Data Sheet

PESDxUSB3S series
ESD protection for differential data lines
Rev. 3 — 26 April 2016
Product data sheet
1. Product profile
1.1 General description
The devices are ElectroStatic Discharge (ESD) protection for one, two and three
differential channels.
It is footprint compatible to PCMFxUSB3S common mode filters with ESD protection.
The diodes provide protection to downstream components from ESD voltages up to
15 kV on each signal line.
Table 1.
Product overview
Type number
Number of channels Package Name
PESD1USB3S
1
WLCSP5
PESD2USB3S
2
WLCSP10
PESD3USB3S
3
WLCSP15
1.2 Features and benefits
 Allows switching between
 ESD protection for one, two and three
PCMFxUSB3S common mode filters
differential channels up to 15 kV
with ESD protection and PESDxUSB3S
contact discharge according to
ESD protection in the same footprint
IEC 61000-4-2
 TREOS protection process for very high  Industry-standard WLCSP5, 10 and 15
system-level ESD robustness: superior
packages for smallest footprint
protection of sensitive Systems on Chips
(SoCs)
1.3 Applications
 Smartphone, cellular and cordless
phone
 USB3.1, USB2.0, HDMI2.0, HDMI1.4
 General-purpose downstream ESD
protection for differential data lines
 Tablet PC and Mobile Internet
Device (MID)
 MIPI D-PHY as used in Camera Serial
Interface (CSI) and Display Serial
Interface (DSI)
PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
2. Pinning information
Table 2.
Pin
Pinning
Symbol
Description
Simplified outline
Graphic symbol
PESD1USB3S (WLCSP5_2-1-2)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN
channel 1, external
B1
GND_CH1
ground channel 1
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT
channel 1, internal
2
A1
C1
A2
C2
B1
1
A
B
C
Transparent top view
WLCSP5_2-1-2
B1
aaa-021381
PESD2USB3S (WLCSP10_4-2-4)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN
channel 1, external
A3
CH2_IN+
channel 2+, external
A4
CH2_IN
channel 2, external
B1
GND_CH1
ground channel 1
B2
GND_CH2
ground channel 2
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT
channel 1, internal
C3
CH2_OUT+
channel 2+, internal
C4
CH2_OUT
channel 2, internal
4
A1, 3
C1, 3
A2, 4
C2, 4
B2
3
2
B1
1
B1, B2 - no internal connection
A
B
C
aaa-021384
Transparent top view
WLCSP10_4-2-4
PESD3USB3S (WLCSP15_6-3-6)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN
channel 1, external
A3
CH2_IN+
channel 2+, external
A4
CH2_IN
channel 2, external
A5
CH3_IN+
channel 3+, external
A6
CH3_IN
channel 3, external
B1
GND_CH1
ground channel 1
B2
GND_CH2
ground channel 2
B3
GND_CH3
ground channel 3
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT
channel 1, internal
C3
CH2_OUT+
channel 2+, internal
C4
CH2_OUT
channel 2, internal
C5
CH3_OUT+
channel 3+, internal
C6
CH3_OUT
channel 3, internal
PESDXUSB3S_SER
Product data sheet
6
A1, 3, 5
C1, 3, 5
A2, 4, 6
C2, 4, 6
B3
5
4
B2
3
B1, B2, B3 - no internal connection
aaa-021385
2
B1
1
A
B
C
Transparent top view
WLCSP15_6-3-6
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Rev. 3 — 26 April 2016
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ESD protection for differential data lines
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
PESD1USB3S
WLCSP5
wafer level chip-size package; 5 bumps (2-1-2)
PESD2USB3S
WLCSP10
wafer level chip-size package; 10 bumps (4-2-4)
PESD3USB3S
WLCSP15
wafer level chip-size package; 15 bumps (6-3-6)
4. Marking
Table 4.
Marking codes
Type number
Marking code
PESD1USB3S
PD1S
PESD2USB3S
PD2S
PESD3USB3S
PD3S
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge
voltage
Min
Max
Unit
-0.5
5
V
contact discharge
-15
15
kV
air discharge
-15
15
kV
-2
2
kV
IEC 61000-4-2, level 4;
all input pins to ground
IEC 61000-4-2, level 4;
all output pins to ground
contact discharge
air discharge
PESDXUSB3S_SER
Product data sheet
-2
2
kV
-8
8
A
storage temperature
-40
+125
°C
ambient temperature
-40
+85
°C
IPPM
rated peak-pulse
current
Tstg
Tamb
tp = 8/20 s
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NXP Semiconductors
ESD protection for differential data lines
6. Characteristics
6.1 Channel characteristics
Table 6.
Channel characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
[1]
Typ
Max
Unit
Cd
diode capacitance
f = 1 MHz; VI = 2.5 V
-
0.45
-
pF
IRM
reverse leakage current
per line; VI = 5 V
-
1
100
nA
VBR
breakdown voltage
IR = 1 mA
6
9
-
V
VF
forward voltage
IF = 10 mA
-
0.8
-
V
-
0.16
-

