DATASHEET

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DG201
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P R O P R OD U
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OBS UBSTIT 444
S
G Data Sheet
IBLE G441, D
D
OS S
May 2001
File Number
3115.5
CMOS Quad SPST Analog Switch
Features
The DG201 solid state analog switch is designed using an
improved, high voltage CMOS monolithic technology. It
provides ease-of-use and performance advantages not
previously available from solid state switches. Destructive
latch-up of solid state analog gates have been eliminated by
Intersil’s CMOS technology.
• Switches Greater than 28VP-P Signals with ±15V Supplies
The DG201 is completely specification and pinout
compatible with the industry standard devices.
• Non-Latching with Supply Turn-Off
Part Number Information
• Industry Standard (DG201)
PART NUMBER
TEMP. RANGE
( oC)
DG201CJ
0 to 70
PACKAGE
16 Ld PDIP
• Break-Before-Make Switching
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700ns
• TTL, DTL, CMOS, PMOS Compatible
• Complete Monolithic Construction
PKG.
NO.
E16.3
Applications
• Data Acquisition
• Sample and Hold Circuits
Functional Diagram
• Operational Amplifier Gain Switching Networks
S
IN
Pinout
DG201 (PDIP)
TOP VIEW
P
N
D
DG201 SWITCH CELL
TRUTH TABLE
LOGIC
DG201
0
ON
1
OFF
1
IN1 1
16 IN2
D1 2
15 D2
S1 3
14 S2
V- 4
13 V+(SUBSTRATE)
GND 5
12 VREF
S4 6
11 S3
D4 7
10 D3
IN4 8
9 IN3
SWITCHES SHOWN FOR LOGIC “1” INPUT
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright © Intersil Americas Inc. 2001
DG201
Functional Diagram
(1/4 DG201)
V+
V-
Q3
Q7
Q5
Q14
Q15
Q8
V+
VREF
Q1
Q10
Q12
Q2
Q9
GATE
PROTECTION
RESISTOR
S1
Q4
Q6
V-
INPUT
Pin Descriptions
PIN
SYMBOL
DESCRIPTION
1
IN1
Logic Control for Switch 1
2
D1
Drain (Output) Terminal for Switch 1
3
S1
Source (Input) Terminal for Switch 1
4
V-
Negative Power Supply Terminal
5
GND
6
S4
Source (Input) Terminal for Switch 4
7
D4
Drain (Output) Terminal for Switch 4
8
IN4
Logic Control for Switch 4
9
IN3
Logic Control for Switch 3
10
D3
Drain (Output) Terminal for Switch 3
11
S3
Source (Input) Terminal for Switch 3
12
VREF
13
V+
Positive Power Supply Terminal (Substrate)
14
S2
Source (Input) Terminal for Switch 2
15
D2
Drain (Output) Terminal for Switch 2
16
IN2
Logic Control for Switch 2
Ground Terminal (Logic Common)
Logic Reference Voltage
2
Q13
Q11
D1
DG201
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V
V+ to VD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
VD to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
VD to VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28V
VREF to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33V
VREF to VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V
Current (Any Terminal). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
Thermal Resistance (Typical, Note 1)
θJA ( oC/W)
θJC (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
90
N/A
Maximum Junction Temperature
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range
“C” Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
TA = 25oC, V+ = +15V, V- = -15V
Electrical Specifications
“C” SUFFIX
TEST CONDITIONS
0oC
(NOTE 2)
25oC
70oC
UNITS
Turn-ON Time (Note 3), tON
RL = 1kΩ, VANALOG = -10V to +10V (Figure 1)
-
1.0
-
µs
Turn-OFF Time (Note 3), tOFF
RL = 1kΩ, VANALOG = -10V to +10V (Figure 1)
-
0.5
-
µs
Charge Injection, Q
Figure 2
-
20 (Typ)
-
mV
Off Isolation Rejection Ratio, OIRR
f = 1MHz, R L = 100Ω, CL ≤ 5pF, (Figure 3)
-
50 (Typ)
-
dB
Crosstalk (Channel-to-Channel), CCRR
One Channel Off
-
-50 (Typ)
-
dB
PARAMETER
DYNAMIC CHARACTERISTICS
DIGITAL INPUT CHARACTERISTICS
Input Logic Current, IIN(ON)
VIN = 0.8V (Note 3)
±1
±1
±10
µA
Input Logic Current, IN(OFF)
VIN = 2.4V (Note 3)
±1
±1
±10
µA
-
±15 (Typ)
-
V
100
100
125
Ω
-
30 (Typ)
-
Ω
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Drain-Source ON Resistance, r DS(ON)
IS = 10mA, VANALOG = ±10V
Channel-to-Channel
r DS(ON) Match, r DS(ON)
Drain OFF Leakage Current, ID(OFF)
VANALOG = -14V to +14V
-
±5
100
nA
Source OFF Leakage Current, IS(OFF)
VANALOG = -14V to +14V
-
±5
100
nA
Channel ON Leakage
Current, ID(ON) + IS(ON)
VD = VS = -14V to +14V
-
±5
200
nA
2000
1000
2000
µA
2000
1000
2000
µA
POWER SUPPLY CHARACTERISTICS
Supply Current, I+ Positive
VIN = 0V or VIN = 5V
Supply Current, I- Negative
NOTES:
2. Typical values are for design aid only, not guaranteed and not subject to production testing.
3. All channels are turned off by high “1” logic inputs and all channels are turned on by low “0” inputs; however 0.8V to 2.4V describes the minimum
range for switching properly. Peak input current required for transition is typically -120µA.
