.28
2.05
ms
Startup Period 100% 1.5[ms](TYP)
PMOS ON-Resistance
RONP2
-
1.20
1.95
Ω
Power Supply 3.7[V]
【CH3】
Error Amp Reference
Voltage
Soft-start Period 85%
VEREF3
0.39
0.40
0.41
V
tSS3
0.425
0.85
1.70
ms
Soft-start Period 100%
PMOS ON-Resistance
RONP3
-
0.45
0.70
Ω
Power Supply 3.7[V]
NMOS ON-Resistance
RONN3
-
0.30
0.55
Ω
Power Supply 3.7[V]
VEREF4
0.39
0.40
0.41
V
tSS4
1.07
2.13
4.26
ms
Soft-start Period 100%
RONPD4
-
0.45
0.70
Ω
Power Supply 3.7[V]
RONND4
-
0.30
0.55
Ω
Power Supply 3.7[V]
RONPU4
-
0.45
0.70
Ω
Power Supply 3.7[V]
RONNU4
-
0.30
0.55
Ω
Power Supply 3.7[V]
DMAX4
65
80
95
%
【CH5】
Error Amp Reference
Voltage
Soft-start Period 85%
VEREF5
0.39
0.40
0.41
V
tSS5
1.75
3.5
7.0
ms
Soft-start Period 100%
PMOS ON-Resistance
RONP5
-
0.35
0.60
Ω
Power Supply 3.7[V]
Power Supply 3.7[V]
【CH4】
Error Amp Reference
Voltage
Soft-start Period 85%
PMOS ON-Resistance
DOWN side
NMOS ON-Resistance
DOWN side
PMOS ON-Resistance
UP side
NMOS ON-Resistance
UP side
Maximum Duty
1.0[ms](TYP)
2.5[ms](TYP)
4.12[ms](TYP)
RONN5
-
0.35
0.60
Ω
DMAX5
76.5
-
-
%
VEREF6
0.386
0.40
0.414
V
Constant voltage control side
VEREF6.1
0.386
0.40
0.414
V
Constant current control side
tSS6
2.55
5.10
10.2
ms
Soft-start Period 100%
RONP6
-
0.40
0.65
Ω
Power Supply 3.7[V]
DMAX6
87
-
-
%
VEREF7
0.983
1.00
1.017
V
tSS7
2.55
5.10
10.2
ms
Soft-start Period 100%
PMOS ON-Resistance
RONP7
-
4.00
6.40
Ω
Power Supply 3.7[V]
NMOS ON-Resistance
RONN7
-
0.70
1.12
Ω
Power Supply 3.7[V]
DMAX7
87
-
-
%
VEREF8
0.978
1.00
1.022
V
tSS8
2.55
5.10
10.2
ms
DMAX8
87
-
-
%
NMOS ON-Resistance
Maximum Duty
【CH6】
Error Amp Reference
Voltage 1
Error Amp Reference
Voltage 2
Soft-start Period 85%
Load Switch
ON-Resistance
Maximum Duty
【CH7】
Error Amp Reference
Voltage
Soft-start Period 85%
Maximum Duty
【CH8】
Error Amp Reference
Voltage
Soft-start Period 85%
Maximum Duty
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TSZ22111・15・001
6/25
6.0[ms](TYP)
6.0[ms](TYP)
Refer to P.16 for Output Voltage accuracy
Soft-start Period 100%
6.0[ms](TYP)
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Function Description
【Features Summary】
Function
CH
Output voltage (TYP)
Power output
Setting res.
USE
External
External
Start-up ch,Motor
Embedded
External
Analog
Buck converter
4.2[V] to 5.5[V]
I/O voltage differential
over 0.2[V]
1.05[V]/1.26[V]/1.8[V]
Embedded
Embedded
Core
CH4
H-BRIDGE converter
3.25[V]/3.3[V]
Embedded
Embedded
Digital
CH5
Buck converter
1.8[V]
Embedded
External
Memory
CH6
Boost
6[V] to 16[V]
External
External
LED
CH7
Boost
12[V] to 13[V]
Embedded
External
CCD
CH8
Reverse
-7.5[V] to -6[V]
External
External
CCD
CH1
Boost converter
CH2
LDO
CH3
【CONTROL】
・Stand-by function related terminals
Following table shows start-up condition of each block.