-
0.16
-

positive transient
-
0.25
-

negative transient
-
0.25
-

Min
Typ
Max
Unit
-
17
-
GHz
Rdyn
dynamic resistance
TLP
[2]
positive transient
negative transient
surge
[1]
This parameter is guaranteed by design.
[2]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 70 to 90 ns.
[3]
According to IEC 61000-4-5 (8/20 s).
[3]
6.2 Frequency characteristics
Table 7.
Frequency characteristics
Symbol Parameter
Conditions
Differential mode: S21dd
f3dB
[1]
PESDXUSB3S_SER
Product data sheet
cut-off frequency
[1]
Normalized to attenuation at 1 MHz.
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NXP Semiconductors
ESD protection for differential data lines
aaa-021319
1
aaa-021320
0
Sdd21
(dB)
Sdd21
(dB)
-1
-20
S21dd A3-A4 > C1-C2
-3
-40
-5
-60
S21dd pin 1 - 2
S21dd A5-A6 > C1-C2
S21dd pin 5 - 6
-7
107
108
109
1010
-80
108
1011
109
Fig 1.
1010
1011
f (Hz)
f (Hz)
Differential mode insertion loss; typical values
Fig 2.
Differential cross-talk; typical values
aaa-021321
115
Zdif
(Ω)
105
Z reference
95
Z DUT
85
40.70
40.90
40.11
4.13
t (ns)
tr = 200 ps
Fig 3.
Differential Time Domain Reflectometer (TDR) plot; typical values
PESDXUSB3S_SER
Product data sheet
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NXP Semiconductors
ESD protection for differential data lines
aaa-012322
Fig 4.
USB3.1 eye diagram 10 Gbps, test board with PESD3USB3S; typical values
aaa-021323
Fig 5.
PESDXUSB3S_SER
Product data sheet
USB3.1 eye diagram 10 Gbps, test board without device; typical values
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
aaa-021324
Fig 6.
HDMI 2.0 eye diagram TP1, test board with PESD3USB3S; typical values
aaa-021325
Fig 7.
PESDXUSB3S_SER
Product data sheet
HDMI 2.0 eye diagram TP1, test board without device; typical values
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
aaa-021326
25
aaa-021327
0
I
(A)
I
(A)
20
-5
15
-10
10
-15
5
-20
0
0
5
10
15
20
-25
-25
25
-20
-15
-10
-5
VCL (V)
Transmission Line Pulse (TLP) = 100 ns
Fig 8.
Transmission Line Pulse (TLP) = 100 ns
Dynamic resistance with positive clamping;
typical values
Fig 9.
Dynamic resistance with negative clamping;
typical values
aaa-021328
25
0
VCL (V)
aaa-021329
0
I
(A)
I
(A)
20
-5
15
-10
10
-15
5
-20
0
0
5
10
15
20
25
-25
-25
-20
-15
-10
-5
VCL (V)
0
VCL (V)
Transmission Line Pulse (TLP) = 5 ns
Transmission Line Pulse (TLP) = 5 ns
Fig 10. Dynamic resistance with positive clamping;
typical values
Fig 11. Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
PESDXUSB3S_SER
Product data sheet
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Rev. 3 — 26 April 2016
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
aaa-021330
10
aaa-021331
0
I
(A)
I
(A)
8
-2
6
-4
4
-6
2
-8
0
0
2
4
6
8
10
-10
-10
-8
VCL (V)
-6
-4
-2
0
VCL (V)
IEC61000-4-5; tp = 8/20 s; positive pulse
IEC61000-4-5; tp = 8/20 s; negative pulse
Fig 12. Dynamic resistance with positive clamping;
typical values
Fig 13. Dynamic resistance with negative clamping;
typical values
PESDXUSB3S_SER
Product data sheet
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
7. Application information
The device is designed to provide high-level ESD protection for differential high-speed
data line pairs such as:
•
•
•
•
•
•
USB 3.1
HDMI 2.0
Transition-Minimized Differential Signaling (TMDS)
DisplayPort
external Serial Advanced Technology Attachment (eSATA)
Low Voltage Differential Signaling (LVDS)
When designing the PCB, give careful consideration to impedance matching and signal
coupling. Do not connect the protected signal lines to unlimited current sources like, for
example, a battery.
Fig 14. Application diagram: protecting the differential data lines of a USB Type-C
connector evaluation dongle with PESD1USB3S
Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed
lines, PESD1USB3S makes it easy to achieve same signal lengths, straight routing, and
optimal positioning for ESD protection directly at the connector.
PESDXUSB3S_SER
Product data sheet
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PESDxUSB3S series