3
DG201
Test Circuits
ANALOG
INPUT 10V
ANALOG
INPUT 10V
3V
3V
0V
0V
VOUT
LOGIC
INPUT
1kΩ
10pF
VOUT
LOGIC
INPUT
FIGURE 1. t ON AND tOFF TEST CIRCUIT
10nF
FIGURE 2. CHARGE INJECTION TEST CIRCUIT
ANALOG INPUT
LOGIC
INPUT
2VP-P AT 1MHz
51Ω
3V
VOUT
100Ω
FIGURE 3. OFF ISOLATION TEST CIRCUIT
V+
Typical Applications
Using the VREF Terminal
The DG201 has an internal voltage divider setting the TTL
threshold on the input control lines for V+ equal to +15V. The
schematic shown in Figure 4 with nominal resistor values,
gives approximately 2.4V on the VREF pin. As the TTL input
signal goes from +0.8V to +2.4V, Q 1 and Q 2 switch states to
turn the switch ON and OFF. If the power supply voltage is
less than +15V, then a resistor (REXT) must be added
between V+ and the V REF pin, to restore +2.4V at V REF.
The table shows the value of this resistor for various supply
voltages, to maintain TTL compatibility. If CMOS logic levels
with a +5V supply are being used, the threshold shifts are
less critical, but a separate column of suitable values is given
in the table. For logic swings of -5V to + 5V, no resistor is
needed.
In general, the “low” logic level should be <0.8V to prevent
Q1 and Q2 from both being ON together (this will cause
incorrect switch function).
TABLE 1.
V+ SUPPLY (V)
REXT FOR TTL
LEVELS (kΩ)
REXT FOR CMOS
LEVELS (kΩ)
+15
-
-
+12
420
-
+10
190
-
+9
136
136
+8
98
98
+7
70
70
4
118kΩ
REXT
VREF
Q1
23kΩ
Q2
GATE
PROTECTION
RESISTOR
INPUT
FIGURE 4.
DG201
Typical Performance Curves
V+ = +15V
V- = -15V
100
125 oC
25 oC
50
-55oC
0
-15
-10
-5
0
5
DRAIN VOLTAGE (V)
10
C
B
50
A
A:
B:
C:
D:
0
-15
15
FIGURE 5. rDS(ON) vs VD AND TEMPERATURE
-10
V+ = +15V, V- = -15V
V+ = +12V, V- = -12V
V+ = +10V, V- = -10V
V+ = +8V, V- = -8V
-5
0
5
DRAIN VOLTAGE (V)
10
15
FIGURE 6. r DS(ON) vs VD AND POWER SUPPLY VOLTAGE
10
10
SOURCE OR DRAIN OFF LEAKAGE
CURRENT (nA)
CHANNEL ON LEAKAGE CURRENT (nA)
D
DRAIN-SOURCE ON RESISTANCE (Ω)
DRAIN-SOURCE ON RESISTANCE (Ω)
100
1
0.1
0.01
1
0.1
0.01
25
45
65
85
TEMPERATURE (oC)
105
FIGURE 7. ID(ON) vs TEMPERATURE
5
125
25
45
65
85
TEMPERATURE (oC)
105
FIGURE 8. IS(OFF) OR ID(OFF) vs TEMPERATURE
125
DG201
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
94 mils x 101 mils x 14 mils
Type: SiO2/Si3N4
SiO2 Thickness: 7kÅ
Si3N4 Thickness: 8kÅ
METALLIZATION:
Type: Al
Thickness: 10kÅ
WORST CASE CURRENT DENSITY:
1 x 105 A/cm2
Metallization Mask Layout
DG201
D1
IN1
IN2
D2
(2)
(1)
(16)
(15)
S1 (3)
(14) S2
V- (4)
(13) V+ (SUBSTRATE)†
GND (5)
(12) VREF
S4 (6)
(11) S3
(7)
D4
† BACKSIDE OF CHIP IS V+
6
(8)
IN4
(9)
IN3
(10)
D3
DG201
Dual-In-Line Plastic Packages (PDIP)
N
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-
SYMBOL
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
C
L
eA
A1
eC
B
MAX
MIN
MAX
NOTES
A
-
A1
0.015
0.210
-
5.33
4
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
C
eB
0.010 (0.25) M C A B S
MILLIMETERS
MIN
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
L
0.115
0.150
2.93
N
16
10.92
7
3.81
4
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
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