Intern
XSHDN
PWM
XSHDN
XSHDN
XSHDN
XSHDN
XSHDN
1
/PFM
2
34
5
6
78
RAM
al
CH1
P
suppl
SAW
y
L
-
H
-
-
-
-
CH2
CH3
CH4
CH5
CH6
CH7
CH8
-
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
L
-
-
-
-
-
H
L
L
L
L
L
H
L
L
L
L
ON
L
H
L
L
L
OFF
ON
OFF
OFF
OFF
L
L
H
L
L
OFF
OFF
ON
OFF
OFF
L
L
L
H
L
OFF
OFF
OFF
ON
OFF
L
L
L
L
H
OFF
OFF
OFF
OFF
ON
(Note) PWM/PFM logic refer to the table below.
(Note) -symbol mean without conditions.
・Other setting terminals
Terminal
PWM/PFM H:PWM operation
H
Open
L
CTL34
CONT78
Function
L:PFM operation
VOUT3
1.80[V]
1.26[V]
1.05[V]
H : CH7,CH8 startup
synchronous
・CTL34 terminal equivalent circuit
VREF
VREF
VOUT4
3.30[V]
3.25[V]
3.25[V]
(Note)High level of CTL34 is VREF voltage
(Note) Logic after some [us] from rising edge of
XSHDN34
L:CH7→CH8 startup
(Note) Logic after some [us] from rising edge of
XSHDN78
・XSHDN2 to XSHDN78, PWM/PFM terminal equivalent circuit
VREF
VBAT
VBAT
100[kΩ]
30[kΩ]
30[kΩ]
CTL34
100[kΩ]
400[kΩ]
AGND
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TSZ22111・15・001
AGND
7/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH1】
・Function
Selectable PWM/PFM boost DC/DC converter.
Output voltage is ranges from 4.2[V] to 5.5[V] (TYP).
Low voltage operation starts up from 2.5[V] and also provides supply voltage to VREF circuit.
VOUT1
PREV1
VOUT1
C1
D1
R1
C3
PFM
FB1
R2
PRE
DRIVER
OUT1
PWM
M1
VBAT
PGND1
0.4[V]
L1
MAX.
DUTY
PWM/PFM
C2
Startup Circuit
0 to VBAT
VOUT1
Setting External Components
・Recommended External Components
Parts Name
Value
Maker
Part Number
C1
22[μF] x 2
Taiyo Yuden
Taiyo Yuden
JMK212BJ226MG
C2
10[μF]
C3
L1
560[pF]
1.0[μH]
Taiyo Yuden
TOKO
UMK105BJ561KV
A997AS-1R0N
M1
D1
-
TOSHIBA
ROHM
SSM3K122TU
RB060M-30
R1
R2
Refer to the right table
Refer to the right table
JMK212BJ106KG
4.2[V]
5.0[V]
R1
510[KΩ]+22[KΩ]
620[KΩ]+24[KΩ]
R2
56[KΩ]
56[KΩ]
-
VOUT1 
R1  R2
 0.4[V]
R2
・Start-up Sequence
2.5[V] to 5.5[V]
VBAT
0[V]
VBAT[V]
XSHDN1
0[V]
When VBAT is 3.2[V] or less
Discharge by load
4.2[V] to 5.5[V]
≈VBAT[V]
VOUT1
0[V]
ON_delay
SOFT
Soft Start Period
・PWM/PFM
H Input Voltage
PWM/PFM
0[V]
VOUT1
4.2[V] to 5.5[V]
PFM operation
PWM operation
PFM operation
(Load 10mA or less)
(Load 10mA or less)
Select PWM/PFM with light load (10mA or less).
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8/25
TSZ02201-0313AA400610-1-2
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BD9631GU
【Internal Supply Voltage】
・Function
LDO input voltage is supplied by VOUT1.
Output voltage is 2.5[V](TYP).
VREF voltage is used to power up internal circuit and reverse reference of CH8.
VCC
VOUT1
Reference
Voltage
VREF
VREF
C1
・Recommended External
Parts name
C1
Value
1.0[μF]
Maker
Taiyo Yuden
Part number
JMK105BJ105KV
・Start-up Sequence
4.2[V] to 5.5[V]
VCC
H input voltage
PWM/PFM
0[V]
2.5[V]
VREF
Discharge
0[V]
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TSZ02201-0313AA400610-1-2
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BD9631GU
【CH2】
・Function
LDO for minimum I/O voltage differential is 0.2[V] or more.