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ESD protection for differential data lines
8. Package outline
WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)
PESD1USB3S
D
bump A1
index area
A1
E
A
detail X
e
1/2 e
b
C
e1
B1
B
e2
A
bump A1
index area
1
2
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
max 0.60 0.38 0.31 0.82 1.22
nom 0.57 0.37 0.26 0.77 1.17 0.40 0.40 0.80
min 0.54 0.36 0.21 0.72 1.12
pesd1usb3s_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
15-12-11
PESD1USB3S
Fig 15. Package outline WLCSP5
PESDXUSB3S_SER
Product data sheet
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
PESD2USB3S
D
bump A1
index area
A1
E
A
detail X
e
b
C
e1
B1
B
B2
e2
A
bump A1
index area
1
2
3
4
e3
X
1/2 e
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
max 0.60 0.38 0.31 1.62 1.22
nom 0.57 0.37 0.26 1.57 1.17 0.40 0.40 0.80
min 0.54 0.36 0.21 1.52 1.12
e3
0.80
pesd2usb3s_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
15-12-11
PESD2USB3S
Fig 16. Package outline WLCSP10
PESDXUSB3S_SER
Product data sheet
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
PESD3USB3S
D
bump A1
index area
A1
E
A
detail X
e
1/2 e
b
C
e1
B2
B1
B
B3
e2
A
1
bump A1
index area
2
3
4
5
6
e3
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
e3
max 0.60 0.38 0.31 2.42 1.22
nom 0.57 0.37 0.26 2.37 1.17 0.40 0.40 0.80 0.80
min 0.54 0.36 0.21 2.32 1.12
pesd3usb3s_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
15-12-11
PESD3USB3S
Fig 17. Package outline WLCSP15
PESDXUSB3S_SER
Product data sheet
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NXP Semiconductors
ESD protection for differential data lines
9. Soldering
WLCSP5: Solder footprint and stencil aperture
PESD1USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
P
SL
SP
SR
Hx
Hy
15-12-11
0.40 0.25 0.25 0.325 1.00 1.40
pesd1usb3s_fr
Fig 18. Soldering footprint WLCSP5 (PESD1USB3S)
PESDXUSB3S_SER
Product data sheet
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PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
WLCSP10: Solder footprint and stencil aperture
PESD2USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
P1
Dimensions in mm
detail X
recommend stencil thickness: 0.1 mm
P
P1
SL
SP
SR
Hx
Hy
15-12-14
15-12-16
0.40 0.80 0.25 0.25 0.325 1.80 1.40
pesd2usb3s_fr
Fig 19. Soldering footprint WLCSP10 (PESD2USB3S)
WLCSP15: Solder footprint and stencil aperture
PESD3USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
P1
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
P
P1
SL
SP
SR
Hx
Hy
15-12-14
15-12-16
0.40 0.80 0.25 0.25 0.325 2.60 1.40
pesd3usb3s_fr
Fig 20. Soldering footprint WLCSP15 (PESD3USB3S)
PESDXUSB3S_SER
Product data sheet
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ESD protection for differential data lines
10. Revision history
Table 8.
Revision history
Document ID
Release
date
Data sheet status
Change
notice
Supersedes
PESDXUSB3S_SER v.3
20160426
Product data sheet
-
PESDXUSB3S_SER v.2
Modification:
•
Product status changed
PESDXUSB3S_SER v.2
20160127
Preliminary data sheet
-
PESDXUSB3S_SER v.1
PESDXUSB3S_SER v.1
20151216
Objective data sheet
-
-
PESDXUSB3S_SER
Product data sheet
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ESD protection for differential data lines
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PESDXUSB3S_SER
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 of 19
PESDxUSB3S series
NXP Semiconductors
ESD protection for differential data lines
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PESDXUSB3S_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 of 19
NXP Semiconductors
PESDxUSB3S series
ESD protection for differential data lines
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Channel characteristics . . . . . . . . . . . . . . . . . . 4
Frequency characteristics. . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 April 2016
Document identifier: PESDXUSB3S_SER
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