Data Sheet

IP4281CZ10
ESD protection for high-speed interfaces
Rev. 01 — 25 September 2008
Product data sheet
1. Product profile
1.1 General description
The IP4281CZ10 is designed for HDMI interface protection. The device includes
high-level ElectroStatic Discharge (ESD) protection diodes for the TMDS signal lines.
All TMDS intra-pairs are protected by a special diode configuration offering a low line
capacitance of only 0.7 pF. These diodes provide protection to downstream components
from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features
n Pb-free, RoHS compliant and free of Halogen and Antimony (dark green compliant)
n ESD protection for HDMI and other LVDS data lines
n All TMDS lines with integrated rail-to-rail clamping diodes for downstream ESD
protection of ±8 kV according to IEC61000-4-2, level 4
n Matched 0.5 mm trace spacing
n TMDS lines with ≤ 0.05 pF matching capacitance between TMDS pairs
n Line capacitance of only 0.7 pF for each channel
n 4-channel, 10-terminal Ultra-Thin Leadless Package (UTLP)
n HDMI 1.3a compliant
1.3 Applications
The IP4281CZ10 is designed for HDMI receiver and transmitter port protection:
n TV, monitor
n Notebook, main board graphics card and ports
n Set-top box and game consoles
n DVD recorder and player
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
Simplified outline
1
TMDS_CH1−
negative channel 1 ESD protection
2
TMDS_CH1+
positive channel 1 ESD protection
3
GND
GND
4
TMDS_CH2−
negative channel 2 ESD protection
5
TMDS_CH2+
positive channel 2 ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
GND
9
n.c.
not connected
10
n.c.
not connected
Graphic symbol
1
1
10
2
9
3
8
2
4
3, 8
4
7
5
6
5
001aai619
Transparent top view
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
IP4281CZ10
Description
Version
XSON10U plastic extremely thin small outline package; no leads; SOT1059-1
10 terminals; UTLP based; body 1 × 2.5 × 0.5 mm
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VI
input voltage
Vesd
electrostatic discharge
voltage
Tstg
Min
Max
Unit
GND − 0.5 +3.63
V
contact
−8
+8
kV
air discharge
−15
+15
kV
−55
+125
°C
all pins to ground;
IEC 61000-4-2, level 4
storage temperature
5. Recommended operating conditions
Table 4.
Operating conditions
Symbol
Parameter
Tamb
ambient temperature
Conditions
IP4281CZ10_1
Product data sheet
Min
Max
Unit
−40
+85
°C
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
2 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
6. Characteristics
Table 5.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VBRzd
Zener diode breakdown voltage
I = 1 mA
6
-
9
V
ILRzd
Zener diode reverse leakage current
per TMDS channel; V = 3.0 V
-
-
1
µA
VF
forward voltage
-
0.7
-
V
Cch(TMDS)
TMDS channel capacitance
f = 1 MHz; Vbias = 2.5 V
[1]
-
0.7
-
pF
∆Cch(TMDS)
TMDS channel capacitance difference f = 1 MHz; Vbias = 2.5 V
[1]
-
0.05 -
pF
Cch(mutual)
mutual channel capacitance
between signal pin and pin n.c.;
f = 1 MHz; Vbias = 2.5 V
[1]
-
0.07 -
pF
Rdyn
dynamic resistance
I = 1 A, Tamb = 25 °C; IEC 61000-4-5/9
positive transient
-
2.4
-
Ω
negative transient
-
1.3
-
Ω
-
8
-
V
VCL(ch)trt(pos) positive transient channel clamping
voltage
[1]
Vesd = 8 kV HBM; Tamb = 25 °C
This parameter is guaranteed by design.
IP4281CZ10_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
3 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
7. Application information
The IP4281CZ10 is mainly designed to provide high-level ESD protection for high-speed
serial data buses such as HDMI and other LVDS data lines.
Therefore, careful printed-circuit board design with respect to impedance matching,
coupling to other signals etc. is recommended. An example showing a basic abstract view
of a layout for an HDMI interface is shown in Figure 1.
TMDS_D2+
IP4281CZ10
TMDS_D2+
5
4
TMDS_D2−
3
TMDS_D1+
2
HDMI
RECEIVER
1
TMDS_D1−
TMDS_D0+
TMDS_CH2+
TMDS_GND
TMDS_CH2−
TMDS_D2−
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1−
HDMI
CONNECTOR
TMDS_D1−
IP4281CZ10
TMDS_D0+
5
TMDS_CH2+
TMDS_GND
TMDS_D0−
TMDS_CLK+
4
3
2
TMDS_CLK−
1
TMDS_CH2−
TMDS_D0−
GND
TMDS_CLK+
TMDS_CH1+
TMDS_GND
TMDS_CH1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
001aai620
Fig 1.
Application diagram
IP4281CZ10_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
4 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
8. Package outline
XSON10U: plastic extremely thin small outline package; no leads;
10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm
SOT1059-1
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
e
L1
v
w
b
1
5
M
M
C
C A B
C
y
y1 C
L2
e2
L
10
6
X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
e2
L
L1
L2
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
2.6
2.4
1.1
0.9
0.5
2
0.6
0.4
0.2
0.15
0.00
0.45
0.25
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT1059-1
---
Fig 2.
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-12-20
08-01-18
Package outline SOT1059-1 (XSON10U)
IP4281CZ10_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
5 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
9. Abbreviations
Table 6.
Abbreviations
Acronym
Description
DVD
Digital Video Disk
ESD
ElectroStatic Discharge
HBM
Human Body Model
HDMI
High-Definition Multimedia Interface
LVDS
Low-Voltage Differential Signaling
RoHS
Restriction of Hazardous Substances
TMDS
Transition Minimized Differential Signaling
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4281CZ10_1
20080925
Product data sheet
-
-
IP4281CZ10_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
6 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4281CZ10_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 25 September 2008
7 of 8
IP4281CZ10
NXP Semiconductors
ESD protection for high-speed interfaces
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended operating conditions. . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Application information. . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
2
2
2
2
3
4
5
6
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 September 2008
Document identifier: IP4281CZ10_1
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