Output voltage ranges : if input voltage is VOUT1, from 3.3[V] to 3.5[V](TYP), VOUT4, 1.8[V](TYP).
VDCO
VOUT1
VOUT4
CURRENT
LIMIT
Reference
Voltage
VOUT2
VOUT2
R1
C2
R3
FB2
C1
R2
・Recommended External
Parts name
Value
R1
Maker
Part number
-
R3
Refer to the right
Refer table
to the right
table
200[mΩ]
-
-
C1
2.2[μF]
Taiyo Yuden
JMK107BJ225KA
C2
10[pF]
Taiyo Yuden
TMK063CH100FP
R2
-
VOUT2
3.3[V]
1.8[V]
R1
300[KΩ]
150[KΩ]
R2
30[KΩ]
30[KΩ]
VOUT2 
R1  R2
 0.3[V]
R2
・Start-up Sequence
4.2[V] to 5.5[V]/3.25[V],3.3[V]
VDCO
2.5[V]
VREF
H input voltage
XSHDN2
0[V]
3.3[V] to 3.5[V]/1.8[V]
VOUT2
Discharge
0[V]
1.5[ms]
Start-up
period
1.5[ms]
・Over Current Protection
Characteristics of output voltage and output current is shown below.
VOUT2
IOUT2
100[mA]
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TSZ22111・15・001
300[mA]
10/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH3】
・Function
Synchronous rectification type current control buck DC/DC converter with built in power MOS output stage.
Output voltage is selectable: 1.05[V]/1.26[V]/1.8[V](TYP).
FB3
VOUT3
VBAT
VBAT3
C2
Place a resistance to
change setting
voltage by external
CTL34
SW3
PRE
DRIVER
0 to VREF
0.4[V]
C1
PGND3
SLOPE
RAMP
VOUT3
L1
CURRENT SENSE
LIMIT
・Recommended External
Parts name
Value
Maker
Part number
C1
10[μF]
Taiyo Yuden
JMK212BJ106KG
C2
10[μF]
Taiyo Yuden
JMK212BJ106KG
L1
10[μH]
sumida
CDRH2D14NP-100NC
・Start-up Sequence
2.5[V] to 5.5[V]
VBAT3
0[V]
2.5[V]
VREF
0[V]
H input voltage
XSHDN34
0[V]
1.05[V]/1.26[V]/1.8[V]
VOUT3
Discharge
0[V]
Soft start period
1.0[ms]
・Over Current Protection
Monitor in-rush current to PMOS of PowerMOS and if over current (about 0.8[A] (TYP)) is detected, it stops switching for
about 2.0[μs] (TYP). Timer latch circuit will latch PMOS to OFF status if such condition remained for 1.0[ms].
Latch will be released either setting XSHDN1=GND, PWM/PFM=GND or restarting the device.
・Setting Voltage
It is possible to return in a set voltage by adding external resistance between VOUT3 and FB3.
CTL34=L
VOUT3  1.050[V]  (0.01452 externalR[kΩ]  0.4)[V]
CTL34=OPEN
VOUT3  1.259[V]  (0.01821 externalR[kΩ]  0.4)[V]
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TSZ22111・15・001
11/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH4】
・Function
Synchronous rectification cross converter with built-in power MOS output stage.
Output voltage is selectable: 3.25[V]/3.3[V](TYP).
In under voltage (2.85[V] (TYP)), boost operation after external PMOS turns ON.
External PMOS turns OFF in soft start period.
VOUT4
VOUT4
C1
USW4
PGND4
FB4
VOUT4
VBAT4
VBAT
L1
C2
Place a resistance
to change setting
voltage by external
Buck-Boost
PWMCOMP
CTL34
PRE
DRIVER
DSW4
M1
0 to VREF
0.4[V]
MAX.
DUTY
SAW
LVS
XLVS
・Recommended External
Parts name
Value
Maker
Part number
C1
22[μF]
Taiyo Yuden
C2
10[μF]
Taiyo Yuden
L1
4.7[μH]
sumida
CDRH2D14NP-4R7NC
M1
-
TOSHIBA
SSM6J53FE
JMK212BJ226MG
JMK212BJ106KG
・ Start-up Sequence
2.5[V] to 5.5[V]
VBAT4
0[V]
2.5[V]
VREF
0[V]
H input voltage
XSHDN34
0[V]
1.05[V]/1.26[V]/1.8[V]
70[%]
VOUT3
0[V]
3.25[V]/3.3[V]
VOUT4
Discharge by load
0[V]
Soft start period
2.5[ms]
・Setting voltage
It is possible to return in a set voltage by adding external resistance between VOUT4 and FB4.
CTL34=L, OPEN
VOUT4 
CTL34=H
330.7[kΩ]  ExternalR[kΩ]
 0.4[V]
40.7[kΩ]
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VOUT4 
12/25
330[kΩ]  ExternalR[kΩ]
 0.4[V]
40[kΩ]
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH5】
・Function
Synchronous rectification buck DC/DC converter with built in power MOS output stage.
Output voltage range is 1.80[V] (TYP).
VBAT
VOUT5
VBAT5
C2
C3
R1
FB5
Buck
PWMCOMP
R2
0.4[V]
PRE
DRIVER
SW5
VOUT5
L1
C1
PGND5
MAX.
DUTY
SAW
・Recommended External
Parts name
Value
Maker
Part number
C1
2.2[μF]
Taiyo Yuden
JMK107BJ225KA
C2
10[μF]
Taiyo Yuden
JMK212BJ106KG
C3
47[pF]
Taiyo Yuden
TMK063CH470JP
L1
10[μH]
R1
180[KΩ]
-
R2
51[KΩ]
-
sumida
CDRH2D14NP-100NC
VOUT5 
R1  R2
 0.4[V]
R2
・Start-up Sequence
2.5[V] to 5.5[V]
VBAT5
0[V]
2.5[V]
VREF
0[V]
H input voltage
XSHDN5
0[V]
1.8[V]
Discharge by load
VOUT5
0[V]
Soft start period
4.12[ms]
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TSZ22111・15・001
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TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH6】
・Function
Boost DC/DC converter with built-in load switch.
This channel enables constant voltage operation and constant voltage operation for protection.
The constant voltage is available with output of 6[V] to 16[V] (TYP).
The load switch turns OFF when XSHDN6 goes LOW (CH6 shutdown) and the timer latch.
VOUT1
VBAT or VOUT1
PREV6
VBAT6
FB6
VOUT6
C2
L1
Place a resistance to
change setting voltage
by external.
PRE
DRIVER
VOUT6
LSO6
C1
OUT6
0.4[V]
MAX.
DUTY
PGND6
QS1
SAW
0.4[V]
FB6.1
R1
・Recommended External
Parts name
Value
Maker
Part number
C1
10[μF]
Taiyo Yuden
EMK212BJ106KG
C2
10[μF]
Taiyo Yuden
JMK212BJ106KG
sumida
CDRH2D14NP-100NC
L1
10[μH]
R1
20[Ω]
QS1
-
ROHM
QS5U17
・Start-up Sequence
2.5[V] to 5.5[V]
VBAT6
0[V]
2.5[V]
VREF
0[V]
H input voltage
XSHDN6
0[V]
6[V] to 16[V]
≈VBAT[V]
VOUT6
Discharge by load
0[V]
ON_delay
SOFT
Soft start period
6.0[ms]
・Set Voltage when Fixed Voltage is Driven
When a fixed voltage is driven by internal resistance, it is set to 16V.
It is possible to return in a set voltage by adding external resistance between VOUT6 and FB6.
However, note the resisting pressure of the capacitance of C1 when stepping up the voltage
applying external resistance.
VOUT6 
ExternalR  400[kΩ]
 0.4[V]
10[kΩ]
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TSZ22111・15・001
14/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH7】
・Function
Synchronous rectification Boost DC/DC converter with integrated output stage power MOS.
Output voltage ranges from 12.0[V] to 13.0[V] (TYP).
Output can shut by back gate control function.
Back gate control function is a function to shut the output by placing back gate of PMOS to SW7 side when in XSHDN78=L
(CH7 shut down) time and a timer latch.
VOUT7
VOUT7
R1
C3
VOUT7
or
FB7
C1
VBAT
R2
PRE
DRIVER
1.0[V]
SW7
MAX.
DUTY
MAX.
DUTY
C2
L1
PGND7
SAW
・Recommended External
Parts name
Value
Maker
Part number
C1
10[μF]
Taiyo Yuden
EMK212BJ106KG
C2
10[μF]
Taiyo Yuden
JMK212BJ106KG
C3
68[pF]
Taiyo Yuden
TMK212CH680JP
L1
22[μH]
Sumida
CDRH2D14B/LDNP-220M
R1
Refer to the right table
-
R2
Refer to the right table
-
VOUT7
Setting External
12[V]
13[V]
R1
220[KΩ]
240[KΩ]
R2
20[KΩ]
20[KΩ]
VOUT7 
R1  R2
 1.0[V]
R2
・Start-up Sequence
Refer to [CH8] Start-up sequence in Page 16.
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TSZ22111・15・001
15/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【CH8】
・Function
Reverse DC/DC Converter.
Output voltage ranges from -7.5[V] to -6.0[V] (TYP).
VOUT8
VBAT
VBAT8
R1
C3
C2
FB8
R2
OUT8
PRE
DRIVER
VREF
M1
1.0[V]
(EREF8)
VOUT8
D1
MAX.
DUTY
L1
MAX.
DUTY
C1
PGND8
SAW
・Recommended External
VOUT8
Parts name
Value
Maker
Part number
C1
10[μF] x 2
Taiyo Yuden
LMK212BJ106KG
C2
10[μF]
Taiyo Yuden
JMK212BJ106KG
C3
68[pF]
Taiyo Yuden
TMK063CH680JP
L1
4.7[μH]
sumida
CDRH2D14P-4R7NC
M1
-
TOSHIBA
SSM6J53FE
D1
-
ROHM
RB060M-30
R1
Refer to the right table
-
R2
Refer to the right table
-
-7.5[V]
-6[V]
R1
680[KΩ]
560[KΩ]
R2
120[KΩ]
120[KΩ]
Setting External
VOUT8  
R1
R1  R2
VREF 
EREF8
R2
R2
Output voltage accuracy is calculated by the above formula.
・Start-up Sequence
<CONT78=L>
2.5[V] to 5.5[V]
VBAT8
0[V]
2.3[V]
VREF
0[V]
VBAT[V]
XSHDN78
0[V]
70[%]
12[V] to 13[V]
Discharge by load
≈VBAT[V]
VOUT7
0[V]
ON_delay
SOFT
SOFT period
6.0[ms]
VOUT8
0[V]
Discharge by load
SOFT
6.0[ms]
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TSZ22111・15・001
16/25
-7.5[V] to -6[V]
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
<CONT78=H>
2.5[V] to 5.5[V]
VBAT8
0[V]
2.5[V]
VREF
0[V]
H input voltage
XSHDN78
0[V]
12[V] to 13[V]
Discharge by load
≈VBAT[V]
VOUT7
0[V]
ON_delay
SOFT
Soft start period
6.0[ms]
VOUT8
0[V]
Discharge by load
-7.5[V] to -6[V]
Soft start period
6.0[ms]
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
【Short Protection Function】
 CH4 to CH8 are monitoring error amp input voltage fed backed from output and enable timer circuit with falling
below the detection voltage of short protection circuit. Timer latch circuit will latch power MOS to OFF status of CH2
to CH8 if such condition remained for 1.0[ms].
 CH3 will be latched by over current protection.
 All channel except CH1 will be latched with any other channels to be over-current and/or shorted.
 Latch will be released either setting XSHDN1=GND, PWM/PFM=GND or restarting the device.
 Short detection comparator will be disabled by soft start.
 The timer latch circuit doesn't operate in PFM mode.
CH3 Over Current
Protection Circuits
VOUT4
FB4
0.2[V]
VOUT5
FB5
.
VOUT6
0.2[V]
Timer Latch Circuits
Latch with the following condition:CH2 to CH8.
CH2:PMOS OFF
CH3:SW3=Hiz
CH4:XLVS=High
DSW4=Hiz
up side=PMOS ON
NMOS OFF
CH5:SW5=Hiz
CH6:Load Switch OFF
CH7:PMOS OFF BG=SW7 side
NMOS OFF
CH8:OUT8=High
FB6
0.4[V]
VOUT7
FB7
0.5[V]
VOUT8
FB8
1.29[V]
VREF
【Thermal shutdown function】
Thermal shutdown function is built in to prevent IC from heat distraction.
Thermal circuit will be disabled by PFM.
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TSZ22111・15・001
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BD9631GU
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
4-G
5-E
4-F
5-G
4-E
3-F
6-C
6-E
6-F
5-F
2-E
2-F
2-C
1-B
3-E
6-D
XSHDN1
PWM/PFM
XSHDN2
XSHDN34
CTL34
XSHDN5
RESERVE
XSHDN6
XSHDN78
CONT78
FB3
FB4
VDCO
VOUT2
VCC
VREF
Terminal
No.
Terminal
Name
5-C
3-B
7-B
5-B
7-E
7-C
7-D
1-A
8-A
1-H
8-H
FB1
FB2
FB5
FB6.1
FB7
FB8
RT
A1
A8
H1
H8
Terminal
No.
Terminal
Name
6-B
FB6
Equivalent Circuit
AGND
Terminal
No.
Terminal
Name
3-D
2-D
1-C
1-F
2-G, 2-H
6-G, 6-H
3-G, 3-H
7-F
6-A
4-C
3-A
4-B
8-C
PREV1
RESERVE
OUT1
SW3
VOUT4
DSW4
USW4
XLVS
SW5
PREV6
LSO6
OUT6
OUT8
Equivalent Circuit
VBAT
(Note 1)
PGND
(Note 1) Only XLVS has upper side Di
Equivalent Circuit
Terminal
No.
Terminal
Name
8-G
8-F
VOUT7
SW7
VBAT
Equivalent Circuit
PGND
AGND
Equivalent Circuit
High resisting
pressure
Terminal
No.
Terminal
Name
2-B
1-G
7-G, 7-H
7-A
2-A
8-B
VBAT
VBAT3
VBAT4
VBAT5
VBAT6
VBAT8
AGND
Equivalent Circuit
VBAT
(Note 2)
VBAT3
VBAT4
VBAT5
VBAT6
VBAT8
PGND
AGND
(Note 2) VBAT5 doesn’t have this Di
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Terminal
No.
Terminal
Name
4-D
5-D
1-D
1-E
4-H,5-H
5-A
4-A
8-E
8-D
AGND1
AGND2
PGND1
PGND3
PGND4
PGND5
PGND6
PGND7
PGND8
19/25
Equivalent Circuit
AGND
PGND
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Power Dissipation PD[W]
Power Dissipation
1.4[W]
1.5
1
0.5
0
85
150
Ambient Temperature
Ta[℃]
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TSZ22111・15・001
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TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating. (Refer page 20)
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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26.Apr.2016 Rev.001
BD9631GU
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 1. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
15. Board Patterning
・VBAT,VBAT3,VBAT4,VBAT5,VBAT6,VBAT8 must be connected to the power supply on the board.
・VCC must be connected to VOUT1 output on the board.
・ALL PGND and AGND must be connected to GND on the board.
・ALL power supply line and GND terminals must be wired with wide/short pattern in order to achieve the lowest
impedance possible.
16. Peripheral Circuitry
・Use low ESR ceramic capacitor for bypass capacitor and place them as close as possible between power supply and
GND terminals.
・Place external components such as L and C by IC using wide and short PCB trace patterns.
・Draw output voltage from each end of capacitor.
・Causing short circuit at CH1 output will overload the external diode and may breakdown the component.
Prepare physical countermeasures by adding poli-switches and fuses to avoid excess current flow.
17. Start-up
・Keep light load condition when starting up the device.
・Switch to PWM mode after CH1 has started up in PFM mode, and the VOUT1 output voltage is stable.
CH2 to CH8 should starts after or simultaneously with PWM mode.
18. Usage of this Product
This IC is designed to be used in DSC/DVD application. When using in other applications, please be sure to consult
with our sales representative in advance.
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
22/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Ordering Information
B
D
9
6
3
Package Name
1
G
U
-
Package
GU: VCSP85H4
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VCSP85H4
(TOP VIEW)
1PIN MARK
Part Number Marking
BD9631
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
LOT Number
23/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Physical Dimension, Tape and Reel Information
Package Name
VCSP85H4(BD9631GU)
LOT No.
Tape
Quantity
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Embossed carrier tape
2500pcs
24/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
BD9631GU
Revision History
Date
Revision
26.Apr.2016
001
Changes
New Release
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
25/25
TSZ02201-0313AA400610-1-2
26.Apr.2016 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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